ETC DD-03182GP-200

DD-03182 SERIES
ARINC 429 LINE DRIVER
FEATURES
DESCRIPTION
The DD-03182 device is a line driver
chip that transmits data on the serial
data bus in accordance with the
“ARINC Specification 429 Mark 33
Digital Information Transfer System”
(ARINC 429). This device can be used
with DDC’s DD-03296 discrete-to-digital device, in conjunction with the DD03282 transceiver chip or the DD00429 microprocessor interface.
The line driver receives TTL information on the DataA/DataB input pins
and transmits it out on the AOUT/BOUT
output pins. The output voltage level
is programmable via the VREF input
pin. The output pins are also protected against short circuits from aircraft
power. The slew rate of the DD-03182
can be programmed for either High
(100 kbit) or Low (12.5 kbit) speed via
two external timing capacitors connected to the CA/CB input pins.
APPLICATIONS
The DD-03182 can be used for many
different applications ranging from
flight critical to nonessential. Surface
mount, DIP and PLCC package configurations are available. Military temperature range is also available if
required.
• Plastic 14-Pin SOIC Package
Available with or without Fuse
• Pin-For-Pin Alternative for Most
Harris/Holt/Raytheon Applications
• Programmable Output Voltage Level
• Short-Circuit Protection on Outputs
• Programmable Slew and Data Rates
+V CA
DATA (A)
LEVEL SHIFTER
AND SLOPE
CONTROL (A)
OUTPUT
DRIVER (A)
AOUT
ROUT
2
CLOCK
GND
VREF
OVERVOLTAGE
PROTECTION
(OPTIONAL)
SYNC
LEVEL SHIFTER
AND SLOPE
CONTROL (B)
DATA (B)
OUTPUT
DRIVER (B)
ROUT
2
V1
CURRENT
REGULATOR
BIAS
-V
CB
FIGURE 1. DD-03182 BLOCK DIAGRAM
© 1993, 1999 Data Device Corporation
Overvoltage Protection optional for
DD-03182VP only.
BOUT
GENERAL
TABLE 1. DD-03182 SPECIFICATIONS
PARAMETER
ABSOLUTE MAXIMUM
RATINGS
VOLTAGE BETWEEN
PINS
+V and -V
V1 and GND
VREF and GND
Output Short-circuit
Protection
Output Overvoltage
Protection
Power Dissipation
POWER SUPPLY
REQUIREMENTS
+V
-V
V1
VREF (for ARINC 429)
VREF (for other applications)
THERMAL
Operating Ambient
Temperature
Ceramic
Plastic
Storage Temperature
Lead Temperature
(localized 10 sec
duration)
Thermal Resistance:
Junction to Case θjc
DD-03182DC
Junction to Ambient θja
(see Note 3)
DD-03182DC
DD-03182PP
DD-03182GP
DD-03182VP
Max. Junction Temperature
SIZE
DD-03182VP
DD-03182DC
DD-03182GP
DD-03182PP
WEIGHT
DD-03182VP
DD-03182DC
DD-03182GP
DD-03182PP
UNITS
MIN
TYP
V
V
V
MAX
The ARINC 429 standard is widely used in the civil aerospace
market (commercial aircraft). ARINC 429 operates at either 12
to 14.5 or 100 kbits on a simplex bus. A simplex bus is one on
which there is only one transmitter but multiple receivers (up to a
maximum of 20 in the case of 429). If receipt of a message by a
given sink R(n) is required by the source T, a separate bus with
R(n) as the source and T as the sink is required. To those
designers who focus on military systems, a simplex bus may
seem cumbersome, but it can be readily certified for civil aircraft.
40
7
6
See Note 1
See Note 2
Communications on 429 buses use 32-bit words with odd parity.
The waveform is a bipolar return to zero with each bit lasting
either 70 or 83µs ±2.5 percent, or 10µs, ±2.5 percent, depending on whether the bus is low- or high-speed. A low-speed bus
is used for general purpose, low critical applications. A highspeed bus is used for transmitting large quantities of data or
flight critical information.
See TABLE 2
VDC
VDC
VDC
VDC
VDC
11.4
-11.4
4.75
4.75
0
°C
°C
°C
°C
-55
-40
-65
15
-15
5
5
15
°C/W
°C/W
°C/W
°C/W
°C
75
95
115
130
oz. (g.)
oz. (g.)
oz. (g.)
oz. (g.)
ARINC 429 imposes relatively modest and readily achievable
performance demands on the hardware. FIGURE 2 is a general
schematic of a 429 bus. The transmitter output impedance
should be in the range of 75 to 85 Ω, equally divided between the
two leads. The output voltage, Vo, is 10 V and is generated by
imposing equal but opposite polarity voltages on the two leads.
The null voltage is 0.5 V. For the receiver, the input resistance
shall be greater than 12,000 Ω and the input differential capacitance and the capacitance to ground shall, in both cases, be less
than 50 pF. The 12,000 Ω minimum input resistance ensures
that up to 20 receivers can be on the bus without overloading it
and minimizes receiver interaction under fault conditions. To preclude continued receiver operation in a lead-to-ground fault condition, 429 has established the range of acceptable receiver voltage levels to be +6.5 to +13.0 V and -6.5 to -13.0 V and null levels from +2.5 to -2.5 V. Any signals falling outside of these levels will be ignored. Also note that a lead-to-ground fault will produce a differential voltage swing up 5.5 V. FIGURE 4 shows the
waveforms required by 429 and permissible levels for transmitter
and receiver voltages.
+125
+85
+150
+300
°C/W
in.
(mm.)
in.
(mm.)
in.
(mm.)
in.
(mm.)
16.5
-16.5
5.25
5.25
175
0.344 x 0.158 x 0.069
(8.737 x 4.013 x 1.753)
0.785 x 0.291 x 0.160
(19.939 x 7.391 x 4.064)
0.413 x 0.300 x 0.082
(10.490 x 7.620 x2.080)
0.454 x 0.454 x 0.155
(11.53 x 11.53 x 3.94)
0.01
0.08
0.02
0.04
Signal Leads
(0.28)
(2.26)
(0.57)
(1.13)
A
A
B
B
Transmitter
Receiver
Shield
Notes:
1. Both outputs can be shorted to ground or to each other, at +25°C ambient temperature.
2. Both outputs are fused between 0.5 Amp DC and 1.0 Amp DC to prevent an
overvoltage fault from coupling onto the system power bus.
3. Thermal resistance when mounted on a 4" x 4" FR4 PC board in a horizontal
position, still air.
To Other Receivers
(max. total of 20)
FIGURE 2. GENERALIZED 429 BUS
2
TABLE 2. DD-03182 POWER DISSIPATION FOR CONTINUOUS ARINC 429 TRANSMISSION
VREF and
+V @
-V @
LOAD POWER
LOAD
V1 @
15
V
-15
V
(mW)
(Note 2)
(mA)
(mA)
(Note 1)
5V
R
C
(Note 3)
(Note 3)
(mA)
(Ω)
(pF)
DATA RATE (KBPS)
0 TO 100
12.5
12.5
12.5
12.5
12.5
12.5
12.5
12.5
12.5
100
100
100
100
100
100
100
100
100
Notes:
No load
2000
2000
2000
800
800
800
400
400
400
2000
2000
2000
800
800
800
400
400
400
0
1000
10,000
30,000
1000
10,000
30,000
1000
10,000
30,000
1000
3,000
10,000
1000
3,000
10,000
1000
3,000
10,000
2.5
4.6
6.5
11.3
7.8
8.9
13.5
12.5
13
16.2
5.8
9.3
22.2
8.4
11.4
23.1
12.8
14.3
24.4
-5.0
-7.1
-8.9
-13.8
-10.3
-11.4
-16
-15.1
-15.5
-18.7
-8.3
-11.7
-24.7
-11
-14
-25.7
-15.3
-16.8
-26.9
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.4
CHIP POWER
(mW)
(Note 1)
0
19
19
19
42
42
42
71
71
71
19
19
19
42
42
42
71
71
71
120
158
206
336
219
249
371
317
329
414
189
281
627
237
317
629
324
364
633
1. Supply current data is at 100% duty cycle. Load and chip power is calculated as 89% duty cycle (32 bits,/36 bits).
2. Data is not presented for 30,000 pF at 100 kbps. This is considered an unrealistic load for high-speed operation.
3. For 12 volt power supplies, multiply tabulated values of chip power by 0.8.
TABLE 3. DD-03182 DC ELECTRICAL CHARACTERISTICS
CONDITIONS: Ambient Temperature is in accordance with the temperature range of device type ordered;
+V = +15 VDC ±10%; -V = -15 VDC ±10%; V1 = VREF = +5 VDC ±5%*.
PARAMETER (SYMBOL)
Quiescent +V Supply Current (IQ+V)
UNITS
mA
MIN
TYP
2.5
Quiescent -V Supply Current (IQ-V)
mA
5
Quiescent V1 Supply Current (IQV1)
mA
4.4
Quiescent VREF supply current (IQVREF)
µA
10
Logic 1 input V (VIH)
Logic 1 input I (IIH)
V
µA
MAX
No load 429 mode.
DATA = CLOCK = SYNC = L
2.0
10
Logic 0 input V (VIL)
V
0.6
Logic 0 input I (IIL)
µA
-20
Output voltage high: +1 (VOH)
V
Output voltage null: 0 (VNULL)
VREF
-250 mV
TEST CONDITIONS
No load 429 mode.
DATA = CLOCK = SYNC = L
No load 429 mode.
DATA = CLOCK = SYNC = L
No load 429 mode.
DATA = CLOCK = SYNC = L
No load
No load
No load
No load (Pin 15 IIL = -2 mA max.)
VREF
VREF
+250 mV
No load 429 Mode
+250
No load 429 Mode
-VREF
-VREF
+250 mV
No load 429 Mode
mV
-250
Output voltage low: -1 (VOL)
V
-VREF
-250 mV
Timing capacitor charge current:
CA [+1] CB [-1] (ICT+)
CA [-1] CB [+1] (ICT-)
µA
µA
+V Short-circuit supply current (ISC [+V])
mA
+150
Output short to GND.
-V Short-circuit supply current (ISC [-V])
mA
-150
Output short to GND.
Output resistance each output (ROUT/2)
is at +25°C only.
ohms
Input capacitance (CIN)
No load 429 Mode.
SYNC = CLOCK = H
CA and CB held at 0
+200
-200
30
pF
37.5
45
15
*Note: The device will operate with +V and -V supplies at ±12 VDC ±5% in accordance with the temperature range of the device type ordered.
3
ing capacitors on CA and CB. Typical Values are 75 pF for
100 kHz data and 500 pF for 12.5 kHz data.
The DD-03182 line driver is designed to take data from a box and
place it on the data bus. The serial data is presented on DATA(A)
and DATA(B) inputs in a dual rail format. The driver is enabled by
the SYNC and CLOCK inputs. The output voltage level is programmed by the VREF input and is normally tied to +5 VDC along
with V1 to produce output levels of +5V, 0V, and
-5 V on each output for 10 V differential outputs (see FIGURE 3).
The cable used in 429 buses is a twisted, shielded pair of 20- to
26-gauge conductors. The shield is grounded at both ends of the
cable run and at all production breaks. Although there is no
specification placed on the cable impedance, it generally falls in
the range of 60 to 80 Ω.
The outputs are fused for fail-safe protection against shorts to
aircraft power. The output slew rate is controlled by external tim-
TABLE 4. DD-03182 TRUTH TABLE
SYNC
(Note 1)
CLOCK
(Note 1)
DATA (A)
(Note 1)
DATA (B)
(Note 1)
AOUT
(Note 2)
BOUT
(Note 2)
COMMENTS
L
X
X
X
0
0
Null
X
L
X
X
0
0
Null
H
H
L
L
0
0
Null
H
H
H
H
0
0
Null
H
H
H
L
+1
-1
Logic 1
H
H
L
H
-1
+1
Logic 0
Notes:
1. X = Don’t care.
2. The AOUT/BOUT notation is as follows:
+1 = VREF volts
0=0
A IN (A)
DATA
B IN (B)
DATA
+V REF
A
OUT
-V
REF
+V
REF
B
OUT
-V
REF
0V
0V
Note: The output slew rates are controlled by timing capacitors CA and CB. They are charged to ±200µA (nominal).
Slew rate (SR) is calculated by SR = 200/C (V/µs), where C is in pF.
FIGURE 3. ARINC 429 WAVEFORM
4
SLEW RATE VS. TIMING CAPACITOR VALUES
(0.4 V/µsec)(10) = 4.0 V
The output slew rates are controlled by timing capacitors CA and
CB, and are charged by ±200 µA (nominal). Slew rate (SR) is calculated by:
SR = 4/(Rise Time)
SR = 200/C (V/µsec), where C is in pF (equation 1).
0.267 µsec = 4V/15 µsec Capacitor = 200/0.267 = 750 pF
HIGH-SPEED SLEW RATE
DD-03182 PIN FUNCTIONS
0.8 µsec = 4V/5 µsec
Capacitor = 200/0.8 = 250 pF
Refer to FIGURES 7, 8 and 9 and TABLE 5 for specific package
pin configurations.
CA and CB = 75 pF for 100 kbps
From equation 1: 200/75 = 2.67 V/µsec
10% - 90% = 0.5 V to 4.5 V
∆ = 4.0 V
VREF (Input) – the voltage on VREF sets the output voltage levels
on AOUT and BOUT. The output logic level swings between
+VREF volts, 0 volts and -VREF volts.
For 100 kbps bit rate, the slew rate specification is 1.5 µsec
±0.5 µsec. Slew rate range (1.0 to 2.0 µsec).
N/C – No Connection
200/SR = Capacitor, in pF
200/2.67 = 75 pF
SYNC (Input) – Logic 0 outputs will be forced to NULL or MARK
state. Logic 1 enables data transmission.
(2.67 V/µsec)(1.5) = 4.0 V
CLOCK (Input) – Logic 0 outputs will be forced to NULL or
MARK state. Logic 1 enables data transmission.
SR = 4/(Rise Time)
DATA(A)/DATA(B) (Inputs) – These signals contain the serial
data to be transmitted on the ARINC 429 data bus.
4 µsec = 4V/1 µsec
Capacitor = 200/4 = 50 pF
2 µsec = 4V/2 µsec
Capacitor = 200/2 = 100 pF
LOW-SPEED SLEW RATE
CA/CB (Analog) – External timing capacitors are tied from these
points to ground to establish the output signal slew rate.
Typically, CA=CB=75 pF for 100 kHz data and CA=CB=500 pF for
12.5 kHz data.
CA and CB = 500 pF for 12.5 kbps
From equation 1: 200/500 = 0.4 V/µsec
AOUT/BOUT (Output) – These are the line driver outputs which
are connected to the aircraft serial data bus.
-V (Input) – This is the negative supply input (-15 VDC nominal).
For 12.5 kbps bit rate, the slew rate specification is 10 µsec
±5.0 µsec. Slew rate range (5 to 15 µsec).
GND – Ground
+V (Input) – This is the positive supply input (+15 VDC nominal).
200/SR = Capacitor in pF
200/0.4 = 500 pF
V1 (Input) – This is the logic supply input (+5 VDC nominal).
TABLE 5. DD-03182 PINOUTS
PIN NUMBER
DC OR GP
PACKAGE
DC OR GP
PACKAGE
1
VREF
VREF
VREF
PP PACKAGE
15
N/C
GND
2
N/C
N/C
N/C
16
V1
+V
3
SYNC
GND
SYNC
17
BOUT
4
DATA (A)
5
CA
SYNC
DATA (A)
18
N/C
N/C
CA
6
AOUT
19
N/C
DATA (A)
AOUT
7
-V
20
N/C
N/C
-V
21
N/C
8
GND
N/C
GND
22
CB
9
+V
CA
+V
23
DATA (B)
N/C
BOUT
24
N/C
25
CLOCK
PP PACKAGE VP PACKAGE PIN NUMBER
10
N/C
11
BOUT
N/C
CB
12
CB
N/C
DATA (B)
26
N/C
13
DATA (B)
AOUT
CLOCK
27
N/C
14
CLOCK
-V
V1
28
V1
5
ADG412BR
TX0_SEL
V+ 13
1 IN1
SPD1A
2
S1 3
D1
GND
TX0_SEL 16 IN2
SPD1B
15
S2 14
D2
V- 4
9 IN3
TX1_SEL
SPD2A 10
TX1_SEL 8
SPD2A
7
5
VCC
S3 11
D3
VR 12
IN4
S4
DD-03182GP
VCC
VCC
6
D4
VCC
VCC
TX0_A
TX0_B
SPD1A
16 V1
1 VREF
VCC
C12
470 pF
C8
68 pF
3 SYNC
14 CLK
4 DATA_A
13 DATA_B
5 CA
12 CB
7
9
SPD1B
B_OUT
6
TX0_A_OUT
11
TX0_B_OUT
VV+
8
C13
470 pF
A_OUT
GND
C9
68 pF
FIGURE 4. RECOMMENDED CIRCUITRY SWITCHING CAPACITORS FOR HIGH-SPEED/LOW-SPEED OPERATION
+5V
1
VCC
ARINC 429
RECEIVE CH 1
ARINC 429
RECEIVE CH 2
2
DI1(A)
3
DI1(B)
4 DI2(A)
5 DI2(B)
+5V
+15V
ARINC 429
TRANSMIT
6
11
C2
75pF
6
7
TXR
30
SEL
-15V
7
9 16 A 4
B 13
14
3
C
C
1
5
12
8
DR1
DR2
DD-03282DC
31
32
TX0 A
TX0 B
C2
75pF
DO(A)
DO(B)
40
DD-03182GP
37
NOTE: C1 = C2 = 500pF FOR
LO SPEED OPERATION
38
1 MHZ CLK
9
10
28
29
34
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
MR
DBCEN
1MCK
TXCK
11
12
13
14
15
16
17
18
19
20
22
23
24
25
26
27
GND
21
FIGURE 5. TYPICAL TRANSCEIVER/LINE DRIVER INTERCONNECT CONFIGURATION
6
DIGITAL CONTROL
INTERFACE
EN TX 33
+5V
39
OE1
OE2
LD1
LD2
LDCW
8
DIGITAL DATA
INTERFACE
TOP VIEW
AOUT
DD-03182
BOUT
MICRO-SEM
SMAJ6.5CA
G
N
D
N
/
C
4
3
2
1
V
1
N
/
C
N
/
C
28
27
26
CLOCK
DATA (A)
6
24
N/C
N/C
7
23
DATA (B)
22
CB
DD-03182PP
PLCC
N/C
8
CA
9
21
N/C
N/C
10
20
N/C
N/C
11
19
N/C
N
/
C
13
14
A
-v
O
U
T
15
16
G
N
D
+v
17
18
B
N
/
C
O
U
T
FIGURE 7. DD-03182PP PIN CONFIGURATION
TOP VIEW
TOP VIEW
1
14
V1
N/C
2
13
CLOCK
SYNC
3
12
DATA(B)
DATA(A)
4
11
CB
CA
5
10
B OUT
A
R
E
F
25
12
FIGURE 6. RECOMMENDED TRANSIENT
PROTECTION CIRCUIT
V
5
N/C
MICRO-SEM
SMAJ6.5CA
S
Y
N
C
OUT
6
9
+V
-V
7
8
GND
1
16
V1
N/C
2
15
N/C
SYNC
3
14
CLOCK
DATA(A)
4
13
DATA(B)
CA
5
12
CB
A OUT
6
11
B OUT
-V
7
10
N/C
GND
8
9
+V
FIGURE 9. DD-03182DC AND GP PIN CONFIGURATION
FIGURE 8. DD-03182VP PIN CONFIGURATION
7
PIN 1
DIMENSIONS ARE IN INCHES (mm)
0.181 - 0.205
(4.597 - 5.207)
0.150 - 0.158
(3.810 - 4.013)
0.228 - 0.244
(5.791 - 6.198)
0.018 - 0.022
(0.457 - 0.559)
0.336 - 0.344
(8.534 - 8.737)
0.053 - 0.069
(1.346 - 1.753)
3˚ - 6˚
0.007 - 0.009
(0.178 - 0.229)
0.05 (1.270) BSC
0.014 - 0.018
(0.356 - 0.457)
0.004 - 0.008
(0.102 - 0.203)
FIGURE 10. DD-03182VP 14-PIN SURFACE MOUNT (SOIC) MECHANICAL OUTLINE
DIMENSIONS ARE IN INCHES (mm)
LEAD #1
0.785 MAX
(19.94)
0.025 RAD
(0.64)
0.291 MAX
(7.39)
0.050 MAX
(1.27)
0.160 MAX
(4.06)
0.290 - 0.320
(7.37 - 8.13)
0.060 ±0.005
(1.52 ±0.13)
0.125 MIN
(3.18)
0 - 10 deg.
0.008 - 0.012
(0.20 - 0.30)
0.020 - 0.070
(0.51 - 1.78)
0.100 ±0.010
(2.54 ±0.25)
0.018 ±0.002
(0.46 ±0.05)
0.385 ±0.025
(9.78 ±0.64)
FIGURE 11. DD-03182DC CERAMIC DIP (JE) MECHANICAL OUTLINE
8
PIN 1
DIMENSIONS ARE IN INCHES (mm)
LEAD COPLANARITY 0.004 MAX
0.026 MIN 0.032 MAX
(0.66 MIN 0.81 MAX)
0.291 MIN 0.300 MAX
(7.39 MIN 7.62 MAX)
0.397 MIN 0.413 MAX
(10.08 MIN 10.49 MAX)
0.092 MIN 0.094 MAX
(2.34 MIN 2.39 MAX)
0.007 MIN 0.013 MAX
(0.18 MIN 0.33 MAX)
0.047MIN 0.053 MAX
(1.19 MIN 1.35 MAX)
0.015 MIN 0.050 MAX
(0.38 MIN 1.27 MAX)
0.393 MIN 0.420 MAX
(9.98 MIN 10.67 MAX)
0.014 MIN 0.019 MAX
(0.36 MIN 0.48 MAX)
0.003 MIN 0.012 MAX
(0.076 MIN 0.30 MAX)
FIGURE 12. DD-03182GP 16-PIN SURFACE MOUNT (SOIC) MECHANICAL OUTLINE
ORIENTATION MARK
DENOTES PIN 1
±0.005
0.490
[12.45)]
0.175
[4.45]
±0.002
0.454
[11.53]
0.100
[2.54]
0.018
[0.46]
MIN
1
±0.002
0.490
[12.45]
6 EQ. SP @
0.050 = 0.300
(TOL NONCUM)
(TYP)
1
±0.002
0.454
[11.53]
0.029
[0.74]
(TYP)
0.050
[1.27]
(TYP)
±0.020
0.410
[10.41]
0.020
[0.51]
MIN
Notes: 1. LEAD CLUSTER TO BE CENTRALIZED ABOUT CASE CENTERLINE WITHIN ±0.010.
2.
DIMENSIONS SHOWN ARE IN INCHES [MILLIMETERS].
FIGURE 13. DD-03182PP PLCC MECHANICAL OUTLINE
9
ORDERING INFORMATION
OTHER APPLICABLE DOCUMENTS
DD-03182XX-XXXX – ARINC 429 Line Driver
RTCA/DO-160D: Environmental Conditions and Test Procedure
for Airborne Equipment
T = Tape and Reel (GP and VP only)
ARINC Specification 429 Mark 33 Digital Information Transfer
System
Options:
0 = With resistors and fuses
1 = With resistors, no fuses*
Screening:
0 = Standard DDC Procedures
2 = Burn-in (DC and GP only)
Temperature Range:
1 = -55 to +125°C (ceramic only)
2 = -40 to +85°C
9 = -55 to +85°C (GP package only)
Package Style/Type:
DC = 16-pin ceramic DIP
GP = 16-pin plastic SOIC
PP = 28-pin plastic PLCC
VP = 14-Pin plastic SOIC
*VP version only.
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NOTES
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The information in this data sheet is believed to be accurate; however, no responsibility is
assumed by Data Device Corporation for its use, and no license or rights are
granted by implication or otherwise in connection therewith.
Specifications are subject to change without notice.
105 Wilbur Place, Bohemia, New York 11716-2482
For Technical Support - 1-800-DDC-5757 ext. 7402
Headquarters - Tel: (631) 567-5600 ext. 7402, Fax: (631) 567-7358
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West Coast - Tel: (714) 895-9777, Fax: (714) 895-4988
Europe - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
Asia/Pacific - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689
World Wide Web - http://www.ddc-web.com
ILC DATA DEVICE CORPORATION
REGISTERED TO ISO 9001
FILE NO. A5976
J-09/99-1M
PRINTED IN THE U.S.A.
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