HMC264CB1 MICROWAVE CORPORATION HMC264CB1 SUB-HARMONIC SMT MIXER 21 - 30 GHz FEBRUARY 2001 V01.0500 Features General Description RUGGED SMT BGA PACKAGE The HMC264CB1 is a 20 – 30 GHz surface mount sub - harmonically pumped (x2) MMIC mixer with an integrated LO amplifier in a rugged Ball Grid Array (BGA) package. The 2LO to RF isolation is an excellent 30 to 38 dB, eliminating the need for additional filtering. The LO amplifier is a single bias (+3V to +4V) two stage design with only –4 dBm drive requirement. This GaAs PHEMT based mixer chip was designed to be used in LMDS, microwave point-to-point radios, and SATCOM applications. All data is with the non-hermetic, epoxy sealed BGA packaged device mounted in a 50 ohm test fixture. Utilizing the HMC264CB1 eliminates the need for wirebonding, thereby providing a consistent connection interface for the customer. INTEGRATED LO AMPLIFIER: -4dBm INPUT SUB-HARMONICALLY PUMPED (x2) LO HIGH 2LO/RF ISOLATION: > 35dB SMT MIXERS 4 Guaranteed Performance, Parameter As a Function of LO Drive & Vdd, - 55 to + 85 deg C IF = 1 GHz LO= -4dBm & Vdd = +4V IF = 1 GHz LO= -4dBm & Vdd = +4V IF = 1 GHz LO= -4dBm & Vdd = +3V Min. Min. Min. Typ. Max. Typ. Max. Typ. Units Max. Frequency Range, RF 21 - 27 27 - 30 21 - 30 GHz Frequency Range LO 12 - 16 10 - 15 10.5 - 14.5 GHz Frequency Range, IF DC - 4 DC - 4 DC - 4 GHz Conversion Loss 10 13 10 13 9 13 dB Noise Figure (SSB) 10 13 10 13 9 13 dB 2LO to RF Isolation 26 30 28 40 17 30 dB 2LO to IF Isolation 32 40 30 40 29 38 dB dB m IP3 (Input) 5 13 6 12 1 10 1 dB Compression (Input) 0 +5 -2 +5 -1 0 ~ +2 Local Oscillator Drive Level -8 -4 +8 -8 -4 +8 -8 -4 +8 dB m 3.75 4.0 4.25 3.75 4.0 4.25 2.75 3.0 3.25 V dc 28 45 28 45 25 40 mA Supply Voltage (Vdd) Supply Current (Idd) dB m Note: Operation may be extened to 32 GHz by increasing LO Drive to 0dBm. 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 132 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com HMC264CB1 MICROWAVE CORPORATION HMC264CB1 SUB-HARMONIC SMT MIXER 21 - 30 GHz FEBRUARY 2001 V01.0500 Conversion Gain vs. Temperature @ LO= -4 dBm, Vdd= +4V Conversion Gain vs. Temperature @ LO= -4 dBm, Vdd= +3V 0 0 -55 C CONVERSION GAIN (dB) +25 C -10 -15 +85 C -20 -25 -5 +25 C -10 -15 +85 C -20 -25 20 22 24 26 28 30 32 34 18 20 22 RF FREQUENCY (GHz) Conversion Gain vs. LO Drive @ Vdd= +4V 26 28 30 32 34 Conversion Gain vs. LO Drive @ Vdd= +3V 0 CONVERSION GAIN (dB) 0 CONVERSION GAIN (dB) 24 RF FREQUENCY (GHz) -5 -10 -4 dBm -15 -6 dBm -2 dBm 0 dBm -20 -5 -2 dBm -10 -15 -4 dBm -6 dBm -20 -8 dBm -25 -25 18 20 22 24 26 28 30 32 34 18 20 22 RF FREQUENCY (GHz) 26 28 30 32 34 Isolation @ LO = -4 dBm, Vdd= +3V 10 10 0 0 LO/IF LO/IF -10 RF/IF LO/RF ISOLATION (dB) -10 ISOLATION (dB) 24 RF FREQUENCY (GHz) Isolation @ LO = -4 dBm, Vdd= +4V -20 -30 -40 2LO/RF -50 2LO/IF -30 -40 2LO/RF 2LO/IF -60 -70 RF/IF LO/RF -20 -50 -60 -70 18 20 22 24 26 28 30 32 34 RF FREQUENCY (GHz) 12 Elizabeth Drive, Chelmsford, MA 01824 18 20 22 24 26 28 30 32 34 RF FREQUENCY (GHz) Phone: 978-250-3343 4 MIXERS 18 SMT CONVERSION GAIN (dB) -55 C -5 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 133 HMC264CB1 MICROWAVE CORPORATION HMC264CB1 SUB-HARMONIC SMT MIXER 21 - 30 GHz FEBRUARY 2001 V01.0500 Input IP3 vs. LO Drive @ Vdd = +3V Input IP3 vs. LO Drive @ Vdd = +4V 30 THIRD ORDER INTERCEPT (dBm) THIRD ORDER INTERCEPT (dBm) 30 25 -2 dBm 20 15 10 5 -4 dBm 0 25 -2 dBm 20 15 10 5 -4 dBm 0 -6 dBm -6 dBm -5 -5 4 18 20 22 24 26 28 30 32 18 34 20 22 26 28 30 32 34 Input IP2 vs. LO Drive, Vdd = +3V 70 SECOND ORDER INTERCEPT (dBm) SECOND ORDER INTERCEPT (dBm) Input IP2 vs. LO Drive, Vdd = +4V -6 dBm 60 50 40 30 -2 dBm 20 -4 dBm 10 0 80 -6 dBm 70 60 50 40 30 -2 dBm 20 -4 dBm 10 0 18 20 22 24 26 28 30 32 34 18 20 22 RF FREQUENCY (GHz) 24 26 28 30 32 34 RF FREQUENCY (GHz) P1dB Input, Vdd = +4V @ LO= -4 dBm P1dB Input, Vdd = +3V @ LO = -4dBm 7 7 6 6 5 5 4 4 P1dB (dBm) P1dB (dBm) MIXERS SMT 24 RF FREQUENCY (GHz) RF FREQUENCY (GHz) 3 2 1 3 2 1 0 0 -1 -1 -2 -2 -3 -3 18 20 22 24 26 28 30 32 34 RF FREQUENCY (GHz) 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 134 18 20 22 24 26 28 30 32 34 RF FREQUENCY (GHz) Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com HMC264CB1 MICROWAVE CORPORATION HMC264CB1 SUB-HARMONIC SMT MIXER 21 - 30 GHz V01.0500 FEBRUARY 2001 Upconverter Performance Conversion Gain, LO= -4 dBm IF Bandwidth @ LO= -4 dBm, vs. Vdd 0 0 IF CONVERSION GAIN (dB) CONVERSION GAIN (dB) Vdd=+4V -5 -10 -15 -20 Vdd = +3V -5 -10 -15 Vdd = +4V -20 Vdd=+3V -25 -25 22 24 26 28 30 32 34 0 1 2 RF FREQUENCY (GHz) 5 6 7 8 9 10 IF Return Loss @ LO= -4 dBm, Vdd= +4V 0 0 -5 -5 RETURN LOSS (dB) RETURN LOSS (dB) 4 -10 -15 RF -20 -10 -15 IF -20 -25 -25 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 FREQUENCY (GHz) 0 2 4 6 8 10 IF FREQUENCY (GHz) MXN Spurious Outputs @ LO Drive = -4 dBm, Vdd = +4V mRF -3 -2 -1 0 1 2 3 nLO ±3 ±2 ±5 ±4 34.8 61.8 26.1 32.6 ±1 0 14.1 -26.9 X 33.8 12.3 78.8 49.0 81.3 4 IF FREQUENCY (GHz) RF & LO Return Loss @ LO= -4 dBm, Vdd = +4V LO 3 MIXERS 20 SMT 18 48.1 RF = 30 GHz @ -10 dBm LO = 13.5 GHz @ -4 dBm All values in dBc below IF power level 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 135 HMC264CB1 MICROWAVE CORPORATION HMC264CB1 SUB-HARMONIC SMT MIXER 21 - 30 GHz V01.0500 FEBRUARY 2001 Schematic Absolute Maximum Ratings RF (20 - 30 GHz) Vdd (+3 to +4V) +13 dBm LO Drive (Vdd = +5V) +13 dBm V dd +5.5 Vdc Storage Temperature -65 to +150 deg C Operating Temperature -55 to +85 deg C LO In (10 - 15 GHz @-4 dBm TYP.) Outline Drawing ( See, Mounting, Note Page 4 - 137) SMT MIXERS 4 IF (DC - 4 GHz) RF / IF Input (Vdd = +5V) 1. MATERIAL: PACKAGE BODY: WHITE ALUMINA (99.0%) BALL CONTACTS : SILVER-COPPER BALL, EUTECTICALLY ATTACHED LID : PLASTIC, B-STAGE EPOXY ATTACHED 2. PLATING : ELECTROLYTIC GOLD 50-225 MICROINCHES OVER ELECTROLYTIC NICKEL 75 TO 225 MICROINCHES. 3. DIMENSIONS ARE IN INCHES (MILLIMETERS).UNLESS OTHERWISE SPECIFIED ALL TOLERANCES ARE ± 0.005 (± 0.13). 4. ALL UNLABELED BALL CONTACTS ARE GROUND. 5. ALL GROUNDS MUST BE SOLDERED TO THE PCB RF GROUND 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 136 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com HMC264CB1 MICROWAVE CORPORATION HMC264CB1 SUB-HARMONIC SMT MIXER 21 - 30 GHz V01.0500 FEBRUARY 2001 Mounting The BGA package is back-metallized and can be mounted with either eutectic solder or electrically conductive epoxy. The mounting surface should be clean and flat. Placement of the BGA package can be done manually or with available automatic placement machines. Eutectic Attach: Electrically conductive epoxy may be applied in the same manner as mentioned above. Again geometry and process parameters should be such as to supply sufficient epoxy around each of the balls of the package without shorting RF/DC ball signal contact . Cure the epoxy per the recommended manufacture's schedule. Handling Precautions: Follow these precautions to avoid permanent damage. Cleanliness: Handle the devices in a clean environment. Static Sensitivity: Follow ESD precautions to protect against ESD strikes ( see page 8 - 2 ). Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the BGA package along the edges with a vacuum collet or with a sharp pair of bent tweezers. Avoiding damaging the solder balls on the package bottom. 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 137 MIXERS Epoxy Attach: 4 SMT Eutectic solder paste may be applied manually or automatically by screen print/dispense methods to the PCB. Geometry and process should be such as to supply sufficient solder volume to obtain adequate solder fillets around the balls of the package after reflow without shorting RF/DC ball signal contacts. The solder should be reflowed in an infrared reflow oven with the appropriate temperature profile for that solder. The finished fillet should resemble a cylindrical column with a flared pedestal at the substrate surface when viewed from the side. Do not expose the BGA package to temperature greater than 220oC for more than 20 seconds.