The documentation and process conversion measures necessary to comply with this revision shall be completed by 1 June 1999. INCH-POUND MIL-PRF-19500/6C 1 March 1999 SUPERSEDING MIL-S-19500/6B 28 December 1971 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, GERMANIUM, LOW-POWER, TYPES 2N43AZ1, 2N43AZ2, 2N44AZ1 AND 2N44AZ2 This Specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for PNP, germanium, low-power transistor. One level of product assurance is provided for each device type as specified in MIL-PRF-19500. 1.2 Physical dimensions. See figure 1 (Z1 suffix) and figure 2 (Z2 suffix). 1.3 Maximum ratings. PT 1/ TA = +25°C VCB VEB VCEO TJ TSTG mW V dc V dc V dc °C °C 150 -45 -5 -30 +85 -55 to +100 1/ Derate linearly 2.50 mW/°C for TA > +25°C. 1.4 Primary electrical characteristics at TA = +25°C. Limits Types 1/ hfe VCE = -5 V dc IE = 1.0 mA dc hib VCB = -5 V dc IE = 1.0 mA dc hob VCB = -5 V dc IE = 1.0 mA dc fhfb Cobo 100 kHz <f < 1 MHz VCB = -5 V dc IE = 0 Cobo VCB = -5 V dc IE = 1. f = 1 kHz Ω µmho MHz pF dB Min 2N43A 2N44A 30 16 25 27 0.1 0.1 0.5 0.5 20 20 - Max 2N43A 2N44A 66 38 35 38 1.5 1.5 3.5 3.0 60 60 20 15 1/ Applies to both package configurations. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad St., Columbus, OH 43216-5000, by using the addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A Distribution Statement A. Approved for public release; distribution is unlimited. FSC 5961 MIL-PRF-19500/6C Dimensions Symbol CD CH HD HT LC LD LL LS1 LS2 LU Inches Min .322 .185 .430 .020 .086 .016 1.50 .137 .041 .016 Max .345 .250 .460 .045 .106 .026 1.75 .151 .055 .019 Millimeters Min Max 8.18 8.76 4.70 6.35 10.92 11.68 .51 1.14 2.18 2.69 0.41 0.66 38.10 44.45 3.48 3.84 1.04 1.40 0.41 0.48 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Measured in the zone .050 (1.27 mm) and .250 (6.35 mm) from the seating plane. 4. Measured in the zone beyond .250 (6.35 mm) from the seating plane. 5. The base shall be connected to the case. 6. All 3 leads. 7. In accordance with ANSI Y14.5M, diameters are equivalent to φx symbology. FIGURE 1. Physical dimensions (suffix "Z1"). 2 Note 4,6 6 3,6 MIL-PRF-19500/6C Symbol CD CH HD LC LD LL LU L1 L2 Q TL TW r α Dimensions Inches Millimeters Min Max Min Max .305 .335 7.75 8.51 .240 .260 6.10 6.60 .335 .370 8.51 9.40 .100 TP 2.54 TP .016 .021 0.41 0.53 1.50 1.75 38.10 44.45 .016 .019 0.41 0.48 --.050 --1.27 .250 --6.35 ----------.029 .045 0.74 1.14 .028 .034 0.71 0.86 --.007 --0.18 45° TP 45° TP Note 6 7,8 7,8 7,8 7,8 7,8 5 3,4 3 10 6 NOTES: 1. Dimension are in inches. 2. Metric equivalents are given for general information only. 3. Beyond r (radius) maximum, TL shall be held for a minimum length of .011 (0.28 mm). 4. Dimension TL measured from maximum HD. 5. Body contour optional within zone defined by HD, CD, and Q. 6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. The device may be measured by direct methods or by the gauge and gauging procedure shown in figure 2. 7. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in L1 and beyond LL minimum. 8. All three leads. 9. The collector shall be internally connected to the case. 10. Dimension r (radius) applies to both inside corners of tab. 11. In accordance with ANSI Y14.5M, diameters are equivalent to φx symbology. 12. Lead 1 = emitter, lead 2 = base, lead 3 = collector (base is connected to the case). FIGURE 2. Physical dimensions (suffix "Z2"). 3 MIL-PRF-19500/6C 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF19500. 3.3 Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall be as specified in MIL-PRF-19500, and figures 1 and 2 herein. 3.3.1 Lead finish. Lead finish shall be solderable as defined in MIL-PRF-19500. 3.3.2 Package outline. This specification contains two standard packages. Any user of this specification that has a specific package outline requirement shall specify their package suffix preference in the document purchase order. If package style is not specified, the manufacturer may supply either package (see 6.2). 3.4 Marking. Marking shall be in accordance with MIL-PRF-19500. 3.4.1 Package identifiers. Devices shall be marked with a suffix to designate the package type: "Z1" suffix for packages conforming to figure 1, "Z2" suffix for devices conforming to figure 2 (See 6.3). 3.5 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing on the applicable qualified products list before contract award (see 4.2 and 6.2). 3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in paragraph 1.3, 1.4, and table I. 3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in paragraphs 4.4.2 and 4.4.3. 4 MIL-PRF-19500/6C 4. VERIFICATION 4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Conformance inspection (see 4.3). 4.2 Qualification inspection. Qualification inspection shall consist of groups A, B, and C inspections. 4.3 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as specified herein. 4.3.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I herein. 4.3.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table VIb (JAN) of MIL-PRF-19500. Electrical measurements (end-points) shall be in accordance with group A, subgroup 2 . Subgroup Method Condition B2 1051 Test condition B, except step 3, TA = +100° B3 1037 VCB = -15 V dc; PT = 150 mW, TA = 25°C, t = 340 hours, ton = toff = 3 minutes minimum for 2,000 cycles. No heat sink or forced-air cooling on devices shall be permitted. B5 3151 RθJA = 0.40 °C/mW 4.3.3 Group C inspection, Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table VII (JAN) of MIL-PRF-19500, and herein for group C testing. Electrical measurements (end points) shall be in accordance with group A, subgroup 2. Subgroup Method Condition C2 2036 Test condition E. C6 1037 VCB = -15 V dc; PT = 150 mW, TA = 25°C, t = 340 hours, ton = toff = 3 minutes minimum for 2,000 cycles. No heat sink or forced-air cooling on devices shall be permitted. 4.4 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.4.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 5 MIL-PRF-19500/6C TABLE I. Group A inspection . Inspection 1/, 2/ MIL-STD-750 Limit Unit Symbol Method Conditions Min Max Subgroup 1 Visual and mechanical examination 2071 Subgroup 2 Collector to base cutoff current 3036 Bias condition D; VCB = -45 V dc; ICBO -16 µA dc Emitter to base cutoff current 3061 Bias condition D; VEB = -5.0 V dc; IEBO -10 µA dc Breakdown voltage, collector to emitter 3011 Bias condition B; IC = -0.6 mA dc; RBE = 10 kΩ V(BR)CER Floating Potential 3020 VCB = -30 V dc; voltmeter input resistance ≥ 1MΩ VEBF -1.0 V dc Collector to emitter voltage (saturated) 3071 Bias condition C; VCE = 50 V dc VCE (sat) -0.16 V dc -0.32 -0.34 V dc V dc 2N43A 2N44A -30 V dc IC = -20 mA dc, IB = -1.3 mA dc IC = -20 mA dc, IB = -2.0 mA dc Base to emitter voltage (saturated) 2N43A 2N44A 3066 Forward-current transfer ratio 2N43A 2N44A 3076 Forward-current transfer ratio 2N43A 2N44A 3076 Test condition B; IC = -20 mA dc, VCE = -1.0 mA dc VCE = -1.0 V dc; IC = -20 mA dc VBE hFE 34 18 VCE = -1.0 V dc; IC = -100 mA dc 65 43 hFE 30 13 Subgroup 3 High temperature operation Collector to base cutoff current TA = +150°C 3036 Low temperature operation Forward-current transfer ratio Bias condition D;VCB = 60 V dc ICBO 225 µA dc 20 15 dB dB TA = -55°C 3076 VCE = 10 V dc; IC = 10 mA dc 2N43A 2N44A See footnotes at end of table. 6 hFE6 MIL-PRF-19500/6C TABLE I. Group A inspection - continued. Inspection 1/, 2/ MIL-STD-750 Limit Unit Symbol Method Conditions Min Max 30 16 66 38 25 27 35 38 Ω Ω 0.1 1.5 µmho 1 1 15 13 x 10 -4 x 10 0.5 0.5 3.5 3.0 MHz MHz 20 60 pF 20 15 dB dB Subgroup 4 Small-signal short-circuit forward current transfer ratio 3206 VCE = -5.0 V dc; IC = 1.0 mA dc hfe 2N43A 2N44A Small-signal short-circuit input impedance 3201 VCB = -5.0 V dc; IE = 1.0 mA dc hib 2N43A 2N44A Small-signal open-circuit output admittance 3216 VCB = -5.0 V dc; IE = 1.0 mA dc hob Small-signal open-circuit reverse-voltage transfer ratio 3211 VCB = -5.0 V dc; IE = 1.0 mA dc hrb 2N43A 2N44A Small-signal short-circuit input forward-current transfer-ratio cutoff frequency 3301 VCB = -5.0 V dc; IE = 1.0 mA dc fhfb 2N43A 2N44A Open circuit output capacitance 3236 VCB = -5.0 V dc; IE = 0 mA; 100 kHz ≤ f ≤ 1 MHz Cobo Noise figure 2N43A 2N44A 3246 VCB = -5.0 V dc; IE = 1.0 mA dc NF Subgroups 5 and 6 Not required 1/ For sampling plan see MIL-PRF-19500. 2/ Applies to both package configurations. 7 -4 MIL-PRF-19500/6C 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Department or Defense Agency, or within the Military Department's System Command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-STD-129. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Issue of DODISS to be cited in the solicitation and, if required, the specific issue of individual documents referenced (see 2.2.1). b. Lead finish (see 3.3.1). c. Type designation and product assurance level. d. Packaging requirements (see 5.1). 6.3 Substitution information. Devices previously covered by this specification, 2N43A and 2N44A, have been replaced by 2N43AZ1 and 2N44AZ1 respectively. 6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Products List QPL-19500 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from Defense Supply Center Columbus, DSCC-VQE, 3990 East Broad St., Columbus, OH 43216. CONCLUDING MATERIAL Custodians: Army - CR Navy - EC Air Force - 85 NASA - NA Preparing activity: DLA - CC (Project 5961-2100) Review activities: Army - AR, MI, SM Navy - AS, CG, MC, OS, SH Air Force - 19 8 MIL-PRF-19500/6C STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL INSTRUCTIONS 1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, 6, and 7. 3. The preparing activity must provide a reply within 30 days from receipt of the form. NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. I RECOMMEND A CHANGE: 1. DOCUMENT NUMBER MIL-PRF-19500/6C 2. DOCUMENT DATE 1 March 1999 3. SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, GERMANIUM, LOW-POWER, TYPES 2N43AZ1, 2N43AZ2, 2N44AZ1 AND 2N44AZ2 4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.) 5. REASON FOR RECOMMENDATION 6. SUBMITTER a. NAME (Last, First, Middle initial) c. ADDRESS (Include Zip Code) b. ORGANIZATION d. TELEPHONE (Include Area Code) Commercial DSN FAX EMAIL 7. DATE SUBMITTED 8. PREPARING ACTIVITY a. Point of Contact Alan Barone c. ADDRESS Defense Supply Center Columbus ATTN: DSCC-VAT Columbus, OH 43216-5000 DD Form 1426, OCT 89 b. TELEPHONE Commercial DSN 614-692-0510 850-0510 FAX 614-692-6939 EMAIL [email protected] IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT: Defense Quality and Standardization Office 5203 Leesburg Pike, Suite 1403, Falls Church, VA 22041-3466 Telephone (703) 756-2340 DSN 289-2340 Previous editions are obsolete 9