REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Added RadHard and class K devices. Added RadHard requirements. Redrew entire document. -sld 97-10-29 K. A. Cottongim E Table I; Changed the min and max limits for Radhard levels L,R device type 02 for the following tests +VOUT, -VOUT. Changed the max limits for VRLINE, VRLOAD, IIN, and Eff. For the IRIP test separate subgroups 1,2,3 to subgroup 1 for device type 01 max limit of 60 mAp-p and for subgroups 2 and 3 the max limit of 100 mA. For the IRIP test separate subgroups 1,2,3 to subgroup 1 for device type 02 max limit of 80 mAp-p and for subgroup 2 and 3 the max limit of 120 mAp-p. 98-02-04 K. A. Cottongim F Made correction to paragraph 4.3.5.a. Updated paragraph 1.2.3 to define the five reliability class levels. Made changes to table I format. -sld 01-03-21 Raymond Monnin G Added case outline Y, bathtub style package. -sld 01-08-21 Raymond Monnin REV SHEET REV G SHEET 15 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve L. Duncan STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 CHECKED BY Michael Jones http://www.dscc.dla.mil APPROVED BY Gregory A. Lude MICROCIRCUIT, HYBRID, LINEAR, 12 VOLT, DUAL CHANNEL, DC/DC CONVERTER DRAWING APPROVAL DATE 92-08-18 REVISION LEVEL G SIZE A SHEET CAGE CODE 5962-92144 67268 1 OF DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 15 5962-E595-01 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ 92144 RHA designator (see 1.2.1) 01 Device type (see 1.2.2) H Device class designator (see 1.2.3) / X Case outline (see 1.2.4) X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 Generic number Circuit function MHF+2812D/883,MHF+2812DF/883 SMHF2812D,SMHF2812DF DC-DC converter, 15 W, ±12 V output DC-DC converter, 15 W, ±12 V output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Z Descriptive designator See figure 1 See figure 1 See figure 1 Terminals Package style 8 8 8 Dual-in-line, Platform Dual-in-line, Bathtub Flange mount, Platform 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage range .................................................................... Power dissipation (PD): Device types 01 and 02 (non-RHA)........................................ Device type 02 (RHA levels L and R) .................................... Output power ............................................................................. Lead soldering temperature (10 seconds) ................................. Storage temperature range........................................................ -0.5 V dc to +50 V dc 6W 8.5 W 15.26 W +300°C -65°C to +150°C 1.4 Recommended operating conditions. Input voltage range .................................................................... +16 V dc to +40 V dc Case operating temperature range............................................ -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Microcircuit Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's). MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 3 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Output voltage +VOUT Conditions 1/ -55°C ≤ TC ≤ +125°C VIN = 28 V dc ±0.5 V, CL = 0 unless otherwise specified Group A subgroups ±IOUT = 625 mA L,R Device types Unit Limits Min Max 1 01,02 11.88 12.12 2,3 01,02 11.76 12.24 1,2,3 02 11.40 12.60 1 01,02 -11.82 -12.18 2,3 01,02 -11.70 -12.30 1,2,3 02 -11.34 -12.66 1,2,3 01,02 0.0 0.875 1,2,3 02 0.0 0.875 1,2 01 80 02 175 01 120 02 275 1,2,3 02 350 1,2,3 01,02 50 1,2,3 02 100 1,2,3 01,02 100 1,2,3 02 200 1,2,3 01,02 50 1,2,3 02 100 1,2,3 01 100 02 150 02 300 V ` -VOUT L,R Output current 2/ IOUT VIN = 16 V dc to 40 V dc L,R VOUT ripple voltage VRIP ±IOUT = 625 mA, B.W. = 10 kHz to 2MHz A mV p-p (±VOUT) 3 L,R VOUT line regulation +VOUT VRLINE ±IOUT = 625 mA, VIN = 16 V dc to 40 V dc L,R -VOUT L,R VOUT load regulation +VOUT VRLOAD ±IOUT = 0 to 625 mA, both outputs changed simultaneously L,R -VOUT L,R 1,2,3 mV mV See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Cross regulation 3/ (-VOUT) XREG Group A subgroups Conditions 1/ -55°C ≤ TC ≤ +125°C VIN = 28 V dc ±0.5 V, CL = 0 unless otherwise specified Device types Min 1 50% IOUT = 625 mA, +IOUT = 50% to 10%, -IOUT = 50% 1 6 02 L,R 10 ±IOUT = 0, inhibit pin (pin 1) = 0 V dc 01,02 12 02 15 01,02 50 02 100 01 60 02 80 01 100 02 120 1,2,3 02 150 1 01,02 76 2,3 01,02 74 1,2,3 02 70 1 01,02 100 02 100 1,2,3 L,R ±IOUT = 0, inhibit pin (pin 1) = open L,R Input ripple current IRIP ±IOUT = 625 mA, LIN = 2 µH, B. W. = 10 kHz to 10 MHz 1 2,3 L,R Efficiency Eff ±IOUT = 625 mA L,R Isolation ISO % 6 50% IOUT = 625 mA, +IOUT = 70% to 30%, -IOUT = 30% to 70% IIN Max 6 01 50% IOUT = 625 mA, -IOUT = 50% to 10%, +IOUT = 50% Input current Unit Limits Input to output, input to case, or output to case, 500 V dc, TC = +25°C L,R mA mA p-p % MΩ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Short circuit internal power dissipation PD Conditions 1/ -55°C ≤ TC ≤ +125°C VIN = 28 V dc ±0.5 V, CL = 0, unless otherwise specified PD = PIN - total POUT Group A subgroups 1,2,3 FS L,R Sync range 4/ FSYNC VOTLOAD VOUT recovery time, from step transient load changes 5/ 6/ +VOUT TTLOAD 50% load to/from 100% load; balanced loads on each output +IOUT = 625 mA to 313 mA, -IOUT = 625 mA -IOUT = 313 mA to 625 mA, +IOUT = 625 mA -IOUT = 625 mA to 313 mA, +IOUT = 625 mA kHz 5,6 01,02 480 620 4,5,6 02 400 700 4,5,6 01,02 500 600 02 500 600 01,02 -600 +600 02 -1200 +1200 4,5,6 4,5,6 4,5,6 4,5,6 L,R -VOUT 8.5 600 L,R -VOUT W 500 L,R +VOUT 6 01,02 L,R +IOUT = 313 mA to 625 mA, -IOUT = 625 mA Max 4 L,R VOUT response to step transient load changes 5/ ±VOUT 01,02 02 ±IOUT = 625 mA Unit Limits Min L,R Switching frequency Device types 4,5,6 L,R 01 200 02 500 02 1200 01 500 02 500 02 1200 01 200 02 500 02 1200 01 500 02 500 02 1200 kHz mV pk µs See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol VOUT response to transient step line changes 7/ 8/ VOTLINE Conditions 1/ -55°C ≤ TC ≤ +125°C VIN = 28 V dc ±0.5 V, CL = 0 unless otherwise specified VIN = 16 V dc to 40 V dc, ±IOUT = 625 mA Group A subgroups 4,5,6 L,R VIN = 40 V dc to 16 V dc, ±IOUT = 625 mA L,R VOUT recovery time from step transient line changes 6/ 7/ 8/ TTLINE VIN = 16 V dc to 40 V dc, ±IOUT = 625 mA 4,5,6 L,R VIN = 40 V dc to 16 V dc, ±IOUT = 625 mA L,R Start up delay 9/ TonD 4,5,6 VIN = 0 to 40 V dc, ±IOUT = 625 mA VtonOS Load fault recovery 6/ 7/ TrLF ±IOUT = from S.C. to 625 mA L,R Capacitive load, (both outputs) 7/ 10/ CL Min Max 01,02 -750 +750 02 -1500 +1500 01,02 -750 +750 02 -1500 +1500 01,02 1.2 02 2.4 01,02 1.2 02 2.4 mV pk ms ms 25 02 50 4 01,02 500 5,6 01,02 750 4,5,6 02 1500 4,5,6 01,02 50 4,5,6 02 100 4 01,02 10 4 02 10 VIN = 0 to 40 V dc, ±IOUT = 625 mA L,R Unit Limits 01,02 L,R Start up overshoot 7/ Device types No effect on dc performance, TC = +25°C L,R mV pk ms µf See footnotes at top of next page. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 8 TABLE I. Electrical performance characteristics - Continued. 1/ Post irradiation testing shall be in accordance with 4.3.5 herein. 2/ For device type 01 the total output power available is 90 percent from either output up to 13.5 W, providing the opposite output is simultaneously carrying 10 percent of the total output power. For device type 02 the total output power available is 70 percent from either output up to 10.5 W providing the opposite output is simultaneuosly carrying 30 percent of the total output power. Each output must carry a minimum of 10 percent of the total output power in order to maintain regulation on the negative output. 3/ Cross regulation is the percent change in the measured -VOUT relative to the magnitude of -VOUT when the loads are equal and at full load, ±7.5 W. 4/ A TTL level waveform (VIH = 4.5 V minimum, VIL = .8 V maximum) with a 50 percent ±10 percent duty cycle applied to the sync input pin (pin 5) within the sync range frequency shall cause the converters switching frequency to become synchronous with the frequency applied to the sync input pin (pin 5). 5/ Load step transition greater than 10 microseconds. 6/ Recovery time is measured from the initiation of the transient to where V OUT has returned to within ±1 percent of its final value. 7/ Parameter shall be tested as part of design characterization and after design or process changes. Therefore, the parameter shall be guaranteed to the limits specified in table I. 8/ Input step transition time greater than 10 microseconds. 9/ Start up delay time measurement is for either a step application of power at the input or the removal of a ground signal from the inhibit pin (pin 1) while power is applied to the input. 10/ Capacitive load may be any value from 0 to the maximum limit without compromising dc performance. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 9 Cases X and Y Symbol Millimeters Min A Inches Max Min 8.38 ∅b D 0.64 36.70 Max .330 0.89 36.96 .025 1.445 .035 1.455 e 5.08 5.33 .200 .210 e1 12.70 12.95 .500 .510 e2 17.78 18.03 .700 .710 e3 22.86 23.11 .900 .910 e4 27.94 28.19 1.100 1.110 1.125 E 28.32 28.58 1.115 E1 20.19 20.44 .795 .805 L 6.10 6.60 .240 .260 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inchpound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Case outlines X and Y weight: 30 grams maximum. 3. Available in a platform package, case outline X or bathtub package, case outline Y . FIGURE 1. Case outline(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 10 Case Z Symbol Millimeters Min A Inches Max Min Max 8.38 A1 ∅b D 0.94 0.64 1.45 0.89 D1 43.82 44.07 .330 .037 .025 .057 .035 1.725 1.735 50.80 D2 2.000 36.83 1.450 e 8.64 8.89 .340 .350 e1 16.26 16.51 .640 .650 e2 21.37 21.59 .840 .850 e3 26.41 26.67 1.040 1.050 e4 31.50 31.75 1.240 1.250 E 28.70 1.130 E1 20.07 20.57 .790 .810 L 6.10 6.60 .240 .260 ∅p 3.20 3.30 .126 .130 R 3.18 3.43 .125 .135 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inchpound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Case outline Z weight: 30 grams maximum. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 11 Device types 01 and 02 Case outlines X , Y, and Z Terminal number Terminal symbol 1 Inhibit 2 Positive output 3 Output return 4 Negative output 5 Sync input 6 Case ground 7 Input return 8 Input FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 12 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters Final electrical parameters 1*, 2, 3 ,4, 5, 6 Group A test requirements 1, 2, 3, 4, 5, 6 Group C end-point electrical parameters 1 1, 2, 3, 4, 5, 6 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices * PDA applies to subgroup 1. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 7, 8 , 9, 10, and 11shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 13 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA). RHA qualification is required only for those devices with the RHA designator as specified herein. RHA level L RHA level R Units Total ionizing dose tolerance level 50 100 kRad(Si) Single event upset survival level (LET) No guarantee 40 MeV a. Radiation dose rate is in accordance with condition C of method 1019 of MIL-STD-883. Unless otherwise specified, components are tested at a rate of 9 rad(Si)/s, in accordance with method 1019 of MIL-STD-750 or MIL-STD-883, as applicable. b. The manufacturer shall perform a worst-case and radiation susceptibility analysis on the device. This analysis shall show that the minimum performance requirements of each component has adequate design margin under worst-case operating conditions (extremes of line voltage, temperatures, load, frequency, radiation enviroment, etc.). This analysis guarantees the post-irradiation parameter limits specified in table I. c. RHA testing shall be performed at the component level for initial device qualification, and after design changes that may affect the RHA performance of the device. As an alternative to testing, components may be procured to manufacturer radiation guarantees that meet the minimum performance requirements. Component radiation performance guarantees shall be established in compliance with MIL-PRF-19500, Group D or MIL-PRF-38535, Group E, as applicable. For components with less than adequate performance margin, component lot radiation acceptance screening shall be performed. d. The manufacturer shall establish procedures controlling component radiation testing, and shall establish radiation test plans used to implement component lot qualification during procurement. Test plans and test reports shall be filed and controlled in accordance with the manufacturer's configuration management system. e. The device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to monitor design changes for continued compliance to RHA requirements. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 14 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0512. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-92144 A REVISION LEVEL G SHEET 15 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 01-08-21 Approved sources of supply for SMD 5962-92144 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. 1/ 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9214401HXA 5962-9214401HXC 5962-9214401HYA 5962-9214401HYC 5962-9214401HZA 5962-9214401HZC 50821 50821 50821 50821 50821 50821 MHF+2812D/883 MHF+2812D/883 MHF+2812D/883-MOD MHF+2812D/883-MOD MHF+2812DF/883 MHF+2812DF/883 5962-9214402HXA 5962-9214402HXC 5962-9214402HZA 5962-9214402HZC 50821 50821 50821 50821 SMHF2812D/HO SMHF2812D/HO SMHF2812DF/HO SMHF2812DF/HO 5962L9214402HXA 5962L9214402HXC 5962L9214402HZA 5962L9214402HZC 50821 50821 50821 50821 SMHF2812D/HL SMHF2812D/HL SMHF2812DF/HL SMHF2812DF/HL 5962R9214402HXA 5962R9214402HXC 5962R9214402HZA 5962R9214402HZC 50821 50821 50821 50821 SMHF2812D/HR SMHF2812D/HR SMHF2812DF/HR SMHF2812DF/HR 5962L9214402KXA 5962L9214402KXC 5962L9214402KZA 5962L9214402KZC 50821 50821 50821 50821 SMHF2812D/KL SMHF2812D/KL SMHF2812DF/KL SMHF2812DF/KL 5962R9214402KXA 5962R9214402KXC 5962R9214402KZA 5962R9214402KZC 50821 50821 50821 50821 SMHF2812D/KR SMHF2812D/KR SMHF2812DF/KR SMHF2812DF/KR The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not specified contact the vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 50821 Vendor name and address Interpoint Corporation 10301 Willows Road Redmond, WA 98073-9705 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.