AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application Datasheet Revision 0.0 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application Table of Contents 1. OVERVIEW................................................................................................................................................................ 1 2. APPLICATIONS ........................................................................................................................................................ 1 2.1. TARGET APPLICATIONS ...................................................................................................................................................... 1 2.2. APPLICATION FEATURES..................................................................................................................................................... 1 2.2.1 DOCKING CONTROL FEATURES ...................................................................................................................................... 1 2.2.2 CLOCK AND ALARM FEATURES ....................................................................................................................................... 1 2.2.3 RADIO FEATURES ........................................................................................................................................................... 1 2.2.4 OTHER SYSTEM FEATURES ............................................................................................................................................ 1 3. ORDERING INFORMATION ..................................................................................................................................... 1 4. PIN CONFIGURATION.............................................................................................................................................. 1 5. BLOCK DIAGRAM .................................................................................................................................................... 2 6. BUILT IN PERIPHERALS ......................................................................................................................................... 2 7. PIN DESCRIPTION ................................................................................................................................................... 3 8. ELECTRICAL SPECIFICATION ............................................................................................................................... 5 8.1. 8.2. 8.3. 8.4. ABSOLUTE MAXIMUM RATING............................................................................................................................................. 5 RECOMMENDED OPERATING CONDITION ........................................................................................................................... 5 LEAKAGE CURRENT AND CAPACITANCE ............................................................................................................................ 5 DC ELECTRICAL CHARACTERISTICS .................................................................................................................................. 5 9. PACKAGE INFORMATION....................................................................................................................................... 6 10. SOLDERING INDICATION........................................................................................................................................ 7 1. 2. 3. 4. REFLOW SOLDERING .......................................................................................................................................................... 7 WAVE SOLDERING .............................................................................................................................................................. 7 MANUAL SOLDERING .......................................................................................................................................................... 7 SUITABILITY OF SURFACE MOUNT IC PACKAGES FOR WAVE AND REFLOW SOLDERING METHODS ............................... 9 Revision 0.0 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application 1. OVERVIEW 2.2.3 Radio Features The AP909 is a controller IC for docking application with remote control function and LCD driver. It has a built-in PLL controller for controlling external radio tuner IC to form a complete digital tuning system (DTS). AP909 also supports real time clock with 12/24 hour display format and dual alarm clock timer. Built-in with LCD driver and support for docking system of prevalent music players and mobile phones, AP909 is suitable for a wide range of audio applications that have build-in clock alarm, radio and docking features. • Auto/Manual radio station scanning • Programmable radio station memory ( independent memory slots for FM and AM ) 2. APPLICATIONS 2.2.4 Other System Features • Support 24 segment x 4 common or 6 common, 1/3 bias LCD display • Automatic detection of AC power • Low standby current 3. ORDERING INFORMATION 2.1. Target Applications ORDERING NUMBER AP909-LQ-L • Docking system • Clock radio • Bluetooth application PACKAGE LQFP 4. PIN CONFIGURATION 75 P71 74 P70 73 P63 72 P62 71 P61 70 P60 69 P53 68 P52 67 P51 66 P50 65 GND 64 P43 63 P42 62 P41 61 P40 60 P33 59 P32 58 P31 57 P30 56 P23 55 P22 54 P21 53 P20 52 P13 51 P12 2.2. Application Features 2.2.1 Docking Control Features • 12/24 hour clock display mode selectable by user • Dual alarm clocks • User selectable alarm mode – wake-to-buzzer, waketo-radio or wake-to-docked_device • Fixed snooze feature • Programmable sleep timer Page 1 of 10 P11 P10 P113 P112 ADCIO5 ADCIO4 ADCIO3 ADCIO2 ADCIO1 ADCIO0 W2 P133 P132 TESTB3 TESTB2 DTSPLLFLT GND IFIN AMIN FMIN VDD P103 P102 P101 P100 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 2.2.2 Clock and Alarm Features 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P72 76 P73 77 P80 78 P81 79 P82 80 P83 81 VLCD2 82 VLCD1 83 VLCD 84 ACIN 85 P120 86 P121 87 P122 88 P123 89 W3 90 PGM 91 ATONE 92 VDD 93 XOSCO 94 XOSCI 95 GND 96 P142 97 P143 98 P140 99 P141 100 P90 P91 P92 P93 RSTB PWRDET AVDD PLLFLT AGND GND P150 P151 VDD VPP P130 P131 WDTEN W0 W1 P00 P01 P02 P03 P110 P111 • Docking control through front panel buttons or remote controller • PLAY, PAUSE, STOP, FAST FORWARD, FAST BACKWARD, RANDOM, REPEAT functions • Device charging through docking system • Support Apple Authentication Coprocessor Revision 0.0 PINS 100 Figure 1 100-Pin LQFP Package of AP909 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application 5. BLOCK DIAGRAM The following diagram shows the system blocks embedded in AP909. CLOCK SYNTHESIZER XOSC DTS PLL CLKGEN RCOSC TIMER ADC SPI PROG PROM 32kx8x2 DATA RAM 2kx8 AC_DET UART I2C MS REMOTE MCU ROTARY SW EMU MCU EIRQ BUZZER GPIO & PIN MUX LCD Display GPIO & PIN MUX INTCON Figure 2 Internal Block Diagram of AP909 6. BUILT-IN PERIPHERALS • High performance 8 bit CPU o Support C language programming • 64 kbyte one time program ROM • 2 kbyte data RAM • Interrupt controller o 13 interrupt sources • Watchdog reset • Real time clock • Embedded RC oscillator • Programmable timer o 3 units • Pulse width modulation o 3 units • LCD driver o 24 segment x 4 common or 6 common, 1/3 bias LCD display • DTS PLL unit Revision 0.0 • 6-bit ADC o 6 channels • AC line frequency detection unit • External interrupt o 4 channels • IR remote transmit and receive control unit • Buzzer unit o output level control available • Rotary type switch counter unit • UART interface o 2 units • I2C interface o 3 channels • SPI interface o 1 channel • Selectable oscillator option o XOSC : low speed 32.768kHz / 75kHz crystal o RCOSC: 3.7MHz internal RC oscillator Page 2 of 10 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application 7. PIN DESCRIPTION Pin Name Alternative Function Type Pullup /down 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 P90 P91 P92 P93 RSTB PWRDET AVDD PLLFLT AGND GND P150 P151 VDD VPP P130 P131 WDTEN W0 W1 P00 P01 P02 P03 SPIDIO SPICLK SPIDI IO,S IO,S IO,S IO,S I,S IA PU PU PU PU U 24 OA IO,S IO,S I2CCLK0 I2CDAT0 PWMO2 REMO IO,S IO,S I,S IO,S IO,S IO,S IO,S IO,S IO,S PU PU U PU PU PU PU PU PU P110 RCK IO,S PU 25 P111 RCD IO,S PU 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 P100 P101 P102 P103 VDD FMIN AMIN IFIN GND DTSPLLFLT TESTB2 TESTB3 P132 P133 W2 ADCIO0 ADCIO1 ADCIO2 ADCIO3 ADCIO4 ADCIO5 P112 P113 P10 P11 TX0 RX0 BOUT0 PWMO1 IO,S IO,S IO,S IO,S PU PU PU PU I2CCLK1 I2CDAT1 TONE BOUT1 OA I,S I,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S 51 P12 COM6 / TX1 IO,S,L PU 52 P13 COM5 / RX1 IO,S,L PU 53 54 55 56 57 58 P20 P21 P22 P23 P30 P31 COM4 COM3 COM2 COM1 SEG1 SEG2 IO,S,L IO,S,L IO,S,L IO,S,L IO,S,L IO,S,L PU PU PU PU PU PU Revision 0.0 RDSCLK IA IA IA TONE U U PU PU PU PU PU PU PU Page 3 of 10 Descriptions General purpose IO port / SPI data IO General purpose IO port / SPI clock IO General purpose IO port / SPI data input General purpose IO port Active low chip reset input Low-voltage detect Analog supply voltage PLL filter Analog ground Ground General purpose IO port General purpose IO port Power supply Power supply General purpose IO port pin General purpose IO port pin Watchdog enable ( active high) General purpose IO port pin / external interrupt. General purpose IO port pin / external interrupt. General purpose IO port / I2C0 clock output General purpose IO port / I2C0 data IO port General purpose IO port / PWM Output 2 General purpose IO port / Remote receiver input General purpose IO port or rotary switch counter input General purpose IO port or rotary switch counter input General purpose IO port or UART0 TX output General purpose IO port or UART0 RX input General purpose IO port or UART0 clock output General purpose IO port pin / PWM output 1 Power supply FM input clock AM input clock IF input clock ground DTS PLL control voltage output Active low chip test enable Active low chip test enable General purpose IO port pin / buzzer General purpose IO port pin General purpose IO port pin / external interrupt. ADC input channel 0 / General purpose IO port ADC input channel 1 / General purpose IO port ADC input channel 2 / General purpose IO port ADC input channel 3 / General purpose IO port ADC input channel 4 / General purpose IO port ADC input channel 5 / General purpose IO port General purpose IO port pin / I2C1 clock output General purpose IO port pin / I2C1 data IO General purpose IO port pin / buzzer output General purpose IO port pin / UART1 clock *Note General purpose IO port / LCD common 6 / UART1 TX *Note General purpose IO port / LCD common 5 / UART1 RX *Note General purpose IO port / LCD common 4 General purpose IO port / LCD common 3 General purpose IO port / LCD common 2 General purpose IO port / LCD common 1 General purpose IO port / LCD segment 1 General purpose IO port / LCD segment 2 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application I O IO IA OA Pin Name Alternative Function Type Pullup /down 59 60 61 62 63 64 65 P32 P33 P40 P41 P42 P43 GND SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 IO,S,L IO,S,L IO,S,L IO,S,L IO,S,L IO,S,L PU PU PU PU PU PU 66 P50 SEG9 / LCDD0 IO,S,L PU 67 P51 SEG10 / LCDD1 IO,S,L PU 68 P52 SEG11 / LCDD2 IO,S,L PU 69 P53 SEG12 / LCDD3 IO,S,L PU 70 P60 SEG13 / LCDD4 IO,S,L PU 71 P61 SEG14 / LCDD5 IO,S,L PU 72 P62 SEG15 / LCDD6 IO,S,L PU 73 P63 SEG16 / LCDD7 IO,S,L PU 74 P70 SEG17 / LCDWRB IO,S,L PU 75 P71 SEG18 / LCDRDB IO,S,L PU 76 P72 SEG19 / LCDA0 IO,S,L PU 77 P73 SEG20 / LCDCSB IO,S,L PU 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 P80 P81 P82 P83 VLCD2 VLCD1 VLCD ACIN P120 P121 P122 P123 W3 TEST4 ATONE VDD XOSCO XOSCI GND SEG21 SEG22 SEG23 SEG24 IO,S,L IO,S,L IO,S,L IO,S,L PU PU PU PU I,S IO,S,L IO,S,L IO,S,L IO,S,L IO,S I,S OA U PU PU PU PU PU D 97 P142 PWMO3P IO,S PU 98 P143 PWMO3N IO,S PU 99 100 P140 P141 I2CCLK2 I2CDAT2 IO,S IO,S PU PU - Input pin - Output pin - Bidirectional pin - Analog input pin - Analog output pin TX1 RX1 BOUT1 IR_TX O I S (P)U (P)D L 0,1,Z Descriptions General purpose IO port / LCD segment 3 General purpose IO port / LCD segment 4 General purpose IO port / LCD segment 5 General purpose IO port / LCD segment 6 General purpose IO port / LCD segment 7 General purpose IO port / LCD segment 8 Ground General purpose IO port / LCD segment 9/ 8-bit MPU interface General purpose IO port / LCD segment 10 / 8-bit MPU interface General purpose IO port / LCD segment 11 / 8-bit MPU interface General purpose IO port / LCD segment 12 / 8-bit MPU interface General purpose IO port / LCD segment 13 / 8-bit MPU interface General purpose IO port / LCD segment 14 / 8-bit MPU interface General purpose IO port / LCD segment 15 / 8-bit MPU interface General purpose IO port / LCD segment 16 / 8-bit MPU interface General purpose IO port / LCD segment 17 / 8-bit MPU interface General purpose IO port / LCD segment 18 / 8-bit MPU interface General purpose IO port / LCD segment 19 / 8-bit MPU interface General purpose IO port / LCD segment 20 / 8-bit MPU interface General purpose IO port / LCD segment 21 General purpose IO port / LCD segment 22 General purpose IO port / LCD segment 23 General purpose IO port / LCD segment 24 1/3 x VLCD voltage 2/3 x VLCD voltage LCD driver supply voltage AC detection input General purpose IO port / UART1 TX *Note General purpose IO port / UART1 RX *Note General purpose IO port / UART1 clock output *Note General purpose IO port / IR TX output General purpose IO port pin / external interrupt. Active high chip test enable Buzzer output with level control Power supply 32.768kHz / 75kHz oscillator output 32.768kHz / 75kHz oscillator input Ground General purpose IO port / PWM3 complementary output 1 General purpose IO port / PWM3 complementary output 2 General purpose IO port pin / I2C2 clock output General purpose IO port / I2C2 data IO - CMOS Schmitt Trigger - (Programmable) Pull-up - (Programmable) Pull-down - LCD Pad - Logic state 0, Logic state 1,High impedance *Note: Depending on the UART1 control register’s content, either P12[2:0] or P1[3:1] can be used as the UART1 ports. Revision 0.0 Page 4 of 10 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application 8. ELECTRICAL SPECIFICATION 8.1. Absolute Maximum Rating Item Power Supply Voltage (logic) Power Supply Voltage (analog) Power Supply Voltage (LCD) Input Voltage Power Dissipation (Ta = 70°C) Storage Temperature Operating Temperature Symbol Rating Unit VDD AVDD VLCD/VLCD1/VLCD2 VIN Pd TSTG Topr -0.5 to 6.0 -0.5 to 6.0 -0.5 to 6.0 -0.5 to VDD+0.5 TBD -20 to 125 0 to 70 V V V V mW °C °C 8.2. Recommended Operating Condition Item Power Supply Voltage (logic) Power Supply Voltage (analog) Power Supply Voltage (LCD) Input Voltage (digital) Input Voltage (analog) Operating Temperature Symbol Min. Typ. Max. Unit VDD AVDD VLCD VLCD1 VLCD2 VIN VIN TOPR 2.7 2.7 VLCD2 0 0 0 0 - 3.6 3.6 VDD VLCD VLCD1 VDD VDD 70 V V V V V °C 8.3. Leakage Current and Capacitance Symbol IIN IOZ CIN CIN CBID *Note1: Parameter Condition Input current Tri-state leakage current Input capacitance *Note1 Output capacitance *Note1 Bidirectional buffer capacitance *Note1 No pull-up or pull-down Min. Typ. Max. Unit -10 -10 - - 10 10 5 5 5 μA μA pF pF pF capacitance value are specified without the package 8.4. DC Electrical Characteristics (VDD=3.3V±10%, AVDD=3.3V±10%, operating temperature = 0°C - 70°C unless specified otherwise) Symbol Parameter Condition Min. Typ. Max. Unit VDD AVDD VIH VIL RPU RPD VINA IOL IOH Idd_opr Idd_idle *Note2: *Note3: *Note4: Revision 0.0 Supply Voltage (logic) Supply Voltage (analog) Input high voltage Input low voltage Pull-up resistance Pull-down resistance FMIN,AMIN,IFIN input voltage Output low current Output high current Core operating current Clock Mode current Core operating mode Clock mode Core operating mode Clock mode VIN = 0V VIN = VDD VOL = 0.4V *Note4 VOH = VDD-0.4V *Note4 *Note2 VDD=3.3V, T=25°C *Note3 2.7 2.4 2.7 2.4 0.7*VDD 30k 30k 150 2.1 1.4 - 45k 45k 3.3 2.3 7 80 3.6 3.6 3.6 3.6 0.3*VDD 75k 75k 10 100 V V V V Ω Ω mVpp mA mA mA μA LCD is ON. The CPU clock source is from the internal PLL clock. No active load is being driven. All inputs = 0V or VDD. LCD is ON. The CPU clock source is from the 32kHz oscillator pads. No active load is being driven. All inputs = 0V or VDD. Excluding PLLFLT, ATONE, XOSC. Page 5 of 10 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application 9. PACKAGE INFORMATION Revision 0.0 Page 6 of 10 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application 10. SOLDERING INDICATION This section gives a very brief insight to a complex technology. There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 1. Reflow Soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. 2. Wave Soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used, the following conditions must be observed for optimal results: z Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. z For packages with leads on two sides and a pitch: – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printedcircuit board. The footprint must incorporate solder thieves at the downstream end. z For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 3. Manual Soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Revision 0.0 Page 7 of 10 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application 4. Suitability of Surface Mount IC Packages for Wave and Reflow Soldering Methods Package BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC (3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Soldering Method Wave Reflow (1) (2) Not suitable Suitable Not suitable Suitable Suitable Suitable Not recommended (3)(4) Suitable Not recommended (5) Suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch equal to or smaller than 0.5 mm. Revision 0.0 Page 9 of 10 August 25, 2008 AP909 OTP Microcontroller with LCD Driver for Wireless Audio Docking Application Valence Semiconductor Design Limited Unit 2001, 20/F, APEC Plaza, 49 Hoi Yuen Road, Kwun Tong, Hong Kong Tel: (852) 2797 3288 Fax: (852) 2776 7770 Email: [email protected] Website: http://www.valencetech.com IMPORTANT NOTICE “Preliminary” product information describes products that are in production, but for which full characterization data is not yet available. ValenceTech Ltd. and its affiliates (“Valence”) believe that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. 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IF THE CUSTOMER OR CUSTOMER’S CUSTOMER USES OR PERMITS THE USE OF VALENCE PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY VALENCE, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS’ FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH THESE USES. Revision 0.0 Page 10 of 10 August 25, 2008