AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application Datasheet Revision 0.6 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application Table of Contents 1. OVERVIEW ................................................................................................................................................................ 1 2. APPLICATIONS ........................................................................................................................................................ 1 2.1. TARGET APPLICATIONS ...................................................................................................................................................... 1 2.2. APPLICATION FEATURES..................................................................................................................................................... 1 2.2.1 CLOCK AND ALARM FEATURES....................................................................................................................................... 1 2.2.2 DOCKING CONTROL FEATURES ...................................................................................................................................... 1 2.2.3 RADIO FEATURES ........................................................................................................................................................... 1 2.2.4 OTHER SYSTEM FEATURES ............................................................................................................................................ 1 3. ORDERING INFORMATION ..................................................................................................................................... 1 4. PIN CONFIGURATION.............................................................................................................................................. 1 5. BLOCK DIAGRAM .................................................................................................................................................... 2 6. BUILT IN PERIPHERALS ......................................................................................................................................... 2 7. PIN DESCRIPTION ................................................................................................................................................... 3 8. ELECTRICAL SPECIFICATION ............................................................................................................................... 5 8.1. 8.2. 8.3. 8.4. 9. ABSOLUTE MAXIMUM RATING............................................................................................................................................. 5 RECOMMENDED OPERATING CONDITION ........................................................................................................................... 5 LEAKAGE CURRENT AND CAPACITANCE............................................................................................................................. 5 DC ELECTRICAL CHARACTERISTICS .................................................................................................................................. 5 BONDING AND PACKAGE INFORMATION............................................................................................................ 6 9.1. 9.2. REFERENCE COB LAYOUT INFORMATION ......................................................................................................................... 6 PACKAGE INFORMATION ..................................................................................................................................................... 7 10. SOLDERING INDICATION........................................................................................................................................ 8 1. 2. 3. 4. REFLOW SOLDERING .......................................................................................................................................................... 8 W AVE SOLDERING .............................................................................................................................................................. 8 MANUAL SOLDERING .......................................................................................................................................................... 8 SUITABILITY OF SURFACE MOUNT IC PACKAGES FOR W AVE AND REFLOW SOLDERING METHODS ............................... 9 Revision 0.6 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application 1. OVERVIEW 2.2.2 Docking Control Features The AP919 is a controller IC for docking application with remote control function and LCD driver. It has a built-in PLL controller for controlling external radio tuner IC to form a complete digital tuning system (DTS). AP919 also supports real time clock with 12/24 hour display format and dual alarm clock timer. Built-in with LCD driver and support for docking system of prevalent music players and mobile phones, AP919 is suitable for a wide range of audio applications that have build-in clock alarm, radio and docking features. • Docking control through front panel buttons or remote controller • PLAY, PAUSE, STOP, FAST FORWARD, FAST BACKWARD, RANDOM, REPEAT functions • Device charging through docking system • Support Apple Authentication Coprocessor 2. APPLICATIONS • Auto/Manual radio station scanning • Programmable radio station memory ( independent memory slots for FM and AM ) 2.1. Target Applications • Docking System • Clock Radio 2.2.3 Radio Features 2.2.4 Other System Features • Support 24 segment x 4 common or 6 common, 1/3 bias LCD display • Automatic detection of AC power • Low standby current 2.2. Application Features 2.2.1 Clock and Alarm Features • 12/24 hour clock display mode selectable by user • Dual alarm clocks • User selectable alarm mode – wake-to-buzzer, wake-to-radio or wake-to-docked_device • Fixed snooze feature • Programmable sleep timer 3. ORDERING INFORMATION ORDERING NUMBER AP919-DC-L AP919-LQ-L PINS 100 100 PACKAGE Bare Dice LQFP P72 P73 P80 P81 P82 P83 / / / / / / SEG 19 76 SEG 20 77 SEG 21 78 SEG 22 79 SEG 23 80 SEG 24 81 VLCD 2 82 VLCD1 83 VLCD 84 ACIN 85 P120 / TX1 86 P121 / RX1 87 P122 / B OUT1 88 P123 89 W 3 90 PGM 91 A TON E 92 VDD 93 XO SCO 94 XOSCI 95 GND 96 TESTB0 / EM U_SCLR 97 TESTB1 / EMU_SDI 98 EM U_SC LK 99 EMU_SDO 100 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P11 / BOUT1 P10 / TONE P113 / I2C DAT2 P112 / I2C CLK 2 ADC IO 5 ADC IO 4 A DCIO3 A DCIO2 ADC IO1 ADC IO 0 W2 P133 P132 / TO NE TESTB 3 TESTB 2 DTSPLLFLT GND IFIN AMIN FM IN VDD P103 / PW MO P102 / BOUT0 P101 / RX0 P100 / TX0 77 P73 / SEG20 76 P72 / SEG19 81 P83 / SEG24 78 P80 / SEG21 79 P81 / SEG22 80 P82 / SEG23 84 VLCD 82 VLCD2 83 VLCD1 87 P121 / RX1 86 P120 / TX1 85 ACIN 88 P122 / BOUT1 91 PGM 90 W3 89 P123 93 VDD 92 ATONE 94 XOSCO 95 XOSCI 97 TESTB0 / EMU_SCLR 96 GND 98 TESTB1 / EMU_SDI 100 EMU_SDO 99 EMU_SCLK 75 P71 / SEG18 74 P70 / SEG17 73 P63 / SEG16 72 P62 / SEG15 71 P61 / SEG14 70 P60 / SEG13 69 P53 / SEG12 68 P52 / SEG11 67 P51 / SEG10 66 P50 / SEG9 65 GND 64 P43 / SEG8 63 P42 / SEG7 62 P41 / SEG6 61 P40 / SEG5 60 P33 / SEG4 59 P32 / SEG3 58 P31 / SEG2 57 P30 / SEG1 56 P23 / COM1 55 P22 / COM2 54 P21 / COM3 53 P20 / COM4 52 P13 / COM5 / RX1 51 P12 / COM6 / TX1 4. PIN CONFIGURATION P90 / SPIDIO 1 P91 / SPICLK 2 P92 / SPIDI / AST0 3 P93 / AST1 4 RSTB 5 PWRDET 6 AVDD 7 PLLFLT 8 AGND 9 75 P71 / SEG18 74 P70 / SEG17 73 P63 / SEG16 72 P62 / SEG15 71 P61 / SEG14 70 P60 / SEG13 69 P53 / SEG12 68 P52 / SEG11 GND 10 OSCI 11 OSCO 12 VDD VPP P130 P131 WDTEN W0 W1 P00 / I2CCLK0 P01 / I2CDAT0 67 66 AP919 65 64 63 62 61 60 13 Dice Form 14 15 16 17 18 19 P40 / SEG5 P33 / SEG4 P32 / SEG3 P31 / SEG2 P30 / SEG1 56 P23 / COM1 55 P22 / COM2 54 P21 / COM3 53 P20 / COM4 52 P13 / COM5 / RX1 51 P12 / COM6 / TX1 20 21 P02 / PWMO 22 P03 / REMO 23 49 50 48 P113 / I2CDAT2 P10 / TONE 47 P11 / BOUT1 46 ADCIO3 45 44 ADCIO2 ADCIO5 43 ADCIO1 ADCIO4 42 ADCIO0 P112 / I2CCLK2 40 41 35 DTSPLLFLT 39 34 GND W2 33 IFIN P133 32 38 31 FMIN AMIN 37 30 VDD 36 29 P103 / PWMO TESTB3 28 TESTB2 27 P132 / TONE 26 P100 / TX0 P101 / RX0 P102 / BOUT0 P90 / SPIDIO 1 P91 / SPICLK 2 P92 / SPIDI / AST0 3 P93 / AST1 4 RSTB 5 PWRDET 6 AVDD 7 PLLFLT 8 AGND 9 GND 10 OSCI 11 OSCO 12 VDD 13 VPP 14 P130 15 P131 16 WDTEN 17 W0 18 W1 19 P00 / I2CCLK0 20 P01 / I2CDAT0 21 P02 / PWMO 22 P03 / REMO 23 P110 / RCK 24 P111 / RCD 25 Revision 0.6 P50 / SEG9 GND P43 / SEG8 P42 / SEG7 P41 / SEG6 59 58 57 P110 / RCK 24 P111 / RCD 25 Figure 1 100-Pin LQFP Package of AP919 P51 / SEG10 Figure 2 Dice Form of AP919 Page 1 of 10 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application 5. BLOCK DIAGRAM GPIO & PIN MUX LCD Display GPIO & PIN MUX The following diagram shows the system blocks embedded in AP919. Figure 3 Internal Block Diagram of AP919 6. BUILT IN PERIPHERALS • High performance 8 bit CPU o Support C language programming • 32 kbyte one time program ROM • 1.5 kbyte data RAM • Interrupt Controller o 10 priority levels • Watchdog reset • Real time clock • Embedded RC oscillator • Programmable timer o 2 units • LCD driver o 24 segment x 4 common or 6 common, 1/3 bias LCD display • DTS PLL unit • 6-bit ADC o 6 channels • AC line frequency detection unit Revision 0.6 • External interrupt o 4 channels • IR remote control unit • Buzzer unit o output level control available • Rotary type switch counter unit • UART interface o 2 units • I2C interface o 2 channels • SPI interface o 1 channel • Selectable oscillator option o XOSC : low speed 32.768kHz / 75kHz crystal o OSC : high speed 3.6864 MHz crystal o RCOSC: medium speed 1MHz internal RC oscillator Page 2 of 10 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application 7. PIN DESCRIPTION Pin Name Alternative Function Type Drive (mA) Pullup /down Reset State 1 2 P90 P91 SPIDIO SPICLK IO,S IO,S 2 2 PU PU Z Z 3 P92 SPIDI / AST0 IO,S 2 PU Z 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 P93 RSTB PWRDET AVDD PLLFLT AGND GND OSCI OSCO VDD VPP P130 P131 WDTEN W0 W1 P00 P01 P02 P03 AST1 IO,S I,S IA 2 PU U Z 2 2 Z Z Z Z Z Z 24 OA I O I2CCLK0 I2CDAT0 PWMO REMO IO,S IO,S I,S I,S I,S IO,S IO,S IO,S IO,S 2 2 2 2 PU PU U PU PU PU PU PU PU P110 RCK IO,S 2 PU Z 25 P111 RCD IO,S 2 PU Z 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 P100 P101 P102 P103 VDD FMIN AMIN IFIN GND DTSPLLFLT TESTB2 TESTB3 P132 P133 W2 ADCIO0 ADCIO1 ADCIO2 ADCIO3 ADCIO4 ADCIO5 P112 P113 P10 P11 TX0 RX0 BOUT0 PWMO IO,S IO,S IO,S IO,S 2 2 2 2 PU PU PU PU Z Z Z Z I2CCLK1 I2CDAT1 TONE BOUT1 OA I,S I,S IO,S IO,S I,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S IO,S 51 P12 COM6 / TX1 52 P13 53 54 55 56 57 P20 P21 P22 P23 P30 Revision 0.6 IA IA IA TONE 2 2 U U PU PU PU Z Z 2 2 2 2 2 2 2 2 2 2 PU PU PU PU Z Z Z Z Z Z Z Z Z Z IO,S,L 2 PU Z COM5 / RX1 IO,S,L 2 PU Z COM4 COM3 COM2 COM1 SEG1 IO,S,L IO,S,L IO,S,L IO,S,L IO,S,L 2 2 2 2 2 PU PU PU PU PU Z Z Z Z Z Page 3 of 10 Descriptions General purpose IO port / SPI data IO General purpose IO port / SPI clock IO General purpose IO port / SPI data input / Autostrobe output 0 General purpose IO port / Auto-strobe output 1 Active low chip reset input Low-voltage detect Analog supply voltage PLL filter Analog ground Ground 3.6864MHz oscillator input 3.6864MHz oscillator output Power supply Power supply General purpose IO port pin General purpose IO port pin Watchdog enable ( active high) MCU external interrupt input pin MCU external interrupt input pin General purpose IO port / I2C0 clock output General purpose IO port / I2C0 data IO port General purpose IO port / PWMO General purpose IO port / Remote receiver input General purpose IO port or rotary switch counter input General purpose IO port or rotary switch counter input General purpose IO port or UART0 TX output General purpose IO port or UART0 RX input General purpose IO port or UART0 clock output General purpose IO port pin / PWM output Power supply FM input clock AM input clock IF input clock ground DTS PLL control voltage output Active low chip test enable Active low chip test enable General purpose IO port pin / buzzer General purpose IO port pin MCU external interrupt input pin ADC input channel 0 / General purpose IO port ADC input channel 1 / General purpose IO port ADC input channel 2 / General purpose IO port ADC input channel 3 / General purpose IO port ADC input channel 4 / General purpose IO port ADC input channel 5 / General purpose IO port General purpose IO port pin / I2C1 clock output General purpose IO port pin / I2C1 data IO General purpose IO port pin / buzzer output General purpose IO port pin / UART1 clock *Note General purpose IO port / LCD common 6 / UART1 TX *Note General purpose IO port / LCD common 5 / UART1 RX *Note General purpose IO port / LCD common 4 General purpose IO port / LCD common 3 General purpose IO port / LCD common 2 General purpose IO port / LCD common 1 General purpose IO port / LCD segment 1 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application Pin Name Alternative Function Type Drive (mA) Pullup /down Reset State 58 59 60 61 62 63 64 65 P31 P32 P33 P40 P41 P42 P43 GND SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 IO,S,L IO,S,L IO,S,L IO,S,L IO,S,L IO,S,L IO,S,L 2 2 2 2 2 2 2 PU PU PU PU PU PU PU Z Z Z Z Z Z Z 66 P50 SEG9 / LCDD0 IO,S,L 2 PU Z 67 P51 SEG10 / LCDD1 IO,S,L 2 PU Z 68 P52 SEG11 / LCDD2 IO,S,L 2 PU Z 69 P53 SEG12 / LCDD3 IO,S,L 2 PU Z 70 P60 SEG13 / LCDD4 IO,S,L 2 PU Z 71 P61 SEG14 / LCDD5 IO,S,L 2 PU Z 72 P62 SEG15 / LCDD6 IO,S,L 2 PU Z 73 P63 SEG16 / LCDD7 IO,S,L 2 PU Z 74 P70 SEG17 / LCDWRB IO,S,L 2 PU Z 75 P71 SEG18 / LCDRDB IO,S,L 2 PU Z 76 P72 SEG19 / LCDA0 IO,S,L 2 PU Z 77 P73 SEG20 / LCDCSB IO,S,L 2 PU Z 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 P80 P81 P82 P83 VLCD2 VLCD1 VLCD ACIN P120 P121 P122 P123 W3 TEST4 ATONE VDD XOSCO XOSCI GND TESTB0 TESTB1 TEST5 TESTOUT1 SEG21 SEG22 SEG23 SEG24 IO,S,L IO,S,L IO,S,L IO,S,L 2 2 2 2 PU PU PU PU Z Z Z Z I O IO IA OA - Input pin - Output pin - Bidirectional pin - Analog input pin - Analog output pin TX1 RX1 BOUT1 I,S IO,S,L IO,S,L IO,S,L IO,S,L I,S I,S OA 2 2 2 2 U PU PU PU PU PU D Z Z Z Z O I I,S I,S I,S O U U D 2 0 S (P)U (P)D L 0,1,Z Descriptions General purpose IO port / LCD segment 2 General purpose IO port / LCD segment 3 General purpose IO port / LCD segment 4 General purpose IO port / LCD segment 5 General purpose IO port / LCD segment 6 General purpose IO port / LCD segment 7 General purpose IO port / LCD segment 8 Ground General purpose IO port / LCD segment 9/ 8-bit MPU interface General purpose IO port / LCD segment 10 / 8-bit MPU interface General purpose IO port / LCD segment 11 / 8-bit MPU interface General purpose IO port / LCD segment 12 / 8-bit MPU interface General purpose IO port / LCD segment 13 / 8-bit MPU interface General purpose IO port / LCD segment 14 / 8-bit MPU interface General purpose IO port / LCD segment 15 / 8-bit MPU interface General purpose IO port / LCD segment 16 / 8-bit MPU interface General purpose IO port / LCD segment 17 / 8-bit MPU interface General purpose IO port / LCD segment 18 / 8-bit MPU interface General purpose IO port / LCD segment 19 / 8-bit MPU interface General purpose IO port / LCD segment 20 / 8-bit MPU interface General purpose IO port / LCD segment 21 General purpose IO port / LCD segment 22 General purpose IO port / LCD segment 23 General purpose IO port / LCD segment 24 1/3 x VLCD voltage 2/3 x VLCD voltage LCD driver supply voltage AC detection input General purpose IO port / UART1 TX *Note General purpose IO port / UART1 RX *Note General purpose IO port / UART1 clock output *Note General purpose IO port MCU external interrupt input pin Active high chip test enable Buzzer output with level control Power supply 32.768kHz / 75kHz oscillator output 32.768kHz / 75kHz oscillator input Ground Active low chip test enable Active low chip test enable Active high chip test enable Chip test output - CMOS Schmitt Trigger - (Programmable) Pull-up - (Programmable) Pull-down - LCD Pad - Logic state 0, Logic state 1,High impedance *Note: Depending on the UART1 control register’s content, either P12[2:0] or P1[3:1] can be used as the UART1 ports. Revision 0.6 Page 4 of 10 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application 8. ELECTRICAL SPECIFICATION 8.1. Absolute Maximum Rating Item Power Supply Voltage (logic) Power Supply Voltage (analog) Power Supply Voltage (LCD) Input Voltage Power Dissipation (Ta = 70°C) Storage Temperature Operating Temperature Symbol Rating Unit VDD AVDD VLCD/VLCD1/VLCD2 VIN Pd TSTG Topr -0.5 to 6.0 -0.5 to 6.0 -0.5 to 6.0 -0.5 to VDD+0.5 TBD -20 to 125 0 to 70 V V V V mW °C °C 8.2. Recommended Operating Condition Item Power Supply Voltage (logic) Power Supply Voltage (analog) Power Supply Voltage (LCD) Input Voltage (digital) Input Voltage (analog) Operating Temperature Symbol Min. VDD AVDD VLCD VLCD1 VLCD2 VIN VIN TOPR 3.0 3.0 VLCD2 0 0 0 0 Typ. Max. Unit - 3.6 3.6 VDD VLCD VLCD1 VDD VDD 70 V V V V V °C 8.3. Leakage Current and Capacitance Symbol IIN IOZ CIN CIN CBID Parameter Condition Input current Tri-state leakage current Input capacitance *Note1 Output capacitance *Note1 Bidirectional buffer capacitance *Note1 No pull-up or pull-down Min. Typ. Max. Unit -10 -10 ±1 ±1 3.0 3.0 3.0 10 10 µA µA pF pF pF *Note1: capacitance value are specified without the package 8.4. DC Electrical Characteristics (VDD=3.3V±10%, AVDD=3.3V±10%, operating temperature = 0°C - 70°C unless specified otherwise) Symbol Parameter Condition Min. Typ. Max. Unit VDD AVDD VIH VIL RPU RPD VINA IOL IOH Idd_opr Idd_idle Supply Voltage (logic) Supply Voltage (analog) Input high voltage Input low voltage Pull-up resistance Pull-down resistance FMIN,AMIN,IFIN input voltage Output low current Output high current Core operating current Clock Mode current Core operating mode Clock mode Core operating mode Clock mode VIN = 0V VIN = VDD VOL = 0.4V VOH = VDD-0.4V *Note2 VDD=3.3V, T=25°C *Note3 3.0 2.4 3.0 2.4 0.7*VDD 30k 30k 150 - 45k 45k 3.6 3.6 3.6 3.6 0.3*VDD 75k 75k 2.8 2.5 7 80 10 100 - V V V V Ω Ω mVpp mA mA mA µA *Note2: LCD is ON. The CPU clock source is from the 3.6864 MHz oscillator pads. No active load is being driven. All inputs = 0V or VDD. *Note3: LCD is ON. The CPU clock source is from the 75 kHz oscillator pads. No active load is being driven. All inputs = 0V or VDD. Revision 0.6 Page 5 of 10 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application 9. BONDING AND PACKAGE INFORMATION 9.1. Reference COB Layout Information Libraries of reference COB PCB layout and dice connection layout are available upon request. Revision 0.6 Page 6 of 10 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application 9.2. Package Information Revision 0.6 Page 7 of 10 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application 10. SOLDERING INDICATION This section gives a very brief insight to a complex technology. There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 1. Reflow Soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. 2. Wave Soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used, the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch: – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printedcircuit board. The footprint must incorporate solder thieves at the downstream end. For packages with leads on four sides, the footprint must be placed at a 45angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 3. Manual Soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Revision 0.6 Page 8 of 10 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application 4. Suitability of Surface Mount IC Packages for Wave and Reflow Soldering Methods Package BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC (3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Soldering Method Wave Reflow (1) (2) Not suitable Suitable Not suitable Suitable Suitable Suitable Not recommended (3)(4) Suitable Not recommended (5) Suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, the package must be placed at a 45angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch equal to or smaller than 0.5 mm. Revision 0.6 Page 9 of 10 May 15, 2008 AP919 OTP Microcontroller with LCD Driver and Digital Tuning System for Docking Application Valence Semiconductor Design Limited Unit 2001, 20/F, APEC Plaza, 49 Hoi Yuen Road, Kwun Tong, Hong Kong Tel: (852) 2797 3288 Fax: (852) 2776 7770 Email: [email protected] Website: http://www.valencetech.com IMPORTANT NOTICE “Preliminary” product information describes products that are in production, but for which full characterization data is not yet available. ValenceTech Ltd. and its affiliates (“Valence”) believe that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty of any kind (express or implied). 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CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). VALENCE PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN AIRCRAFT SYSTEMS, MILITARY APPLICATIONS, PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS (INCLUDING MEDICAL DEVICES, AIRCRAFT SYSTEMS OR COMPONENTS AND PERSONAL OR AUTOMOTIVE SAFETY OR SECURITY DEVICES). INCLUSION OF VALENCE PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK AND VALENCE DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY VALENCE PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER’S CUSTOMER USES OR PERMITS THE USE OF VALENCE PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY VALENCE, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS’ FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH THESE USES. Revision 0.6 Page 10 of 10 May 15, 2008