ETC PTU2N60

PTD2N60/PTU2N60
600V N-Channel MOSFET
PTD2N60
(TO-252)
Features
•
•
•
•
•
•
1.9A, 600V, RDS(on) = 4.70Ω @VGS = 10 V
Low gate charge ( typical 9nC)
High ruggedness
Fast switching
100% avalanche tested
Improved dv/dt capability
General Description
PTU2N60
(TO-251)
This Power MOSFET is produced using PHILOP's
advanced planar stripe DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency sw itched mode power supplies,
active power factor correction based on half bridge
topology.
Absolute Maximum Ratings
Symbol
VDSS
ID
Parameter
PTD2N60/ PTU2N60
Units
Drain to Source Voltage
600
V
Continuous Drain Current(@TC = 25°C)
1.9
A
Continuous Drain Current(@TC = 100°C)
1.14
A
7.6
A
± 30
V
120
mJ
IDM
Drain Current Pulsed
(Note 1)
VGS
Gate to Source Voltage
EAS
Single Pulsed Avalanche Energy
EAR
Repetitive Avalanche Energy
(Note 1)
4.4
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
4.5
V/ns
(Note 2)
Total Power Dissipation(@TC = 25 °C)
PD
TSTG, TJ
TL
W
44
Derating Factor above 25 °C
W/ °C
0.35
Operating Junction Temperature & Storage Temperature
Maximum Lead Temperature for soldering purpose, 1/8 from Case for 5 seconds.
-55 to +150
°C
300
°C
* Drain current limited by maximum junction temperature.
Thermal Characteristic
Symbol
Parameter
Typ
Max
Units
RθJC
Thermal Resistance, Junction-to-Case
-
2.87
°C /W
RθJA
Thermal Resistance, Junction-to-Ambient*
-
50
°C /W
RθJA
Thermal Resistance, Junction-to-Ambient
-
110
°C/W
PTD2N60/PTU2N60
Electrical Characteristics
Symbol
TC = 25°C unless otherwise noted
Parameter
Test Conditions
Min
Typ
Max
Units
600
--
--
V
--
V/°C
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0 V, ID = 250 µA
∆BVDSS
/
∆TJ
Breakdown Voltage Temperature
Coefficient
ID = 250 µA, Referenced to 25°C
--
0.7
VDS = 600 V, VGS = 0 V
--
--
1
µA
VDS = 480 V, TC = 125°C
--
--
10
µA
IDSS
Zero Gate Voltage Drain Current
IGSSF
Gate-Body Leakage Current, Forward
VGS = 30 V, VDS = 0 V
--
--
100
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = -30 V, VDS = 0 V
--
--
-100
nA
2.0
--
4.0
V
--
3.6
4.7
Ω
--
200
--
pF
--
20
--
pF
--
4
--
pF
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250 µA
RDS(on)
Static Drain-Source
On-Resistance
VGS = 10 V, ID =
0.95 A
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDD = 300 V, ID = 2.0A,
RG = 25 Ω
(Note 4, 5)
VDS = 480 V, ID = 2.0 A,
VGS = 10 V
(Note 4, 5)
--
10
--
ns
--
25
--
ns
--
25
--
ns
--
30
--
ns
--
9
-
nC
--
1.5
--
nC
--
4.0
--
nC
A
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
--
--
1.9
ISM
--
--
7.6
A
VSD
Maximum Pulsed Drain-Source Diode Forward Current
VGS = 0 V, IS = 1.9 A
Drain-Source Diode Forward Voltage
--
--
1.5
V
trr
Reverse Recovery Time
--
230
--
ns
Qrr
Reverse Recovery Charge
--
1.0
--
µC
VGS = 0 V, IS = 2.0 A,
dIF / dt = 100 A/µs
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 56 mH, IAS = 2.0 A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 2.0 A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
(Note 4)
PTD2N60/PTU2N60
Typical Characteristics
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation with Source Current
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
PTD2N60/PTU2N60
Typical Characteristics
(Continued)
Figure 7. Breakdown Voltage Variation
vs Temperature
Figure 9. Maximum Safe Operating Area
Figure 8. On-Resistance Variation
vs Temperature
Figure 10. Maximum Drain Current
vs Case Temperature
Figure 11. Transient Thermal Response Curve
PTD2N60/PTU2N60
1 0V
3
VGS
VDD
PTD2N60/PTU2N60
Peak Diode Recovery dv/dt Test Circuit & Waveforms
+
D U T
V
D S
_
I
S D
L
D r iv e r
R
V
V GS
( D r iv e r )
G S
G
S am e T ype
as D U T
V
D D
• d v / d t c o n t r o lle d b y R G
• I S D c o n t r o lle d b y p u ls e p e r io d
G a te P u ls e W id th
D = -------------------------G a t e P u ls e P e r io d
10V
IF M , B o d y D io d e F o r w a r d C u r r e n t
I
S D
d i/d t
( D U T )
IR
M
B o d y D io d e R e v e r s e C u r r e n t
V DS
( D U T )
B o d y D io d e R e c o v e r y d v / d t
V
S D
B o d y D io d e
F o r w a r d V o lt a g e D r o p
V
D D