WFF12N65
Wisdom Semiconductor
N-Channel MOSFET
Features
RDS(on) (Typical 0.65 Ω )@VGS=10V
■
Gate Charge (Typical 50nC)
Improved dv/dt Capability, High Ruggedness
100% Avalanche Tested
Maximum Junction Temperature Range (150°C)
■
■
■
{
Symbol
■
2. Drain
●
◀
1. Gate{
▲
●
●
{
General Description
This Power MOSFET is produced using Wisdom’s advanced
planar stripe, DMOS technology. This latest technology has been
especially designed to minimize on-state resistance, have a high
rugged avalanche characteristics. These devices are well suited
for high efficiency switch mode power supplies, active power factor
correction, electronic lamp ballasts based on half bridge topology.
3. Source
TO-220F
2
1
3
Absolute Maximum Ratings (* Drain current limited by junction temperature)
Symbol
VDSS
ID
Value
Units
Drain to Source Voltage
Parameter
650
V
Continuous Drain Current(@TC = 25°C)
12*
A
Continuous Drain Current(@TC = 100°C)
7.5*
A
48*
A
±30
V
IDM
Drain Current Pulsed
VGS
Gate to Source Voltage
EAS
Single Pulsed Avalanche Energy
(Note 2)
936
mJ
EAR
Repetitive Avalanche Energy
(Note 1)
22.5
mJ
Peak Diode Recovery dv/dt
(Note 3)
4.5
V/ns
51
W
dv/dt
PD
TSTG, TJ
TL
(Note 1)
Total Power Dissipation(@TC = 25 °C)
Derating Factor above 25 °C
Operating Junction Temperature & Storage Temperature
Maximum Lead Temperature for soldering purpose,
1/8 from Case for 5 seconds.
0.41
W/°C
- 55 ~ 150
°C
300
°C
Thermal Characteristics
Symbol
Parameter
Value
Min.
Typ.
Max.
Units
RθJC
Thermal Resistance, Junction-to-Case
-
-
2.43
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
-
-
62.5
°C/W
1/2
Copyright@Wisdom Semiconductor Inc., All rights reserved.
WFF12N65
Electrical Characteristics
Symbol
( TC = 25 °C unless otherwise noted )
Parameter
Test Conditions
Min
Typ
Max
Units
650
710
-
V
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250uA
Δ BVDSS/
Δ TJ
Breakdown Voltage Temperature
coefficient
ID = 250uA, referenced to 25 °C
-
0.6
-
V/°C
IDSS
VDS = 650V, VGS = 0V
-
-
10
uA
Drain-Source Leakage Current
IGSS
VDS = 520V, TC = 125 °C
-
-
100
uA
Gate-Source Leakage, Forward
VGS = 30V, VDS = 0V
-
-
100
nA
Gate-source Leakage, Reverse
VGS = -30V, VDS = 0V
-
-
-100
nA
2.0
-
4.0
V
-
0.65
0.80
Ω
-
1800
-
-
200
-
-
25
-
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250uA
RDS(ON)
Static Drain-Source On-state Resistance
VGS =10 V, ID = 6.0A
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VGS =0 V, VDS =25V, f = 1MHz
pF
Dynamic Characteristics
td(on)
tr
td(off)
Turn-on Delay Time
VDD =325V, ID =12.0A, RG =4.7Ω
Rise Time
Turn-off Delay Time
(Note 4, 5)
-
30
-
-
90
-
-
160
-
Fall Time
-
90
Qg
Total Gate Charge
-
50
-
Qgs
Gate-Source Charge
-
10
-
Qgd
Gate-Drain Charge(Miller Charge)
-
20
-
Min.
Typ.
Max.
tf
VDS =520V, VGS =10V, ID =12.0A
(Note 4, 5)
ns
nC
Source-Drain Diode Ratings and Characteristics
Symbol
Parameter
IS
Continuous Source Current
ISM
Pulsed Source Current
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
Integral Reverse p-n Junction
Diode in the MOSFET
IS =12.0A, VGS =0V
IS=12A, VGS=0V, dIF/dt=100A/us
※ NOTES
1. Repeativity rating : pulse width limited by junction temperature
2. L = 12.0mH, IAS =12.0A, VDD = 50V, RG = 25Ω , Starting TJ = 25°C
3. ISD ≤ 12A, di/dt ≤ 200A/us, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse Width ≤ 300us, Duty Cycle ≤ 2%
5. Essentially independent of operating temperature.
2/2
Copyright@Wisdom Semiconductor Inc., All rights reserved.
-
-
12
-
-
48
Unit.
A
-
-
1.4
V
-
450
-
ns
-
5.0
-
uC
Typical Characteristics
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
12
VGS, Gate-Source Voltage [V]
VDS = 130V
10
VDS = 325V
VDS = 520V
8
6
4
2
※ Note : ID = 12.0 A
0
0
5
10
15
20
25
30
35
40
45
50
55
QG, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
Typical Characteristics
(Continued)
Figure 7. Breakdown Voltage Variation
vs Temperature
Figure 8. On-Resistance Variation
vs Temperature
12
Operation in This Area
is Limited by R DS(on)
2
10
10 µs
10
ID, Drain Current [A]
ID, Drain Current [A]
100 µs
1
10
1 ms
10 ms
DC
0
10
-1
10
8
6
4
※ Notes :
o
2
1. TC = 25 C
o
2. TJ = 150 C
3. Single Pulse
-2
10
0
10
1
10
2
10
3
10
0
25
50
75
100
125
VDS, Drain-Source Voltage [V]
TC, Case Temperature [℃]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
Figure 11. Transient Thermal Response Curve
150
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+
V
DS
_
I
SD
L
D r iv e r
R
V
V GS
( D r iv e r )
G S
G
S am e T ype
as DUT
V
DD
• d v / d t c o n t r o lle d b y R G
• I S D c o n t r o lle d b y p u ls e p e r io d
G a t e P u ls e W id t h
D = -------------------------G a t e P u ls e P e r io d
10V
I F M , B o d y D io d e F o r w a r d C u r r e n t
I SD
( DUT )
d i/d t
IR M
B o d y D io d e R e v e r s e C u r r e n t
V DS
( DUT )
B o d y D io d e R e c o v e r y d v / d t
V
SD
B o d y D io d e
F o r w a r d V o lt a g e D r o p
V
DD
Package Dimensions
TO-220F( PV )