LINER LTC1875EGN

LTC1875
15µA Quiescent Current
1.5A Monolithic Synchronous
Step-Down Regulator
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FEATURES
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DESCRIPTIO
High Efficiency: Up to 95%
Low Quiescent Current: Only 15µA with No Load
550kHz Constant Frequency Operation
2.65V to 6V Input Voltage Range
VOUT from 0.8V to VIN, IOUT to 1.5A
True PLL Frequency Locking from 350kHz to 750kHz
Power Good Output Voltage Monitor
Low Dropout Operation: 100% Duty Cycle
Burst Mode® or Pulse Skipping Operation
Current Mode Operation for Excellent Line and Load
Transient Response
Shutdown Mode Draws < 1µA Supply Current
±2% Output Voltage Accuracy
Overcurrent and Overtemperature Protected
Available in 16-Lead SSOP Package
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Portable Computers
Portable Instruments
Wireless Modems
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode is a registered trademark of Linear Technology Corporation.
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The switching frequency is internally set to 550kHz, allowing the use of small surface mount inductors and capacitors. For noise sensitive applications, the LTC1875 can be
externally synchronized from 350kHz to 750kHz. Burst
Mode operation is inhibited during synchronization or
when the SYNC/MODE pin is pulled low.
The internal synchronous switch increases efficiency and
eliminates the need for an external Schottky diode. Low
output voltages are easily supported with a 0.8V feedback
reference voltage. The LTC1875 is available in a 16-lead
SSOP package.
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APPLICATIO S
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The LTC®1875 is a high efficiency 1.5A monolithic synchronous buck regulator using a constant frequency,
current mode architecture. Operating supply current is
only 15µA with no load and drops to < 1µA in shutdown.
The input supply voltage range of 2.65V to 6V makes the
LTC1875 ideally suited for single Li-Ion battery-powered
applications. 100% duty cycle provides low dropout operation, extending battery life in portable systems.
TYPICAL APPLICATIO
High Efficiency Step-Down Converter
Efficiency vs Output Load Current
CIN
22µF
100
95
SVIN
RUN/SS
PVIN
SYNC/MODE SWP
LTC1875
PGOOD
SWN
ITH
VOUT*
3.3V
+
150k
47pF
PGND
COUT
47µF
88.7k
220pF
VFB
SGND
VIN = 3.6V
90
L1
6.8µH
28.0k
1875 TA01
CIN: TAIYO YUDEN CERAMIC JMK325BJ226MM
COUT: SANYO POSCAP 6TPA47M
L1: TOKO 646CY-6R8M
*VOUT CONNECTED TO VIN (MINUS SWITCH AND L1 VOLTAGE DROP) FOR 2.65V < VIN < 3.3V
EFFICIENCY (%)
VIN
2.65V TO 6V
VIN = 4.2V
85
VIN = 6V
80
75
70
65
Burst Mode OPERATION
VOUT = 3.3V
L = 6.8µH
60
55
0.1
1
10
100
OUPUT CURRENT (mA)
1000
1875 TA01a
1875f
1
LTC1875
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ABSOLUTE MAXIMUM RATINGS
PACKAGE/ORDER INFORMATION
(Note 1)
Input Supply Voltage .................................. – 0.3V to 7V
ITH, PLL_LPF Voltages ............................. – 0.3V to 2.7V
RUN/SS, VFB Voltages ............................... – 0.3V to VIN
SYNC/MODE Voltage ................................. – 0.3V to VIN
(VPVIN – VSWP) Voltage ............................... – 0.3V to 7V
VSWN Voltage .............................................. – 0.3V to 7V
P-Channel Switch Source Current (DC) .................... 2A
N-Channel Switch Sink Current (DC) ........................ 2A
Peak Switching Sink and Source Current ................. 3A
Operating Ambient Temperature Range
(Note 2) ............................................. – 40°C to 85°C
Junction Temperature (Note 3, 6) ........................ 125°C
Storage Temperature Range ................ – 65°C to 150°C
Lead Temperature (Soldering, 10 sec)................. 300°C
ORDER PART
NUMBER
TOP VIEW
SGND 1
RUN/SS 2
16 PLL_LPF
14 PGOOD
ITH 4
13 SVIN
SWP1 5
12 SWP2
SWN1 6
11 SWN2
PGND1 7
10 PGND2
PVIN1 8
LTC1875EGN
15 SYNC/MODE
VFB 3
9
GN PART
MARKING
PVIN2
1875
GN PACKAGE
16-LEAD PLASTIC SSOP
TJMAX = 125°C, θJA = 110°C/ W, θJC = 40°C/ W
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full operating
temperature range, otherwise specifications are TA = 25°C. VIN = 3.6V unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
IVFB
Feedback Current
(Note 4)
●
MIN
VFB
Regulated Output Voltage
(Note 4) 0°C ≤ TA ≤ 85°C
(Note 4) – 40°C ≤ TA ≤ 85°C
●
TYP
MAX
8
60
UNITS
nA
0.784
0.740
0.80
0.80
0.816
0.840
V
V
∆VOVL
Overvoltage Trip Limit with Respect to VFB
∆VOVL = VOVL – VFB
●
20
60
110
mV
∆VUVL
Undervoltage Trip Limit with Respect to VFB ∆VUVL = VFB – VUVL
●
20
60
110
mV
∆VFB/VFB
Reference Voltage Line Regulation
VIN = 2.65V to 6V (Note 4)
0.05
0.25
%/V
VLOADREG
Output Voltage Load Regulation
Measured in Servo Loop, VITH = 0.9V to 1.2V
Measured in Servo Loop, VITH = 1.6V to 1.2V
0.1
– 0.1
0.6
– 0.6
%
%
VIN
Input Voltage Range
6
V
IQ
Input DC Bias Current
Pulse Skipping Mode
Burst Mode Operation
Shutdown
365
22
1
µA
µA
µA
750
kHz
●
SYNC Capture Range
fOSC
Oscillator Frequency
IPLLLPF
Phase Detector Output Current
Sinking Capability
Sourcing Capability
fPLLIN < fOSC
fPPLIN > fSOC
RPFET
RDS(ON) of P-Channel FET
RNFET
RDS(ON) of N-Channel FET
IPK
Peak Inductor Current
VFB = 0.7V, Duty Cycle < 35%, VIN = 3V
ILSW
SW Leakage
VRUN = 0V, VSW = 0V or 6V, VIN = 6V
ISYNC/MODE
SYNC/MODE Leakage Current
2.65
(Note 5)
2.65V < VIN < 6V, VSYNC/MODE = 0V, IOUT = 0A
VSYNC/MODE = VIN, IOUT = 0A
VRUN = 0V, VIN = 6V
fSYNC
VSYNC/MODE SYNC/MODE Threshold
●
●
270
15
0
350
VFB ≥ 0.7V
VFB = 0V
495
550
80
605
kHz
kHz
3
–3
10
– 10
20
– 20
µA
µA
ISW = 100mA, VIN = 5V
0.28
0.35
Ω
ISW = – 100mA, VIN = 5V
0.35
0.4
Ω
2.15
2.75
A
±0.01
±2.5
µA
1.0
1.5
V
±0.01
±1
µA
●
●
1.6
●
0.2
1875f
2
LTC1875
ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full operating
temperature range, otherwise specifications are TA = 25°C. VIN = 3.6V unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
VRUN
RUN Threshold
VRUN Ramping Up
IRUN
RUN Input Current
VRUN = 0V
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: The LTC1875E is guaranteed to meet specified performance from
0°C to 70°C. Specifications over the – 40°C to 85°C operating temperature
range are assured by design, characterization and correlation with
statistical process controls.
Note 3: TJ is calculated from the ambient temperature TA and power
dissipation PD according to the following formula:
LTC1875: TJ = TA + (PD • 110°C/W)
MIN
0.2
●
TYP
MAX
UNITS
0.7
1.5
V
±0.01
±1
µA
Note 4: The LTC1875 is tested in a feedback loop which servos VFB to the
balance point for the error amplifier (VITH = 1.2V)
Note 5: Dynamic supply current is higher due to the gate charge being
delivered at the switching frequency.
Note 6: This IC includes overtemperature protection that is intended to
protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
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TYPICAL PERFOR A CE CHARACTERISTICS
0.8
595
SYNCHRONOUS SWITCH
MAIN SWITCH
VIN = 3V
575
FREQUENCY (kHz)
RDS(ON) (Ω)
0.6
0.5
VIN = 5V
0.4
0.3
VIN = 3V
0.2
580
VIN = 3.6V
570
OSC FREQUENCY (kHz)
0.7
Oscillator Frequency
vs Supply Voltage
Oscillator Frequency
vs Temperature
RDS(ON) vs Temperature
555
535
VIN = 5V
515
560
550
540
0.1
0
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
495
–50
125
–25
0
25
50
75
TEMPERATURE (°C)
1875 G01
100
530
125
0
1875 G02
DC Supply Current
vs Temperature
300
Switch Leakage Current
vs Temperature
10
0.6
VIN = 3.6V
9
0.5
SWITCH LEAKAGE (µA)
200
0.4
0.3
100
0.2
50
0.1
MAIN SWITCH
6
5
MAIN SWITCH
4
3
SYNCHRONOUS SWITCH
1
0
0
50
TEMPERATURE (°C)
7
2
BURST MODE
0
–50
VIN = 7V
RUN = 0V
8
SYNCHRONOUS SWITCH
PULSE SKIPPING MODE
RDS(ON) (Ω)
SUPPLY CURRENT (µA)
250
8
1875 G03
RDS(ON) vs Input Voltage
150
2
4
6
SUPPLY VOLTAGE (V)
100
125
1875 G04
0
2
4
6
INPUT VOLTAGE (V)
8
1875 G05
0
–50
0
50
TEMPERATURE (°C)
100
125
1875 G06
1875f
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LTC1875
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TYPICAL PERFOR A CE CHARACTERISTICS
Reference Voltage vs
Temperature
Output Voltage vs Load Current
1.84
805
804
REFERENCE VOLTAGE (mV)
OUTPUT VOLTAGE (V)
1.82
1.80
1.78
1.76
1.74
Burst Mode OPERATION
VIN = 3.6V
L = 4.7µH
1.72
803
802
801
800
799
798
797
796
795
–50
1.70
0
VIN = 6V
500
1000
1500
LOAD CURRENT (mA)
2000
–25
0
25
50
75
TEMPERATURE (°C)
1875 G07
125
1875 G13
Efficiency vs Output Current
Efficiency vs Output Current
95
100
VIN = 3V
90
90
VIN = 4.2V
VIN = 3.6V
80
85
80
VIN = 4.2V
75
VIN = 3.6V
EFFICIENCY (%)
EFFICIENCY (%)
100
VIN = 6V
70
65
70
60
50
VIN = 3.6V
VIN = 4.2V
40
30
60
VOUT = 1.8V
L = 4.7µH
Burst Mode OPERATION
55
50
0.1
1
10
100
OUTPUT CURRENT (mA)
20
10
0
0.1
1000
VOUT = 1.8V
L = 4.7µH
Burst Mode OPERATION
PULSE SKIPPING MODE
1
10
100
OUTPUT CURRENT (mA)
1875 G14
1000
1875 G15
Efficiency vs Input Voltage
Load Step (Burst Mode Operation)
100
100mA
95
10mA
VOUT
100mV/DIV
EFFICIENCY (%)
90
1mA
85
IL
1A/DIV
80
75
70
ITH
1V/DIV
0.1mA
65
60
VOUT = 2.5V
L = 6.8µH
Burst Mode OPERATION
55
50
2
3
4
5
INPUT VOLTAGE (V)
6
VIN = 3.6V
VOUT = 1.5V
L = 6.8µH
50µs/DIV
CIN = 22µF
COUT = 47µF
ILOAD = 200mA to 1700mA
1875 G08
1875 G16
1875f
4
LTC1875
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TYPICAL PERFOR A CE CHARACTERISTICS
Load Step Response (Pulse
Skipping Mode)
Pulse Skipping Mode Operation
VOUT
100mV/DIV
IL
200mA/DIV
IL
1A/DIV
VOUT
100mV/DIV
ITH
1V/DIV
SW
5V/DIV
VIN = 3.6V
VOUT = 1.5V
L = 6.8µH
100µs/DIV
CIN = 22µF
COUT = 47µF
ILOAD = 200mA to 1700mA
1875 G09
VIN = 4.2V
VOUT = 2.5V
L = 6.8µH
1µs/DIV
CIN = 22µF
COUT = 47µF
ILOAD = 50mA
1875 G10
Soft-Start with Shorted Output
Burst Mode Operation
IL
200mA/DIV
IVIN
500mA/DIV
VOUT
100mV/DIV
RUN/SS
1V/DIV
SW
5V/DIV
VIN = 4.2V
VOUT = 2.5V
L = 6.8µH
25µs/DIV
CIN = 22µF
COUT = 47µF
ILOAD = 50mA
1875 G11
VIN = 3.6V
VOUT = 0V
L = 6.8µH
5ms/DIV
CIN = 22µF
COUT = 47µF
ILOAD = 0A
1875 G12
1875f
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LTC1875
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PI FU CTIO S
SGND (Pin 1): Signal Ground Pin.
RUN/SS (Pin 2): Combination of Soft-Start and Run
Control Inputs. Forcing this pin below 0.7V shuts down the
device. In shutdown all functions are disabled and device
draws zero supply current. For the proper operation of the
part, force this pin above 2.5V. Do not leave this pin
floating. Soft-start can be accomplished by raising the
voltage on this pin gradually with an RC circuit.
VFB (Pin 3): Feedback Pin. Receives the feedback voltage
from an external resistor divider across the output.
ITH (Pin 4): Error Amplifier Compensation Point. The
current output increases with this control voltage. Nominal voltage range for this pin is 0.5V to 1.8V.
SWP1, SWP2 (Pins 5, 12): Upper Switch Nodes. These
pins connect to the drains of the internal main PMOS
switches and should always be connected together
externally.
SWN1, SWN2 (Pins 6, 11): Lower Switch Nodes. These
pins connect to the drains of the internal synchronous
NMOS switches and should always be connected together
externally.
PVIN1, PVIN2 (Pins 8, 9): Power Supply Pins for the
Internal Drivers and Switches. These pins should always
be tied together.
SVIN (Pin 13): Signal Power Supply Pin.
PGOOD (Pin 14): Power Good Indicator Pin. Power good
is an open-drain logic output. The PGOOD pin is pulled to
ground when the voltage on the VFB pin is not within
±7.5% of its nominally regulated potential. This pin requires a pull-up resistor for power good indication. Power
good indication works in all modes of operation.
SYNC/MODE (Pin 15): External Clock Synchronization
and Mode Select Input. To synchronize, apply an external
clock with a frequency between 350kHz and 750kHz. To
select Burst Mode operation, tie pin to SVIN. Grounding
this pin selects pulse skipping mode. Do not leave this pin
floating.
PLL_LPF (Pin 16): Output of the Phase Detector and
Control Input of Oscillator. Connect a series RC lowpass
network from this pin to ground if externally synchronized.
If unused, this pin may be left open.
PGND1, PGND2 (Pins 7, 10): Power Ground Pins. Ground
pins for the internal drivers and switches. These pins
should always be tied together.
1875f
6
2
3
15
RUN/SS
VFB
0.6V
SYNC/MODE
PLL_LPF
+
16
SOFT-START
0.8V REF
SVIN
0.74V
0.86V
0.8V
FREQ
SHIFT
VCO
AND
OSC
+
–
–
+
–
+
EA
SLOPE
COMP
UVDET
OVDET
SVIN
SLEEP
OSC
+
Y = “0” ONLY WHEN X IS A CONSTANT “1”
OV
4
ITH
0.45V
Q
R
1 SGND
14 PGOOD
SWITCHING
LOGIC
AND
BLANKING
CIRCUIT
SLEEP
SHUTDOWN
BURST
EN
THERMAL
SHUTDOWN
RS LATCH
Q
S
+
–
–
–
BURST DEFEAT
Y
X
0.8V
ICOMP
–
+
+
RCMP
ANTISHOOTTHROUGH
–
BOTTOM
MOSFET
2.9Ω
6, 11
5, 12
8, 9
1875 FD
7, 10
PGND
SWN
SWP
TOP
MOSFET
PVIN
13
SVIN
LTC1875
BLOCK DIAGRA
1875f
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LTC1875
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OPERATIO
(Refer to Block Diagram)
Main Control Loop
The LTC1875 uses a constant frequency, current mode
step-down architecture. Both the top MOSFET and synchronous bottom MOSFET switches are internal. During
normal operation, the internal top power MOSFET is
turned on each cycle when the oscillator sets the RS latch,
and turned off when the current comparator, ICOMP, resets
the RS latch. The peak inductor current at which ICOMP
turns the top MOSFET off is controlled by the voltage on
the ITH pin, which is the output of error amplifier EA. When
the load current increases, it causes a slight decrease in
the feedback voltage, VFB, relative to the 0.8V internal
reference, which, in turn, causes the ITH voltage to increase until the average inductor current matches the new
load current. While the top MOSFET is off, the bottom
MOSFET is turned on until either the inductor current
starts to reverse direction or the next clock cycle begins.
Comparator OVDET guards against transient overshoots
> 7.5% by turning the main switch off and keeping it off
until the fault is removed.
Burst Mode Operation
The LTC1875 is capable of Burst Mode operation in which
the internal power MOSFETs operate intermittently based
on load demand. To enable Burst Mode operation, simply
tie the SYNC/MODE pin to SVIN or connect it to a logic high
(VSYNC/MODE > 1.5V). To disable Burst Mode operation
and enable PWM pulse skipping mode, connect the SYNC/
MODE pin to SGND. In this mode, the efficiency is lower at
light loads but becomes comparable to Burst Mode operation when the output load exceeds 100mA. The advantage
of pulse skipping mode is lower output ripple.
When the converter is in Burst Mode operation, the peak
current of the inductor is set to approximately 400mA,
even though the voltage at the ITH pin indicates a lower
value. The voltage at the ITH pin drops when the inductor’s
average current is greater than the load requirement. As
the ITH voltage drops below approximately 0.45V, the
BURST comparator trips, turning off both power MOSFETs.
The ITH pin is then disconnected from the output of the EA
amplifier and held 0.65V above ground.
In sleep mode, both power MOSFETs are held off and the
internal circuitry is partially turned off, reducing the quiescent current to 15µA. The load current is now being
supplied from the output capacitor. When the output
voltage drops, the ITH pin reconnects to the output of the
EA amplifier and the top MOSFET is again turned on and
this process repeats.
Soft-Start/Run Function
The RUN/SS pin provides a soft-start function and a
means to shut down the LTC1875. Soft-start reduces the
input current surge by gradually increasing the regulator’s
maximum output current. This pin can also be used for
power supply sequencing.
Pulling the RUN/SS pin below 0.7V shuts down the
LTC1875, which then draws < 1µA current from the supply. This pin can be driven directly from logic circuits as
shown in Figure 1. It is recommended that this pin is driven
to VIN during normal operation. Note that there is no
current flowing out of this pin. Soft-start action is accomplished by connecting an external RC network to the RUN/
SS pin as shown in Figure 1. The LTC1875 actively pulls
the RUN/SS pin to ground under low input supply voltage
conditions.
VIN
3.3V OR 5V
D1*
0.32V
RSS
RUN/SS
CSS
*ZETEX BAT54
1875 F01
Figure 1. RUN/SS Pin Interfacing
1875f
8
LTC1875
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OPERATIO
(Refer to Block Diagram)
Power Good Indicator
Low Dropout Operation
The power good function monitors the output voltage in all
modes of operation. Its open-drain output is pulled low
when the output voltage is not within ±7.5% of its nominally regulated voltage. The feedback voltage is filtered
before it is fed to a power good window comparator in
order to prevent false tripping of the power good signal
during fast transients. The window comparator monitors
the output voltage even in Burst Mode operation. In
shutdown mode, open drain is actively pulled low to
indicate that the output voltage is invalid.
When the input supply voltage decreases toward the
output voltage in a buck regulator, the duty cycle increases toward the maximum on-time. Further reduction
of the supply voltage forces the main switch to remain on
for more than one cycle until it reaches 100% duty cycle.
The output voltage will then be determined by the input
voltage minus the voltage drop across the top MOSFET
and the inductor.
Short-Circuit Protection
When the output is shorted to ground, the frequency of
the oscillator is reduced to about 80kHz, 1/7 the nominal
frequency. This frequency foldback ensures that the inductor current has more time to decay, thereby preventing
runaway. The oscillator’s frequency will progressively
increase to 550kHz (or to the synchronized frequency)
when VFB rises above 0.3V.
Frequency Synchronization
Low Supply Operation
The LTC1875 is designed to operate down to an input
supply voltage of 2.65V although the maximum allowable
output current is reduced at this low voltage. Figure 2
shows the reduction in the maximum output current as a
function of input voltage.
Another important detail to remember is that at low input
supply voltages, the RDS(ON) of the P-channel switch
increases. Therefore, the user should calculate the power
dissipation when the LTC1875 is used at 100% duty cycle
with low supply voltage (see Thermal Considerations in
the Applications Information section).
The LTC1875 can be synchronized to an external clock
source connected to the SYNC/MODE pin. The turn-on of
the top MOSFET is synchronized to the rising edge of the
external clock.
VOUT = 1.5V
MAX OUTPUT CURRENT (mA)
When the LTC1875 is clocked by an external source, Burst
Mode operation is disabled. In this synchronized mode,
when the output load current is very low, current comparator, ICOMP, may remain tripped for several cycles and force
the main switch to stay off for the same number of cycles.
Increasing the output load slightly allows constant frequency PWM operation to resume.
2000
1500
VOUT = 3.3V
1000
VOUT = 2.5V
500
0
Frequency synchronization is inhibited when the feedback
voltage VFB is below 0.6V. This prevents the external clock
from interfering with the frequency foldback for shortcircuit protection.
2.5
3.5
4.5
5.5
INPUT VOLTAGE (V)
6.5
7.5
1875 F02
Figure 2. Maximum Output Current vs Input Voltage
1875f
9
LTC1875
Slope Compensation and Inductor Peak Current
Slope compensation is required in order to prevent subharmonic oscillation at high duty cycles. It is accomplished by internally adding a compensating ramp to the
inductor current signal at duty cycles in excess of 40%. As
a result, the maximum inductor peak current is reduced for
duty cycles > 40%. This is shown in the decrease of the
inductor peak current as a function of duty cycle graph in
Figure 3.
MAXIMUM INDUCTOR PEAK CURRENT (mA)
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OPERATIO
2200
VIN = 3V
2000
1800
1600
1400
1200
1000
800
0
20
40
60
DUTY CYCLE (%)
80
100
1875 F03
Figure 3. Maximum Inductor Peak Current vs Duty Cycle
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APPLICATIO S I FOR ATIO
The basic LTC1875 application circuit is shown on the first
page of this data sheet. External component selection is
driven by the load requirement and begins with the selection of L followed by CIN and COUT.
Inductor Value Calculation
The inductor selection will depend on the operating frequency of the LTC1875. The internal nominal frequency is
550kHz, but can be externally synchronized from 350kHz
to 750kHz.
The operating frequency and inductor selection are interrelated in that higher operating frequencies allow the use
of smaller inductor and capacitor values. However, operating at a higher frequency results in lower efficiency
because of increased switching losses.
The inductor value has a direct effect on ripple current. The
ripple current ∆IL decreases with higher inductance or
frequency and increases with higher input voltages.
∆IL =
 V 
1
VOUT  1– OUT 
( f)(L)  VIN 
(1)
Accepting larger values of ∆IL allows the use of smaller
inductors, but results in higher output voltage ripple.
A reasonable starting point for setting ripple current is
∆IL = 0.3(IMAX).
The inductor value also has an effect on Burst Mode
operation. The transition to low current operation begins
when the inductor current peaks fall to approximately
500mA. Lower inductor values (higher ∆IL) will cause this
to occur at lower load currents, which can cause a dip in
efficiency in the upper range of low current operation. In
Burst Mode operation, lower inductance values will cause
the burst frequency to increase.
Inductor Selection
The inductor should have a saturation current rating
greater than the peak inductor current set by the current
comparator of LTC1875. Also, consideration should be
given to the resistance of the inductor. Inductor conduction losses are directly proportional to the DC resistance
of the inductor. Manufacturers sometimes provide maximum current ratings based on the allowable losses in the
inductor.
Suitable inductors are available from Coilcraft, Coiltronics, Dale, Sumida, Toko, Murata, Panasonic and other
manufacturers.
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CIN and COUT Selection
In continuous mode, the source current of the top MOSFET
is a trapezoidal waveform of duty cycle VOUT/VIN. To
prevent large voltage transients, a low ESR input capacitor
sized for the maximum RMS current must be used. The
maximum RMS input capacitor current is given by:
IRMS(CIN) ≅ IOMAX
[VOUT (VIN – VOUT )]1/ 2
VIN
This formula has a maximum at VIN = 2VOUT, where
IRMS = IOUT/2. This simple worst-case condition is commonly used for design because even significant deviations do not offer much relief. Note that the capacitor
manufacturer’s ripple current ratings are often based on
2000 hours of life. This makes it advisable to further
derate the capacitor, or choose a capacitor rated at a
higher temperature than required. Several capacitors may
also be paralleled to meet size or height requirements in
the design. Always consult the manufacturer if there are
any questions.
Depending on how the LTC1875 circuit is powered up,
you may need to check for input voltage transients. Input
voltage transients may be caused by input voltage steps
or by connecting the circuit to an already powered up
source such as a wall adapter. The sudden application of
input voltage will cause a large surge of current in the
input leads that will store energy in the parasitic inductance of the leads. This energy will cause the input voltage
to swing above the DC level of the input power source and
it may exceed the maximum voltage rating of the input
capacitor and LTC1875.
The easiest way to suppress input voltage transients is to
add a small aluminum electrolytic capacitor in parallel
with the low ESR input capacitor. The selected capacitor
needs to have the right amount of ESR in order to critically
dampen the resonant circuit formed by the input lead
inductance and the input capacitor. The typical values of
ESR will fall in the range of 0.5Ω to 2Ω and capacitance
will fall in the range of 5µF to 50µF.
The selection of COUT is driven by the required effective
series resistance (ESR). Typically, once the ESR requirement is satisfied, the capacitance is adequate for filtering.
The output ripple ∆VOUT is determined by:

1 
∆VOUT ≅ ∆IL  ESR +


8fC OUT 
where f = operating frequency, COUT = output capacitance
and ∆IL = ripple current in the inductor. The output ripple
is highest at maximum input voltage since ∆IL increases
with input voltage. For the LTC1875, the general rule for
proper operation is:
ESRCOUT < 0.125Ω
The choice of using a smaller output capacitance increases the output ripple voltage due to the frequency
dependent term but can be compensated for by using
capacitor(s) of very low ESR to maintain low ripple voltage. The ITH pin compensation components can be optimized to provide stable high performance transient
response regardless of the output capacitor selected.
Manufacturers such as Taiyo Yuden, AVX, Kemet and
Sanyo should be considered for low ESR, high performance capacitors. The POSCAP solid electrolytic chip
capacitor available from Sanyo is an excellent choice for
output bulk capacitors due to its low ESR/size ratio. Once
the ESR requirement for COUT has been met, the RMS
current rating generally far exceeds the IRIPPLE(P-P)
requirement.
Output Voltage Programming
The output voltage is set by a resistor divider according to
the following formula:
 R1
VOUT = 0.8V 1 + 
 R2
(2)
The external resistor divider is connected to the output,
allowing remote voltage sensing as shown in Figure 4.
1875f
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0.8V ≤ VOUT ≤ 6V
RLP
2.4V
R1
VFB
PLL_LPF
R2
LTC1875
CLP
SYNC/
MODE
SGND
1875 F04
DIGITAL
PHASE/
FREQUENCY
DETECTOR
VCO
Figure 4. Setting the LTC1875 Output Voltage
Phase-Locked Loop and Frequency Synchronization
The LTC1875 has an internal voltage-controlled oscillator
and phase detector comprising a phase-locked loop. This
allows the MOSFET turn-on to be locked to the rising edge
of an external frequency source. The frequency range of
the voltage-controlled oscillator is 350kHz to 750kHz. The
phase detector used is an edge sensitive digital type that
provides zero degrees phase shift between the external
and internal oscillators. This type of phase detector will not
lock up on input frequencies close to the harmonics of the
VCO center frequency. The PLL hold-in range ∆fH is equal
to the capture range, ∆fH = ∆fC = ±200kHz.
The output of the phase detector is a pair of complementary current sources charging or discharging the external
1000
900
OSC FREQUECNY (kHz)
800
700
600
500
400
300
200
100
0
0
0.5
1
VPLLLPF (V)
1.5
2
1875 F05
Figure 5. Relationship Between Oscillator Frequency
and Voltage at PLL_LPF Pin
1875 F06
Figure 6. Phase-Locked Loop Block Diagram
filter network on the PLL_LPF pin. The relationship between the voltage on the PLL_LPF pin and operating
frequency is shown in Figure 5. A simplified block diagram
is shown in Figure 6.
If the external frequency (VSYNC/MODE) is greater than
550kHz, the center frequency, current is sourced continuously, pulling up the PLL_LPF pin. When the external
frequency is less than 550kHz, current is sunk continuously, pulling down the PLL_LPF pin. If the external and
internal frequencies are the same but exhibit a phase
difference, the current sources turn on for an amount of
time corresponding to the phase difference. Thus the
voltage on the PLL_LPF pin is adjusted until the phase and
frequency of the external and internal oscillators are
identical. At this stable operating point the phase comparator output is open and the filter capacitor CLP holds the
voltage.
The loop filter components CLP and RLP smooth out the
current pulses from the phase detector and provide a
stable input to the voltage controlled oscillator. The filter
components CLP and RLP determine how fast the loop
acquires lock. Typically RLP = 10k and CLP is 2200pF to
0.01µF. When not synchronized to an external clock, the
internal connection to the VCO is disconnected. This
disallows setting the internal oscillation frequency by a DC
voltage on the VPLLLPF pin.
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Efficiency Considerations
The efficiency of a switching regulator is equal to the
output power divided by the input power times 100%. It is
often useful to analyze individual losses to determine what
is limiting the efficiency and which change would produce
the most improvement. Efficiency can be expressed as:
Efficiency = 100% – (L1 + L2 + L3 + ...)
Where L1, L2, etc. are the individual losses as a percentage
of input power.
the internal power MOSFET switches. Each time the
gate is switched from high to low to high again, a
packet of charge dQ moves from PVIN to ground. The
resulting dQ/dt is the current out of PVIN that is typically
larger than the DC bias current. In continuous mode,
IGATECHG = f(QT + QB) where QT and QB are the gate
charges of the internal top and bottom switches. Both
the DC bias and gate charge losses are proportional to
supply voltage and thus their effects will be more
pronounced at higher supply voltages.
Although all dissipative elements in the circuit produce
losses, two main sources usually account for most of the
losses in LTC1875 circuits: supply quiescent currents and
I2R losses. The supply quiescent current loss dominates
the efficiency loss at very low load current whereas the I2R
loss dominates the efficiency loss at medium to high load
currents. In a typical efficiency plot, the efficiency curve at
very low load currents can be misleading since the actual
power lost is of no consequence as illustrated in Figure 7.
2. I2R losses are calculated from the resistances of the
internal switches RSW and external inductor RL. In
continuous mode the average output current flowing
through inductor L is “chopped” between the main
switch and the synchronous switch. Thus, the series
resistance looking into SW pins is a function of both top
and bottom MOSFET RDS(ON) and the duty cycle (DC) as
follows:
1. The supply quiescent current is due to two components: the DC bias current as given in the Electrical
Characteristics and the internal main switch and synchronous switch gate charge currents. The gate charge
current results from switching the gate capacitance of
The RDS(ON) for both the top and bottom MOSFETs can
be obtained from the Typical Performance Characteristics curves. Thus, to obtain I2R losses, simply add RSW
to RL and multiply by the square of the average output
current.
1
POWER LOST (W)
0.1
RSW = (RDS(ON)TOP)(DC) + RDS(ON)BOT)(1 – DC)
Other losses including CIN and COUT ESR dissipative
losses, MOSFET switching losses and inductor core losses
generally account for less than 2% total additional loss.
VIN = 6V
VOUT = 3.3V
L = 6.8µH
Burst Mode
OPERATION
Thermal Considerations
0.01
0.001
0.0001
0.1
1
10
100
LOAD CURRENT (mA)
1000
1875 F07
Figure 7. Power Lost vs Load Current
In most applications, the LTC1875 does not dissipate
much heat due to its high efficiency. But, in applications
where the LTC1875 is running at high ambient temperature with low supply voltage and high duty cycles, such as
in dropout, the heat dissipated may exceed the maximum
junction temperature of the part. If the junction temperature reaches approximately 150°C, both power switches
will be turned off and the SW nodes will become high
impedance.
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To avoid the LTC1875 from exceeding the maximum
junction temperature, the user will need to do some
thermal analysis. The goal of the thermal analysis is to
determine whether the power dissipated exceeds the
maximum junction temperature of the part. Normally,
some iterative calculation is required to determine a reasonably accurate value. The temperature rise is given by:
TR = P • θJA
where P is the power dissipated by the regulator and θJA
is the thermal resistance from the junction of the die to the
ambient temperature.
The junction temperature is given by:
T J = TA + TR
where TA is the ambient temperature. Because the power
transistor RDS(ON) is a function of temperature, it is
usually necessary to iterate 2 to 3 times through the
equations to achieve a reasonably accurate value for the
junction temperature.
As an example, consider the LTC1875 in dropout at an
input voltage of 3V, a load current of 0.8A and an ambient
temperature of 70°C. From the typical performance graph
of switch resistance, the RDS(ON) of the P-channel switch
at 70°C is 0.35Ω. Therefore, power dissipated by the IC is:
P = I2 • RDS(ON) = 0.224W
For the SSOP package, the θJA is 110°C/W. Thus the
junction temperature of the regulator is:
TJ = 70°C + (0.224)(110) = 95°C
However, at this temperature, the RDS(ON) is actually 0.4Ω.
Therefore:
TJ = 70°C + (0.256)(140) = 98°C
which is below the maximum junction temperature of
125°C.
Note that at higher supply voltages, the junction temperature is lower due to reduced switch resistance (RDS(ON)).
Checking Transient Response
The regulator loop response can be checked by looking at
the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, VOUT immediately shifts by an amount
equal to (∆ILOAD • ESR), where ESR is the effective series
resistance of COUT. ∆ILOAD also begins to charge or
discharge COUT, generating a feedback error signal. The
regulator loop then acts to return VOUT to its steady-state
value. During this recovery time, VOUT can be monitored
for overshoot or ringing that would indicate a stability
problem. The ITH pin can be used for external compensation as shown in Figure 9. (The capacitor, CC2, is typically
needed for noise decoupling.)
A second, more severe transient is caused by switching in
loads with large (> 1µF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in parallel
with COUT, causing a rapid drop in VOUT. No regulator can
deliver enough current to prevent this problem if the load
switch resistance is low and it is driven quickly. The only
solution is to limit the rise time of the switch drive so that
the load rise time is limited to approximately (25 • CLOAD).
Thus, a 10µF capacitor charging to 3.3V would require a
250µs rise time, limiting the charging current to about
130mA.
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PC Board Layout Checklist
As with all high frequency switchers, when considering
layout, care must be taken in order to achieve optimal
electrical, thermal and noise performance. Figure 8 is a
sample of PC board layout for the design example shown
in Figure 9. A 4-layer PC board is used in this design.
Several guidelines are followed in this layout:
1. In order to minimize switching noise and improve
output load regulation, the PGND pins of the LTC1875
should be connected directly to 1) the negative terminal
of the output decoupling capacitors, 2) the negative
terminal of the input capacitor and 3) vias to the ground
plane immediately adjacent to Pins 1, 7 and 10. The
ground trace on the top layer of the PC board should be
as wide and short as possible to minimize series resistance and inductance.
2. Beware of ground loops in multiple layer PC boards. Try
to maintain one central ground node on the board and
use the input capacitor to avoid excess input ripple for
high output current power supplies. If the ground is to
be used for high DC currents, choose a path away from
the small-signal components.
3. The high di/dt loop from the top terminal of the input
capacitor, through the power MOSFETs and back to the
input capacitor should be kept as tight as possible to
reduce inductive ringing. Excess inductance can cause
increased stress on the power MOSFET and increase
noise on the input. If low ESR ceramic capacitors are
used to reduce input noise, place these capacitors close
to the DUT in order to keep the series inductance to a
minimum.
VIA CONNECTION TO VIN
VIAS TO GND PLANE
CC1
RC
CC2
CPL
RSVIN
RPL
VIA CONNECTION TO RFB1
CSS
RPG
RSS
RFB2
RFB1
DUT
L1
CIN1
CIN2
VIN
COUT
PGND
VOUT
1875 F08
VIAS TO GND PLANE
Figure 8. Typical Application and Suggested Layout (Topside Only)
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APPLICATIO S I FOR ATIO
4. Place the small-signal components away from high
frequency switching nodes. In the layout shown in
Figure 8, all of the small-signal components have been
placed on one side of the IC and all of the power
components have been placed on the other.
Substituting VOUT = 2.5V, VIN = 4.2V, ∆IL = 450mA and
f = 550kHz in equation (3) gives:
5. For optimum load regulation and true sensing, the top
of the output resistor divider should connect independently to the top of the output capacitor (Kelvin connection), staying away from any high dV/dt traces. Place
the divider resistors near the LTC1875 in order to keep
the high impedance FB node short.
A 4.7µH inductor works well for this application. For good
efficiency choose a 2A inductor with less than 0.125Ω
series resistance.
Design Example
As a design example, assume the LTC1875 is used in a
single lithium-ion battery-powered cellular phone application. The VIN will be operating from a maximum of 4.2V
down to about 2.65V. The load current requirement is a
maximum of 1.5A but most of the time it will be on standby
mode, requiring only 2mA. Efficiency at both low and high
load currents is important. Output voltage is 2.5V. With
this information we can calculate L using equation (1),
L=
 V 
1
VOUT  1– OUT 
( f)(∆IL )  VIN 
L=
2.5V
 2.5V 
1–
 = 4.09µH
550kHz • 450mA  4.2V 
CIN will require an RMS current rating of at least 0.75A at
temperature and COUT will require an ESR of less than
0.125Ω. In most applications, the requirements for these
capacitors are fairly similar.
For the feedback resistors, choose R2 = 412k. R1 can then
be calculated from equation (2) to be:
V

R1 =  OUT – 1 • R2 = 875.5k, use 887k
 0.8

Figure 9 shows the complete circuit along with its efficiency curve.
(3)
1875f
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RSVIN
10Ω
CSVIN
0.1µF
13
RPG
100k
SVIN
14
POWER
GOOD
15
SYNC/MODE
PGOOD
PVIN
RSS
1M
PVIN
2
PGND
RUN/SS
PGND
CSS
0.1µF
LTC1875
16
SWP
SWP
PLL_LPF
SWN
SWN
4
CC2
220pF
VFB
ITH
CC1
47pF
SGND
RC
150k
8
9
7
CIN2
10µF
CIN1
10µF
VIN
2.65V TO 4.2V
GND
10
5
12
COUT
47µF
L1
4.7µH
VOUT*
2.5V/1.5A
6
11
3
R1 887k
1
R2
412k
1875 F09a
BOLD LINES INDICATE HIGH CURRENT PATHS
CIN1, CIN2: TAIYO-YUDEN CERAMIC JMK316BJ106ML
COUT: TDK CERAMIC C4532X5R0J476M
L1: TOKO A921CY-4R7M
*1.5A IS THE MAXIMUM OUTPUT CURRENT
Figure 9a. Single Lithium-Ion to 2.5V/1.5A Regulator from Design Example
100
VOUT = 2.5V
95 L = 4.7µH
VIN = 3V
EFFICIENCY (%)
90
VIN = 3.6V
85
VIN = 4.2V
80
75
70
65
60
0.1
1
10
100
OUTPUT CURRENT (mA)
1000
1875 F09b
Figure 9b. Efficiency vs Output Current for Design Example
1875f
17
LTC1875
U
TYPICAL APPLICATIO
Single Li-Ion to 1.8V/1.5A Regulator Using All Ceramic Capacitors
RSVIN
10Ω
CSVIN
0.1µF
13
RPG
100k
SVIN
14
POWER
GOOD
15
SYNC/MODE
PGOOD
PVIN
RSS
1M
PVIN
2
PGND
RUN/SS
PGND
CSS
0.1µF
LTC1875
16
SWP
SWP
PLL_LPF
SWN
SWN
4
CC2
220pF
VFB
ITH
CC1
47pF
SGND
8
9
7
CIN2
10µF
CIN1
10µF
VIN 3V TO 4.2V
GND
10
5
12
COUT
47µF
L1
4.7µH
VOUT*
1.8V/1.5A
6
11
3
R1 523k
1
R2
412k
1875 TA02
RC
150k
BOLD LINES INDICATE HIGH CURRENT PATHS
CIN1, CIN2: TAIYO YUDEN CERAMIC JMK316BJ106ML
COUT: TDK CERAMIC C4532X5R0J476M
L1: TOKO A921CY-4R7M
*1.5A IS THE MAXIMUM OUTPUT CURRENT
Efficiency vs Output Current
100
VOUT = 1.8V
L = 4.7µH
VIN = 3.3V
90
EFFICIENCY (%)
VIN = 4.2V
80
70
60
50
40
0.1
1
10
100
OUPUT CURRENT (mA)
1000
1875 TA02a
1875f
18
LTC1875
U
PACKAGE DESCRIPTION
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
.045 ±.005
16 15 14 13 12 11 10 9
.254 MIN
.009
(0.229)
REF
.150 – .165
.229 – .244
(5.817 – 6.198)
.0165 ± .0015
.150 – .157**
(3.810 – 3.988)
.0250 TYP
RECOMMENDED SOLDER PAD LAYOUT
1
.015 ± .004
× 45°
(0.38 ± 0.10)
.007 – .0098
(0.178 – 0.249)
2 3
4
5 6
7
.053 – .068
(1.351 – 1.727)
8
.004 – .0098
(0.102 – 0.249)
0° – 8° TYP
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
.008 – .012
(0.203 – 0.305)
.0250
(0.635)
BSC
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
GN16 (SSOP) 0502
1875f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
LTC1875
U
TYPICAL APPLICATIO
Single Li-Ion to 3.3V/1A Regulator Using All Ceramic Capacitors
RSVIN
10Ω
CSVIN
0.1µF
13
RPG
100k
SVIN
14
POWER
GOOD
15
SYNC/MODE
PGOOD
PVIN
RSS
1M
PVIN
2
PGND
RUN/SS
PGND
CSS
0.1µF
LTC1875
16
PLL_LPF
SWP
SWP
SWN
SWN
4
CC2
220pF
CC1
47pF
9
CIN2
10µF
VIN 3V TO 4.2V
GND
10
5
12
L1
4.7µH
COUT
47µF
VOUT
3.3V*
1A**
6
11
VFB
SGND
CIN1
10µF
7
3
ITH
RC
150k
8
1
R1
1.29M
BOLD LINES INDICATE HIGH CURRENT PATHS
R2
412k
1875 TA03
CIN1, CIN2: TAIYO YUDEN CERAMIC JMK316BJ106ML
COUT: TDK CERAMIC C4532X5R0J476M
L1: TOKO A921CY-4R7M
*VOUT CONNECTED TO VIN FOR 3V < VIN < 3.3V
**1A IS THE MAXIMUM OUTPUT CURRENT
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ThinSOT is a trademark of Linear Technology Corporation.
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Linear Technology Corporation
LT/TP 0403 2K • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
 LINEAR TECHNOLOGY CORPORATION 2001