ONSEMI 2N3055H

2N3055, MJ2955
Preferred Device
Complementary Silicon
Power Transistors
. . . designed for general−purpose switching and amplifier
applications.
• DC Current Gain − hFE = 20 −70 @ IC = 4 Adc
• Collector−Emitter Saturation Voltage −
•
•
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VCE(sat) = 1.1 Vdc (Max) @ IC = 4 Adc
Excellent Safe Operating Area
Pb−Free Package is Available
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MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Emitter Voltage
VCEO
60
Vdc
Collector−Emitter Voltage
VCER
70
Vdc
Collector−Base Voltage
VCB
100
Vdc
Emitter−Base Voltage
VEB
7
Vdc
IC
15
Adc
Collector Current − Continuous
Base Current
IB
7
Adc
Total Power Dissipation @ TC = 25°C
Derate above 25°C
PD
115
0.657
W
W/°C
TJ, Tstg
– 65 to + 200
°C
Symbol
Max
Unit
RJC
1.52
°C/W
Operating and Storage Junction Temperature Range
15 A
POWER TRANSISTORS
COMPLEMENTARY SILICON
60 V
115 W
MARKING
DIAGRAM
TO−204AA (TO−3)
CASE 1−07
xxxx55 = Device Code
xxxx= 2N3055 or MJ2955
A
= Assembly Location
YY
= Year
WW = Work Week
x
= 1, 2, or 3
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
ORDERING INFORMATION
Package
Shipping†
2N3055
TO−204AA
100 Units / Tray
2N3055G
TO−204AA
(Pb−Free)
1 Units / Tubes
140
2N3055H
TO−204AA
100 Units / Tray
120
MJ2955
TO−204AA
100 Units / Tray
Device
160
PD, POWER DISSIPATION (WATTS)
xxxx55
A
YYWW
100
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
80
60
40
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
20
0
0
25
50
75
100
125
150
175
200
Preferred devices are recommended choices for future use
and best overall value.
TC, CASE TEMPERATURE (°C)
Figure 1. Power Derating
 Semiconductor Components Industries, LLC, 2004
April, 2004 − Rev. 4
1
Publication Order Number:
2N3055/D
2N3055, MJ2955
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ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
VCEO(sus)
60
−
Vdc
*OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 1)
(IC = 200 mAdc, IB = 0)
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Collector−Emitter Sustaining Voltage (Note 1)
(IC = 200 mAdc, RBE = 100 )
VCER(sus)
70
−
Vdc
Collector Cutoff Current
(VCE = 30 Vdc, IB = 0)
ICEO
−
0.7
mAdc
Collector Cutoff Current
(VCE = 100 Vdc, VBE(off) = 1.5 Vdc)
(VCE = 100 Vdc, VBE(off) = 1.5 Vdc, TC = 150°C)
ICEX
−
−
1.0
5.0
Emitter Cutoff Current
(VBE = 7.0 Vdc, IC = 0)
IEBO
−
5.0
20
5.0
70
−
−
1.1
3.0
mAdc
mAdc
*ON CHARACTERISTICS (Note 1)
hFE
DC Current Gain
(IC = 4.0 Adc, VCE = 4.0 Vdc)
(IC = 10 Adc, VCE = 4.0 Vdc)
Collector−Emitter Saturation Voltage
(IC = 4.0 Adc, IB = 400 mAdc)
(IC = 10 Adc, IB = 3.3 Adc)
−
VCE(sat)
Vdc
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Base−Emitter On Voltage
(IC = 4.0 Adc, VCE = 4.0 Vdc)
VBE(on)
−
1.5
Vdc
Is/b
2.87
−
Adc
Current Gain − Bandwidth Product
(IC = 0.5 Adc, VCE = 10 Vdc, f = 1.0 MHz)
fT
2.5
−
MHz
*Small−Signal Current Gain
(IC = 1.0 Adc, VCE = 4.0 Vdc, f = 1.0 kHz)
hfe
15
120
−
*Small−Signal Current Gain Cutoff Frequency
(VCE = 4.0 Vdc, IC = 1.0 Adc, f = 1.0 kHz)
fhfe
10
−
kHz
SECOND BREAKDOWN
Second Breakdown Collector Current with Base Forward Biased
(VCE = 40 Vdc, t = 1.0 s, Nonrepetitive)
DYNAMIC CHARACTERISTICS
*Indicates Within JEDEC Registration. (2N3055)
1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
20
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC − VCE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 2 is based on TC = 25°C; TJ(pk) is
variable depending on power level. Second breakdown
pulse limits are valid for duty cycles to 10% but must be
derated for temperature according to Figure 1.
IC, COLLECTOR CURRENT (AMP)
50 s
dc
10
1 ms
6
4
500 s
2
250 s
1
0.6
0.4
0.2
BONDING WIRE LIMIT
THERMALLY LIMITED @ TC = 25°C (SINGLE PULSE)
SECOND BREAKDOWN LIMIT
6
10
20
40
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
60
Figure 2. Active Region Safe Operating Area
http://onsemi.com
2
2N3055, MJ2955
500
200
300
TJ = 150°C
25°C
100
−55 °C
70
50
30
20
10
7.0
5.0
0.3
0.5 0.7 1.0
2.0 3.0
5.0 7.0
IC, COLLECTOR CURRENT (AMP)
0.2
0.1
−55 °C
70
50
30
20
10
10
VCE , COLLECTOR−EMITTER VOLTAGE (VOLTS)
VCE , COLLECTOR−EMITTER VOLTAGE (VOLTS)
TJ = 25°C
1.6
8.0 A
1.2
0.8
0.4
0
5.0
10
20
50
100 200
500 1000 2000
IB, BASE CURRENT (mA)
5.0 7.0
0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (AMP)
10
Figure 4. DC Current Gain, MJ2955 (PNP)
2.0
4.0 A
0.2
0.1
Figure 3. DC Current Gain, 2N3055 (NPN)
IC = 1.0 A
VCE = 4.0 V
TJ = 150°C
25°C
100
hFE , DC CURRENT GAIN
200
hFE , DC CURRENT GAIN
VCE = 4.0 V
5000
2.0
TJ = 25°C
1.6
IC = 1.0 A
4.0 A
8.0 A
1.2
0.8
0.4
0
5.0
Figure 5. Collector Saturation Region,
2N3055 (NPN)
10
20
50
100 200
500 1000 2000
IB, BASE CURRENT (mA)
5000
Figure 6. Collector Saturation Region,
MJ2955 (PNP)
1.4
2.0
TJ = 25°C
1.2
TJ = 25°C
0.8
V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
1.6
1.0
VBE(sat) @ IC/IB = 10
0.6
VBE @ VCE = 4.0 V
0.4
1.2
VBE(sat) @ IC/IB = 10
VBE @ VCE = 4.0 V
0.8
0.4
0.2
0
VCE(sat) @ IC/IB = 10
VCE(sat) @ IC/IB = 10
0.1
0.2
0.3
0.5 0.7
1.0
2.0
3.0
5.0 7.0
0
10
0.1
IC, COLLECTOR CURRENT (AMPERES)
0.2
0.3
0.5
1.0
2.0
3.0
5.0
IC, COLLECTOR CURRENT (AMP)
Figure 7. “On” Voltages, 2N3055 (NPN)
Figure 8. “On” Voltages, MJ2955 (PNP)
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3
10
2N3055, MJ2955
PACKAGE DIMENSIONS
TO−204 (TO−3)
CASE 1−07
ISSUE Z
A
N
C
−T−
E
D
SEATING
PLANE
K
2 PL
0.13 (0.005)
U
T Q
M
M
Y
DIM
A
B
C
D
E
G
H
K
L
N
Q
U
V
M
−Y−
L
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. ALL RULES AND NOTES ASSOCIATED WITH
REFERENCED TO−204AA OUTLINE SHALL APPLY.
2
H
G
B
M
T Y
1
−Q−
0.13 (0.005)
INCHES
MIN
MAX
1.550 REF
−−−
1.050
0.250
0.335
0.038
0.043
0.055
0.070
0.430 BSC
0.215 BSC
0.440
0.480
0.665 BSC
−−−
0.830
0.151
0.165
1.187 BSC
0.131
0.188
MILLIMETERS
MIN
MAX
39.37 REF
−−−
26.67
6.35
8.51
0.97
1.09
1.40
1.77
10.92 BSC
5.46 BSC
11.18
12.19
16.89 BSC
−−−
21.08
3.84
4.19
30.15 BSC
3.33
4.77
M
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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2N3055/D