ROHM DTA125TSA

DTA125TUA / DTA125TKA / DTA125TSA
Transistors
Digital transistor (built-in resistor)
DTA125TUA / DTA125TKA / DTA125TSA
Each lead has same dimensions
(1) Emitter(Source)
(2) Base(Gate)
(3) Collector(Drain)
ROHM : UMT3
EIAJ : SC-70
Junction temperature
Tj
Tstg
Storage temperature
200
Pc
300
150
−55 ∼ +150
(1)
2.8
mW
0.3to0.6
°C
°C
Package
Marking
Packaging code
Basic ordering unit (pieces)
UMT3
9A
SMT3
9A
T146
3000
SPT
−
T106
3000
DTA125TSA
4
2
3Min.
DTA125TSA
3
DTA125TKA
(1) Emitter(Source)
(2) Base(Gate)
(3) Collector(Drain)
(15Min.)
DTA125TUA
Each lead has same dimensions
ROHM : SMT3
EIAJ : SC-59
!Package, marking, and packaging specifications
Part No.
(2)
1.6
1.1
V
mA
0.95 0.95
1.9
2.9
−5
−100
0.8
VEBO
IC
(3)
V
V
Emitter-base voltage
Collector current
Collector power DTA125TUA / DTA125TKA
dissipation
DTA125TSA
0to0.1
Unit
−50
−50
0.4
Limits
VCBO
VCEO
2.0
(1)
0.1to0.4
0.15
Symbol
1.3
0to0.1
0.15
0.2
2.1
DTA125TKA
Parameter
0.9
(2)
(3)
0.3
1.25
!Absolute maximum ratings (Ta = 25°C)
Collector-base voltage
Collector-emitter voltage
0.65 0.65
DTA125TUA
0.7
!External dimensions (Units : mm)
!Features
1) Built-in bias resistors enable the configuration of an
inverter circuit without connecting external input
resistors.
2) The bias resistors consist of thin-film resistors with
complete isolation to allow positive biasing of the input,
and parasitic effects are almost completely eliminated.
3) Only the on / off conditions need to be set for
operation, making device design easy.
4) Higher mounting densities can be achieved.
TP
5000
0.45
2.5
0.5 0.45
5
(1) (2) (3)
Taping specifications
(1) Emitter
(2) Collector
(3) Base
ROHM : SPT
EIAJ : SC-72
!Electrical characteristics (Ta = 25°C)
!Circuit schematic
Parameter
Symbol
Min.
Typ.
Max.
Unit
Collector-base breakdown voltage
Collector-emitter breakdown voltage
Emitter-base breakdown voltage
BVCBO
BVCEO
−50
−50
−
−
−
−
V
V
IC = −50µA
IC = −1mA
BVEBO
−
−
V
µA
IE = −50µA
ICBO
−5
−
−
Collector cutoff current
Emitter cutoff current
Collector-emitter saturation voltage
−
−
100
−
−
250
−0.3
600
µA
V
−
VEB = −4V
IC = −0.5mA , IB = −0.05mA
IC = −1mA , VCE = −5V
140
−
200
260
−
kΩ
MHz
IEBO
VCE(sat)
DC current transfer ratio
hFE
Input resistance
R1
Transition frequency
fT
∗ Transition frequency of the device.
250
−0.5
−0.5
Conditions
R1
E
VCB = −50V
−
VCE = −10V , IE = 5mA , f = 100MHz
C
B
E : Emitter
C : Collector
B : Base
∗