TRA2532 Overvoltage Transient Suppressor 24 V–32 V Designed for applications requiring a diode with reverse avalanche characteristics for use as reverse power transient suppressor. Developed to suppress transients in automotive system, this device operates in the forward mode as standard rectifier or reverse mode as power zener diode and will protect expensive modules such as ignition, injection, antiblocking system . . . from overvoltage conditions. • High Power Capability • Economical http://onsemi.com MICRODE BUTTON CASE 193 Mechanical Characteristics • Finish: All External Surfaces are Corrosion Resistant, and Contact • • • • MARKING DIAGRAM Areas are Readily Solderable Polarity: Indicated by Cathode Band Weight: 1.8 Grams (Approximately) Maximum Temperature for Soldering Purposes: 260°C Marking: 2532 2532 LYYWW 2532 L YY WW MAXIMUM RATINGS Rating Symbol Value Unit DC Blocking Voltage VR 23 Volts Average Forward Current (Single Phase, Resistive Load, TC = 150°C) IO 32 Amps ORDERING INFORMATION Peak Repetitive Reverse Surge Current (Time Constant = 10 ms, TC = 25°C) IRSM 80 Amps Non–Repetitive Peak Surge Current (Halfwave, Single Phase, 60 Hz) IFSM 500 Amps Operating Junction Temperature Range TJ –65 to +175 °C Storage Temperature Range Tstg –65 to +150 °C Semiconductor Components Industries, LLC, 2000 October, 2000 – Rev. 1 = Device Code = Location Code = Year = Work Week Device TRA2532 1 Package Shipping Microde Button 5000 Units/Box Publication Order Number: TRA2532/D TRA2532 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction to Case Symbol Value Unit RθJC 0.8 °C/W ELECTRICAL CHARACTERISTICS Characteristic Symbol Min Max Unit Instantaneous Forward Voltage (Note 1.) (iF = 100 Amps, TC = 25°C) vF – 1.18 Volts Reverse Current(1) (VR = 23 Vdc, TC = 25°C) IR – 10 µA Breakdown Voltage(1) (IZ = 100 mA, TC = 25°C) V(BR) 24 32 Volts Breakdown Voltage (IZ = 80 Amps, TC = 25°C, PW = 80 µs) V(BR) – 40 Volts V(BR)TC 0.096* 0.096* %/°C VFTC 2* 2* mV/°C Breakdown Voltage Temperature Coefficient Forward Voltage Temperature Coefficient @ IF = 10 mA 1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%. *Typical http://onsemi.com 2 10 104 VR = 20 V C t , CAPACITANCE (nF) 103 102 101 100 1 25 V F , INSTANTANEOUS FORWARD VOLTAGE (mV) TJ = 25°C 50 75 100 150 125 175 10 100 VR, REVERSE VOLTAGE (V) Figure 1. Normalized Reverse Current Figure 2. Typical Reverse Capacitance 1150 PW = 300 s TC = 25°C 1050 1000 Maximum 950 Typical 900 850 800 750 1 10 80 60 40 20 0 100 0 IF, AVERAGE FORWARD CURRENT (A) 25 50 75 100 125 150 175 200 TC, CASE TEMPERATURE (°C) Figure 3. Forward Voltage Figure 4. Maximum Current Rating 1000 1000 WRSM, PEAK REVERSE ENERGY (J) IRSM, PEAK REVERSE CURRENT (A) 1 TJ, JUNCTION TEMPERATURE (°C) 1200 1100 0.1 IF, AVERAGE FORWARD CURRENT (A) IR, REVERSE CURRENT (NORMALIZED) TRA2532 TC = 25°C 100 10 1 10 100 1000 TC = 25°C 100 10 1 1 t, TIME CONSTANT (mS) 10 100 t, TIME CONSTANT (mS) Figure 5. Maximum Peak Reverse Current Figure 6. Maximum Reverse Energy http://onsemi.com 3 1000 TRA2532 PRSM, PEAK REVERSE POWER (W) PRSM, PEAK REVERSE POWER (W) 10000 TC = 25°C 1000 100 10 100 Time Constant = 10 ms Time Constant = 100 ms 25 1000 50 100 75 125 t, TIME CONSTANT (mS) TC, CASE TEMPERATURE (°C) Figure 7. Maximum Peak Reverse Power Figure 8. Reverse Power Derating 100 150 1.20 1.18 VZ (IRSM)/VZ (100 mA) r(t), TRANSIENT THERMAL RESISTANCE 1 2800 2600 2400 2200 2000 1800 1600 1400 1200 1000 800 600 400 200 10–1 RJC(t) = RJC • r(t) PW = 80 s, TC = 25°C 1.16 1.14 1.12 1.10 1.08 1.06 1.04 1.02 1.00 10–2 0.1 1 10 100 300 10 20 30 40 50 60 70 80 90 100 110 120 t, TIME (mS) IRSM, PEAK REVERSE CURRENT (A) Figure 9. Thermal Response Figure 10. Typical Clamping Factor http://onsemi.com 4 TRA2532 2 Ohms 0 – 150 V 50 mF dl/dt Limitation 100 H TRA2532 Figure 11. Load Dump Test Circuit 100 dl/dt < 1 A/s 80 (%) 60 40 20 0 0 0.1 t (50%) t (37%) 0.2 0.3 t (10%) 0.4 0.5 t (37%) = Time Constant t (50%) = 0.7 t (37%) t (10%) = 2.3 t (37%) t, TIME (s) Figure 12. Load Dump Pulse Current http://onsemi.com 5 TRA2532 MECHANICAL STRESS Assembly and Soldering Information There are two basic areas of consideration for successful implementation of button rectifiers: 1. Mounting and Handling 2. Soldering Each should be carefully examined before attempting a finished assembly or mounting operation. COMPRESSION TORSION Mounting and Handling The button rectifier lends itself to a multitude of assembly arrangements, but one key consideration must always be included: One Side of the Connections to the Button Must be Flexible! This stress relief to the button should also be chosen for maximum contact area to afford the best heat transfer – but not at the expense of flexibility. For an annealed copper terminal a thickness of 0.015″ is suggested. TENSION SHEAR Exceeding these recommended maximums can result in electrical degradation of the device. Strain Relief Terminal for Button Rectifier Soldering The button rectifier is basically a semiconductor chip bonded between two nickel–plated copper heat sinks with an encapsulating material of epoxy compound. The exposed metal areas are also tin plated to enhance solderability. In the soldering process it is important that the temperature not exceed 260°C if device damage is to be avoided. Various solder alloys can be used for this operation but two types are recommended for best results: 1. 95% Sn, 5% Sb; melting point 237°C 2. 96.5% tin, 3.5% silver; melting point 221°C 3. 63% tin, 37% lead; melting point 183°C Solder is available as preforms or paste. The paste contains both the metal and flux and can be dispensed rapidly. The solder preform requires the application of a flux to assure good wetting of the solder. The type of flux used depends upon the degree of cleaning to be accomplished and is a function of the metal involved. These fluxes range from a mild rosin to a strong acid; e.g., Nickel plating oxides are best removed by an acid base flux while an activated rosin flux may be sufficient for tin plated parts. Since the button is relatively lightweight, there is a tendency for it to float when the solder becomes liquid. To prevent bad joints and misalignment, it is suggested that a weighting or spring loaded fixture be employed. It is also important that severe thermal shock (either heating or cooling) be avoided as it may lead to damage of the die or encapsulant of the part. Copper Terminal Button Base (Heat Sink Material) The base heat sink may be of various materials whose shape and size are a function of the individual application and the heat transfer requirements. Common Materials Steel Copper Aluminum Advantages and Disadvantages Low Cost: relatively low heat conductivity High Cost: high heat conductivity Medium Cost: medium heat conductivity. Relatively expensive to plate and not all platers can process aluminum. Handling of the button during assembly must be relatively gentle to minimize sharp impact shocks and avoid nicking of the plastic. Improperly designed automatic handling equipment is the worst source of unnecessary shocks. Techniques for vacuum handling and spring loading should be investigated. The mechanical stress limits for the button diode are as follows: Compression Tension Torsion Shear 32 lbs. 32 lbs. 6–inch lbs. 55 lbs. 142.3 Newton 142.3 Newton 0.68 Newtons–meters 244.7 Newton http://onsemi.com 6 TRA2532 control but requires sophisticated temperature monitoring systems such as infrared. 3. Ovens are good for batch soldering and are production limited. There are handling problems because of slow cooling. Response time is load dependent, being a function of the watt rating of the oven and the mass of parts. Large ovens may not give an acceptable temperature gradient. Capital cost is low compared to belt furnaces and flame soldering. 4. Hot Plates are good for soldering small quantities of prototype devices. Temperature control is fair with overshoot common because of the exposed heating surface. Solder flow and positioning can be corrected during soldering since the assembly is exposed. Investment cost is very low. Button holding fixtures for use during soldering may be of various materials. Stainless steel has a longer use life while black anodized aluminum is less expensive and will limit heat reflection and enhance absorption. The assembly volume will influence the choice of materials. Fixture dimension tolerances for locating the button must allow for expansion during soldering as well as allowing for button clearance. Heating Techniques The following four heating methods have their advantages and disadvantages depending on volume of buttons to be soldered. 1. Belt furnaces readily handle large or small volumes and are adaptable to establishment of “on–line’’ assembly since a variable belt speed sets the run rate. Individual furnace zone controls make excellent temperature control possible. 2. Flame Soldering involves the directing of natural gas flame jets at the base of a heatsink as the heatsink is indexed to various loading–heating– cooling–unloading positions. This is the most economical labor method of soldering large volumes. Flame soldering offers good temperature Regardless of the heating method used, a soldering profile giving the time–temperature relationship of the particular method must be determined to assure proper soldering. Profiling must be performed on a scheduled basis to minimize poor soldering. The time–temperature relationship will change depending on the heating method used. http://onsemi.com 7 TRA2532 PACKAGE DIMENSIONS MICRODE BUTTON CASE 193–04 ISSUE J DIM A B D F M A MILLIMETERS MIN MAX 8.43 8.69 4.19 4.45 5.54 5.64 5.94 6.25 5 NOM INCHES MIN MAX 0.332 0.342 0.165 0.175 0.218 0.222 0.234 0.246 5 NOM M D B F ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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