Quad Parametric Measurement Unit With Integrated 16-Bit Level Setting DACs AD5522 Preliminary Technical Data FEATURES PRODUCT OVERVIEW Quad Parametric Measurement Unit FV, FI, FN, MV, MI Functions 4 Programmable Current Ranges (Internal RSENSE) 5uA, 20uA, 200uA and 2mA 1 Programmable Current Range up to 64mA (external RSENSE) 22.5 V FV Range with Asymmetrical Operation Integrated 16-Bit DACs Provide Programmable Levels Offset and Gain Correction on Chip Low Capacitance Outputs Suited to Relay Less Systems On-chip Comparators Per Channel FI Voltage Clamps & FV Current Clamps Guard Drive Amplifier System PMU connections Programmable Temperature Shutdown Feature SPI/Microwire/DSP & LVDS Compatible Interfaces Compact 80 lead TQFP Package with Exposed Pad (Top Or Bottom) The AD5522 is a high performance, highly integrated parametric measurement unit consisting of four independent channels. Each PPMU channel includes five, 16-bit, voltage out DACs setting the programmable inputs levels for the force voltage input, clamp and comparator inputs (high and low). Five programmable force and measure current ranges are available ranging from 5µA to 64mA. Four of these ranges use on chip sense resistors, while a high current range up to 64mA is available per channel using off chip sense resistors. Currents in excess of 64mA require an external amplifier. Low capacitance DUT connections (FOH, EXT FOH) ensure the device is suited to relay less test systems. The PMU functions are controlled via a simple three wire serial interface compatible with SPI/QSPI/Microwire and DSP interface standards. Interface clocks of 50MHz allow fast updating of modes. LVDS (Low Voltage Differential Signaling) interface protocol at 100MHz is also supported. Comparator outputs are provided per channel for device go no-go testing and characterization. Control registers provide easy way of changing force or measure conditions, DAC levels and selected current ranges. SDO (serial data out) allows the user to readback information for diagnostic purposes. APPLICATIONS Automatic Test Equipment (ATE) per pin Parametric Measurement Unit Continuity & Leakage Testing Device Power Supply Instrumentation SMU (Source Measure Unit) Precision Measurement VREF 16 REFGND X1 REG M REG C REG 16 16 DGND DVCC AVSS(0-4) AVDD(0-4) AGND CCOMP (0-3) X2 REG EXTFOH(0-3) CLH *2 *2 OFFSET DAC FIN *6 16 X1 REG M REG C REG INTERNAL RANGE SELECT (5uA, 20uA, 200uA, 2mA) 16 SW 1 16-Bit FIN DAC X2 REG FOH(0-3) - 16 16 X2 REG SW 4 16-Bit CLL DAC *2 SW 6 SW 7 EXTMEASIH(0-3) CLL OFFSET DAC BIAS TO CENTER IRANGE SW 10 *2 SW 5 RSENSE SW 2 16 1kΩ FORCE AMPLIFER AGNDx 16 60Ω + *6 X1 REG M REG C REG CFF(0-3) SW 3 16 16 SYS_SENSE EN x4 16-Bit CLH DAC 16 SYS_FORCE + - SW 8 EXTERNAL RSENSE (CURRENTS UP TO 64mA) 10kΩ + EXTMEASIL(0-3) x5 or x10 MEASOUT (0-3) SW 12 AGND (0-3) 16 MEASOUT MUX & GAIN x1/x0.2 X1 REG M REG C REG 16 *6 16 X2 REG SW 9 MEASURE CURRENT IN AMP SW 11 *6 16 + - TEMP SENSOR MEASVH (0-3) + - 16-Bit CPH DAC AGNDx 16 CPH *6 16 X1 REG M REG C REG 16 *6 16 CPL 16-Bit CPL DAC X2 REG - + - - GUARD AMP DUTGND SW 16 SW 14 DUT GUARDIN (0-3)/ DUTGND (0-3) DUTGND MEASURE VOLTAGE IN AMP - + + GUARD (0-3) SW 13 + x1 SW 15 COMPARATOR 10kΩ AGNDx 16-Bit OFFSET DAC 16 TO ALL DAC OUTPUT AMPLIFIERS TO MEASOUT MUX 16 SERIAL INTERFACE POWER ON RESET RESET SDO SCLK SDI SYNC BUSY LOAD LVDS/ CPOL0/ SCLK SPI CPOH0/ SDI CPOL1/ SYNC CPOH1/ SDO CPOL2 CPOH2 CPOL3 /CPO0 /CPO1 /CPO2 TEMP SENSOR TMPALM CLAMP & GUARD ALARM CGALM CPOH3 /CPO3 Figure 1. Functional Block Diagram Rev.PrM Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved. AD5522 Preliminary Technical Data TABLE OF CONTENTS Features..................................................................................................................... 1 Force Voltage, FV ............................................................................................. 26 Revision History...................................................................................................... 2 Force Current, FI.............................................................................................. 27 Specifications ........................................................................................................... 4 SPI INTERFACE .............................................................................................. 28 Table 2. TIMING Characteristics .................................................................... 9 LVDS INTERFACE.......................................................................................... 28 Absolute Maximum Ratings................................................................................ 12 Serial Interface Write Mode ........................................................................... 28 Thermal Resistance.......................................................................................... 12 RESET Function............................................................................................... 28 ESD Caution ..................................................................................................... 12 BUSY and LOAD Function ............................................................................ 28 Pin Configuration and Function Descriptions................................................. 13 Register Update Rates...................................................................................... 29 TERMINOLOGY.................................................................................................. 16 Register Selection............................................................................................. 30 Functional Description ........................................................................................ 17 Write System Control Register....................................................................... 31 Force Amplifier ................................................................................................ 19 Write PMU Register ........................................................................................ 33 Comparators ..................................................................................................... 19 Write DAC Register ......................................................................................... 35 Clamps ............................................................................................................... 19 Read Registers................................................................................................... 37 Current Range selection.................................................................................. 20 Readback of System Control Register........................................................... 38 High Current ranges........................................................................................ 20 Readback of PMU Register............................................................................. 39 Device under test ground (DUTGND) ........................................................ 20 Readback of Comparator Status Register..................................................... 39 Guard amplifer ................................................................................................. 21 Readback of Alarm Status Register ............................................................... 40 Compensation Capacitors .............................................................................. 21 Readback of DAC Register ............................................................................. 40 System Force Sense Switches.......................................................................... 22 Power On Default ............................................................................................ 41 Temperature Sensor......................................................................................... 22 Setting up the device on power on ................................................................ 42 Measure Output (MEASOUT) ...................................................................... 22 Changing Modes .............................................................................................. 42 DAC Levels............................................................................................................. 23 Required external components ...................................................................... 43 Offset DAC........................................................................................................ 23 Typical Application for the AD5522 ............................................................. 45 Offset and Gain registers ................................................................................ 23 Outline Dimensions ............................................................................................. 46 Cached x2 registers .......................................................................................... 23 Ordering Guide ................................................................................................ 47 VREF ..................................................................................................................... 24 Notes ....................................................................................................................... 48 Reference Selection.......................................................................................... 24 Calibration ........................................................................................................ 25 System Level Calibration ................................................................................ 25 REVISION HISTORY Rev PrM, 12th March – Update to specification pages, addition of typical plots, general update of all sections of datasheet. Update of AD5522 models. . Rev. PrM | Page 2 of 48 Preliminary Technical Data VREF 16 X1 REG M REG C REG 16 16 REFGND CCOMP 0 X2 REG *2 EN CH0 16-Bit CLH DAC 16 *2 DGND DVCC AVSS(0-4) AVDD(0-4) AGND AD5522 EXTFOH 0 CLH OFFSET DAC INTERNAL RANGE SELECT (5uA, 20uA, 200uA, 2mA) 16 16 FIN *6 16 X1 REG M REG C REG 16 SW 1 16-Bit FIN DAC + X2 REG FOH 0 FORCE AMPLIFER AGND *6 - SW 6 SW 5 16 16 16 X2 REG 16-Bit CLL DAC SW 7 EXTMEASIH 0 CLL + - OFFSET DAC BIAS TO CENTER IRANGE *2 SW 10 *2 SW 4 RSENSE SW 2 16 X1 REG M REG C REG CFF 0 SW 3 SW 8 EXTERNAL RSENSE (CURRENTS UP TO 64mA) 10kΩ + EXTMEASIL 0 x5 or x10 MEASOUT 0 SW 12 AGND MEASOUT MUX & GAIN x1/x0.2 + - TEMP SENSOR 16 MEASURE CURRENT IN AMP SW 11 *6 16 X1 REG M REG C REG 16 16 X2 REG MEASVH 0 + - 16-Bit CPH DAC AGND SW 13 + *6 DUTGND x1 16 CPH *6 16 X1 REG M REG C REG 16 16 SW 9 + - - CPL 16-Bit CPL DAC X2 REG - + GUARD AMP GUARD 0 DUT DUTGND GUARDIN 0/ DUTGND 0 SW 14 SW 15 MEASURE VOLTAGE IN AMP - + SW 16 10kΩ COMPARATOR CPOL0/ SCLK AGNDx CPOH0/ SDI CCOMP 1 MEASOUT 1 CPOL1/ SYNC EXTFOH 1 CFF 1 FOH 1 EXTMEASIH 1 EXTMEASIL 1 MEASVH 1 GUARD 1 GUARDIN 1/DUTGND 1 CH1 CPOH1/ SDO AGND MUX CCOMP 2 MEASOUT 2 EXTFOH 2 CFF 2 FOH 2 EXTMEASIH 2 EXTMEASIL 2 MEASVH 2 GUARD 2 GUARDIN 2/DUTGND 2 CH2 CPOL2/CPO0 CPOH2/CPO1 AGND SYS_SENSE SYS_FORCE MUX EN CCOMP 3 EXTFOH 3 16 X1 REG M REG C REG 16 16 16-Bit CLH DAC 16 X2 REG *2 *2 CLH CH3 OFFSET DAC 16 FIN *6 16 16 X1 REG M REG C REG 16 INTERNAL RANGE SELECT (5uA, 20uA, 200uA, 2mA) SW 1 16-Bit FIN DAC + X2 REG FOH 3 FORCE AMPLIFER AGND *6 - X1 REG M REG C REG 16 16 16 X2 REG 16-Bit CLL DAC SW 6 SW 7 SW 5 EXTMEASIH 3 CLL OFFSET DAC BIAS TO CENTER IRANGE *2 SW 10 *2 SW 4 RSENSE SW 2 16 CFF 3 SW 3 + - SW 8 EXTERNAL RSENSE (CURRENTS UP TO 64mA) 10kΩ + EXTMEASIL 3 x5 or x10 MEASOUT 3 SW 12 MEASOUT MUX & GAIN x1/x0.2 16 AGND *6 X1 REG M REG C REG 16 16 X2 REG MEASVH 3 + - 16-Bit CPH DAC AGND *6 CPH *6 X1 REG M REG C REG 16 16 16-Bit CPL DAC X2 REG SW 16 SW 13 + DUTGND x1 16 16 SW 9 MEASURE CURRENT IN AMP SW 11 16 + - TEMP SENSOR + - - CPL GUARD 3 GUARD AMP GUARDIN 3/ DUTGND 3 SW 14 SW 15 - + - + MEASURE VOLTAGE IN AMP DUT 10kΩ COMPARATOR AGND 16-Bit OFFSET DAC 16 SW 15a 16 SERIAL INTERFACE POWER ON RESET RESET 10kΩ AGND SDO SCLK SDI SYNC BUSY LOAD DUTGND DUTGND TO ALL DAC OUTPUT AMPLIFIERS LVDS/ CPOL3 SPI /CPO2 CPOH3 /CPO3 Figure 2. Detailed Block Diagram Rev. PrM | Page 3 of 48 TO MEASOUT MUX TEMP SENSOR TMPALM CLAMP & GUARD ALARM CGALM AD5522 Preliminary Technical Data SPECIFICATIONS Table 1. AVDD ≥ 10V, AVSS ≤ −5V, |AVDD – AVSS| ≥ 20V and ≤ 33V, DVCC = 2.3V to 5.25V, VREF=5V, Gain (m), Offset (c) and DAC Offset registers at default values (TJ = +25 to +90oC, max specs unless otherwise noted.) Parameter FORCE VOLTAGE Min Typ1 Max Units FOH Output Voltage Range AVSS+4 AVDD-4 V EXTFOH Output Voltage Range AVSS+3 AVDD-3 V -100 22.5 100 Output Voltage Span Offset Error Offset Error Tempco2 Gain Error Gain Error Tempco2 ±100 -0.5 0.5 ±10 V mV µV/ oC % ppm/ oC Linearity Error -0.02 0.02 % FSR Short Circuit Current Limit2 -120 -10 120 10 mA mA MEASURE CURRENT Offset Error Offset Error Tempco2 Gain Error Gain Error Tempco2 Linearity Error Output Voltage Span2 CM Error -1 1 -0.01 0.01 22.5 % µV/ oC % ppm/ oC % FSCR V -0.005 0.005 %FSVR/V ±10 -1 1 25 Measure Current Ranges ±5 ±20 ±200 ±2 µA µA µA mA Up to ±64 FORCE CURRENT Voltage Compliance, FOH Voltage Compliance, EXTFOH Offset Error AVSS+4 AVSS+3 -2 Gain Error Gain Error Tempco2 Linearity Error -0.02 0.02 V V %FSCR ppm FS/ o C % ppm/ oC % FSCR CM Error -0.005 0.005 %FSCR/V Offset Error Tempco2 Force Current Ranges AVDD-4 AVDD-3 2 mA ±10 -0.5 0.5 ±25 ±5 ±20 ±200 ±2 µA µA µA mA Up to ±64 mA Rev. PrM | Page 4 of 48 Test Conditions/Comments All current ranges from FOH at full scale current. Includes ±1V dropped across sense resistor External high current range at full scale current. Does not include ±1V dropped across sense resistor Measured at Midscale Code, 0V. Prior to calibration. Prior to calibration. FSR = Fullscale Range. ±10 V range, Gain and offset errors calibrated out. On 64mA range. In all other ranges. MEASURE = (IDUT X RSENSE x GAIN) V(Rsense)= ±1V, Measured with zero current flowing. Instrumentation Amp Gain = 5 or 10 Offset and Gain errors calibrated out % of FS Change at measure output per V change in DUT voltage Set using internal sense resistor Set using internal sense resistor Set using internal sense resistor Set using internal sense resistor Set using external sense resistor, internal amplifier can drive to 64mA Measured at Midscale Code, 0V. Prior to calibration. Prior to calibration. % of FS Change at measure output per V change in DUT voltage Set using internal sense resistor, 200kΩ Set using internal sense resistor, 50kΩ Set using internal sense resistor, 5kΩ Set using internal sense resistor, 500Ω Set using external sense resistor, internal amplifier can drive to 64mA Preliminary Technical Data AD5522 MEASURE VOLTAGE Measure Voltage Range Offset Error Offset Error Offset Error Tempco2 Gain Error Gain Error Gain Error Tempco2 Linearity Error COMPARATOR Comparator Span Offset Error Propagation delay2 VOLTAGE CLAMPS Clamp Span Positive Clamp Accuracy Negative Clamp Accuracy Recovery Time2 Activation Time2 CURRENT CLAMPS Clamp Accuracy Recovery Time2 Activation Time2 FOH, EXTFOH, EXTMEASIL, EXTMEASIH, CFF Pin Capacitance2 Leakage Current Leakage Current Tempco2 MEASVH Pin Capacitance2 Leakage/Bias Current Leakage Current Tempco2 SYS_SENSE Pin Capacitance2 SYS_SENSE Impedance Leakage Current Leakage Current Tempco2 SYS_FORCE Pin Capacitance2 SYS_FORCE Impedance Leakage Current Leakage Current Tempco2 AVDD-4 AVSS+4 -10 -40 10 40 ±10 -0.5 -0.5 0.5 0.5 ±10 -0.01 -10 0.01 1 0.25 22.5 10 V mV μs 22.5 150 V mV mV μs μs -150 0.5 1.5 1.5 3 0.5 1.5 Programmed Clamp value +15 1.5 3 Prog’d Clamp value 10 -3 % of FSC range pF nA nA/ oC 3 pF nA nA/ oC 1.3 3 pF kΩ nA nA/ oC 80 3 pF Ω nA nA/ oC 3 ±0.1 Gain = 1 Gain = 0.2 Clamp current scales with selected range On or off switch leakage SYS_Sense Connected, Force Amplifier Inhibited 3 1 -3 ±0.1 SYS_Force Connected, Force Amplifier Inhibited 6 60 -3 ±0.1 Includes FOH, MEASVH, SYS_SENSE, SYS_FORCE, EXTMEASIL COMBINED LEAKAGE at DUT Leakage Current Leakage Current Tempco2 DUTGND Voltage Range Leakage Current GAIN = 1, measured at 0V GAIN = 0.2, measured at 0V μs μs 3 ±0.1 -3 V V mV mV µV/ oC % FSR % FSR ppm/ oC % FSR -15 15 nA nA/ oC typ 500 1 mV μA ±0.5 -500 -1 Rev. PrM | Page 5 of 48 AD5522 Preliminary Technical Data MEASURE OUTPUT (MEASOUT) Measure Output Voltage Span Measure Pin output Impedance Output leakage current Output Capacitance2 Max Load Capacitance2 Output Current drive2 Short Circuit Current2 MEASOUT Slew Rate2 MEASOUT enable time 2 MEASOUT disable time -3 2 -10 2 MEASOUT MI to MV switching time2 GUARD OUTPUT Guard Output Voltage Span Guard Output Offset Short Circuit Current2 Max Load Capacitance2 Guard Output Impedance Slew Rate2 Alarm Activation Time2 FORCE AMPLIFIER Slew Rate2 Gain Bandwidth2 Max stable load Capacitance2 22.5 100 3 15 1 10 2 150 320 400 1100 200 22.5 10 10 1000 -10 -10 100 5 200 0.4 1.3 10,000 100 V Ω nA pF μF mA mA V/μs ns ns ns Measured from BUSY rising edge. V mV mA nF Ω V/μs μs CLOAD = 10 pf Alarm delayed to eliminate false alarms. V/us MHz pF nF 17 17 32 TBD TBD 40 40 80 80 300 µs µs µs µs µs 17 18 40 TBD TBD 40 40 80 TBD TBD µs µs µs µs µs 18 22 45 1000 2300 55 85 120 TBD 4000 µs µs µs µs µs 20 21 50 1000 2300 65 85 120 TBD 4000 µs µs µs µs µs MI SETTLING TIME TO 0.05% OF FS 64mA Range2 2mA range2 200µA range2 20µA range2 5µA range2 FI SETTLING TIME TO 0.05% OF FS 64mA Range2 2mA range2 200µA range2 20µA range2 5µA range2 MV SETTLING TIME TO .05% OF FS 64mA Range2 2mA range2 200µA range2 20µA range2 5µA range2 With SW12 off Closing SW12, Measured from BUSY rising edge. Opening SW12, Measured from BUSY rising edge. FV SETTLING TIME TO 0.05% OF FS 64mA Range2 2mA range2 200µA range2 20µA range2 5µA range2 With respect to AGND Software Programmable output range Rev. PrM | Page 6 of 48 Ccomp=100pF, Cff=220pF, Cload=200pF Ccomp=100pF, Cff=220pF, Cload=200pF CCOMP = 100pF. Larger Load cap requires larger CCOMP CCOMP = 1nF. Larger Load cap requires larger CCOMP Mid scale to full scale change, Measured from /SYNC rising edge, Clamps ON Ccomp=100pF, Cff=220pF, Cload=200pF Ccomp=100pF, Cff=220pF, Cload=200pF Ccomp=100pF, Cff=220pF, Cload=200pF Ccomp=100pF, Cff=220pF, Cload=200pF Ccomp=100pF, Cff=220pF, Cload=200pF Mid scale to full scale change, Measured from /SYNC rising edge, Clamps ON Ccomp=100pF, Cff=220pF, Cload=200pF Ccomp=100pF, Cff=220pF, Cload=200pF Ccomp=100pF, Cff=220pF, Cload=200pF Ccomp=100pF, Cff=220pF, Cload=200pF Ccomp=100pF, Cff=220pF, Cload=200pF Mid scale to full scale change, Measured from /SYNC rising edge, Clamps ON Ccomp=100pF, Cload=200pF Ccomp=100pF, Cload=200pF Ccomp=100pF, Cload=200pF Ccomp=100pF, Cload=200pF Ccomp=100pF, Cload=200pF Mid scale to full scale change, Measured from /SYNC rising edge, Clamps ON Ccomp=100pF, Cload=200pF Ccomp=100pF, Cload=200pF Ccomp=100pF, Cload=200pF Ccomp=100pF, Cload=200pF Ccomp=100pF, Cload=200pF Preliminary Technical Data DAC SPECIFICATIONS Resolution Voltage Output Span2 Differential Nonlinearity2 COMPARATOR DAC DYNAMIC SPECIFICATIONS Output Voltage Settling Time2 Slew Rate2 Digital-to-Analog Glitch Energy2 Glitch Impulse Peak Amplitude2 REFERENCE INPUT VREF DC Input Impedance VREF Input Current VREF Range DIE TEMPERATURE SENSOR Accuracy Output Voltage at 25°C Output Scale Factor Output Voltage Range INTERACTION & CROSSTALK Crosstalk (VM) 2 Crosstalk (MI) 2 AD5522 16 22.5 1 Bits V LSB 1.5 µs V/µs nV-s mV 500mV change to ±½ LSB. 10 5 MΩ µA V Typically 100 MΩ. Per input. Typically ±30 nA. 0 3 °C V mV/°C V -0.01 0.01 % FSR -0.01 0.01 % FSR 0.5 mV -1 5.5 20 10 1 -10 2 ±7 1.5 5 Crosstalk within a channel2 Shorted DUT Crosstalk2 SPI INTERFACE LOGIC LOGIC INPUTS VIH, Input High Voltage VIL, Input Low Voltage IINH, IINL, Input Current CIN, Input Capacitance2 CMOS LOGIC OUTPUTS VOH, Output High Voltage VOL, Output Low Voltage Tristate leakage current Output Capacitance2 OPEN DRAIN LOGIC OUTPUTS VOL, Output Low Voltage Output Capacitance2 LVDS INTERFACE LOGIC LOGIC INPUTS – Reduced Range Link Input Voltage Range Input Differential Threshold External Termination Resistance Differential Input Voltage LOGIC OUTPUTS – Reduced Range Link Output Offset Voltage Output Differential Voltage TBD TBD 1.7/2.0 -1 0.7/0.8 1 10 V V µA pF 0.4 1 10 V V µA pF 0.4 10 V pF 1575 100 120 mV mV Ω mV VREF=5V, within a range of -16.25 to 22.5V Guaranteed monotonic by design over temperature. All channels in FIMV mode, measure the voltage for one channel in the highest current force range, once when all three other channels are at FI = 0mA and once when they are at 2mA All channels in FVMI mode, measure the current for one channel in the lowest current measure range, once when all three other channels are at FV = -10V and once when they are at +10V All channels in FVMI mode, one channel at midscale, measure the current for one channel in the lowest current range, for a change in comparator or clamp DAC levels for that PMU. S/C applied to one PMU channel, measure effect on other channels. (2.3 to 2.7)/(2.7 to 5.25V) Jedec Compliant Input Levels (2.3 to 2.7)/(2.7 to 5.25V) Jedec Compliant Input Levels SDO, CPOX DVCC – 0.4 -1 875 -100 80 100 100 1200 400 mV mV Rev. PrM | Page 7 of 48 IOL = 500 µA BUSY, TMPALM, CGALM IOL = 500 µA, CL = 50pF, RPULLUP = 1kΩ AD5522 NOISE PERFORMANCE NSD of Measure Voltage In-Amp NSD of Measure Current In-Amp NSD of Force Amplifier POWER SUPPLIES AVDD AVSS DVCC AIDD AISS AIDD AISS DICC Max Power Dissipation2 Power Supply Sensitivity2 ∆Forced Voltage/∆AVDD ∆Forced Voltage/∆AVSS ∆Measured Current/∆AVDD ∆Measured Current/∆AVSS ∆Forced Current/∆AVDD ∆Forced Current/∆AVSS ∆Measured Voltage/∆AVDD ∆Measured Voltage/∆AVSS ∆Forced Voltage/∆DVCC ∆Measured Current/∆DVCC ∆Forced Voltage/∆DVCC ∆Measured Current/∆DVCC 1 2 Preliminary Technical Data 290 290 300 10 -5 2.3 28 -23 5.25 25 -25 35 -35 3 7 nV/√Hz nV/√Hz nV/√Hz @ 1kHz, measured at MEASOUT @ 1kHz, measured at MEASOUT @ 1kHz, measured at FOH V V V mA mA mA mA mA W | AVDD – AVSS| ≤ 33V Internal ranges (5μA to 2mA), Excluding Load Conditions Internal ranges (5μA to 2mA), Excluding Load Conditions External range, Excluding Load Conditions External range, Excluding Load Conditions From DC to 1kHz -75 -75 -75 -75 -75 -75 -75 -75 -90 -90 -90 -90 dB dB dB dB dB dB dB dB dB dB dB dB Typical specifications are at 25°C and nominal supply, ±15.25V, unless otherwise noted. Guaranteed by design and characterization, not production tested. FV = Force Voltage, FI = Force Current, MV = Measure Voltage, MI = Measure Current FSR = Full Scale Range, FSCR = Full Scale Current Range, FS = Full Scale. Specifications subject to change without notice. Rev. PrM | Page 8 of 48 Preliminary Technical Data AD5522 TABLE 2. TIMING CHARACTERISTICS AVDD ≥ 10V, AVSS ≤ −5V, |AVDD – AVSS| ≥ 20V and ≤ 33V, DVCC = 2.3V to 5.25V, VREF=5V (TJ = +25 to +90oC, max specs unless otherwise noted.) SPI INTERFACE (Figure 5 and Figure 6) Parameter1, 2, 3 Limit at TMIN, TMAX 595 t1 20 t2 8 t3 8 t4 10 Unit ns min ns min ns min ns min ns min t5 15 ns min Minimum SYNC High Time. t6 5 ns min 29th SCLK Falling Edge to SYNC Rising Edge. t7 t8 t93 5 4.5 30 ns min ns min ns max Data Setup Time. Data Hold Time. SYNC Rising Edge to BUSY Falling Edge. t10 Description Single channel write time SCLK Cycle Time. SCLK High Time. SCLK Low Time. SYNC Falling Edge to SCLK Falling Edge Setup Time. BUSY Pulse Width Low 1 DAC X1 1.25 µs max BUSY Pulse Width Low 2 DAC X1 1.75 µs max BUSY Pulse Width Low 3 DAC X1 2.25 µs max BUSY Pulse Width Low 4 DAC X1 2.75 µs max BUSY Pulse Width Low Other Regs 270 ns max BUSY Pulse Width Low, System Control Register/PMU Register/M or C Registers t11 20 ns min t12 20 ns min 29th SLCK Falling EDGE to LOAD Falling Edge LOAD pulse width low t13 150 ns min BUSY rising edge to FOH Output Response time t14 0 ns min BUSY rising edge to LOAD falling edge t15 100 ns max LOAD rising edge to FOH Output Response time t16 10 ns min RESET Pulse Width Low. t17 300 µs max RESET Time Indicated by BUSY Low. t18 100 ns min Minimum SYNC High Time in Readback Mode. 25 45 60 LVDS INTERFACE (Figure 7) Parameter1, 2, 3 Limit at TMIN, TMAX t1 10 t2 4 t3 2 ns max ns max ns max DVCC = 5V to 5.25V, SCLK Rising Edge to SDO Valid. DVCC = 3V to 3.7V, SCLK Rising Edge to SDO Valid DVCC = 2.3V to 3V, SCLK Rising Edge to SDO Valid Unit ns min ns min ns min Description SCLK Cycle Time. SCLK Pulse Width High and Low Time. SYNC to SCLK Setup Time. t4 t5 t6 2 2 2 ns min ns min ns min Data Setup Time. Data Hold Time. SCLK to SYNC Hold Time. t7 t8 TBD TBD ns min ns min SCLK Rising Edge to SDO Valid. SYNC high time t 4, 5 19 1 Guaranteed by design and characterization, not production tested. All input signals are specified with tr = tf = 2 ns (10% to 90% of VCC) and timed from a voltage level of 1.2 V. 3 See Figure 5 and Figure 6 4 This is measured with load circuit of Figure 4 5 SDO output gets slower with lower DVCC supply and may require use of slower SCLK. 2 Rev. PrM | Page 9 of 48 AD5522 Preliminary Technical Data V CC IOL 200µA RL TO OUTPUT PIN 2.2kΩ TO OUTPUT PIN CL V OH (min) - V OL (max) 2 50pF V OL CL 50pF IOL 200µA Figure 4. Load Circuit for SDO, BUSY Timing Diagram Figure 3.. Load Circuit forCGALM, TMPALM t1 SCLK 1 24 29 2 t2 t3 t4 t6 SYNC t5 t7 t8 DB0 DB28 SDI t9 t10 BUSY t11 t12 LOAD1 t13 FOH1 t14 t12 LOAD2 FOH2 t15 t16 RESET t17 BUSY 1LOAD ACTIVE 2 LOAD ACTIVE DURING BUSY AFTER BUSY Figure 5. SPI Write Timing (Write word contains 29 bits) Rev. PrM | Page 10 of 48 Preliminary Technical Data AD5522 SCLK 58 29 t19 t18 SYNC SDI DB28 DB23/ DB28 DB0 DB0 INPUT WORD SPECIFIES REGISTER TO BE READ NOP CONDITION DB23/ DB28 SDO DB0 SELECTED REGISTER DATA CLOCKED OUT UNDEFINED Figure 6. SPI Read Timing (Readback word contains 24 bits and can be clocked out with a minimum of 24 clock edges) t8 SYNC SYNC t6 t1 t3 SCLK SCLK SDI MSB D28 t4 t2 MSB D23/D28 LSB D0 LSB D0 SDI t7 t5 SDO MSB DB23/ DB28 SDO UNDEFINED LSB DB0 SELECTED REGISTER DATA CLOCK OUT Figure 7. LVDS Read and Write Timing, (Readback word contains 24 bits and can be clocked out with a minimum of 24 clock edges) Rev. PrM | Page 11 of 48 AD5522 Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS Table 3. AD5522 Absolute Maximum Ratings Parameter Supply Voltage AVDD to AVSS AVDD to AGND AVSS to AGND VREF to AGND DUTGND to AGND REFGND to AGND DVCC to DGND AGND to DGND Digital Inputs to DGND Analog Inputs to AGND Storage Temperature Operating Junction Temperature Reflow Soldering Peak Temperature Time at Peak Temperature Junction Temperature THERMAL RESISTANCE3 Rating 34V -0.3V to 34V 0.3V to -34V -0.3 V, +7V AVDD +0.3V to AVSS -0.3V AVDD +0.3V to AVSS -0.3V - 0.3V to 7V - 0.3V to +0.3V - 0.3V to DVCC +0.3V AVSS - 0.3V to AVDD +0.3V –65°C to +125°C +25 to +90°C Thermal resistance values are specified for the worst-case conditions, i.e., specified for device soldered in circuit board for surface mount packages. Table 4. Thermal Resistance (JEDEC 4 layer (1S2P) board) Air Flow (LFPM) TQFP Exposed Pad Down TQFP Exposed Pad Up θJA 0 22.3 θJC 4.8 200 17.2 500 15.1 Unit °C/W °C/W θJA TBD θJC 2 TBD TBD °C/W °C/W Table 5. Thermal Resistance (JEDEC 4 layer (1S2P) board with cooling plate4 at 45°C, natural convection at 55°C ambient) Package Thermals 230°C 10s to 40s 150°C max TQFP Exposed Pad Down TQFP Exposed Pad Up Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condition s above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 3 4 θJA 5.4 3.0 θJC 4.8 2 Unit °C/W °C/W Simulated Thermal information. Assumes perfect thermal contact between cooling plate and exposed paddle ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. PrM | Page 12 of 48 Preliminary Technical Data AD5522 EXTFOH1 AVSS 61 MEASOUT3 63 62 MEASOUT1 MEASOUT0 MEASOUT2 64 65 66 AVSS SYS_FORCE 68 67 SYS_SENSE AGND 69 REFGND 71 70 DUTGND AVDD VREF 72 73 74 CGALM SPI/LVDS 75 TMPALM 77 76 AVSS RESET 78 80 79 EXTFOH0 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS AVDD 1 60 AVDD CFF0 2 59 CFF1 CCOMP0 3 58 CCOMP1 EXTMEASIH0 4 57 EXTMEASIH1 EXTMEASIL0 5 56 EXTMEASIL1 FOH0 6 55 FOH1 GUARD0 7 54 GUARD1 GUARDIN0 /DUTGND0 8 53 GUARDIN1 /DUTGND1 MEASVH0 9 52 MEASVH1 AGND 10 51 AGND AGND 11 TOP VIEW EXPOSED PAD ON BOTTOM 50 AGND MEASVH2 12 49 MEASVH3 GUARDIN2 /DUTGND2 (Not to Scale) 13 48 GUARDIN3 /DUTGND3 GUARD2 14 47 GUARD3 FOH2 15 46 FOH3 EXTMEASIL2 16 45 EXTMEASIL3 EXTMEASIH2 17 44 EXTMEASIH3 CCOMP2 18 43 CCOMP3 CFF2 19 42 CFF3 AVDD 20 41 AVDD 40 EXTFOH3 38 39 AVSS CPOH3/CPO3 37 CPOL3/CPO2 35 36 CPOL2/CPO0 CPOH2/CPO1 33 34 DVCC 32 SDO LOAD 30 31 DGND 29 CPOL1/SYNC CPOH1/SDO 27 28 SDI 26 CPOH0/SDI SYNC 24 25 BUSY SCLK 23 AVSS CPOL0/SCLK 21 22 EXTFOH2 AD5522 Figure 8. Pin Configuration (Exposed Pad on bottom of package) Table 6. Pin Function Descriptions Pin No. Bottom Pin No. Top Mnemonic Exposed Pad 22, 39, 62, 67, 79, 1, 20, 41, 60, 74 33 2, 14, 19, 42,59, 7, 21, 40, 61, 80 48 AVSS(0-4) Description The exposed pad is electrically connected to AVSS. TQFP with exposed pad on BOTTOM: For enhanced thermal, electrical and board level performance, the exposed paddle on the bottom of the package should be soldered to a corresponding thermal land paddle on the PCB. Negative analog supply voltage AVDD(0-4) Positive analog supply voltage LOAD Active low logic input used for synchronizing updates within one device or across a group of devices. If synchronization is not required, LOAD may be tied low and updates to DAC channels or PMU modes will happen as they are presented to the device. See the BUSY and LOAD FUNCTIONS section for detailed information. 34 10, 11, 50, 51, 69 30 23 47 12, 30, 31, 70, 71 51 58 DVCC AGND Digital supply voltage Analog ground, reference points for force and measure circuitry DGND BUSY Digital ground reference point. Open Drain active low input/output indicating the status of interface. 24 25 57 56 SCLK CPOL0/ SCLK Clock input, active falling edge Comparator output low in SPI mode and SCLK in LVDS interface mode 26 55 CPOH0/ SDI Comparator output high in SPI mode and SDI in LVDS interface mode 27 28 54 53 SDI SYNC Serial data input Frame sync, active low 29 31 52 50 CPOL1/ SYNC CPOH1/SDO Comparator output low in SPI mode and SYNC in LVDS interface mode Comparator output high in SPI mode and SDO in LVDS interface mode Rev. PrM | Page 13 of 48 AD5522 Preliminary Technical Data 32 35 36 37 38 66, 65, 64, 63 68 70 71 72 75 49 46 45 44 43 15, 16, 17, 18 13 11 10 9 6 SYS_FORCE SYS_SENSE REFGND VREF SPI/LVDS 76 5 CGALM 77 4 TMPALM 78 3 RESET 3, 18, 43, 58 78, 63, 38, 23 79, 62, 39, 22 1, 60, 41, 20 75, 66, 35, 26 77, 64, 37, 24 76, 65, 36, 25 72, 69, 32, 29 8 CCOMP(0-3) 74, 67, 34, 27 73, 68, 33, 28 GUARD (0-3) 2, 19, 42, 59 80, 21, 40, 61 6, 15, 46, 55 4, 17, 44, 57 5, 16, 45, 56 9, 12, 49, 52 73 7, 14 , 47, 54 8, 13, 48, 53 SDO CPOL2/CPO0 CPOH2/CPO1 CPOL3/CPO2 CPOH3/CPO3 MEASOUT(0-3) CFF (0-3) Serial data out, for readback and diagnostic purposes Comparator output Low, comparator window in LVDS interface mode Comparator output Low, comparator window in LVDS interface mode Comparator output Low, comparator window in LVDS interface mode Comparator output Low, comparator window in LVDS interface mode Multiplexed DUT voltage/Current sense output/temperature sensor voltage per channel, referenced to AGND. External FORCE signal input, enables connection of system PMU. External SENSE signal output, enables connection of system PMU. Accurate analog reference input ground. Reference Input for DAC channels, 5V for specified performance. Interface select pin. Logic low selects SPI interface compatible mode, logic high selects LVDS interface mode. In LVDS mode the CPOH(0-3) pins default to differential interface pins. CGALM is an open drain pin providing shared Alarm information for Guard amplifier and Clamp circuitry. By default, this output pin is disabled. The System Control Register allows user to enable this function and to set the open drain output as a latched output, or to configure either the Guard or Clamp function or both flagging the alarm pin. When this pin flags an alarm, the origins of the alarm may be determined by reading back the Alarm Status Register. Two flags per channel in this word (one latched, one unlatched) indicate which function caused the alarm and if the alarm is still present. The function of this pin is to flag a Temperature Alarm. It is a latched active low open drain output indicating the junction temperature has exceeded either the programmed or default (130degC) temperature setting. Two flags in the Alarm Status Register (one latched, one unlatched) indicate if the temperature has dropped below 130degC or still above. User action is required to clear this latched alarm flag, by writing to the “CLEAR” bit in any of the PMU registers. Active low, level sensitive input used to reset all internal nodes on the device to their power-on reset value. Compensation capacitor Input per channel. See section on compensation capacitors.. FOH(0-3) External capacitor optimizing the stability performance of the force amplifier (per channel).. See section on Compensation Capacitors Per channel, Force output for high current range. Use external resistor here for current range up to 64mA. Per channel force output for all other ranges. EXTMEASIH(0-3) Per channel sense input (high sense) for high current range. EXTMEASIL(0-3) Per channel sense input (Low sense) for high current range. MEASVH(0-3) Per channel DUT voltage sense input (high sense) DUTGND DUT voltage sense input (low sense). By default, DUTGND is shared between all four PMU channels. If user requires a DUTGND input per channel, the GUARDIN (0-3)/DUTGND(0-3) pin may be configured to be a DUTGND input per each PMU channel. Guard output drive. EXTFOH(0-3) GUARDIN(0-3) /DUTGND(0-3) This pin has dual functionality; it may be either a Guard input per channel or DUTGND per channel. Its function is determined via the serial interface. The power on default is GUARDIN, where it functions as the input to the Guard Amplifier. Alternatively, it may be configured to be used as a DUTGND input per channel. In this case, the input to the Guard amplifier is internally connected to MEASVH and the GUARDIN/DUTGND pin is used as a DUTGND input per channel. See section on Guard Amplifier Rev. PrM | Page 14 of 48 CCOMP2 CFF2 AVDD 62 61 EXTMEASIH2 64 63 FOH2 EXTMEASIL2 65 67 66 GUARDIN2 \DUTGND2 GUARD2 MEASVH2 69 68 70 AGND AGND 71 GUARDIN0 DUTGND0 MEASVH0 73 72 FOH0 EXTMEASIL0 GUARD0 74 75 77 76 CCOMP0 EXTMEASIH0 AD5522 78 AVDD 80 79 CFF0 Preliminary Technical Data EXTFOH0 1 60 EXTFOH2 AVSS 2 59 AVSS RESET 3 58 BUSY TMPALM 4 57 SCLK CGALM 5 56 CPOL0/SCLK SPI/LVDS 6 55 CPOH0/SDI AVDD 7 54 SDI 8 53 SYNC 52 CPOL1/SYNC TOP VIEW EXPOSED PAD ON TOP 51 DGND 50 CPOH1/SDO (Not to Scale) 49 SDO 48 LOAD DUTGND AD5522 VREF 9 REFGND 10 SYS_SENSE 11 AGND 12 SYS_FORCE 13 Figure 9. Pin Configuration (Exposed Pad on Top of package) Rev. PrM | Page 15 of 48 40 AVDD EXTMEASIL3 39 36 FOH3 CFF3 35 GUARD3 37 34 38 33 GUARDIN3/ DUTGND3 CCOMP3 32 MEASVH3 EXTMEASIH3 30 31 AGND EXTFOH3 AGND 41 29 20 28 AVSS EXTFOH1 MEASVH1 42 GUARDIN1/ DUTGND1 19 27 CPOH3/CPO3 AVSS GUARD1 43 26 18 FOH1 CPOL3/CPO2 MEASOUT3 25 44 EXTMEASIL1 17 23 CPOH2/CPO1 MEASOUT2 24 45 CCOMP1 16 EXTMEASIH1 CPOL2/CPO0 MEASOUT1 21 DVCC 46 22 47 15 CFF1 14 AVDD AVSS MEASOUT0 AD5522 Preliminary Technical Data TERMINOLOGY Offset Error Offset error is a measure of the difference between actual and ideal voltage expressed in mV. Gain Error Gain error is the difference between full-scale error and zero-scale error. It is expressed in %. Gain Error = Full-Scale Error − Zero-Scale Error Linearity Error Relative accuracy, or endpoint linearity, is a measure of the maximum deviation from a straight line passing through the endpoints of the full-scale range. It is measured after adjusting for offset error and gain error and is expressed in % FSR. CM Error Common Mode Error is the error at the output of the amplifier due to the common mode input voltage. It is expressed in % of FSR/V. Clamp Accuracy Clamp accuracy is a measure of where the clamps begin to function fully and limit the clamped voltage or current. Leakage Current Current measured at an output pin, when that function is off or high impedance. Pin Capacitance Capacitance measured at a pin when that function is off or high impedance. Slew Rate The rate of change of output voltage, expressed in V/μs. DAC SPECIFIC TERMS Differential Nonlinearity Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1LSB maximum ensures monotonicity. Output Voltage Settling Time The amount of time it takes for the output of a DAC to settle to a specified level for a full-scale input change. Digital-to-Analog Glitch Energy The amount of energy injected into the analog output at the major code transition. The area of the glitch in is specified in nV-s. It is measured by toggling the DAC register data between 0x1FFF and 0x2000. Digital Crosstalk The glitch impulse transferred to the output of one converter due to a change in the DAC register code of another converter is defined as the digital crosstalk and is specified in nV-s. Digital Feedthrough When the device is not selected, high frequency logic activity on the device’s digital inputs can be capacitively coupled both across and through the device to show up as noise on the VOUT pins. It can also be coupled along the supply and ground lines. This noise is digital feedthrough. Rev. PrM | Page 16 of 48 Preliminary Technical Data AD5522 TYPICAL PERFORMANCE CHARACTERISTICS Leakage as function of Temp, V = 12V 2 EXTFOH CFF Leakage Current - nA 1.5 FOH EXTMEASIH 1 EXTMEASIL MEASVH GRD_DUTGND 0.5 COMBINED LEAKAGE 0 -0.5 25 35 45 55 65 75 85 Temp - degC Figure 13Leakage as a function of Temperature (V = 12V). Figure 10 FV Linearity Leakage as function of Temp, V = 0V 1 Leakage Current - nA EXTFOH CFF 0.8 FOH EXTMEASIH 0.6 EXTMEASIL 0.4 MEASVH GRD_DUTGND 0.2 COMBINED LEAKAGE 0 -0.2 25 45 65 85 Temp - degC Figure 14. Leakage as a function of temp, (V = 0V) Figure 11MV linearity Leakage as function of Temp, V = -12V 0.2 Leakage Current - nA 0 -0.2 -0.4 EXTFOH CFF -0.6 FOH EXTMEASIH -0.8 EXTMEASIL MEASVH -1 GRD_DUTGND -1.2 COMBINED LEAKAGE 25 45 65 85 Temp - degC Figure 12MI Linearity in 2mA range Figure 15. Leakage as a function of temp, (V = -12V) Rev. PrM | Page 17 of 48 95 AD5522 Preliminary Technical Data 0.15 0.1 0.05 nA 0 EXTFOH -0.05 CFF FOH -0.1 EXTMEASIH EXTMEASIL -0.15 MEASVH GRD_DUTGND 12 8 10 6 4 V 2 0 -2 -4 -6 -8 COMBINED LEAKAGE -1 0 -1 2 -0.2 Figure 18. ACPSRR versus Frequency Figure 16. Leakage as a function of voltage (25degC). Figure 17Noise Spectral density Rev. PrM | Page 18 of 48 Preliminary Technical Data AD5522 FUNCTIONAL DESCRIPTION The AD5522 is a highly integrated quad per pin parametric measurement unit (PPMU) for use in semiconductor automatic test equipment. It contains programmable modes to force a pin voltage and measure the corresponding current (FVMI), force current measure voltage (FIMV), force current measure current (FIMI), force voltage measure voltage (FVMV) and force nothing measure voltage (FNMV) or measure current (FNMI). The PPMU can force or measure a voltage range of 22.5 V. It can force or measure currents ranging up to 64mA per channel using the internal amplifier, while the addition of an external amplifier enables higher current ranges. On Chip are all the DAC levels required for each PMU channel. FORCE AMPLIFIER The force amplifier drives the analog output FOH, which drives a programmed current or voltage to the DUT (device under test). Headroom and footroom requirements for this amplifier is 3V on either end. An additional ±1V is dropped across the sense resistor when maximum current is flowing through it. This amplifier is designed to drive DUT capacitances up to 10nF, with a compensation value of 100pF. Larger DUT capacitive load will require larger compensation capacitances. Local feedback ensures the amplifiers are stable when disabled. A disabled channel reduces power consumption by 2.5mA/channel. COMPARATORS Per channel, the DUT measured value is monitored by two comparators configured as window comparators. Internal DAC levels set the CPL and CPH (low and high) threshold values. There are no restrictions on the voltage settings of the comparator high and lows. CPL going higher than CPH is not a useful operation; however, it will not cause any problems to the device. CPOL and CPOH are continuous time comparator outputs. comparator output available CPO (0-3) provides information on whether the measured voltage or current is inside or outside the set CPH and CPL window. Information of whether the measurement was high or low is available via the serial interfaces (Comparator Status Register). Table 8. Comparator Output Function using LVDS interface TEST CONDITION CPO Output CPL < VDUT And IDUT < CPH 1 CPL > VDUT or IDUT > CPH 0 CLAMPS Current and voltage clamps are included on chip per PMU channel. They protect the DUT in the event of an open or a short. Internal DAC levels set the CLL and CLH (low and high) levels and the clamps work to limit the force amplifier in the event of a voltage or current at the DUT exceeding the set levels. The clamps also function to protect the DUT when a transient voltage or current spike occurs when changing to a different operating mode or when programming the device to a different current range. The voltage clamps are active while forcing current and the current clamps are active while forcing voltage. By default, the current clamps are off. Simply set them up via the status register through the serial interface. The voltage clamps are always active in FI mode. If a clamp level has been hit, this will be flagged via the CGALM open drain output and the resulting alarm information may be read back via the SPI or LVDS interface. CLL should never be greater than CLH. Table 7. Comparator Output Function TEST CONDITION CPOL CPOH VDUT or IDUT > CPH 0 VDUT or IDUT < CPH 1 VDUT or IDUT > CPL 1 VDUT or IDUT < CPL 0 CPH > VDUT or IDUT > CPL 1 1 When using SPI interface, full comparator functionality is available. When using the LVDS interface, the comparator function is limited to one output per comparator, due to the large pin count requirement of the LVDS interface. In this case, Rev. PrM | Page 19 of 48 AD5522 Preliminary Technical Data CURRENT RANGE SELECTION HIGH CURRENT BUFFER EN EXTFOH Integrated thin film resistors minimize external components and allow easy selection of current ranges from 5 µA (200kΩ), 20μA (50kΩ), 200μA (5kΩ) and 2mA (500Ω). Per channel, one current range up to 64mA may be accommodated by connecting an external sense resistor. For current ranges in excess of 64mA, it is recommended an external amplifier be used. CFF INTERNAL RANGE SELECT (5uA, 20uA, 200uA, 2mA) FIN + DAC FOH - Rsense EXTMEASIH OFFSET DAC BIAS TO CENTER IRANGE + + x5 or x10 MEASOUT x1/x0.2 VFIN FI = RSENSE × Gain Where: FI = Forced Current VFIN = Voltage of the FIN DAC, See VOUT for DAC levels. RSENSE = Selected Sense Resistor Gain of Current Measure Instrumentation amplifier, it may be set (via the serial interface) to 5 or 10. Using the 5kΩ sense resistor and ISENSE gain of 10, the maximum current range possible is ±225μA. Similarly for the other current ranges, there is an over range of 12.5% to allow for correction. Also, the forced current range will only be the quoted full scale range with an applied reference of 5V or 2.5V (with ISENSE AMP gain = 5). The ISENSE amplifier is biased by the Offset DAC output voltage, in such as way as to center the Measure current output irrespective of the voltage span used. EXTMEASIL + - - MEASVH AGND For the suggested current ranges, the maximum voltage drop across the sense resistors is ±1V, however, to allow for correction of errors, there is some over range available in the current ranges. The full-scale voltage range that can be loaded to the DAC is ±11.5V; the forced current may be calculated as follows: Rsense 10kΩ + DUT + DUTGND x1 + - - Figure 19. Addition of high current amplifier for wider current range(>64mA) DEVICE UNDER TEST GROUND (DUTGND) By default, there is one DUTGND input available for all four PMU channels. In some applications of a PMU, it is necessary that each channel operate from its own DUTGND level. Therefore the shared pin GUARDIN(0-3)/DUTGND(0-3) may be configured as either the input to the GUARD amplifier (GUARDIN), or as a DUTGND per channel function. This may be configured through the serial interface on power on as per required operation. The default connection is SW13b (GUARDIN) and SW14b (DUTGND PER DEVICE). When configured as DUTGND per channel, this multifunction pin is no longer connected to the input of the guard amplifier, instead it is connected to the low end of the instrumentation amplifier (SW14a), and the input of the Guard amplifier is now connected internally to MEASVH (SW13a). MEASVH (0-3) + AGNDx HIGH CURRENT RANGES With the use of an external high current amplifier, one high current range in excess of 64mA is possible. The high current amplifier simply buffers the force output and provides the drive for the required current. Rev. PrM | Page 20 of 48 SW 16 SW 13 + b x1 + - - When using the EXTFOHx outputs for current ranges up to 64mA, there is no switch in series with the EXTFOHx line, ensuring minimum capacitance presented at the output of the force amplifier. This is also an important feature if using a Pin electronics driver to provide high current ranges. a GUARD AMP MEASURE VOLTAGE IN AMP GUARD (0-3) a SW 14 b GUARDIN (0-3)/ DUTGND (0-3) a DUTGND Figure 20. Using the DUTGND per channel Feature DUT Preliminary Technical Data AD5522 GUARD AMPLIFER COMPENSATION CAPACITORS A Guard amplifier allows the user to bootstrap the shield of the cable to the voltage applied to the DUT, ensuring minimal drops across the cable. This is particularly important for measurements requiring a high degree of accuracy and in leakage current testing. Each channel requires an external compensation capacitor (CCOMP) to ensure stability into the maximum load capacitance while ensuring settling time is optimized. In addition, one CFF pin is provided to further optimize stability and settling time performance when in Force voltage mode. When changing from Force current to force voltage mode, the switch connecting CFF capacitor is automatically closed. While the force amplifier is designed to drive load capacitances up to 10nF (with Ccomp = 100pF), using larger compensation capacitor values, it is possible to drive larger load at the expense of an increase in settling time. If a wide range of load capacitance must be driven, then an external multiplexer connected to the CCOMP pin will allow optimization of settling time versus stability. The series resistance of a switch placed on CCOMP, should typically be <50Ω. If not required, all four Guard Amplifiers may be disabled via the serial interface (through the System Control Register), this decreases the power consumption by 400uA per channel. As described in the DUTGND section, the GUARDIN(0-3) /DUTGND(0-3) is a shared pin. It can function either as a guard amplifier input per channel or as a DUTGND input per channel as required by the end application. Refer to Figure 20. A Guard alarm event occurs when the guard output moves more than 100mV away from the Guard input voltage for more than 200μs. In the event this happens, this will be flagged via the CGALM open drain output. As the guard and clamp alarm functions share the same alarm outputCGALM, the alarm information (alarm trigger and alarm channel) is available via the serial interface (ALARM STATUS REGISTER). Alternatively, the serial interfaces allow the user to setup the CGALM output to flag either the clamp status or the guard status. By default, this open drain alarm pin is an unlatched output, but may be set to a latched output via the serial interface, System Control Register. Similarly, connecting the CFF node to a multiplexer externally, would cater for a wide range of CDUT in Force Voltage mode. The series resistance of the multiplexer used should be such that: 1 ⎛ ⎜ 2 RON Π × CDUT ⎝ ⎞ ⎟ > 100kHz ⎠ Table 9. Suggested Compensation Capacitor Selection CLOAD CCOMP CFF ≤1nF 100pF 220pF ≤10nF 100pF 1nF ≤100nF CLOAD/100 CLOAD/10 Rev. PrM | Page 21 of 48 AD5522 Preliminary Technical Data SYSTEM FORCE SENSE SWITCHES MEASURE OUTPUT (MEASOUT) Each channel has switches to allow connection of the force (FOHx) and sense (MEASVHx) lines to a central PMU for calibration purposes. There is one set of SYS_FORCE and SYS_SENSE pins per device. For calibration purposes, it is recommended the SYS_FORCE path be connected individually to each PMU channel, FOH path. The measured DUT voltage or current (voltage representation of DUT current) is available on MEASOUT (0-3) with respect to AGND. The default MEASOUT range is the forced voltage range for voltage measure and current measure (nominally ±11.25V, depends on reference voltage and offset DAC) and includes some over range to allow for offset correction. The serial interface allows the user to select another MEASOUT range of VREF to AGND, allowing for a smaller input range ADC to be used. Each PMU channel MEASOUT line may be made high impedance via the serial interface. TEMPERATURE SENSOR An on board temperature sensor monitors temperatures and in the event of the temperature exceeding a factory defined value, (130°C) or a user programmable value, the device will protect itself by shutting down all channels and will flag an alarm through the latched open drain TMPALM pin. Alarm status may be readback from the Alarm Status Register or the PMU registers where latched and unlatched bits tell if an alarm has occurred and whether the temperature has dropped below the set alarm temperature. When using low supply voltages, ensure that there is sufficient headroom and footroom for the required force voltage range. The Offset DAC also directly offsets the MEASURE output voltage level, but only when GAIN1 = 0. Table 10. MEASOUT Output Ranges MEASOUT Function GAIN1 = “0”VREF = 5V GAIN1 = “1” MEASOUT Gain = 1 ±VDUT (up to 11.25V) MEASOUT Gain = 1/5 MV ±VRSENSE X 10 = up to ±11.25V ± VRSENSE X 5 = up to ±5.625 0 to 4.5V 0 to 2.25V MI GAIN0 = “0” GAIN0 = “1” CURRENT MEAS GAIN = 10 CURRENT MEAS GAIN = 5 Rev. PrM | Page 22 of 48 0 to 4.5VREF 5 Preliminary Technical Data AD5522 DAC LEVELS Each channel contains five dedicated DAC levels : one for the force amplifier, one each for the clamp high and low levels and one each for the comparator high and low levels. The architecture of a single DAC channel consists of a 16-bit resistor-string DAC followed by an output buffer amplifier. This resistor-string architecture guarantees DAC monotonicity. The 16-bit binary digital code loaded to the DAC register determines at what node on the string the voltage is tapped off before being fed to the output amplifier. The transfer function for DAC outputs is: Therefore, depending on headroom available, the input to the Force Amplifier may be unipolar positive, or bipolar, either symmetrical or asymmetrical about DUTGND but always within a voltage span of 22.5V. The offset DAC offsets all DAC functions. It also centers the current range, such that zero current always flows at midscale code irrespective of offset DAC setting. Rearranging the transfer function for the DAC output gives the following equation to determine what Offset DAC code is required for a given reference and output voltage range. ⎛ 216 (VOUT − DUTGND) ⎞ ⎛ 4.5 × DACCODE ⎞ ⎟⎟ − ⎜ OFFSETDAC ⋅CODE = ⎜⎜ ⎟ 3.5VREF 3.5 ⎠ ⎠ ⎝ ⎝ ⎛ OFFSETDAC ⋅CODE ⎞ ⎛ DACCODE ⎞ VOUT = 4.5VREF ⎜ ⎟ + DUTGND ⎟ − 3.5VREF ⎜ 216 216 ⎠ ⎝ ⎠ ⎝ OFFSET AND GAIN REGISTERS Where the voltage range must be take into account the +/-4V headroom and footroom requirements for the amplifier and sense resistor and must be within the range -16.25V to 22.5V (22V range + 500mV overrange to allow for correction). OFFSET DAC The device is capable of forcing a 22.5V (4.5 × VREF) voltage range. Included on chip is one 16 Bit offset DAC (one for all four channels) which allows for adjustment of the voltage range. The useable range is -16.25V to 22.5V. Zero scale gives a fullscale range of 0V to +22.5V, mid scale gives ±11.25V, while the most negative useful range is in a range of -16.25V to 6.25V. Full scale loaded to the Offset DAC does not give a useful output voltage range as the output amplifiers are limited by available footroom. The following table shows the effect of the Offset DAC on the other DACs in the device. Table 11. OFFSET DAC Relationship with other DACs with VREF = 5V Offset DAC Code 0 0 0 DAC Code DAC Output Voltage Range 0 32768 65535 0.00 V 11.25 V 22.50 V 32768 32768 32768 0 32768 65535 -8.75 V 2.50 V 13.75 V 42130 42130 42130 0 32768 65535 -11.25 V 0.00 V 11.25 V 60855 60855 60855 0 32768 65535 -16.25 -5.00 6.25 65535 - Footroom Limitations Each DAC level contains independent offset and gain control registers that allow the user to digitally trim offset and gain. These registers give the user the ability to calibrate out errors in the complete signal chain, including the DAC, using the internal m and c registers, which hold the correction factors. All registers in the AD5522 are volatile, so need to be loaded on power on during a calibration cycle. The digital input transfer function for each DAC can be represented as x2 = [(m + 1)/ 2n × x1] + (c – 2n – 1) where: x2 = the data-word loaded to the resistor string DAC. x1 = the 16-bit data-word written to the DAC input register. m = code in gain register (default code = 216 – 1.) c = code in offset register (default code = 215) n = DAC resolution (n = 16). The calibration engine is only engaged when data is written to the x1 register. This has the advantage of minimizing the setup time of the device. CACHED X2 REGISTERS Each DAC has a number of cached x2 values. These registers store the result of an offset and gain calibration in advance of a mode change. This enables the user to preload registers; allow the calibration engine to calculate the appropriate x2 value and store until ready to change modes. As the data is ready and held in the appropriate register, this enables mode changing be as time efficient as possible. If an update occurs to a DAC register set that is currently part of the operating PMU mode, the DAC output will update immediately (depending on LOAD condition). Rev. PrM | Page 23 of 48 AD5522 Preliminary Technical Data Offset and Gain registers for the FIN DAC VREF The FIN (force amplifier input) DAC level contains independent offset and gain control registers that allow the user to digitally trim offset and gain. There are six sets of x1, m and c registers, one set (x1, m and c) for the force voltage range, and one set for each of the force current ranges (4 internal current ranges and 1 external current range). Six x2 registers store calculated DAC values ready to load to the DAC register on a mode change. One buffered analog input supplies all 20 DACs with the necessary reference voltage to generate the required DC levels. OFFSET DAC VREF 16 16 16 X1 REG M REG C REG 16 FIN 16-Bit FIN DAC X2 REG *6 Serial I/F Figure 21. FIN DAC Registers Offset and Gain registers for the COMPARATOR DACs The Comparator DAC levels contain independent offset and gain control registers that allow the user to digitally trim offset and gain. There are six sets of (x1, m and c) registers, one set for the voltage mode, and one set for each of the four internal current ranges and one set for the external current range. In this way, x1 may also be preprogrammed, so switching different modes, allows for efficient switching into the required compare mode. Six x2 registers store cached calculated DAC values ready to load to the DAC register on a mode change. 16 16 X1 REG M REG C REG 16 VREF 16 X2 REG 16-Bit CPH DAC CPH *6 16 16 X1 REG M REG C REG 16 Serial I/F 16 X2 REG CPL 16-Bit CPL DAC Figure 22. Comparator Registers Offset and Gain registers for the Clamp DACs The clamp DAC levels contain independent offset and gain control registers that allow the user to digitally trim offset and gain. There are just two sets of registers, one for the voltage mode and another register set (x1, m and c) for all five current ranges. Two x2 registers store cached calculated DAC values ready to load to the DAC register on a PMU mode change. 16 X1 REG M REG C REG 16 16 16 16-Bit CLH DAC CLH 16 16-Bit CLL DAC CLL X2 REG 16 X1 REG M REG C REG 16 16 X2 REG The voltage applied to the VREF pin determines the output voltage range and span applied to the force amplifier, clamp and comparator inputs. This device can be used with a reference input ranging from 2V to 5V, however, for most applications, a reference input of 5V or 2.5V will be sufficient to meet all voltage range requirements. The DAC amplifier gain is 4.5, which gives a DAC output span of 22.5V. The DACs have offset and gain registers which can be used to calibrate out system errors. In addition, the gain register can be used to reduce the DAC output range to the desired force voltage range. The Force DAC will retain 16 bit resolution even with a gain register setting of quarter scale (0x4000). Therefore, from a single 5V reference, it is possible to get a voltage span as high as 22.5V or as low as 5.625V all from one 5V reference. When using the offset and gain registers, the chosen output range should take into account the system offset and gain errors that need to be trimmed out. Therefore, the chosen output range should be larger than the actual, required range. When using low supply voltages, ensure that there is sufficient headroom and footroom for the required force voltage range. Also, note that with a supply differential of less than 18V and a full scale current range requirement, it is necessary to reduce the current measure in amp gain to 5 so the feedback path can swing through the full range. Also, the forced current range will only be the quoted full scale range with an applied reference of 5V or 2.5V (with ISENSE AMP gain = 5). *6 VREF REFERENCE SELECTION For other voltage/current ranges, the required reference level can be calculated as follows: 1. Identify the nominal range required 2. Identify the maximum offset span and the maximum gain required on the full output signal range. 3. Calculate the new maximum output range including the expected maximum offset and gain errors. 4. Choose the new required VOUTmax and VOUTmin, keeping the VOUT limits centered on the nominal values. Note that AVDD and AVSS must provide sufficient headroom. 5. Calculate the value of VREF as follows: VREF = (VOUTMAX – VOUTMIN)/4.5 Serial I/F Figure 23. Clamp Registers Rev. PrM | Page 24 of 48 Preliminary Technical Data AD5522 Reference Selection Example 12/12.26× 65535 = 64145 Nominal Output Range = 10V (-2V to +8V) Offset Error = ±100mV Gain Error = ±0.5% REFGND = AGND = 0V Example 1: Gain Error = +0.5%, Offset Error = +100mV 1) Gain Error (0.5%) Calibration: 63937 × 0.995 = 63617 => Load Code “0b1111 1000 1000 0001” to m register 2) Offset Error (100mV) Calibration: LSB Size = 10.25/65535 = 156 µV; Offset Coefficient for 100mV Offset = 100/0.156 = 641 LSBs => Load Code “0b0111 1101 0111 1111” to c register 1) Gain Error = ±0.5% => Maximum Positive Gain Error = +0.5% => Output Range incl. Gain Error = 10 + 0.005(10)=10.05V 2) Offset Error = ±100mV => Maximum Offset Error Span = 2(100mV)=0.2V => Output Range including Gain Error and Offset Error = 10.05V + 0.2V = 10.25V 3) VREF Calculation Actual Output Range = 10.25V, that is -2.125V to +8.125V (centered); VREF = (8.125V + 2.125V)/4.5 = 2.28V SYSTEM LEVEL CALIBRATION There are many ways to calibrate the device on power on. The following gives an example of how to calibrate the FIN DAC of the device without a DUT or DUT board connected. Calibration Procedure for Force and Measure circuitry: 1) Calibrate Force Voltage (2 point) Write zero scale to the Force DAC (FIN), connect SYS_FORCE to FOHx and SYS_SENSE to MEASVHx, close the internal Force/Sense Switch (SW 7). Using the System PMU, measure the error between voltage at FOHx, MEASVHx and desired value. Similarly, load Full scale to the Force DAC, and measure the error between FOHx , MEASVH and the desired value. Work out m and c values. Load these values to appropriate m and c registers for Force DAC. 2) Calibrate Measure Voltage (2 point) Connect SYS_FORCE to FOH, SYS_SENSE to MEASVHx Close Internal Force/Sense switch (SW 7). Force voltage on FOH via SYS_FORCE and measure voltage at MEASOUT. The difference is the error between the actual forced voltage and the voltage at MEASOUT. 3) Calibrate Force current (2 point) In Force current mode, write zero and fullscale to the Force DAC. Connect SYS_FORCE to external ammeter and to FOH pin. Measure error on zero and fullscale current and calculate m and c values. 4) Calibrate Measure Current (2 Point) Write zero scale to the Force DAC in Force Current mode. Connect SYS_FORCE to an external ammeter and to the FOH pin. Measure the error between ammeter reading and MEASOUT reading. Repeat with Full scale loaded to the Force DAC. 5) Repeat for all four channels. If the solution yields an inconvenient reference level, the user can adopt one of the following approaches: 1. Use a resistor divider to divide down a convenient, higher reference level to the required level. 2. Select a convenient reference level above VREF and modify the Gain and Offset registers to digitally downsize the reference. In this way the user can use almost any convenient reference level. 3. Use a combination of these two approaches In this case, the optimum reference to choose is a 2.5V reference, then use the m and c registers and the OFFSET DAC to achieve the required -2V to +8V range. The ISENSE amplifier gain should be changed to a gain of 5. This ensures a full scale current range of the specified values and also allows optimization of power supplies and minimizes power consumption within the device. CALIBRATION The user can perform a system calibration by overwriting the default values in the m and c registers for any individual DAC channels as follows: Calculate the nominal offset and gain coefficients for the new output range (see previous example) Calculate the new m and c values for each channel based on the specified offset and gain errors Calibration Example Nominal Offset Coefficient = 32768 Nominal Gain Coefficient = 10/10.25x 65535 = 63937 Similarly, calibrate the comparators and clamp DACs and load the appropriate gain and offset registers. Calibrating these DACs will require some successive approximation to find where the comparator trips or the clamps engage. Rev. PrM | Page 25 of 48 AD5522 Preliminary Technical Data CIRCUIT OPERATION FORCE VOLTAGE, FV Most PMU measurements are performed while in force voltage and measure current mode, for example, when the device is used as a device power supply, or in continuity or leakage testing. In the force voltage mode, the voltage forced is mapped directly to the DUT. The voltage measure amplifier completes the loop giving negative feedback to the forcing amplifier. See Figure 24. Forced Voltage at DUT = VFIN Where: VFIN = Voltage of the FIN DAC, See VOUT for DAC levels. EXTFOH CFF INTERNAL RANGE SELECT (5uA, 20uA, 200uA, 2mA) FIN + DAC FOH - Rsense EXTMEASIH OFFSET DAC BIAS TO CENTER IRANGE + - MEASOUT x1/x0.2 - Rsense up to (64mA) 10kΩ + x5 or x10 + - EXTMEASIL MEASVH AGND + DUT + DUTGND x1 - + - Figure 24. Forcing voltage, measuring current Rev. PrM | Page 26 of 48 Preliminary Technical Data AD5522 FORCE CURRENT, FI In the force current mode, the voltage at FIN is now converted to a current and applied to the DUT. The feedback path is now the current measure amplifier, feeding back the voltage measured across the sense resistor and MEASOUT reflects the voltage measured across the DUT. See Figure 25. For the suggested current ranges, the maximum voltage drop across the sense resistors is ±1V, however, to allow for correction of errors, there is some over range available in the current ranges. The maximum full-scale voltage range that can be loaded to the FIN DAC is ±11.5V; the forced current may be calculated as follows: FI = VFIN RSENSE × Gain Where: FI = Forced Current VFIN = Voltage of the FIN DAC, See VOUT for DAC levels. RSENSE = Selected Sense Resistor Gain of Current Measure Instrumentation amplifier, it may be set (via the serial interface) to 5 or 10. The ISENSE amplifier is biased by the Offset DAC output voltage, in such as way as to center the Measure current output irrespective of the voltage span used. Using the 5kΩ sense resistor and ISENSE gain of 10, the maximum current range possible is ±225μA. Similarly for the other current ranges, there is an over range of 12.5% to allow for correction. EXTFOH CFF INTERNAL RANGE SELECT (5uA, 20uA, 200uA, 2mA) FIN + DAC FOH - Rsense EXTMEASIH OFFSET DAC BIAS TO CENTER IRANGE + - MEASOUT x1/x0.2 - Rsense up to (64mA) 10kΩ + x5 or x10 + - EXTMEASIL MEASVH AGND + DUT + DUTGND x1 - + - Figure 25. .Forcing current, measuring voltage Rev. PrM | Page 27 of 48 AD5522 Preliminary Technical Data The AD5522 contains two high-speed serial interfaces, an SPI compatible, interface operating at clock frequencies up to 50MHz, and an EIA-644-compliant, LVDS interface. To minimize both the power consumption of the device and onchip digital noise, the interface powers up fully only when the device is being written to, that is, on the falling edge of SYNC. the section Power On Default). This sequence takes approx 300µs. The falling edge of RESET initiates the reset process; BUSY goes low for the duration, returning high when RESET is complete. While BUSY is low, all interfaces are disabled. When BUSY returns high, normal operation resumes and the status of the RESET pin is ignored until it goes low again. The SDO output will be high impedance during a power on reset or a RESET. SPI INTERFACE Power on reset follows the same function as RESET. The serial interface operates over a 2.3V to 5.25V DVCC supply range. The serial interface is controlled by four pin, as follows: BUSY AND LOAD FUNCTION SYNC Frame synchronization input. BUSY is an open drain output that indicates the status of the AD5522 interface. When writing to any of the registers BUSY goes low and stays low until the command completes. SERIAL INTERFACE SDI Serial data input pin. SCLK Clocks data in and out of the device. SDO Serial data output pin for data readback purposes. There is also an SPI/LVDS select pin, which must be held low for SPI interface and high for LVDS interface. LVDS INTERFACE The LVDS interface uses the same input pins as the SPI interface with the same designations. In addition, three other pins are provided for the complementary signals needed for differential operation, thus: SYNC/SYNC Differential frame synchronization signal. Writing to a DAC register drives the BUSY signal low for longer than a simple PMU or System Control Register write. For the DACs, the value of the internal cached (x2) data is calculated and stored each time the user writes new data to the corresponding x1 register. During this write and calculation, the BUSY output is driven low. While BUSY is low, the user can continue writing new data to the x1, m, or c registers, but no output updates can take place. X2 values are stored and held until a PMU word is written that calls the appropriate cached x2 register. Only then does a DAC output update. The DAC outputs and PMU modes are updated by taking the LOAD input low. If LOAD goes low while BUSY is active, the LOAD event is stored and the DAC outputs or PMU modes update immediately after BUSY goes high. A user can also hold the LOAD input permanently low. In this case, the change in DAC outputs or PMU modes update immediately after BUSY goes high. SDI/SDI Differential serial data input. SCLK/SCLK Differential clock input. SDO/SDO Serial data output pin for data readback SERIAL INTERFACE WRITE MODE The AD5522 allows writing of data via the serial interface to every register directly accessible to the serial interface, which is all registers except the DAC registers. The serial word is 29 bits long. The serial interface works with both a continuous and a burst (gated) serial clock. Serial data applied to SDI is clocked into the AD5522 by clock pulses applied to SCLK. The first falling edge of SYNC starts the write cycle. At least 29 falling clock edges must be applied to SCLK to clock in 29 bits of data, before SYNC is taken high again. The input register addressed is updated on the rising edge of SYNC. In order for another serial transfer to take place, SYNC must be taken low again. The BUSY pin is bidirectional and has a 50 kΩ internal pullup resistor. Where multiple AD5522 devices may be used in one system, the BUSY pins can be tied together. This is useful where it is required that no DAC or PMU in any device is updated until all others are ready. When each device has finished updating the x2 registers, it will release the BUSY pin. If another device has not finished updating its x2 registers, it will hold BUSY low, thus delaying the effect of LOAD going low. As there is only one multiplier shared between four channels, this task must be done sequentially, so the length of the BUSY pulse will vary according to the number of channels being updated. RESET FUNCTION Bringing the level sensitive RESET line low resets the contents of all internal registers to their power-on reset state (detailed in Rev. PrM | Page 28 of 48 Preliminary Technical Data AD5522 Table 12. BUSY Pulse Width REGISTER UPDATE RATES Action BUSY Pulse Width (μs max) Loading data to PMU, System Control Register or Readback 0.27 Loading x1 to any 1 PMU DAC Channel 1.25 Loading x1 to any 2 PMU DAC Channels 1.75 Loading x1 to any 3 PMU DAC Channels 2.25 Loading x1 to any 4 PMU DAC Channels 2.75 As mentioned previously the value of the X2 register is calculated each time the user writes new data to the corresponding X1 register. The calculation is performed by a three stage process. The first two stages take 500ns each and the third stage takes 250ns. When the writes to one of the X1 registers is complete the calculation process begins. If the write operation involves the update of a single DAC channel the user is free to write to another register provided that the write operation doesn’t finish until the first stage calculation is complete, i.e. 500ns after the completion of the first write operation. BUSY Pulse Width = ((Number of channels +1) × 500ns) + 250ns Calibration Engine Time BUSY also goes low during power-on reset and when a falling edge is detected on the RESET pin. ~600ns WRITE #1 WRITE #1 500ns 1st STAGE 500ns 250ns 2nd STAGE 3rd STAGE 1st STAGE 1st STAGE WRITE #2 Calibration Engine Time ~600ns 500ns 2nd STAGE 1st STAGE WRITE #2 500ns 250ns 2nd STAGE 3rd STAGE 1st STAGE WRITE #3 3rd STAGE 2nd STAGE 1st STAGE e.g. WRITE TO 3 FIN DAC REGISTERS 1st STAGE 3rd STAGE 2nd STAGE 3rd STAGE Figure 27. Multiple Single Channel writes engaging calibration engine 3rd STAGE 2nd STAGE 2nd STAGE 3rd STAGE Figure 26. Multiple writes to DAC x1 registers Writing data to the System control register, PMU control register, m or c registers do not involve the digital calibration engine, thus speeding up configuration of the device on power on. Rev. PrM | Page 29 of 48 AD5522 Preliminary Technical Data REGISTER SELECTION PMU Address Bits, PMU3, PMU2, PMU1, PMU0 The serial word assignment consists of 29 bits. Bits 28 through to 22 are common to all registers, whether writing to or reading from the device. PMU3 to PMU0 data bits address each PMU channel (or associated DAC register). When PMU3 to PMU0 are all zeros, the System Control Register is addressed. Mode Bits MODE0 and MODE1 address the different sets of DAC registers and the PMU register. Bits PMU3 through PMU0 address each of the PMU channels on chip. This allows individual control of each PMU channel or any manner of combined addressing in addition to multi channel programming. PMU bits also allow access to write registers such as the System Control Register and the many DAC registers, in addition to reading from all the registers. Table 13. Mode Bits B23 MODE1 0 0 1 1 Readback Control, RD/WR The R/W bit set high initiates a readback sequence of PMU, Alarm, Comparator, System Control Register or DAC information as determined by address bits. B22 MODE0 0 1 0 1 WRITE FUNCTION Action System Control Register or PMU Register DAC Gain (m) Register DAC Offset (c) Register DAC Input Data Register, (x1) Table 14. Read and Write Functions of the AD5522 B28 RD/WR B27 PMU3 B26 PMU2 WRITE FUNCTIONS 0 0 0 B25 PMU1 B24 PMU0 B23 MODE1 B22 MODE0 B21 to B0 DATA BITS 0 0 0 0 DATA BITS 0 0 0 0 0 0 1 DATA BITS 0 0 0 0 0 1 0 DATA BITS 0 0 0 0 0 1 1 11 1111 1111 1111 1111 1111b 0 0 0 0 0 1 1 DATA BITS other than all 1’s WRITE ADDRESSED DAC OR PMU REGISTER 0 0 0 0 1 Select DAC or PMU Registers. DATA BITS See Table 13 0 0 0 1 0 0 0 0 1 1 0 0 1 0 0 0 0 1 0 0 0 0 0 1 1 1 0 0 1 1 1 1 READ FUNCTIONS 1 0 0 0 0 0 0 All zeros 1 0 0 0 0 0 1 All zeros 1 0 0 0 0 1 0 X 1 0 0 0 0 1 1 All zeros READ ADDRESSED DAC or PMU REGISTER – Can only read one PMU or DAC register at one time. 1 0 0 0 1 PMU/DAC REGISTER ADDRESS DAC ADDRESS SEE 1 0 0 1 0 SEE Table 13 Table 21 1 0 1 0 0 1 1 0 0 0 SELECTED REGISTER CH3 CH2 CH1 CH0 Write to System Control Register (Table 16) RESERVED RESERVED NOP (No Operation) RESERVED × × × × CH3 CH3 CH3 × × × CH2 × CH2 CH2 × CH1 CH1 × × CH1 CH1 CHO × CH0 × × × CH0 Read from System Control Register Read from Comparator Status Registers Reserved Read from Alarm Status Register × × × CH3 × × CH2 × × CH1 × × CH0 × × × NOP (No Operation) If a NOP (No Operation) command is loaded, no change is made to DAC or PMU registers. This code is useful when performing a read back of a register within the device (via the SDO pin) where a change of DAC code or PMU function may not be required Reserved Commands Any bit combination that is not described in the Register address tables for the PMU, DAC and System Control Registers are Reserved commands. These commands are unassigned commands; they are reserved for factory use. To ensure correct operation of the device, do not used reserved commands. Rev. PrM | Page 30 of 48 Preliminary Technical Data AD5522 WRITE SYSTEM CONTROL REGISTER The System Control Register is accessed when the PMU channel address PMU3-PMU0 and Mode Bits, MODE1 and MODE0 are all zeros. It allows quick setup of different functions within the device. The System Control Register operates on a per device basis. CPBIASEN DUTGND/CH GUARD ALM B8 B7 B6 B5 B4 B3 B2 B1/0 0 CPOLH0 B9 LATCHED CPOLH1 B10 TMP0 B11 TMP1 B12 TMP ENABLE B13 GAIN0 B14 GAIN1 B15 GUARD EN B16 INT10K B17 CLAMP ALM B18 CPOLH2 B19 CPOLH3 CL3 B20 CL0 B21 CL1 B22 CL2 B23 MODE0 B24 MODE1 B25 PMU0 PMU3 B26 PMU1 B27 PMU2 B28 RD/WR Table 15. System Control Register Bits Table 16. System Control Register Functions Bit 28 (MSB) Bit name RD/WR 27 26 25 24 PMU3 PMU2 PMU1 PMU0 Description When low, a write function takes place to the selected register, while if the RD/WR bit is set high, this initiates a readback sequence of PMU, Alarm, Comparator, System Control or DAC register as determined by address bits. Bits PMU3 through PMU0 address each of the PMU channels in the device. If all four of these bits are set to zero, the System Control Register is addressed. B27 B26 B25 B24 B23 B22 SELECTED REGISTER PMU3 PMU2 PMU1 PMU0 MODE1 MODE0 CH3 CH2 CH1 CH0 0 0 0 0 0 0 Write to System Control Register × × CHO 0 0 0 1 Select DAC or PMU Registers. × See below × × CH1 × 0 0 1 0 0 0 1 1 1 23 22 MODE1 MODE0 0 1 0 1 1 1 0 0 1 1 1 0 0 0 1 × × CH1 × CH2 × CH0 × - - - - CH3 × × × - - - - CH3 CH2 CH1 × CH3 CH2 CH1 CH0 Mode Bits, MODE0 and MODE1 allow addressing of the PMU register or the DAC gain (m), offset (c ) or input register (x1). Set to Zero to access the System Control Register. MODE1 MODE0 Action 0 0 System Control Register or PMU Register 0 1 DAC Gain (m) Register 1 0 DAC Offset (c) Register 1 1 DAC Input Data Register, (x1) SYSTEM CONTROL REGISTER SPECIFIC BITS Current Clamp Enable. Bits CL3 through CL0 enable and disable the current clamp function per channel. A “0” disables, while a “1” 21 CL3 enables. The clamp enable function is also available in the PMU register on a per channel basis. This dual functionality allows 20 CL2 flexible enable or disabling of this function. When reading back information on the status of the clamp enable function, what was 19 CL1 most recently written to the current clamp register is available in the readback word from either PMU or System Control Registers. 18 CL0 The Voltage clamps (FI mode) are always enabled. 17 16 15 14 CPOLH3 CPOLH2 CPOLH1 CPOLH0 13 CPBIASEN 12 DUTGND/CH 11 10 GUARD ALM CLAMP ALM 9 INT10K Comparator Output Enable. By default the comparator outputs are hi-Z on power on. A “1” in each bit position enables the comparator output for the selected channel. The CPBIASEN (Bit 13) must be enabled to power on the comparator functions. The comparator enable function is also available in the PMU register on a per channel basis. This dual functionality allows flexible enable or disabling of this function. When reading back information on the status of the comparator enable function, what was most recently written to the comparator register is available in the readback word from either PMU or System Control Registers. Comparator Enable. By default the comparators are powered down on power on. To enable the comparator function for all channels, write a “1” to the CPBIASEN bit. A “0” disabled the comparators and shuts them down. Comparator Output Enables bits (CPOLHx) allow the user to switch on each comparator output individually, enabling bussing of comparator outputs. DUTGND per channel enable. The GUARDIN(0-3)/DUTGND(0-3) pins are shared pin functions and may be configured to enable a DUTGND per PMU channel or GUARD input per PMU channel. Setting this bit to “1” enables DUTGND per channel. In this mode, this pin now functions as a DUTGND pin on a per channel basis. The guard inputs are disconnected from this pin and instead connected directly to the MEASVH line by an internal connection. Default power on condition is GUARDIN(0-3). Clamp and Guard Alarm Function share one open drain CGALM alarm pin. By default, the CGALM pin is disabled. Bits GUARD ALM and CLAMP ALM allow the user to choose if they only wish to have both or either information flagged to the CGALM pin. Set high to enable either alarm function. Internal Sense Short, INT10K. Setting this bit high allows the user to connect in an internal sense short resistor of 10kΩ between the FOH and the MEASVH lines, (closes SW 7), it also closes SW 15, connecting another 10 kΩ resistor between DUTGND and AGND. Rev. PrM | Page 31 of 48 AD5522 8 GUARD EN 7 6 GAIN1 GAIN0 Preliminary Technical Data Guard enable. The Guard Amplifier is disabled on power on; write a “1” to enable it. Disabling the guard function if not in use saves power (typically 400μA per Channel). MEASOUT Output Range. The MEASOUT range defaults to the voltage force span for voltage and current measurements, this is ±11.25V, which includes some over range to allow for offset correction. The MEASOUT range may be reduced by using the GAIN0 and GAIN1 data bits. This allows for use of asymmetrical supplies and also for use of a smaller input range ADC. GAIN1 = “0”VREF = 5V MEASOUT Function GAIN1 = “1” MV MI GAIN0 = “0” GAIN0 = “1” CURRENT MEAS GAIN = 10 CURRENT MEAS GAIN = 5 MEASOUT Gain = 1 ±VDUT (up to 11.25V) MEASOUT Gain = 1/5 ±VRSENSE X 10 = up to ±11.25V ± VRSENSE X 5 = up to ±5.625 0 to 4.5V 0 to 2.25V 0 to 4.5VREF 5 5 4 3 TMP ENABLE TMP1 TMP0 Thermal Shutdown Function, TMP ENABLE, TMP1, TMP0 To disable the Thermal Shutdown feature, write a “0” to the TMP ENABLE bit (enabled by default). Bits TMP1 and TMP0 allow the user to program the thermal shutdown temperature of operation. TMP ENABLE TMP1 TMP0 Action 0 X X Thermal Shutdown Disabled 1 X X Thermal Shutdown Enabled 1 0 0 Shutdown at Junction Temp of 130°C (Power On Default) 1 0 1 Shutdown at Junction Temp of 120°C 1 1 0 Shutdown at Junction Temp of 110°C 1 1 1 Shutdown at Junction Temp of 100°C 2 LATCHED 1 0 (LSB) 0 0 Configure open drain CGALM as a latched or unlatched output pin. When high, this bit sets the CGALM alarm output as latched outputs allowing it to drive a controller I/O without having to poll the line constantly. Default condition on power on is unlatched. Unused bits. Set to 0. Rev. PrM | Page 32 of 48 Preliminary Technical Data AD5522 WRITE PMU REGISTER To address PMU functions, set Mode bits MODE1, MODE0 low, this selects the PMU register as outlined in Table 13 and Table 14. The AD5522 has very flexible addressing, in that it allows writing of data to a single PMU channel, any combination of them or all PMU channels. This enables multi pin broadcasting to similar pins on a DUT. Bits 27 to 24 select which PMU or group of PMUs is addressed. Table 17. PMU Register Bits B28 B27 B26 B25 B24 B23 B22 B21 B20 B19 B18 B17 B16 B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 to B0 RD/WR PMU3 PMU2 PMU1 PMU0 MODE1 MODE0 CH EN FORCE1 FORCE0 X C2 C1 C0 MEAS1 MEAS0 FIN SF0 SF0 CL CPOLH COMPARE V/I CLEAR UNUSED DATA BITS Table 18. PMU Register Functions Bit 28 (MSB) Bit name RD/WR 27 26 25 24 PMU3 PMU2 PMU1 PMU0 Description When low, a write function takes place to the selected register, while if the RD/WR bit is set high, this initiates a readback sequence of PMU, Alarm, Comparator, System Control or DAC register as determined by address bits. Bits PMU3 through PMU0 address each of the PMU channels in the device. This allows individual control of each PMU channel or any manner of combined addressing in addition to multi-channel programming. B27 B26 B25 B24 B23 B22 SELECTED REGISTER PMU3 PMU2 PMU1 PMU0 MODE1 MODE0 CH3 CH2 CH1 CH0 0 0 0 0 0 0 Write to System Control Register × × CHO Select DAC or PMU Registers. × 0 0 0 1 × × CH1 × See below 0 0 1 0 0 0 1 1 1 23 22 MODE1 MODE0 0 1 0 1 1 1 0 0 1 1 1 0 0 0 1 × × CH1 CH0 × CH2 × × - - - - CH3 × × × - - - - CH3 CH2 CH1 × CH3 CH2 CH1 CH0 Mode Bits, MODE0 and MODE1 allow addressing of the PMU register or the DAC gain (m), offset (c ) or input register (x1). Set to zero to access the PMU Register. MODE1 MODE0 Action 0 0 System Control Register or PMU Register 0 1 DAC Gain (m) Register 1 0 DAC Offset (c) Register 1 1 DAC Input Data Register, (x1) PMU REGISTER SPECIFIC BITS 21 CH EN Channel Enable, Set high to enable the selected channel, similarly, set low to disable a selected channel or group of channels. When disabled, SW 2 is closed, SW 5 open. 20 FORCE1 Bits FORCE1 and FORCE0 address the force function for each of the PMU channels (in association with P3-P0). All combinations of forcing and measuring (using MEAS0 and MEAS1) are available. The Hi-Z (voltage and current) modes allows 19 FORCE0 user to optimize glitch response during mode changes. While in these modes, with PMU Hi-Z, new x1 codes loaded to the FIN DAC register and the Clamp DAC register will be calibrated, stored in x2 register and loaded directly to the DAC outputs. FORCE1 FORCE0 Action 0 0 FV & Current Clamp (if clamp enabled) 0 1 FI & Voltage Clamp (if clamp enabled) 1 0 Hi-Z FOH Voltage (pre load FIN DAC & Clamp DAC) 1 1 Hi-Z FOH Current (pre load FIN DAC & Clamp DAC) 18 17 16 15 RESERVED C2 C1 C0 0 Bits C2 through C0 address allow selection of the required current range. C2 C1 C0 Action 0 0 0 ±5µA current range 0 0 1 ±20µA current range 0 1 0 ±200µA current range 0 1 1 ±2mA current range 1 0 0 ±external current range 1 0 1 Reserved 1 1 0 Reserved 1 1 1 Reserved Rev. PrM | Page 33 of 48 AD5522 Preliminary Technical Data 14 13 MEAS1 MEAS0 Bits MEAS1 and MEAS0 allow selection of the required measure mode, allowing the measout line to be disabled, connected to the temperature sensor or enabled for measurement or current or voltage. MEAS1 MEAS0 Action 0 0 MEASOUT connected to I SENSE 0 1 MEASOUT connected to V SENSE 1 0 MEASOUT connected to Temperature Sensor 1 1 MEASOUT Hi-Z (SW 12 Open) 12 11 10 FIN SFO SSO Bit FIN = 0 switches the input of the force amplifier to GND, while FIN = 1 connects it to FIN DAC output. Bits SF0 through SS0 address each of the different combinations of switching the system force and sense lines to the force and sense at the DUT. Selection of which channel the system force and sense lines are connected to as per P3 to P0 addressing. For correct operation, only one PMU channel should be connected at any one time to the SYS_FORCE/SYS_SENSE paths. SF0 SS0 Action 0 0 SYS_FORCE and SYS_SENSE Hi-Z 0 1 SYS_FORCE Hi-Z, SYS_SENSE connected to MEASVHx 1 0 SYS_FORCE connected to FOHx, SYS_SENSE Hi-Z 1 1 SYS_FORCE connected to FOHx, SYS_SENSE connected to MEASVHx 9 CL 8 CPOLH 7 6 COMPARE V/I CLEAR 5 4 3 2 1 0 (LSB) 0 Per PMU current clamp enable bit. A logic high enables the clamp function for the selected PMU. The current clamp enable function is also available in the System control register. This dual functionality allows flexible enable or disabling of this function. When reading back information on the status of the clamp enable function on a per channel basis, what was most recently written to the current clamp register is available in the readback word from either PMU or System Control Registers. The Voltage clamps (FI mode) are always enabled. Comparator output enable bit. A logic high enables the comparator output for the selected PMU, the comparator function CPBIASEN must be enabled in the SYSTEM CONTROL REGISTER. The comparator output enable function is also available in the System control register. This dual functionality allows flexible enable or disabling of this function. A logic high selects compare voltage function, while logic low, current function. To clear or reset a latched alarm bit and pin (temperature, guard or clamp), load a “1” to the Clear bit position. This bit applies to latched alarm (clamp and guard) conditions on all four PMU channels. Unused bits. Set to 0. Rev. PrM | Page 34 of 48 Preliminary Technical Data AD5522 WRITE DAC REGISTER The DAC input, gain and offset registers are addressed through a combination of PMU bits (Bits 27 through 24) and MODE bits (Bits 23 and 22). Bits A5 through A0 address each of the DAC levels on chip. D15 through D0 are the DAC data Bits when writing to these registers. PMU address bits allow addressing to DAC across any combination of PMU channels. Table 19. DAC Register Bits B28 RD/WR B27 PMU3 B26 PMU2 B25 PMU1 B24 PMU0 B23 MODE1 B22 MODE0 B21 A5 B20 A4 B19 A3 B18 A2 B17 A1 B16 A0 B15 to B0 DATA BITS D15 (MSB to D0 (LSB) Table 20. DAC Register Functions Bit 28 (MSB) Bit name Description RD/WR 27 26 25 24 PMU3 PMU2 PMU1 PMU0 When low, a write function takes place to the selected register, while if the RD/WR bit is set high, this initiates a readback sequence of PMU, Alarm, Comparator, System Control or DAC register as determined by address bits. Bits PMU3 through PMU0 address each of the PMU and DAC channels in the device. This allows individual control of each DAC channel or any manner of combined addressing in addition to multi-channel programming. B27 B26 B25 B24 B23 B22 SELECTED REGISTER PMU3 PMU2 PMU1 PMU0 MODE1 MODE0 CH3 CH2 CH1 CH0 0 0 0 0 0 0 Write to System Control Register × × CHO Select DAC or PMU Registers. × 0 0 0 1 See below × × CH1 × 0 0 1 0 0 0 1 1 1 23 22 MODE1 MODE0 DAC REGISTER SPECIFIC BITS 21,20,19 A5,A4,A3 18,17,16 A2,A1,A0 15 to 0(LSB) D15 (MSB) to D0(LSB) 0 1 0 1 1 1 0 0 1 1 1 0 0 0 1 × × CH1 CH0 × CH2 × × - - - - CH3 × × × - - - - CH3 CH2 CH1 × CH3 CH2 CH1 CH0 Mode Bits, MODE0 and MODE1 allow addressing of the DAC gain (m), offset (c ) or input register (x1) MODE1 MODE0 Action 0 0 System Control Register or PMU Register 0 1 DAC Gain (m) Register 1 0 DAC Offset (c) Register 1 1 DAC Input Data Register, (x1) DAC Address Bits. A5 to A3 select which register set is addressed. See Table 21 DAC Address Bits, A2 to A0 select which DAC is addressed. See Table 21 16 DAC Data bits. D15 MSB. Rev. PrM | Page 35 of 48 AD5522 Preliminary Technical Data DAC Addressing For the FIN and Comparator (CPH & CPL) DACs, there are sets of x1, m and c registers for each current range and for the voltage range, but only two sets for the Clamp function (CLL and CLH). When calibrating the device, m and c registers allow volatile storage of offset and gain coefficients. Calculation of the corresponding DAC x2 register only occurs when x1 data is loaded (no internal calculation occurs on m or c updates). There is one Offset DAC per all four channels in the device, it is addressed through any PMU0-3 address. The Offset DAC only has an input register associated with it; there are no m or c registers for this DAC. When writing to this DAC, set both Mode bits high to address the DAC input register (x1). This address table is also used for readback of a particular DAC address. Table 21. DAC Register Addressing 000 ±5µA I range Address bits A5 to A3 (DAC ADDRESS Register) 000 001 MODE1 MODE0 RESERVED 0 1 RESERVED 1 0 1 1 OFFSET DAC FIN 001 010 011 100 101 110 111 ±20µA I range ±200µA I range ±2mA I range ±external I range Voltage range RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED Register Set A2 to A0 (REGISTER ADDRESS) FIN FIN FIN FIN FIN RESERVED RESERVED 010 011 100 101 110 111 RESERVED RESERVED CPL CPH RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED CLL I1 CLL V2 RESERVED RESERVED CLH I1 CLH V2 RESERVED RESERVED CPL CPL CPL CPL CPL RESERVED RESERVED CPH CPH CPH CPH CPH RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED 1 CLL I = Clamp Level Low Current register. CLH I = Clamp Level High Current Register. When forcing a voltage, current clamps are engaged, so this register set will be loaded to the Clamp DAC. 2 CLL V = Clamp Level Low Voltage register. CLH V = Clamp Level High Voltage Register. When forcing a current, voltage clamps are engaged, so this register set will be loaded to the Clamp DAC. Rev. PrM | Page 36 of 48 Preliminary Technical Data AD5522 READ REGISTERS Readback of all the registers in the device is possible via the both SPI and LVDS interfaces. In order to readback data from a register, it is first necessary to write a “readback” command to tell the device which register is required to readback. See Table 22 to address the appropriate channel. Table 22. Read Functions of the AD5522 B28 RD/WR B27 PMU3 B26 PMU2 B25 PMU1 B24 PMU0 B23 MODE1 B22 MODE0 B21 to B0 DATA BITS CH3 SELECTED REGISTER CH2 CH1 CH0 READ FUNCTIONS 1 0 0 0 0 0 0 All zeros Read from System Control Register 1 0 0 0 0 0 1 All zeros Read from Comparator Status Registers 1 0 0 0 0 1 0 X Reserved 1 0 0 0 0 1 1 All zeros Read from Alarm Status Register READ ADDRESSED PMU REGISTER – ONLY ONE PMU REGISTER CAN BE READ AT ONE TIME All zeros 1 0 0 0 1 0 0 × × × CH0 1 0 0 1 0 0 0 × × CH1 × 1 0 1 0 0 0 0 × CH2 × × 1 1 0 0 0 0 0 CH3 × × × READ ADDRESSED DAC “m” Register – ONLY ONE DAC REGISTER CAN BE READ AT ONE TIME DAC ADDRESS 1 0 0 0 1 0 1 × × × CH0 SEE Table 21 1 0 0 1 0 0 1 × × CH1 × 1 0 1 0 0 0 1 × CH2 × × CH3 × × × 1 1 0 0 0 0 1 READ ADDRESSED DAC “c” Register – ONLY ONE DAC REGISTER CAN BE READ AT ONE TIME DAC ADDRESS 1 0 0 0 1 1 0 × × × CH0 SEE Table 21 1 0 0 1 0 1 0 × × CH1 × 1 0 1 0 0 1 0 × CH2 × × CH3 × × × 1 1 0 0 0 1 0 READ ADDRESSED DAC “x1” Register – ONLY ONE DAC REGISTER CAN BE READ AT ONE TIME DAC ADDRESS 1 0 0 0 1 1 1 × × × CH0 SEE Table 21 1 0 0 1 0 1 1 × × CH1 × 1 0 1 0 0 1 1 × CH2 × × CH3 × × × 1 1 0 0 0 1 1 Once the required channel has been addressed, the device will load the 24 bit Readback data into the MSB positions of the 29 Bit serial shift register, the five LSB bits will be filled with zeros. SCLK rising edges clock this readback data out on SDO(framed by the SYNC signal). A minimum of 24 clock rising edges are required to shift the readback data out of the shift register. If writing a 24-bit word to shift data out of the device, user must ensure that the 24 bit write is effectively a NOP (No Operation) command. The last 5 bits in the shift register will always be 00000b, these five bits will become the MSBs of the shift register when the 24 bit write is loaded. To ensure the device receives a NOP command as outlined in Table 14, the recommended flush command is 0xFFFFFF and no change will be made to any register within the device. Readback data may also be shifted out by writing another 29 bit write or read command. If writing a 29-bit command, the readback data will be MSB data available on SDO, followed by 00000b. Rev. PrM | Page 37 of 48 AD5522 Preliminary Technical Data READBACK OF SYSTEM CONTROL REGISTER The readback function is a 24 bit word, mode, address and System Control Register data bits as shown in the following table. Table 23. Readback System Control Register Data Bit Bit name Description 23 (MSB) MODE1 0 22 MODE0 0 SYSTEM CONTROL REGISTER SPECIFIC READBACK BITS 21 CL3 Readback the status of the individual Clamp Enable bits. A “0” means the clamp is disabled, while a “1” enabled. The clamp enable function is also available in the System Control Register. This dual functionality allows flexible 20 CL2 enable or disabling of this function. When reading back information on the status of the clamp enable function, 19 CL1 what was most recently written to the clamp register from either System Control register or PMU register will be 18 CL0 available in the readback word. 17 16 15 14 CPOLH3 CPOLH2 CPOLH1 CPOLH0 13 CPBIASEN 12 DUTGND/CH 11 10 9 GUARD ALM CLAMP ALM INT10K 8 7 6 5 4 3 2 GUARD EN GAIN1 GAIN0 TMP ENABLE TMP1 TMP0 LATCHED 1 0 (LSB) Unused Readback bits Readback information on the Comparator Output Enable status. A “1” signifies the function is enabled, while a “0” disabled. A logic high indicates that the PMU comparator output is enabled, while if low, it’s disabled. The comparator output enable function is also available in the PMU Register. This dual functionality allows flexible enable or disabling of this function. When reading back information on the status of the comparator output enable function, what was most recently written to the comparator register from either System Control register or PMU register will be available in the readback word. This readback bit tells the status of the Comparator Enable function. A “1” in this bit position means the Comparator functions are enabled, while a “0” disabled. DUTGND per channel enable. If this bit is set at “1”, DUTGND per channel is enabled, while if “0”, individual guard inputs are available per channel. These bits give status on which of these alarm bits trigger the CGALM pin. If this bit is set high, the internal 10k resistor is connected between FOH and MEASVH, and between DUTGND and AGND. If low, they are disconnected. Readback status of the Guard amplifies. If high, Amplifiers are enabled. Status of the selected MEASOUT Output Range. Information is available on the status of the setting for Thermal shutdown function. Refer to System control write register. This bit tells of the status of the open drain outputs. When high, the open drain alarm outputs are latched outputs, while if low, they are unlatched. Will be loaded with zeros. Rev. PrM | Page 38 of 48 Preliminary Technical Data AD5522 READBACK OF PMU REGISTER The PMU readback function is a 24 bit word, mode, address and PMU data bits. Table 24. Readback PMU Register (Only one PMU register may be read back at any one time). Bit Bit name 23 (MSB) MODE1 22 MODE0 PMU REGISTER SPECIFIC BITS 21 CH EN 20 FORCE1 19 FORCE0 18 RESERVED 17 C2 16 C1 15 C0 14 MEAS1 13 MEAS0 12 FIN 11 SFO 10 SSO 9 CL 8 CPOLH 7 COMPARE V/I 6 LTMPALM 5 TMPALM 4, 3, 2, 1, 0 (LSB) Unused Readback bits Description 0 0 Channel Enable, If high selected channel is enabled, otherwise disabled. These bits tell what force and measure mode the selected channel is in. 0 These three bits tell what forced or measured current range is set for the selected channel. Bits MEAS1 and MEAS0 tell which measure mode is selected, voltage, current, temperature sensor or HiZ. This bit shows the status of the Force input amplifier. The system force and sense lines may be connected to any of the four PMU channels. Reading back these bits tell if they are switched in or not. A logic high in this readback position tells if the Per PMU clamp is enabled, while if low, the clamp is disabled. The clamp enable function is also available in the System Control Register. This dual functionality allows flexible enable or disabling of this function. When reading back information on the status of the clamp enable function, what was most recently written to the clamp register from either System Control register or PMU register will be available in the readback word. A logic high indicates that the PMU comparator output is enabled, while if low, it’s disabled. The comparator output enable function is also available in the System Control Register. This dual functionality allows flexible enable or disabling of this function. When reading back information on the status of the comparator output enable function, what was most recently written to the comparator register from either System Control register or PMU register will be available in the readback word. A logic high selects indicates the selected channel is comparing voltage function, while logic low, current function. TMPALM corresponds to the open drain TMPALM output pin which flags the user of a temperature event exceeding the default or user programmed level. The temperature alarm is a per device alarm, and latched (LTMPALM) and unlatched (TMPALM) bits tell a temperature event occurred and if the alarm still exists (if the junction temperature still exceeds the programmed alarm level). To reset an alarm event, the user must write to the CLEAR bit in the PMU register. Will be loaded with zeros. READBACK OF COMPARATOR STATUS REGISTER The Comparator output status Register is a read only register giving access to the output status of each of the comparators on the chip. Table 25 shows the format of the comparator readback word. Table 25. Comparator Status Readback Register Bit Bit name Description 23 (MSB) MODE1 0 22 MODE0 1 COMPARATOR STATUS REGISTER SPECIFIC BITS Comparator output conditions per channel corresponding to the comparator output pins. 21 CP0L0 20 CP0H0 19 CP0L1 18 CP0H1 17 CP0L2 16 CP0H2 15 CP0L3 14 CP0H3 13 to 0 (LSB) Unused Readback bits Will be loaded with zeros. Rev. PrM | Page 39 of 48 AD5522 Preliminary Technical Data READBACK OF ALARM STATUS REGISTER The Alarm Status register is a READ only register that gives information on temperature, clamp and guard alarm events. In the event the Guard and Clamp alarm functions are not used, (the alarm function may be switched off in the System Control Register). In this case, the Temperature alarm status is also available in the contents of any of the four PMU readback registers. Table 26. Alarm Status Readback Register Bit Bit name Description 23 (MSB) MODE1 1 22 MODE0 1 ALARM STATUS READBACK REGISTER SPECIFIC BITS 21 LTMPALM TMPALM corresponds to the open drain TMPALM output pin which flags the user of a temperature event exceeding the default or user programmed level. The temperature alarm is a per device alarm, and latched 20 TMPALM (LTMPALM) and unlatched (TMPALM) bits tell a temperature event occurred and if the alarm still exists (if the junction temperature still exceeds the programmed alarm level). To reset an alarm event, the user must write to the CLEAR bit in the PMU register. 19 LG0 LGx is the per channel latched Guard Alarm bit and Gx is an unlatched alarm bit. These bits give information on which channel flagged an alarm on the open drain alarm CGALM pin and if the alarm 18 G0 condition still exists. 17 LG1 16 G1 15 LG2 14 G2 13 LG3 12 G3 11 LC0 10 C0 9 LC1 8 C1 7 LC2 6 C2 5 LC3 4 C3 3 to 0 (LSB) Unused Readback bits LCx is a per channel latched Clamp alarm bit and Cx is the unlatched alarm bit. These bits give information on which channel flagged an alarm on the open drain alarm CGALM pin and if the alarm condition still exists. Will be loaded with zeros. READBACK OF DAC REGISTER The DAC readback function is a 24 bit word, mode, address and DAC data bits. Table 27. DAC Register Readback Bit Bit name 23 (MSB) MODE1 22 MODE0 DAC READBACK REGISTER SPECIFIC BITS 21 to 16 A5, A4, A3, A2, A1 15 to 0 (LSB) D15 to D0 Description 0 0 Address Bits indicating the DAC register that is read. Contents of the addressed DAC register (x1, m or c). Rev. PrM | Page 40 of 48 Preliminary Technical Data AD5522 POWER ON DEFAULT The power on default for all DAC channels is that the contents of each m register is set to full-scale (0xFFFF) and c register to midscale(0x8000). The contents of the DAC registers are : Offset DAC: 0xA492, FIN DACs: 0x8000, CLL DACs: 0x0000, CLH DACs: 0xFFFF, CPL DACs: 0x0000, CPH DACs: 0xFFFF The power on default for the Alarm Status Register is 0xFFFFF0, while the Comparator Status registers powers up at 0x400000. The power on defaults of the PMU register and the System Control Register are shown below. Table 28. Power on Default for System Control Register and PMU Register Bit 21 (MSB) 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 SYSTEM CONTROL REGISTER POWER ON DEFAULT Bit name Description CL3 0 CL2 0 CL1 0 CL0 0 CPOLH3 0 CPOLH2 0 CPOLH1 0 CPOLH0 0 CPBIASEN 0 DUTGND/CH 0 GUARD ALM 0 CLAMP ALM 0 INT10K 0 GUARD EN 0 GAIN1 0 GAIN0 0 PMU REGISTER POWER ON DEFAULT Bit name Description CH EN 0 FORCE1 0 FORCE0 0 RESERVED 0 C2 0 C1 1 C0 1 MEAS1 1 MEAS0 1 FIN 0 SFO 0 SSO 0 CL 0 CPOLH 0 COMPARE V/I 0 1 LTMPALM 5 TMP ENABLE 1 TMPALM 1 4 3 2 1 0 (LSB) TMP1 TMP0 LATCHED Unused Data Bits 0 0 0 0 0 Unused Data Bits 0 0 0 0 0 Rev. PrM | Page 41 of 48 AD5522 Preliminary Technical Data SETTING UP THE DEVICE ON POWER ON CHANGING MODES On power on, default conditions are recalled from the power on reset register ensuring each PMU and DAC channel is powered up to a known condition. To operate the device, the user must: There are different ways of handling a mode change: 1) Configure the device by writing to the System Control register to set up different functions as required. 2) Calibrate out errors and load required calibration values to (Gain) m and (Offset) c registers, and load codes to each DAC input register (x1). Once x1 values are loaded to the individual DACs, the calibration engine calculates the appropriate x2 value and stores it ready for the PMU address to call it. 3) 4) Load the required PMU channel with the required force mode, current range etc. Loading the PMU channel configures the switches around the Force Amplifier, Measure function, clamps and comparators and also acts as a load signal for the DACs, loading the DAC register with the appropriate stored x2 value. As the voltage and current ranges have individual DAC registers associated with them, each PMU register mode of operation calls a particular x2 register. Hence, only updates (changes to x1 register) to DACs associated with the selected mode of operation are reflected to the output of the PMU. If there is a change to the x1 value associated with a different PMU mode of operation, then this x1 value and it’s m and c coefficients are used to calculate a corresponding x2 value which is stored in the correct x2 register, but it does not get loaded to the DAC. 1) Load any DAC x1 values that are required to change. Remember that x1 registers are available per voltage and current range (for Force Amplifier and Comparator DACs), so you can preload these and may not need to make changes. The calibration engine will calculate the x2 values and store them. 2) Now change into the new PMU mode. This will load the new switch conditions in the PMU circuitry and load the DAC register with the stored x2 data. or 1) Use the Hi-Z V or Hi-Z I mode in the PMU register, this makes the amplifier high impedance. 2) Now load any DAC x1 values that need to be loaded. Remember that x1 registers are available per voltage and current range, so you can preload these and may not need to make changes. 3) When the Hi-Z (V or I) modes are used, the relevant DAC outputs are automatically updated (FIN, CLL, CLH DACs). For example, when selecting Hi-Z V (Voltage), the FIN Voltage x2 result is loaded, offset and gain corrected, cached and loaded to the FIN DAC. When forcing a voltage, current clamps are engaged, so the CLL I (Current) register can be loaded, gain and offset corrected and loaded to the DAC register. Similarly, for the CLH I register. 4) Now change into the new PMU mode (FI/FV). This will load the new switch conditions in the PMU circuitry. As the DAC outputs are already loaded, transients when changing current or voltage mode will be minimized. Rev. PrM | Page 42 of 48 Preliminary Technical Data AD5522 REQUIRED EXTERNAL COMPONENTS The minimum required external components are shown in the block diagram below. Decoupling will be very dependent on the type of supplies used, other decoupling on the board and the noise in the system. It is possible more or less decoupling may be required as a result. AVSS AVDD DVCC 10µF 10µF 0.1µF AVSS 0.1µF AVDD REF 10µF 0.1µF 0.1µF VREF DVCC CCOMP(0-3) EXTFOH3 CFF3 EXTFOH0 CFF0 FOH3 FOH0 MEASVH3 MEASVH0 EXTMEASIH3 EXTMEASIH0 up to 64mA up to 64mA EXTMEASIL0 EXTMEASIL3 DUT DUT EXTFOH2 CFF2 EXTFOH1 CFF1 FOH2 FOH1 MEASVH2 MEASVH1 EXTMEASIH2 EXTMEASIH1 up to 64mA up to 64mA EXTMEASIL1 DUTGND EXTMEASIL2 DUT DUT Figure 28. External components required for use with this PMU device. Rev. PrM | Page 43 of 48 AD5522 Preliminary Technical Data POWER SUPPLY DECOUPLING In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. The printed circuit board on which the AD5522 is mounted should be designed so that the analog and digital sections are separated and confined to certain areas of the board. If the AD5522 is in a system where multiple devices require an AGND-to-DGND connection, the connection should be made at one point only. The star ground point should be established as close as possible to the device. For supplies with multiple pins (AVSS, AVDD, VCC), it is recommended to tie these pins together and to decouple each supply once. The AD5522 should have ample supply decoupling of 10 µF in parallel with 0.1 µF on each supply located as close to the package as possible, ideally right up against the device. The 10µF capacitors are the tantalum bead type. The 0.1 µF capacitor should have low effective series resistance (ESR) and effective series inductance (ESI), such as the common ceramic types that provide a low impedance path to ground at high frequencies, to handle transient currents due to internal logic switching. Digital lines running under the device should be avoided, because these couple noise onto the device. The analog ground plane should be allowed to run under the AD5522 to avoid noise coupling (only with the package with paddle up).. The power supply lines of the AD5522 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. Fast switching digital signals should be shielded with digital ground to avoid radiating noise to other parts of the board, and should never be run near the reference inputs. It is essential to minimize noise on all VREF lines. Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other. This reduces the effects of feedthrough through the board. As is the case for all thin packages, care must be taken to avoid flexing the package and to avoid a point load on the surface of this package during the assembly process. Also note that the exposed paddle of the AD5522 is connected to the negative supply AVSS. Rev. PrM | Page 44 of 48 Preliminary Technical Data AD5522 TYPICAL APPLICATION FOR THE AD5522 . Figure 29 shows the AD5522 as used in an ATE system. This device can used as a per pin parametric unit in order to speed up the rate at which testing can be done. The central PMU shown in the block diagram is usually a highly accurate PMU, and is shared among a number of pins in the tester. In general, many discrete levels are required in an ATE system for the pin drivers, comparators, clamps, and active loads. DAC devices, such as the AD5379, offer a highly integrated solution for a number of these levels. The AD5379 is a dense 40-channel DAC designed with high channel requirements, such as ATE Driven Shield DAC Guard Amp Central PMU AD5522 ADC DAC Timing Generator DLL,Logic DAC ADC Vterm DAC Timing Data Memory VCH PPMU VH DUT DAC Relays Formatter De-Skew 50 Ω Coax Driver VL DAC VCL Guard Amp DAC DAC Compare Memory GND Sense VTH Formatter De-Skew Comp DAC VTL DAC IOL DAC Device Power supply ADC Active Load VCOM DAC DAC IOH Figure 29. Typical Applications Circuit using the AD5522 as a per pin parametric unit. Rev. PrM | Page 45 of 48 AD5522 Preliminary Technical Data OUTLINE DIMENSIONS 14.20 14.00 SQ 13.80 0.75 0.60 0.45 12.20 12.00 SQ 11.80 1.20 MAX 80 61 61 1 60 80 1 60 PIN 1 EXPOSED PAD TOP VIEW (PINS DOWN) BOTTOM VIEW 0° MIN 1.05 1.00 0.95 0.15 0.05 (PINS UP) 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY SEATING PLANE 9.50 BSC SQ 20 41 41 40 21 20 21 40 VIEW A 0.50 BSC LEAD PITCH 0.27 0.22 0.17 VIEW A ROTATED 90° CCW COMPLIANT TO JEDEC STANDARDS MS-026-ADD-HD Figure 30. 80 lead TQFP/EP with exposed pad on bottom 14.20 14.00 SQ 13.80 0.75 0.60 0.45 1.20 MAX 12.20 12.00 SQ 11.80 80 61 61 1 80 1 60 60 PIN 1 EXPOSED PAD 0° MIN 1.05 1.00 0.95 0.15 0.05 SEATING PLANE 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY BOTTOM VIEW 9.50 BSC (PINS UP) TOP VIEW (PINS DOWN) 20 41 40 21 VIEW A 6.50 BSC VIEW A ROTATED 90° CCW COMPLIANT TO JEDEC STANDARDS MS-026-ADD-HU Figure 31. 80 lead TQFP/EP with exposed pad on top Rev. PrM | Page 46 of 48 41 20 21 40 0.50 BSC LEAD PITCH 0.27 0.22 0.17 Preliminary Technical Data AD5522 ORDERING GUIDE Model Function Package Description1 AD5522JSVD Quad PMU with 4 internal current ranges, full comparator function, 1 external current range, SPI and LVDS serial interfaces. Quad PMU with 4 internal current ranges, full comparator function, 1 external current range, SPI and LVDS serial interfaces. Quad PMU, 4 internal current ranges, window comparator function, SPI interface. 80 Lead TQFP with exposed pad on bottom Package Options SV-80 80 Lead TQFP with exposed pad on top SV-80 64 Lead LFCSP with exposed pad on bottom 9mm x 9mm CP-64 AD5522JSVUZ2 AD5523JCPZ2,3 1 Exposed pad is electrically connected internally to AVSS. 2 Lead Free Package. Reduced functionality. Contact factory for AD5523 datasheet and more details. 3 Rev. PrM | Page 47 of 48 AD5522 Preliminary Technical Data NOTES © 2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective companies. Printed in the U.S.A. PR06197-0-03/07(PrM) Rev. PrM | Page 48 of 48