AD AD5764BSU

Complete, Quad, 14/16-Bit, High Accuracy,
Serial Input, Bipolar Voltage Output DAC
iCMOSTM
Preliminary Technical Data
AD5744/AD5764
FEATURES
GENERAL DESCRIPTION
Complete quad 14/16-bit D/A converter
Programmable output range: ±10 V, ±10.25 V, or ±10.5 V
±1 LSB max INL error, ±1 LSB max DNL error
Low noise : 60 nV/√Hz
Settling time: 10µs max
Integrated reference buffers
Internal reference, 10 ppm/°C
On-chip temp sensor, ±5°C accuracy
Output control during power-up/brownout
Programmable short-circuit protection
Simultaneous updating via LDAC
Asynchronous CLR to zero code
Digital offset and gain adjust
Logic output control pins
DSP/microcontroller compatible serial interface
Temperature range:−40°C to +85°C
iCMOS™ Process Technology
The AD5744/64 is a quad, 14/16-bit serial input, voltage output
digital-to analog converter that operates from supply voltages of
±12 V up to ±15 V. Nominal full-scale output range is ±10 V,
provided are integrated output amplifiers, reference buffers,
internal reference, and proprietary power-up/power-down
control circuitry. It also features a digital I/O port that may be
programmed via the serial interface, and an analog temperature
sensor. The part incorporates digital offset and gain adjust
registers per channel.
APPLICATIONS
Industrial automation
Open/Closed-loop servo control
Process control
Data acquisition systems
Automatic Test Equipment
Automotive test and measurement
High accuracy instrumentation
The AD5744/64 is a high performance converter that offers
guaranteed monotonicity, integral nonlinearity (INL) of ±1 LSB,
low noise and 10 µs settling time and includes an on-chip 5 V
reference with a reference tempco of 10 ppm/°C max. During
power-up (when the supply voltages are changing), Vout is
clamped to 0V via a low impedance path.
The AD5744/64 uses a serial interface that operates at clock rates
of up to 30 MHz and is compatible with DSP and microcontroller
interface standards. Double buffering allows the simultaneous
updating of all DACs. The input coding is programmable to either
twos complement or Offset binary formats. The asynchronous
clear function clears all DAC registers to either bipolar zero or
zero-scale depending on the coding used. The AD5744/64 is ideal
for both closed-loop servo control and open-loop control
applications. The AD5744/64 is available in a 32-lead TQFP
package, and offers guaranteed specifications over the −40°C to
+85°C industrial temperature range. See functional block
diagram, Figure 1.
iCMOS™ Process Technology
For analog systems designers within industrial/instrumentation equipment OEMs who need high performance ICs at higher-voltage levels, iCMOS is a
technology platform that enables the development of analog ICs capable of 30V and operating at +/-15V supplies while allowing dramatic reductions in
power consumption and package size, and increased AC and DC performance.
Rev. PrA
15-Nov-04
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703
© 2004 Analog Devices, Inc. All rights reserved.
AD5744/AD5764
Preliminary Technical Data
TABLE OF CONTENTS
Functional Block Diagram .............................................................. 3
Coarse gain register.................................................................... 20
Specifications..................................................................................... 4
Fine gain register ........................................................................ 21
AC Performance Characteristics ................................................ 6
offset register............................................................................... 21
Timing Characteristics ................................................................ 7
AD5744/64 Features....................................................................... 22
Absolute Maximum Ratings.......................................................... 10
Analog Output Control ............................................................. 22
ESD Caution................................................................................ 10
Digital Offset and Gain Control............................................... 22
Pin Configuration and Function Descriptions........................... 11
Programmable Short-Circuit protection................................. 22
Terminology .................................................................................... 13
Digital I/O Port........................................................................... 22
typical performance characteristics ............................................. 15
Temperature Sensor ................................................................... 22
General Description ....................................................................... 16
Local ground offset adjust......................................................... 22
dac architecture........................................................................... 16
applications information ............................................................... 23
Reference Buffers........................................................................ 16
typical operating circuit............................................................. 23
Serial interface ............................................................................ 16
layout guidelines......................................................................... 24
Simultaneous Updating Via LDAC .......................................... 17
Isolated interface ........................................................................ 24
transfer function ......................................................................... 18
microprocessor interfacing ....................................................... 24
Asynchronous Clear (CLR)....................................................... 18
Evaluation board ........................................................................ 26
Function Register ....................................................................... 19
Outline Dimensions ....................................................................... 27
DAta register ............................................................................... 20
Ordering Guide .......................................................................... 27
REVISION HISTORY
Revision PrA 15-Nov-04: Preliminary Version
Rev. PrA 15-Nov-04| Page 2 of 27
AD5744/AD5764
Preliminary Technical Data
FUNCTIONAL BLOCK DIAGRAM
PGND
AVDD
AVSS
AVDD
AVSS
REFOUT
REFGND
VREF AB
DVCC
+5V
REFERENCE
DGND
14/16
SDIN
SCLK
SYNC
SDO
INPUT SHIFT
REGISTER
AND
CONTROL
LOGIC
INPUT
REG A
REFERENCE
BUFFERS
RSTOUT
RSTIN
VOLTAGE
MONITOR
AND
CONTROL
ISCC
G1
DAC 14/16
REG A
DAC A
VOUTA
G2
GAIN REG A
AGNDA
OFFSET REG A
INPUT
REG B
G1
DAC 14/16
REG B
DAC B
VOUTB
G2
GAIN REG B
AGNDB
OFFSET REG B
D0
D1
INPUT
REG C
G1
DAC 14/16
REG C
DAC C
VOUTC
G2
GAIN REG C
AGNDC
OFFSET REG C
BIN/2SCOMP
INPUT
REG D
G1
DAC 14/16
REG D
DAC D
VOUTD
G2
CLR
GAIN REG D
AGNDD
OFFSET REG D
LDAC
REFERENCE
BUFFERS
TEMP
SENSOR
VREF CD
TEMP
Figure 1. Functional Block Diagram
Rev. PrA 15-Nov-04| Page 3 of 27
AD5744/AD5764
Preliminary Technical Data
SPECIFICATIONS
AVDD = +11.4 V to +16.5 V, AVSS = −11.4 V to −16.5 V, AGND = DGND = REFGND = PGND=0 V; REFAB = REFCD= 5 V Ext;
DVCC = 2.7 V to 5.5 V, RLOAD = 10 kΩ, CL = 200 pF. All specifications TMIN to TMAX, unless otherwise noted.
Table 1.
A Grade1
B Grade1
C Grade1
Unit
Test Conditions/Comments
16
14
±2
±1
±1
16
14
±1
±1
±1
Bits
AD5764
AD5744
Relative Accuracy (INL)
Differential Nonlinearity
Bipolar Zero Error
16
14
±4
±1
±1
LSB max
LSB max
mV max
Bipolar Zero TC
Zero Code Error
±2
±1
±2
±1
±2
±1
ppm FSR/°C max
mV max
Zero Code TC
Gain Error
±2
±0.02
±2
±0.02
±2
±0.02
ppm FSR/°C max
% FSR max
2
0.5
2
0.5
2
0.5
ppm FSR/°C max
LSB max
5
1
±10
1/5
5
1
±10
1/5
5
1
±10
1/5
V nom
MΩ min
µA max
V min/max
±1% for specified performance
Typically 100 MΩ
Typically ±30 nA
4.999/5.001
±10
TBD
TBD
4.999/5.001
±10
TBD
TBD
4.999/5.001
±10
TBD
TBD
V min/max
ppm/°C max
µV p-p typ
nV/√Hz typ
At 25°C
±10
±13
±2
±TBD
±10
±13
±2
±TBD
±10
±13
±2
±TBD
AVDD/AVSS = ±11.4 V
AVDD/AVSS = ±16.5 V
Short Circuit Current
Load Current
Capacitive Load Stability
RL = ∞
RL = 10 kΩ
DC Output Impedance
DIGITAL INPUTS2
10
±1
10
±1
10
±1
V min/max
V min/max
ppm FSR/°C max
ppm FSR/1000 Hours
typ
mA max
mA max
200
TBD
0.3
200
TBD
0.3
200
TBD
0.3
pF max
pF max
Ω max
VIH, Input High Voltage
2
Parameter
ACCURACY
Resolution
Gain TC
DC Crosstalk2
REFERENCE INPUT/OUTPUT
Reference Input2
Reference Input Voltage
DC Input Impedance
Input Current
Reference Range
Reference Output
Output Voltage
Reference TC
Output Noise(0.1 Hz to 10 Hz)
Noise Spectral Density
OUTPUT CHARACTERISTICS2
Output Voltage Range3
Output Voltage TC
Output Voltage Drift VS Time
Guaranteed monotonic
At 25°C. Error at other
temperatures
obtained using bipolar zero TC.
At 25°C. Error at other
temperatures
obtained using zero code TC.
At 25°C. Error at other
temperatures
obtained using gain TC.
RISCC = 6 KΩ , See Figure ???
For specified performance
DVCC = 2.7 V to 5.5 V, JEDEC
compliant
2
2
V min
1
Temperature range −40°C to +85°C; typical at +25°C. Device functionality is guaranteed to +105°C with degraded performance.
Guaranteed by characterization. Not production tested.
3
Output amplifier headroom requirement is 1.4 V min.
2
Rev. PrA 15-Nov-04| Page 4 of 27
AD5744/AD5764
Preliminary Technical Data
A Grade1
0.8
±10
10
B Grade1
0.8
±10
10
C Grade1
0.8
±10
10
Unit
V max
µA max
pF max
0.4
DVCC – 1
0.4
DVCC – 1
0.4
DVCC – 1
V max
V min
Output Low Voltage
0.4
0.4
0.4
V max
Output High Voltage
DVCC – 0.5
DVCC – 0.5
DVCC – 0.5
V min
±1
±1
±1
µA max
DVCC= 5 V ± 10%, sinking 200 µA
DVCC = 5 V ± 10%, Sourcing 200
µA
DVCC = 2.7 V to 3.6 V, Sinking 200
µA
DVCC = 2.7 V to 3.6 V, Sourcing
200 µA
SDO only
5
5
5
pF typ
SDO only
±1
±5
1.5
5
0/3.0
200
10
±1
±5
1.5
5
0/3.0
200
10
±1
±5
1.5
5
0/3.0
200
10
°C typ
°C max
V typ
mV/°C typ
V min/max
µA max
ms typ
At 25°C
−40°C < T <+85°C
11.4/16.5
2.7/5.5
11.4/16.5
2.7/5.5
11.4/16.5
2.7/5.5
V min/max
V min/max
−85
3.75
2.75
1
−85
3.75
2.75
1
−85
3.75
2.75
1
dB typ
mA/Channel max
mA/Channel max
mA max
244
244
244
mW typ
Parameter
VIL, Input Low Voltage
Input Current
Pin Capacitance
DIGITAL OUTPUTS (D0,D1, SDO) 2
Output Low Voltage
Output High Voltage
High Impedance Leakage
Current
High Impedance Output
Capacitance
TEMP SENSOR
Accuracy
Output Voltage @ 25°C
Output Voltage Scale Factor
Output Voltage Range
Output Load Current
Power On Time
POWER REQUIREMENTS
AVDD/AVSS
DVCC
Power Supply Sensitivity4
∆VOUT/∆ΑVDD
AIDD
AISS
DICC
Power Dissipation
4
Guaranteed by characterization. Not production tested.
Rev. PrA 15-Nov-04| Page 5 of 27
Test Conditions/Comments
Total for All Pins. TA = TMIN to TMAX.
Current source only.
To within ±5°C
Outputs unloaded
Outputs unloaded
VIH = DVCC, VIL = DGND. TBD mA
typ
±12 V operation output
unloaded
AD5744/AD5764
Preliminary Technical Data
AC PERFORMANCE CHARACTERISTICS
AVDD = +11.4 V to +16.5 V, AVSS = −11.4 V to −16.5 V, AGND = DGND = REFGND = PGND=0 V; REFAB = REFCD= 5 V Ext;
DVCC = 2.7 V to 5.5 V, RLOAD = 10 kΩ, CL = 200 pF. All specifications TMIN to TMAX, unless otherwise noted. Guaranteed by design and
characterization, not production tested.
Table 2.
Parameter
DYNAMIC PERFORMANCE
Output Voltage Settling Time
Slew Rate
Digital-to-Analog Glitch Energy
Glitch Impulse Peak Amplitude
Channel-to-Channel Isolation
DAC-to-DAC Crosstalk
Digital Crosstalk
Digital Feedthrough
Output Noise (0.1 Hz to 10 Hz)
Output Noise (0.1 kHz to 100 kHz)5
1/f Corner Frequency
Output Noise Spectral Density
Complete System Output Noise Spectral
Density6
5
6
A Grade
B Grade
C Grade
Unit
Test Conditions/Comments
8
10
1
5
5
5
100
5
8
10
1
5
5
5
100
5
5
1
8
10
1
5
5
5
100
5
5
1
µs typ
µs max
µs max
V/µs typ
nV-s typ
mV max
dB typ
nV-s typ
nV-s typ
nV-s typ
Full-scale step
0.1
45
1
60
80
0.1
45
1
60
80
LSB p-p typ
µV rms max
kHz typ
nV/√Hz typ
nV/√Hz typ
Guaranteed by design and characterization. Not production tested.
Includes noise contributions from integrated reference buffers, 14/16-bit DAC and output amplifier.
Rev. PrA 15-Nov-04| Page 6 of 27
512 LSB step settling @ 16 Bits
Effect of input bus activity on DAC
output under test
Measured at 10 kHz
Measured at 10 kHz
AD5744/AD5764
Preliminary Technical Data
TIMING CHARACTERISTICS
AVDD = +11.4 V to +16.5 V, AVSS = −11.4 V to −16.5 V, AGND = DGND = REFGND = PGND = 0 V; REFAB = REFCD= 5 V Ext;
DVCC = 2.7 V to 5.5 V, RLOAD = 10 kΩ, CL = 200 pF. All specifications TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter7,8,9
t1
t2
t3
t4
t5 10
t6
t7
t8
t9
t10
t11
t12
t13
t14
t1511,12
t1612
t1712
Limit at TMIN, TMAX
33
13
13
13
13
40
5
0
20
20
5
10
20
12
20
8
20
Unit
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
µs max
ns min
µs max
ns max
ns min
ns min
Description
SCLK cycle time
SCLK high time
SCLK low time
SYNC falling edge to SCLK falling edge setup time
24th SCLK falling edge to SYNC rising edge
Minimum SYNC high time
Data setup time
Data hold time
SYNC rising edge to LDAC falling edge
LDAC pulse width low
LDAC falling edge to DAC output response time
DAC output settling time
CLR pulse width low
CLR pulse activation time
SCLK rising edge to SDO valid
SCLK falling edge to SYNC rising edge
SYNC rising edge to LDAC falling edge
7
Guaranteed by design and characterization. Not production tested.
All input signals are specified with tr = tf = 5 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.
See Figure 2, Figure 3, and Figure 4.
10
Stand-alone mode only.
11
Measured with the load circuit of Figure 5.
12
Daisy-chain mode only.
8
9
Rev. PrA 15-Nov-04| Page 7 of 27
AD5744/AD5764
Preliminary Technical Data
t1
SCLK
1
2
24
t6
t2
t3
t5
t4
SYNC
t8
t7
SDIN
DB0
DB23
t9
t10
LDAC
t12
t11
VOUT
LDAC = 0
t12
t11
VOUT
t13
CLR
04641-PrA-002
t14
VOUT
Figure 2. Serial Interface Timing Diagram
t1
SCLK
24
t3
t6
48
t2
t5
t16
t4
SYNC
t8
t7
DB23
DB0
INPUT WORD FOR DAC N
DB23
DB0
t15
INPUT WORD FOR DAC N+1
DB23
SDO
UNDEFINED
DB0
INPUT WORD FOR DAC N
LDAC
Figure 3. Daisy Chain Timing Diagram
Rev. PrA 15-Nov-04| Page 8 of 27
t17
t10
04641-PrA-003
SDIN
AD5744/AD5764
Preliminary Technical Data
SCLK
24
48
SYNC
DB23
DB0
DB23
DB0
INPUT WORD SPECIFIES
REGISTER TO BE READ
NOP CONDITION
DB0
DB23
SDO
UNDEFINED
SELECTED REGISTER DATA
CLOCKED OUT
Figure 4. Readback Timing Diagram
200µA
VOH (MIN) OR
VOL (MAX)
CL
50pF
200µA
IOH
04641-PrA-004
TO OUTPUT
PIN
IOL
Figure 5. Load Circuit for SDO Timing Diagram
Rev. PrA 15-Nov-04| Page 9 of 27
04641-PrA-005
SDIN
AD5744/AD5764
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Transient currents of up to 100 mA will not cause SCR latch-up.
Table 4.
Parameter
AVDD to AGND, DGND
AVSS to AGND, DGND
DVCC to DGND
Digital Inputs to DGND
Digital Outputs to DGND
REF IN to AGND, PWRGND
REF OUT to AGND
VOUTA,B,C,D to AGND
AGND to DGND
Operating Temperature Range
Industrial
Storage Temperature Range
Junction Temperature (TJ max)
32-Lead TQFP Package,
θJA Thermal Impedance
Reflow Soldering
Peak Temperature
Time at Peak Temperature
Rating
−0.3 V to +17 V
+0.3 V to −17 V
−0.3 V to +7 V
−0.3 V to DVCC + 0.3 V
−0.3 V to DVCC + 0.3 V
−0.3 V to +17 V
AVSS to AVDD
AVSS to AVDD
−0.3 V to +0.3 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
−40°C to +85°C
−65°C to +150°C
150°C
TBD°C/W
220°C
10 sec to 40 sec
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. PrA 15-Nov-04| Page 10 of 27
AD5744/AD5764
Preliminary Technical Data
BIN/2sCOMP
AVDD
AVSS
TEMP
REFGND
REFOUT
REFCD
REFAB
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
32
SYNC
SCLK
SDIN
SDO
CLR
LDAC
D0
D1
25
1
24
AGNDA
VOUTA
VOUTB
AGNDB
AGNDC
VOUTC
VOUTD
AGNDD
PIN 1
INDICATOR
AD5744/64
TOP VIEW
(Not to Scale)
8
17
16
RSTOUT
RSTIN
DGND
DVCC
AVDD
PGND
AVSS
ISCC
9
Figure 6. 32-Lead TQFP Pin Configuration Diagram
Table 5. Pin Function Descriptions
Pin No.
1
Mnemonic
SYNC
2
SCLK13
3
4
SDIN13
SDO
5
6
CLR13
LDAC
7, 8
D0, D1
9
RSTOUT
10
RSTIN
11
12
DGND
DVCC
13, 31
14
15, 30
AVDD
PGND
AVSS
13
Function
Active Low Input. This is the frame synchronization signal for the serial interface.
While SYNC is low, data is transferred in on the falling edge of SCLK.
Serial Clock Input. Data is clocked into the shift register on the falling edge of SCLK.
This operates at clock speeds up to 30 MHz.
Serial Data Input. Data must be valid on the falling edge of SCLK.
Serial Data Output. Used to clock data from the serial register in daisy-chain or
readback mode.
Active Low Input. Asserting this pin sets the DAC registers to 0x0000.
Load DAC. Logic input. This is used to update the DAC registers and consequently
the analog output. When tied permanently low, the addressed DAC register is
updated on the 24th clock of the serial register write. If LDAC is held high during the
write cycle, the DAC input register is updated but the output is held off until the
falling edge of LDAC. In this mode, all analog outputs can be updated
simultaneously on the falling edge of LDAC.
D0 and D1 form a digital I/O port. The user can configure these pins as inputs or
outputs that are configurable and readable over the serial interface. When
configured as inputs, these pins have weak internal pull-ups to DVCC.
Reset Logic Output. This is the output from the on-chip voltage monitor used in the
reset circuit. If desired, it may be used to control other system components.
Reset Logic Input. This input allows external access to the internal reset logic.
Applying a Logic 0 to this input resets the DAC output to 0 V. In normal operation,
RSTIN should be tied to Logic 1.
Digital GND Pin.
Digital Supply Pin. Voltage ranges from 2.7 V to 5.5 V. When programmed as
outputs, D0 and D1 are referenced to DVCC.
Positive Analog Supply Pins. Voltage ranges from 11.4 V to 16.5 V.
Ground Reference Point for Analog Circuitry.
Negative Analog Supply Pins. Voltage ranges from –11.4 V to –16.5 V.
Internal pull-up device on this logic input. Therefore, it can be left floating and will default to a logic high condition.
Rev. PrA 15-Nov-04| Page 11 of 27
Preliminary Technical Data
Pin No.
16
Mnemonic
ISCC
17
18
AGNDD
VOUTD
19
VOUTC
20
21
22
AGNDC
AGNDB
VOUTB
23
VOUTA
24
25
AGNDA
REFAB
26
REFCD
27
REFOUT
28
29
REFGND
TEMP
32
BIN/2sCOMP
Function
This pin us used in association with an external resistor to AGND to program the
short-circuit current of the output amplifiers.
Ground Reference Pin for DAC D Output amplifier.
Analog Output Voltage of DAC D. Buffered output with a nominal full-scale output
range of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF
load.
Analog Output Voltage of DAC C. Buffered output with a nominal full-scale output
range of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF
load.
Ground Reference Pin for DAC C Output Amplifier.
Ground Reference pin for DAC B Output Amplifier.
Analog Output Voltage of DAC B. Buffered output with a nominal full-scale output
range of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF
load.
Analog Output Voltage of DAC A. Buffered output with a nominal full-scale output
range of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF
load.
Ground Reference Pin for DAC A Output Amplifier.
External Reference Voltage Input for Channels A and B. Reference input range is 1 V
to 5 V; programs the full-scale output voltage. REFIN = 5 V for specified performance.
External Reference Voltage Input for Channels C and D. Reference input range is 1 V
to 5 V; programs the full-scale output voltage. REFIN = 5 V for specified performance.
Reference Output. This is the buffered reference output from the internal voltage
reference. The internal reference is 5 V ± 1 mV, with a reference tempco of 10
ppm/°C.
Reference Ground Return for the Reference Generator and Buffers.
This pin provides an output voltage proportional to temperature. The output
voltage is 1.5 V typical at 25°C; variation with temperature is 5 mV/°C.
Determines the DAC Coding. When set to a logic high, input coding is offset binary.
When set to a logic low, input coding is twos complement. (See Table 6 and Table 7)
Rev. PrA 15-Nov-04| Page 12 of 27
Preliminary Technical Data
TERMINOLOGY
90% of the output signal and is given in V/µs.
Relative Accuracy
For the DAC, relative accuracy or Integral Nonlinearity (INL) is
a measure of the maximum deviation, in LSBs, from a straight
line passing through the endpoints of the DAC transfer
function. A typical INL vs. code plot can be seen in Figure ?.
Gain Error
Differential Nonlinearity
Total Unadjusted Error
Differential Nonlinearity (DNL) is the difference between the
measured change and the ideal 1 LSB change between any two
adjacent codes. A specified differential nonlinearity of ±1 LSB
maximum ensures monotonicity. This DAC is guaranteed
monotonic by design. A typical DNL vs. code plot can be seen
in Figures ?.
Total Unadjusted Error (TUE) is a measure of the output error
taking all the various errors into account. A typical TUE vs.
code plot can be seen in Figure ?.
This is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from the
ideal, expressed as a percentage of the full-scale range.
Zero-Code Error Drift
This is a measure of the change in zero-code error with a
change in temperature. It is expressed in µV/°C.
Monotonicity
A DAC is monotonic, if the output either increases or remains
constant for increasing digital input code. The AD5744/64 is
monotonic over its full operating temperature range
Gain Error Drift
This is a measure of the change in gain error with changes in
temperature. It is expressed in (ppm of full-scale range)/°C.
Bipolar Zero Error
Bipolar zero error is the deviation of the analog output from the
ideal half-scale output of 0 V when the DAC register is loaded
with 0x8000 (Offset Binary coding) or 0x0000 (2sComplement
coding)
Full-Scale Error
Full-scale error is a measure of the output error when full-scale
code is loaded to the DAC register. Ideally the output voltage
should be full scale value – 1 LSB. Full-scale error is expressed
in percentage of full-scale range. A plot of full-scale error vs.
temperature can be seen in Figure ?.
Negative Full-Scale Error / Zero Scale Error
Negative full-scale error is the error in the DAC output voltage
when 0x0000 (Offset Binary coding) or 0x8000 (2sComplement
coding) is loaded to the DAC register. Ideally the output voltage
should be negative full scale value – 1 LSB.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV secs
and is measured when the digital input code is changed by
1 LSB at the major carry transition (7FFF Hex to 8000 Hex). See
Figure ?.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into
the analog output of the DAC from the digital inputs of the
DAC but is measured when the DAC output is not updated. It is
specified in nV secs and measured with a full-scale code change
on the data bus, i.e., from all 0s to all 1s and vice versa.
Power Supply Sensitivity
Power supply sensitivity indicates how the output of the DAC is
affected by changes in the power supply voltage.
Output Voltage Settling Time
Output voltage settling time is the amount of time it takes for
the output to settle to a specified level for a full-scale input
change.
Slew Rate
The slew rate of a device is a limatation in the rate of change of
the output voltage. The output slewing speed of a voltageoutput D/A converter is usually limited by the slew rate of the
amplifier used at its output. Slew rate is measured from 10% to
DC Crosstalk
This is the dc change in the output level of one DAC in response
to a change in the output of another DAC. It is measured with a
full-scale output change on one DAC while monitoring another
DAC. It is expressed in µV.
DAC-to-DAC Crosstalk
This is the glitch impulse transferred to the output of one DAC
due to a digital code change and subsequent output change of
Rev. PrA 15-Nov-04| Page 13 of 27
Preliminary Technical Data
another DAC. This includes both digital and analog crosstalk. It
is measured by loading one of the DACs with a full-scale code
change (all 0s to all 1s and vice versa) with LDAC low and
monitoring the output of another DAC. The energy of the glitch
is expressed in nV-s.
Channel-to-Channel Isolation
This is the ratio of the amplitude of the signal at the output of
one DAC to a sine wave on the reference input of another DAC.
It is measured in dB.
Rev. PrA 15-Nov-04| Page 14 of 27
Preliminary Technical Data
TYPICAL PERFORMANCE
CHARACTERISTICS
Rev. PrA 15-Nov-04| Page 15 of 27
Preliminary Technical Data
GENERAL DESCRIPTION
SERIAL INTERFACE
The AD5744/64 is a quad 14/16-bit, serial input, bipolar voltage
output DAC. It operates from supply voltages of ±11.4 V to
±16.5 V and has a buffered output voltage of up to ± 10.5 V.
Data is written to the AD5744/64 in a 24-bit word format, via a
3-wire serial interface. The device also offers an SDO pin, which
is available for daisy chaining or readback.
Input Shift Register
The AD5744/64 incorporates a power-on reset circuit, which
ensures that the DAC registers power up loaded with 0x0000.
The AD5744/64 also features a digital I/O port that may be
programmed via the serial interface, an analog temperature
sensor, on-chip 10 ppm/°C voltage reference, on-chip reference
buffers and per channel digital gain and offset registers.
DAC ARCHITECTURE
The DAC architecture of the AD5744/64 consists of a 14/16-bit
current-mode segmented R-2R DAC. The simplified circuit
diagram for the DAC section is shown in Figure 13.
The four MSBs of the 14/16-bit data word are decoded to drive
15 switches, E1 to E15. Each of these switches connects one of
the 15 matched resistors to either AGND or IOUT. The
remaining 12 bits of the data word drive switches S0 to S11 of
the 12-bit R-2R ladder network.
R
Vref
2R
2R
2R
R
2R
R
2R
2R
2R
R/8
E15
E14
E1
S11
S10
S0
VOUT
AGND
4 MSBs DECODED INTO
15 EQUAL SEGMENTS
12 BIT R-2R LADDER
Figure 7. DAC Ladder Structure
REFERENCE BUFFERS
The AD5744/64 can operate with either an external or internal
reference. The reference inputs (REFAB and REFCD) have an
input range up to 5 V. This input voltage is then used to provide
a buffered positive and negative reference for the DAC cores.
The positive reference is given by
The AD5744/64 is controlled over a versatile 3-wire serial
interface that operates at clock rates of up to 30 MHz and is
compatible with SPI, QSPI, MICROWIRE and DSP standards.
The input shift register is 24 bits wide. Data is loaded into the
device MSB first as a 24-bit word under the control of a serial
clock input, SCLK. The input register consists of a read/write
bit, three register select bits, three DAC address bits and 14/16
data bits as shown in Table 8.The timing diagram for this
operation is shown in Figure 2.
Upon power-up the DAC registers are loaded with zero code
(0x0000). The corresponding output voltage depends on the
state of the BIN/2sCOMP pin. If the BIN/2sCOMP pin is tied to
DGND then the data coding is 2sComplement and the outputs
will power-up to 0V. If the BIN/2sCOMP pin is tied high then
the data coding is Offset binary and the outputs will power-up
to Negative Full-scale.
Standalone Operation
The serial interface works with both a continuous and noncontinuous serial clock. A continuous SCLK source can only be
used if SYNC is held low for the correct number of clock cycles.
In gated clock mode, a burst clock containing the exact number
of clock cycles must be used and SYNC must be taken high after
the final clock to latch the data. The first falling edge of SYNC
starts the write cycle. Exactly 24 falling clock edges must be
applied to SCLK before SYNC is brought back high again; if
SYNC is brought high before the 24th falling SCLK edge, the
write is aborted. If more than 24 falling SCLK edges are applied
before SYNC is brought high, the input data will be corrupted.
The input register addressed is updated on the rising edge of
SYNC. In order for another serial transfer to take place, SYNC
must be brought low again. After the end of the serial data
transfer, data is automatically transferred from the input shift
register to the input register of the addressed DAC.
When the data has been transferred into the input register of
the addressed DAC, all DAC registers and outputs can be
updated by taking LDAC low while SYNC is high.
+ VREF = 2* VREF
While the negative reference to the DAC cores is given by
-VREF = -2*VREF
These positive and negative reference voltages (along with the
gain register values) define the output ranges of the DACs.
Rev. PrA 15-Nov-04| Page 16 of 27
Preliminary Technical Data
68HC11*
containing the exact number of clock cycles must be used and
SYNC must be taken high after the final clock to latch the data.
AD5744/64*
MOSI
SDIN
SCK
SCLK
Readback Operation
PC7
SYNC
PC6
LDAC
Readback mode is invoked by setting the R/W bit = 1 in the
serial input register write. With R/W = 1, Bits A2–A0, in
association with Bits REG2 , REG1, and REG0, select the
register to be read. The remaining data bits in the write
sequence are don’t cares. During the next SPI write, the data
appearing on the SDO output will contain the data from the
previously addressed register. For a read of a single register, the
NOP command can be used in clocking out the data from the
selected register on SDO. The readback diagram in Figure 4
shows the readback sequence. For example, to read back the
fine gain register of Channel A on the AD5744/64, the following
sequence should be implemented. First, write 0xA0XXXX to
the AD5744/64 input register. This configures the AD5744/64
for read mode with the fine gain register of Channel A selected.
Note that all the data bits, DB15 to DB0, are don’t cares. Follow
this with a second write, a NOP condition, 0x00XXXX. During
this write, the data from the fine gain register is clocked out on
the SDO line, i.e., data clocked out will contain the data from
the fine gain register in Bits DB5 to DB0.
MISO
SDO
SDIN
AD5744/64*
SCLK
SYNC
LDAC
SDO
R
SDIN
AD5744/64*
SCLK
SYNC
SIMULTANEOUS UPDATING VIA LDAC
LDAC
After data has been transferred into the input register of the
DACs, there are two ways in which the DAC registers and DAC
outputs can be updated. Depending on the status of both SYNC
and LDAC.
SDO
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 8. Daisy chaining the AD5744/64
Individual DAC Updating
Daisy-Chain Operation
For systems that contain several devices, the SDO pin may be
used to daisy-chain several devices together. This daisy-chain
mode can be useful in system diagnostics and in reducing the
number of serial interface lines. The first falling edge of SYNC
starts the write cycle. The SCLK is continuously applied to the
input shift register when SYNC is low. If more than 24 clock
pulses are applied, the data ripples out of the shift register and
appears on the SDO line. This data is clocked out on the rising
edge of SCLK and is valid on the falling edge. By connecting the
SDO of the first device to the DIN input of the next device in
the chain, a multidevice interface is constructed. Each device in
the system requires 24 clock pulses. Therefore, the total number
of clock cycles must equal 24N, where N is the total number of
AD5744/64s in the chain. When the serial transfer to all devices
is complete, SYNC is taken high. This latches the input data in
each device in the daisy chain and prevents any further data
from being clocked into the input shift register. The serial clock
may be a continuous or a gated clock. A continuous SCLK
source can only be used if SYNC is held low for the correct
number of clock cycles. In gated clock mode, a burst clock
In this mode, LDAC is held low while data is being clocked into
the input shift register. The addressed DAC output is updated
on the rising edge of SYNC.
Simultaneous Updating of All DACs
In this mode, LDAC is held high while data is being clocked
into the input shift register. All DAC outputs are updated by
taking LDAC low any time after SYNC has been taken high.
The update now occurs on the falling edge of LDAC.
Rev. PrA 15-Nov-04| Page 17 of 27
Preliminary Technical Data
OUTPUT
I/V AMPLIFIER
Table 7. Ideal output voltage to input Code relationship for the
AD5744
16-BIT
DAC
VREFIN
VOUT
MSB
11
10
10
01
00
INPUT
REGISTER
SCLK
SYNC
SDIN
INTERFACE
LOGIC
SDO
Figure 9. Simplified Serial Interface showing input loading
circuitry for one DAC Channel
TRANSFER FUNCTION
Table 6 and Table 7 Show the ideal input code to output voltage
relationship for the AD5744/64 for both Offset binary and twos
complement data coding.
Table 6. Ideal output voltage to input code relationship for the
AD5764
Digital Input
Analog Output
1111
0000
0000
1111
0000
1111
0000
0000
1111
0000
LSB
1111
0001
0000
1111
0000
VOUT
+2 VREF x (32767/32768)
+2 VREF x (1/32768)
1111
0000
0000
1111
0000
1111
0000
0000
1111
0000
LSB
1111
0001
0000
1111
0000
1111
0000
0000
1111
0000
LSB
1111
0001
0000
1111
0000
Twos Complement Data Coding
MSB
LSB
01
1111
1111
1111
00
0000
0000
0001
00
0000
0000
0000
11
1111
1111
1111
10
0000
0000
0000
VOUT
+2 VREF x (8192/8192)
+2 VREF x (1/8192)
0V
-2 VREF x (1/8192)
-2 VREF x (8192/8192)
VOUT
+2 VREF x (8192/8192)
+2 VREF x (1/8192)
0V
-2 VREF x (1/8192)
-2 VREF x (8192/8192)
The output voltage expression for the AD5764 is given by:
⎡ D ⎤
VOUT = −2 × VREFIN + 4 × VREFIN ⎢
⎣ 65536 ⎥⎦
⎡ D ⎤
VOUT = −2 × VREFIN + 4 × VREFIN ⎢
⎣16384 ⎥⎦
0V
-2 VREF x (32767/32768)
where:
D is the decimal equivalent of the code loaded to the DAC.
VREFIN is the reference voltage applied at the REFIN pin.
VOUT
ASYNCHRONOUS CLEAR (CLR)
+2 VREF x (32767/32768)
CLR is an active low, level sensitive clear that allows the outputs
to be cleared to either 0 V (Offset binary coding) or negative
full scale (twos complement coding). It is necessary to maintain
CLR low for a minimum amount of time (refer to Figure 3) for
the operation to complete. When the CLR signal is returned
high, the output remains at the cleared value until a new value is
programmed. The CLR signal has priority over LDAC and
SYNC. A clear can also be initiated through software by writing
the command 0x04XXXX to the AD5744/64.
-2 VREF x (1/32768)
Twos Complement Data Coding
MSB
0111
0000
0000
1111
1000
1111
0000
0000
1111
0000
The output voltage expression for the AD5744 is given by:
Offset Binary Data Coding
MSB
1111
1000
1000
0111
0000
Analog Output
Offset Binary Data Coding
DAC
REGISTER
LDAC
Digital Input
+2 VREF x (1/32768)
0V
-2 VREF x (1/32768)
-2 VREF x (32767/32768)
Rev. PrA 15-Nov-04| Page 18 of 27
Preliminary Technical Data
Table 8. AD5744/64 Input Register Format
MSB
LSB
DB23
DB22
DB21
DB20
DB19
DB18
DB17
DB16
R/W
0
REG2
REG1
REG0
A2
A1
A0
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DATA
Table 9. Input Register Bit Functions
Indicates a read from or a write to the addressed register.
R/W
REG2, REG1, REG0
Used in association with the address bits to determine if a read or write operation is to the data register, offset
register, gain register, or function register.
REG2
REG1
REG0
Function
0
0
0
Function Register
0
1
0
Data Register
0
1
1
Coarse Gain Register
1
0
0
Fine Gain Register
1
0
1
Offset Register
These bits are used to decode the DAC channels
A2
A1
A0
Channel Address
0
0
0
DAC A
0
0
1
DAC B
0
1
0
DAC C
0
1
1
DAC D
1
0
0
ALL DACs
Data Bits
A2, A1, A0
D15 – D0
FUNCTION REGISTER
The Function Register is addressed by setting the three REG bits to 000. The values written to the address bits and the data bits determine
the function addressed. The Functions available through the function register are shown in Table 10 and
Table 11.
Table 10. Function Register Options
REG2
0
0
REG1
0
0
REG0
0
0
A2
0
0
A1
0
0
A0
0
1
0
0
0
0
0
0
1
1
0
0
0
1
DB15 .. DB6
DB5
Don’t Care
LocalGroundOffset Adjust
DB4
DB3
DB2
NOP, Data = Don’t Care
D1 Value D0
D1
Direction
Direction
CLR, Data = Don’t Care
LOAD, Data = Don’t Care
Rev. PrA 15-Nov-04| Page 19 of 27
DB1
DB0
D0
Value
SDO
Disable
DB0
Preliminary Technical Data
Table 11. Explanation of Function Register Options
NOP
Local-GroundOffset Adjust
D0 / D1
Direction
D0 / D1 Value
SDO Disable
CLR
LOAD
No operation instruction used in readback operations.
Set by the user to enable local-ground-offset adjust function.
Cleared by the user to disable local-ground-offset adjust function (default).
Set by the user to enable D0/D1 as outputs.
Cleared by the user to enable D0/D1 as inputs (default). Have weak internal pull-ups.
I/O port status bits. Logic values written to these locations determine the logic outputs on the D0 and D1 pins when
configured as outputs. These bits indicate the status of the D0 and D1 pins when the I/O port is active as an input. When
enabled as inputs, these bits are don’t cares during a write operation.
Set by the user to disable the SDO output.
Cleared by the user to enable the SDO output (default).
Addressing this function resets the DAC outputs to 0 V in twos complement mode and negative full scale in binary
mode.
Addressing this function updates the DAC registers and consequently the analog outputs.
DATA REGISTER
The Data register is addressed by setting the three REG bits to 010. The DAC address bits select with which DAC Channel the Data
transfer is to take place (Refer to Table 9). The data bits are in positions D15 to D0 for the AD5764 as shown in Table 12 and D13 to D0
for the AD5744 as shown in Table 13.
Table 12. Programming the AD5764 Data Register
REG2
0
REG1
1
REG0
0
A2
A1
A0
DAC Address
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
DB7
16 Bit DAC Data
DB13
DB12
DB11
DB10
DB9
DB8
14 Bit DAC Data
DB6
DB5
DB4
DB3
DB2
DB1
DB0
DB6
DB5
DB4
DB3
DB2
DB1
X
DB0
X
Table 13. Programming the AD5744 Data Register
REG2
0
REG1
1
REG0
0
A2
A1
A0
DAC Address
DB15
DB14
DB7
COARSE GAIN REGISTER
The Coarse Gain Register is addressed by setting the three REG bits to 011. The DAC address bits select with which DAC Channel the
Data transfer is to take place (Refer to Table 9). The Coarse Gain Register is a 2-bit register and allows the user to select the output range
of each DAC as shown in Table 15.
Table 14. Programming the Coarse Gain Register
REG2
0
REG1
1
REG0
1
A2 A1 A0
DAC Address
DB15 …. DB2
Don’t Care
DB1
CG1
DB0
CG0
Table 15. Output Range Selection
Output Range
CG1
CG0
± 10 V
± 10.25 V
± 10.5 V
0
0
1
0
1
0
Rev. PrA 15-Nov-04| Page 20 of 27
Preliminary Technical Data
FINE GAIN REGISTER
The Fine Gain Register is addressed by setting the three REG bits to 100. The DAC address bits select with which DAC Channel the Data
transfer is to take place (Refer to Table 9). The Fine Gain Register is a 6-bit register and allows the user to adjust the gain of each DAC
channel by -32 LSBs to +31 LSBs in 1 LSB steps as shown in
Table 16 and
Table 17.
Table 16. Programming AD5764 Fine Gain Register
REG2
1
REG1
0
REG0
0
A2
A1
DAC Address
A0
DB15 …. DB6
Don’t Care
DB5
FG5
DB4
FG4
DB3
FG3
DB2
FG2
DB1
FG1
DB0
FG0
Table 17. Fine Gain Register Options
Gain Adjustment
+31 LSBs
+30 LSBs
No Adjustment
-31 LSBs
-32 LSBs
FG5
0
0
0
1
1
FG4
1
1
0
0
0
FG3
1
1
0
0
0
FG2
1
1
0
0
0
FG1
1
1
0
0
0
FG0
1
0
0
1
0
OFFSET REGISTER
The Offset Register is addressed by setting the three REG bits to 101. The DAC address bits select with which DAC Channel the Data
transfer is to take place (Refer to Table 9). The Offset Register is an 8-bit register and allows the user to adjust the offset of each channel
by – 15.875 LSBs to + 16 LSBs in steps of 1/8 LSB as shown in Table 18 and Table 19.
Table 18. Programming the Offset Register
REG2
1
REG1
0
REG0
1
A2 A1 A0
DAC Address
DB15 …. DB8
Don’t Care
DB7
OF7
DB6
OF6
DB5
OF5
DB4
OF4
Table 19. Offset Register options
Offset Adjustment
+15.875 LSBs
+16.5 LSBs
No Adjustment
-15.875 LSBs
-16 LSBs
OF7
0
0
0
1
1
OF6
1
1
0
0
0
OF5
1
1
0
0
0
OF4
1
1
0
0
0
OF3
1
1
0
0
0
OF2
1
1
0
0
0
OF1
1
1
0
0
0
Rev. PrA 15-Nov-04| Page 21 of 27
OF0
1
0
0
1
0
DB3
OF3
DB2
OF2
DB1
OF1
DB0
OF0
Preliminary Technical Data
AD5744/64 FEATURES
ANALOG OUTPUT CONTROL
The resistor value is calculated as follows;
In many industrial process control applications, it is vital that
the output voltage be controlled during power up and during
brownout conditions. When the supply voltages are changing,
the VOUT pin is clamped to 0 V via a low impedance path. To
prevent the output amp being shorted to 0 V during this time,
transmission gate G1 is also opened. These conditions are
maintained until the power supplies stabilize and a valid word is
written to the DAC register. At this time, G2 opens and G1
closes. Both transmission gates are also externally controllable
via the Reset In (RSTIN) control input. For instance, if RSTIN is
driven from a battery supervisor chip, the RSTIN input is
driven low to open G1 and close G2 on power-off or during a
brownout. Conversely, the on-chip voltage detector output
(RSTOUT) is also available to the user to control other parts of
the system. The basic transmission gate functionality is shown
in Figure 10.
RSTOUT
RSTIN
VOLTAGE
MONITOR
AND
CONTROL
R=
60
Isc
If the ISCC pin is left unconnected the short circuit current
limit defaults to 5 mA. It should be noted that limiting the short
circuit current to a small value can affect the slew rate of the
output when driving into a capacitive load, therefore the value
of short-circuit current programmed should take into account
the size of the capacitive load being driven.
DIGITAL I/O PORT
The AD5744/64 contains a 2-bit digital I/O port (D1 and D0);
these bits can be configured as inputs or outputs independently,
and can be driven or have their values read back via the serial
interface. The I/O port signals are referenced to DVCC and
DGND. When configured as outputs, they can be used as control signals to multiplexers or can be used to control calibration
circuitry elsewhere in the system. When configured as inputs,
the logic signals from limit switches, for example can be applied
to D0 and D1 and can be read back via the digital interface.
TEMPERATURE SENSOR
The on-chip temperature sensor provides a voltage output that
is linearly proportional to the Centigrade temperature scale.
The typical accuracy of the temperature sensor is ±1°C at +25°C
and ±5°C over the −40°C to +105°C range. Its nominal output
voltage is 1.5V at +25°C, varying at 5 mV/°C, giving a typical
output range of 1.175V to 1.9 V over the full temperature range.
Its low output impedance, low self heating, and linear output
simplify interfacing to temperature control circuitry and A/D
converters.
VOUTA
G2
AGNDA
04641-PrA-008
G1
Figure 10. Analog Output Control Circuitry
DIGITAL OFFSET AND GAIN CONTROL
The AD5744/64 incorporates a digital offset adjust function
with a ±16 LSB adjust range and 0.125 LSB resolution. The gain
register allows the user to adjust the AD5744/64’s full-scale
output range. The full-scale output can be programmed to
achieve full-scale ranges of ±10 V, ±10.25 V, and ±10.5 V. A fine
gain trim is also available, allowing a trim range of ±16 LSB in 1
LSB steps.
PROGRAMMABLE SHORT-CIRCUIT PROTECTION
The short-circuit current of the output amplifiers can be programmed by inserting an external resistor between the ISCC
pin and AGND. The programmable range for the current is
500 µA to 10 mA, corresponding to a resistor range of 120 kΩ
to 6 kΩ.
LOCAL GROUND OFFSET ADJUST
The AD5744/64 incorporates a Local Ground Offset Adjust
feature which when enabled in the Function Register adjusts the
DAC outputs for voltage differences between The individual
DAC ground pins and the REFGND pin ensuring that the DAC
output voltages are always with respect to the local DAC ground
pin. For instance if pin AGNDA is at +5mV with respect to the
REFGND pin and VOUTA is measured with respect to
AGNDA then a +5mV error will result, enabling the Local
Ground Offset Adjust feature will offset VOUTA by +5mV
eliminating the error.
Rev. PrA 15-Nov-04| Page 22 of 27
Preliminary Technical Data
APPLICATIONS INFORMATION
in the voltage reference is reflected in the outputs of the device.
TYPICAL OPERATING CIRCUIT
There are four possible sources of error to consider when
choosing a voltage reference for high accuracy applications:
initial accuracy, temperature coefficient of the output voltage,
long term drift and output voltage noise.
Figure 11 shows the typical operating circuit for the
AD5744/64. The only external components needed for this
precision 14/16-bit DAC are decoupling capacitors on the
supply pins, R-C connection from REFOUT to REFAB and
REFCD and a short circuit current setting resistor. Because the
device incorporates a voltage reference, and reference buffers, it
eliminates the need for an external bipolar reference and
associated buffers. This leads to an overall saving in both cost
and board space.
In the circuit below, VDD and VSS are both connected to ±15 V,
but VDD and VSS can operate with supplies from ±11.4 V to
±16.5 V. In Figure 11, AGNDA is connected to REFGND, but
the option of Force/Sense is included on this device, if required
by the user.
+15V -15V
10 µF
10 µF
10 µF
3kΩ
TEMP
BIN/2SCOMP
Long term drift is a measure of how much the reference output
voltage drifts over time. A reference with a tight lon-term drift
specification ensures that the overall solution remains relatively
stable over its entire lifetime.
The temperature coefficient of a reference’s output voltage
affects INL, DNL and TUE. A reference with a tight
tempaerature coefficient specifiaction should be chosen to
reduce the dependence of the DAC output voltage on ambient
conditions.
100 nF
100 nF
Initial accuracy error on the output voltage of an external
reference could lead to a full-scale error in the DAC. Therefore,
to minimize these errors, a reference with low initial accuracy
error specification is preferred. Also, choosing a reference with
an output trim adjustment, such as the ADR425, allows a
system designer to trim system errors out by setting the
reference voltage to a voltage other than the nominal. The trim
adjustment can also be used at temperature to trim out any
error.
SYNC
2
SCLK
SDIN
3
SDIN
SDO
4
SDO
REFAB
REFCD
TEMP
AVSS
AVDD
REFOUT
1
SCLK
REFGND
SYNC
BIN/2SCOMP
32 31 30 29 28 27 26 25
+5V
AGNDA 24
AD5744/64
VOUTA 23
VOUTA
VOUTB 22
VOUTB
AGNDB 21
AGNDC 20
LDAC
VOUTC 19
VOUTC
D0
7
D0
VOUTD 18
VOUTD
D1
8
D1
AGNDD 17
ISCC
AVSS
PGND
AVDD
DVCC
DGND
10 11 12 13 14 15 16
100 nF
6kΩ
Table 20. Partial List of Precision References Recommended for
use with the AD5744/64
10 µF
RSTIN
9
100 nF
RSTOUT
RSTIN
CLR
6
RSTOUT
5
LDAC
10 µF
In high accuracy applications, which have a relatively low noise
budget, reference output voltage noise needs to be considered.
Choosing a reference waith as low an output noise voltage as
practical for the system resolution required is important.
Precision voltage references such as the ADR435 (XFET design)
produce low output noise in the 0.1 Hx to 10 Hz region.
However, as the circuit bandwidth increases, filtering the output
of the reference may be required to minimise the output noise.
100 nF
10 µF
Part No.
ADR435
ADR425
ADR02
ADR395
AD586
+5V +15V -15V
Figure 11. Typical operating circuit
Precision Voltage Reference Selection
To achieve the optimum performance from the AD5744/64 over
it’s full operating temperature range an external voltage
reference must be used. Thought should be given to the
selection of a precision voltage reference. The AD5744/64 has
two reference inputs, REFAB and REFCD. The voltages applied
to the reference inputs are used tomprovide a buffered positiver
and negative reference for the DAC cores. Therefore, any error
Rev. PrA 15-Nov-04| Page 23 of 27
Initial
Accuracy
(mV max)
±6
±6
±5
±6
± 2.5
Long-Term
Drift
(ppm typ)
30
50
50
50
15
Temp Drift
(ppm/
°C max)
3
3
3
25
10
0.1 Hz to
10 Hz Noise
(µV p-p typ)
3.4
3.4
15
5
4
Preliminary Technical Data
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful
consideration of the power supply and ground return layout
helps to ensure the rated performance. The printed circuit
board on which the AD5744/64 is mounted should be designed
so that the analog and digital sections are separated and
confined to certain areas of the board. If the AD5744/64 is in a
system where
multiple devices require an AGND-to-DGND connection, the
connection should be made at one point only. The star ground
point should be established as close as possible to the device.
The AD5744/64 should have ample supply bypassing of 10 µF
in
parallel with 0.1 µF on each supply located as close to the
package as possible, ideally right up against the device. The 10
µF capacitors are the tantalum bead type. The 0.1 µF capacitor
should have low effective series resistance (ESR) and low
effective series inductance (ESI) such as the common ceramic
types, which provide a low impedance path to ground at high
frequencies to handle transient currents due to internal logic
switching.
DAC is not required, the LDAC pin may be tied permanently
low. The DAC can then be updated on the rising edge of SYNC.
DVCC
µCONTROLLER
CONTROL OUT
TO LDAC
SYNC OUT
TO SYNC
SERIAL CLOCK OUT
TO SCLK
TO SDIN
SERIAL DATA OUT
OPTO-COUPLER
Figure 12. Isolated Interface
The power supply lines of the AD5744/64 should use as large a
trace as possible to provide low impedance paths and reduce
the effects of glitches on the power supply line. Fast switching
signals such as clocks should be shielded with digital ground to
avoid radiating noise to other parts of the board, and should
never be run near the reference inputs. A ground line routed
between the SDIN and SCLK lines helps reduce crosstalk
between them (not required on a multilayer board, which has a
separate ground plane, but separating the lines helps). It is
essential to minimize noise on the reference inputs, because it
couples through to the DAC output.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feed through the board. A
microstrip technique is by far the best, but not always possible
with a double-sided board. In this technique, the component
side of the board is dedicated to ground plane, while signal
traces are placed on the solder side.
ISOLATED INTERFACE
In many process control applications, it is necessary to provide
an isolation barrier between the controller and the unit being
controlled. Opto-isolators can provide voltage isolation in
excess of 3 kV. The serial loading structure of the AD5744/64
makes it ideal for opto-isolated interfaces, because the number
of interface lines is kept to a minimum. Figure 12 shows a 4channel isolated interface to the AD5744/64. To reduce the
number of opto-isolators, if the simultaneous updating of the
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5744/64 is via a serial bus
that uses standard protocol compatible with microcontrollers
and DSP processors. The communications channel is a 3-wire
(minimum) interface consisting of a clock signal, a data signal,
and a synchronization signal. The AD5744/64 requires a 24-bit
data word with data valid on the falling edge of SCLK.
For all the interfaces, the DAC output update may be done
automatically when all the data is clocked in, or it may be done
under the control of LDAC. The contents of the DAC register
may be read using the readback function.
AD5744/64 to MC68HC11 Interface
Figure 13 shows an example of a serial interface between the
AD5744/64 and the MC68HC11 microcontroller. The serial
peripheral interface (SPI) on the MC68HC11 is configured for
master mode (MSTR = 1), clock polarity bit (CPOL = 0), and
the clock phase bit (CPHA = 1). The SPI is configured by
writing to the SPI control register (SPCR)-----see the 68HC11
User Manual. SCK of the 68HC11 drives the SCLK of the
AD5744/64, the MOSI output drives the serial data line (DIN)
of
the AD5744/64, and the MISO input is driven from SDO. The
SYNC is driven from one of the port lines, in this case PC7.
When data is being transmitted to the AD5744/64, the SYNC
line
Rev. PrA 15-Nov-04| Page 24 of 27
Preliminary Technical Data
(PC7) is taken low and data is transmitted MSB first. Data
appearing on the MOSI output is valid on the falling edge of
SCK. Eight falling clock edges occur in the transmit cycle, so, in
order to load the required 24-bit word, PC7 is not brought high
until the third 8-bit word has been transferred to the DAC’s
input shift register.
MC68HC11*
AD5744/64*
MISO
SDO
MOSI
SDIN
SCLK
SCLK
PC7
SYNC
through the SPORT control register and should be configured
as follows: internal clock operation, active low framing, and
24-bit word length.
Transmission is initiated by writing a word to the Tx register
after the SPORT has been enabled. As the data is clocked out of
the DSP on the rising edge of SCLK, no glue logic is required to
interface the DSP to the DAC. In the interface shown, the DAC
output is updated using the LDAC pin via the DSP.
Alternatively, the LDAC input could be tied permanently low,
and then the update takes place automatically when TFS is
taken high.
ADSP2101/
ADSP2103*
AD5744/64*
DR
SDO
*ADDITIONAL PINS OMITTED FOR CLARITY
DT
SDIN
Figure 13. AD5744/64 to MC68HC11 Interface
SCLK
SCLK
TFS
LDAC is controlled by the PC6 port output. The DAC can be
updated after each 3-byte transfer by bringing LDAC low. This
example does not show other serial lines for the DAC. If CLR
were used, it could be controlled by port output PC5, for
example.
SYNC
RFS
FO
LDAC
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 14. AD5744/64 to ADSP2101/ADSP2103 Interface
AD5744/64 to 8051 Interface
The AD5744/64 requires a clock synchronized to the serial
data. For this reason, the 8051 must be operated in Mode 0. In
this mode, serial data enters and exits through RxD, and a shift
clock is output on TxD.
P3.3 and P3.4 are bit programmable pins on the serial port and
are used to drive SYNC and LDAC, respectively.
The 8051 provides the LSB of its SBUF register as the first bit in
the data stream. The user must ensure that the data in the SBUF
register is arranged correctly, because the DAC expects MSB
first. When data is to be transmitted to the DAC, P3.3 is taken
low. Data on RxD is clocked out of the microcontroller on the
rising edge of TxD and is valid on the falling edge. As a result,
no glue logic is required between this DAC and the
microcontroller interface.
The 8051 transmits data in 8-bit bytes with only eight falling
clock edges occurring in the transmit cycle. Because the DAC
expects a 24-bit word, SYNC (P3.3) must be left low after the
first eight bits are transferred. After the third byte has been
transferred, the P3.3 line is taken high. The DAC may be
updated using LDAC via P3.4 of the 8051.
AD5744/64 to PIC16C6x/7x Interface
The PIC16C6x/7x synchronous serial port (SSP) is configured
as an SPI master with the clock polarity bit set to 0. This is done
by writing to the synchronous serial port control register
(SSPCON). See the PIC16/17 Microcontroller User Manual. In
this example, I/O port RA1 is being used to pulse SYNC and
enable the serial port of the AD5744/64. This microcontroller
transfers only eight bits of data during each serial transfer
operation; therefore, three consecutive write operations are
needed. Figure 15 shows the connection diagram.
PIC16C6x/7x*
AD5744/64*
SDI/RC4
SDO
SDO/RC5
SDIN
SCLK/RC3
SCLK
RA1
SYNC
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 15. AD5744/64 to PIC16C6x/7x Interface
AD5744/64 to ADSP2101/ADSP2103 Interface
An interface between the AD5744/64 and the ADSP2101/
ADSP2103 is shown in Figure 14. The ADSP2101/ADSP2103
should be set up to operate in the SPORT transmit alternate
framing mode. The ADSP2101/ADSP2103 are programmed
Rev. PrA 15-Nov-04| Page 25 of 27
Preliminary Technical Data
EVALUATION BOARD
The AD5744/64 comes with a full evaluation board to aid
designers in evaluating the high performance of the part with a
minimum of effort. All that is required with the evaluation
board is a power supply, and a PC. The AD5744/64 evaluation
kit includes a populated, tested AD5744/64 printed circuit
board. The evaluation board interfaces to the USB interface of
the PC. Software is available with the evaluation board, which
allows the user to easily program the AD5744/64. The software
runs on any PC that has Microsoft Windows® 98/2000/NT/XP
installed.
An application note is available that gives full details on
operating the evaluation board.
Rev. PrA 15-Nov-04| Page 26 of 27
Preliminary Technical Data
OUTLINE DIMENSIONS
1.20
MAX
9.00 SQ
0.75
0.60
0.45
24
17
16
25
TOP VIEW
7.00
SQ
(PINS DOWN)
32
9
1
0.15
0.05
8
0.80
BSC
0.45
0.37
0.30
1.05
1.00
0.95
7°
0°
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-026ABA
Figure 16. 32-Lead Thin Quad Flatpack [TQFP]
(SU-32)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD5764CSU
AD5764BSU
AD5764ASU
AD5744CSU
AD5744BSU
AD5744ASU
Function
Quad 16-Bit DAC
Quad 16-Bit DAC
Quad 16-Bit DAC
Quad 14-Bit DAC
Quad 14-Bit DAC
Quad 14-Bit DAC
INL
± 1 LSB Max
± 2 LSB Max
± 4 LSB Max
± 1 LSB Max
± 2 LSB Max
± 4 LSB Max
Package Description
32-Lead TQFP
32-Lead TQFP
32-Lead TQFP
32-Lead TQFP
32-Lead TQFP
32-Lead TQFP
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR05303-0-11/04(PrA)
Rev. PrA 15-Nov-04| Page 27 of 27
Package Option
SU-32
SU-32
SU-32
SU-32
SU-32
SU-32