AD ADC08D500

ADC08D500
High Performance, Low Power, Dual 8-Bit, 500 MSPS A/D
Converter
General Description
Features
The ADC08D500 is a dual, low power, high performance
CMOS analog-to-digital converter that digitizes signals to 8
bits resolution at sampling rates up to 800 MSPS. Consuming a typical 1.4 Watts at 500 MSPS from a single 1.9 Volt
supply, this device is guaranteed to have no missing codes
over the full operating temperature range. The unique folding
and interpolating architecture, the fully differential comparator design, the innovative design of the internal sample-andhold amplifier and the self-calibration scheme enable a very
flat response of all dynamic parameters beyond Nyquist,
producing a high 7.5 ENOB with a 250 MHz input signal and
a 500 MHz sample rate while providing a 10-18 B.E.R. Output
formatting is offset binary and the LVDS digital outputs are
compliant with IEEE 1596.3-1996, with the exception of an
adjustable common mode voltage between 0.8V and 1.2V.
Each converter has a 1:2 demultiplexer that feeds two LVDS
buses and reduces the output data rate on each bus to half
the sampling rate. The two converters can be interleaved
and used as a single 1 GSPS ADC.
The converter typically consumes less than 3.5 mW in the
Power Down Mode and is available in a 128-lead, thermally
enhanced exposed pad LQFP and operates over the Industrial (-40˚C ≤ TA ≤ +85˚C) temperature range.
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Internal Sample-and-Hold
Single +1.9V ± 0.1V Operation
Choice of SDR or DDR output clocking
Interleave Mode for 2x Sampling Rate
Multiple ADC Synchronization Capability
Guaranteed No Missing Codes
Serial Interface for Extended Control
Fine Adjustment of Input Full-Scale Range and Offset
Duty Cycle Corrected Sample Clock
Key Specifications
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Resolution
Max Conversion Rate
Bit Error Rate
ENOB @ 250 MHz Input
DNL
Power Consumption
— Operating
— Power Down Mode
8 Bits
500 MSPS (min)
10-18 (typ)
7.5 Bits (typ)
± 0.15 LSB (typ)
1.4 W (typ)
3.5 mW (typ)
Applications
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Direct RF Down Conversion
Digital Oscilloscopes
Satellite Set-top boxes
Communications Systems
Test Instrumentation
Block Diagram
20121453
© 2005 National Semiconductor Corporation
DS201214
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High Performance, Low Power, Dual 8-Bit, 500 MSPS A/D Converter
May 2005
ADC08D500
Ordering Information
Industrial Temperature Range (-40˚C <
TA < +85˚C)
NS Package
ADC08D500CIYB
128-Pin Exposed Pad LQFP
ADC08D500EVAL
Evaluation Board
Pin Configuration
20121401
* Exposed pad on back of package must be soldered to ground plane to ensure rated performance.
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2
ADC08D500
Pin Descriptions and Equivalent Circuits
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
OutV / SCLK
Output Voltage Amplitude and Serial Interface Clock. Tie this
pin high for normal differential DCLK and data amplitude.
Ground this pin for a reduced differential output amplitude and
reduced power consumption. See Section 1.1.6. When the
extended control mode is enabled, this pin functions as the
SCLK input which clocks in the serial data.See Section 1.2 for
details on the extended control mode. See Section 1.3 for
description of the serial interface.
4
OutEdge / DDR
/ SDATA
DCLK Edge Select, Double Data Rate Enable and Serial Data
Input. This input sets the output edge of DCLK+ at which the
output data transitions. (See Section 1.1.5.2). When this pin is
floating or connected to 1/2 the supply voltage, DDR clocking
is enabled. When the extended control mode is enabled, this
pin functions as the SDATA input. See Section 1.2 for details
on the extended control mode. See Section 1.3 for description
of the serial interface.
15
DCLK_RST
DCLK Reset. A positive pulse on this pin is used to reset and
synchronize the DCLK outs of multiple converters. See
Section 1.5 for detailed description.
26
29
PD
PDQ
Power Down Pins. A logic high on the PD pin puts the entire
device into the Power Down Mode. A logic high on the PDQ
pin puts only the "Q" ADC into the Power Down mode.
CAL
Calibration Cycle Initiate. A minimum 80 input clock cycles
logic low followed by a minimum of 80 input clock cycles high
on this pin initiates the self calibration sequence. See Section
2.4.2 for an overview of self-calibration and Section 2.4.2.2 for
a description of on-command calibration.
FSR/ECE
Full Scale Range Select and Extended Control Enable. In
non-extended control mode, a logic low on this pin sets the
full-scale differential input range to 650 mVP-P. A logic high on
this pin sets the full-scale differential input range to 870
mVP-P. See Section 1.1.4. To enable the extended control
mode, whereby the serial interface and control registers are
employed, allow this pin to float or connect it to a voltage
equal to VA/2. See Section 1.2 for information on the
extended control mode.
CalDly / DES /
SCS
Calibration Delay, Dual Edge Sampling and Serial Interface
Chip Select. With a logic high or low on pin 14, this pin
functions as Calibration Delay and sets the number of clock
cycles after power up before calibration begins (See Section
1.1.1). With pin 14 floating, this pin acts as the enable pin for
the serial interface input and the CalDly value becomes 0b
(short delay with no provision for a long power-up calibration
delay). When this pin is floating or connected to a voltage
equal to VA/2, DES (Dual Edge Sampling) mode is selected
where the "I" input is sampled at twice the clock rate and the
"Q" input is ignored. See Section 1.1.5.1.
3
30
14
127
3
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ADC08D500
Pin Descriptions and Equivalent Circuits
(Continued)
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
18
19
CLK+
CLK-
LVDS Clock input pins for the ADC. The differential clock
signal must be a.c. coupled to these pins. The input signal is
sampled on the falling edge of CLK+. See Section 1.1.2 for a
description of acquiring the input and Section 2.3 for an
overview of the clock inputs.
11
10
.
22
23
VINI+
VINI−
.
VINQ+
VINQ−
Analog signal inputs to the ADC. The differential full-scale
input range is 650 mVP-P when the FSR pin is low, or 870
mVP-P when the FSR pin is high.
7
VCMO
Common Mode Voltage. The voltage output at this pin is
required to be the common mode input voltage at VIN+ and
VIN− when d.c. coupling is used. This pin should be grounded
when a.c. coupling is used at the analog inputs. This pin is
capable of sourcing or sinking 100µA. See Section 2.2.
31
VBG
126
CalRun
Calibration Running indication. This pin is at a logic high when
calibration is running.
32
REXT
External bias resistor connection. Nominal value is 3.3k-Ohms
( ± 0.1%) to ground. See Section 1.1.1.
34
35
Tdiode_P
Tdiode_N
Temperature Diode Positive (Anode) and Negative (Cathode)
for die temperature measurements. See Section 2.6.2.
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Bandgap output voltage capable of 100 µA source/sink.
4
ADC08D500
Pin Descriptions and Equivalent Circuits
(Continued)
Pin Functions
Pin No.
83 / 78
84 / 77
85 / 76
86 / 75
89 / 72
90 / 71
91 / 70
92 / 69
93 / 68
94 / 67
95 / 66
96 / 65
100 / 61
101 / 60
102 / 59
103 / 58
104
105
106
107
111
112
113
114
115
116
117
118
122
123
124
125
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56
55
54
50
49
48
47
46
45
44
43
39
38
37
36
Symbol
Equivalent Circuit
Description
DI7−
DI7+
DI6−
DI6+
DI5−
DI5+
DI4−
DI4+
DI3−
DI3+
DI2−
DI2+
DI1−
DI1+
DI0−
DI0+
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
DQ7−
DQ7+
DQ6−
DQ6+
DQ5−
DQ5+
DQ4−
DQ4+
DQ3−
DQ3+
DQ2−
DQ2+
DQ1−
DQ1+
DQ0−
DQ0+
I and Q channel LVDS Data Outputs that are not delayed in
the output demultiplexer. Compared with the DId and DQd
outputs, these outputs represent the later time samples.
These outputs should always be terminated with a 100Ω
differential resistor.
DId7−
DId7+
DId6−
DId6+
DId5−
DId5+
DId4−
DId4+
DId3−
DId3+
DId2−
DId2+
DId1−
DId1+
DId0−
DId0+
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
DQd7−
DQd7+
DQd6−
DQd6+
DQd5−
DQd5+
DQd4−
DQd4+
DQd3−
DQd3+
DQd2−
DQd2+
DQd1−
DQd1+
DQd0−
DQd0+
I and Q channel LVDS Data Outputs that are delayed by one
CLK cycle in the output demultiplexer. Compared with the
DI/DQ outputs, these outputs represent the earlier time
sample. These outputs should always be terminated with a
100Ω differential resistor.
OR+
OR-
Out Of Range output. A differential high at these pins
indicates that the differential input is out of range (outside the
range ± 325 mV or ± 435 mV as defined by the FSR pin).
82
81
DCLK+
DCLK-
Differential Clock outputs used to latch the output data.
Delayed and non-delayed data outputs are supplied
synchronous to this signal. This signal is at 1/2 the input clock
rate in SDR mode and at 1/4 the input clock rate in the DDR
mode.
2, 5, 8,
13, 16,
17, 20,
25, 28,
33, 128
VA
79
80
Analog power supply pins. Bypass these pins to ground.
5
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ADC08D500
Pin Descriptions and Equivalent Circuits
(Continued)
Pin Functions
Pin No.
Symbol
40, 51
,62, 73,
88, 99,
110, 121
VDR
Output Driver power supply pins. Bypass these pins to DR
GND.
1, 6, 9,
12, 21,
24, 27,
41
GND
Ground return for VA.
42, 53,
64, 74,
87, 97,
108, 119
DR GND
52, 63,
98, 109,
120
NC
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Equivalent Circuit
Description
Ground return for VDR.
No Connection. Make no connection to these pins.
6
Operating Ratings (Notes 1, 2)
(Notes 1,
2)
Ambient Temperature Range
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VA)
−40˚C ≤ TA ≤ +85˚C
+1.8V to +2.0V
Driver Supply Voltage (VDR)
+1.8V to VA
Supply Voltage (VA, VDR)
2.2V
Analog Input Common Mode
Voltage
VCMO ± 50mV
Voltage on Any Input Pin
−0.15V to (VA
+0.15V)
VIN+, VIN- Voltage Range
(Maintaining Common Mode)
200mV to VA
0V to 100 mV
Ground Difference
(|GND - DR GND|)
Ground Difference
|GND - DR GND|
Package Input Current (Note 3)
± 25 mA
± 50 mA
Power Dissipation at TA = 85˚C
2.0 W
ESD Susceptibility (Note 4)
Human Body Model
Machine Model
2500V
250V
Input Current at Any Pin (Note 3)
Soldering Temperature, Infrared,
10 seconds (Note 5)
Storage Temperature
0V
CLK Pins Voltage Range
0V to VA
Differential CLK Amplitude
0.4VP-P to 2.0VP-P
Package Thermal Resistance
Package
θJA
θJC (Top of
θJ-PAD
Package)
(Thermal
10˚C / W
2.8˚C / W
Pad)
235˚C
128-Lead
Exposed Pad
LQFP
−65˚C to +150˚C
25˚C / W
Converter Electrical Characteristics
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
STATIC CONVERTER CHARACTERISTICS
INL
Integral Non-Linearity
DC Coupled, 1MHz Sine Wave
Overanged
± 0.3
± 0.9
LSB (max)
DNL
Differential Non-Linearity
DC Coupled, 1MHz Sine Wave
Overanged
± 0.15
± 0.6
LSB (max)
8
Bits
−1.5
0.5
LSB (min)
LSB (max)
± 25
± 25
± 15
mV (max)
Resolution with No Missing Codes
VOFF
Offset Error
VOFF_ADJ Input Offset Adjustment Range
PFSE
-0.45
Extended Control Mode
Positive Full-Scale Error (Note 9)
NFSE
Negative Full-Scale Error (Note 9)
FS_ADJ
Full-Scale Adjustment Range
± 45
−0.6
−1.31
Extended Control Mode
± 20
mV
mV (max)
%FS
NORMAL MODE (non DES) DYNAMIC CONVERTER CHARACTERISTICS
FPBW
B.E.R.
Full Power Bandwidth
Bit Error Rate
Gain Flatness
ENOB
SINAD
Normal (non DES) Mode
Effective Number of Bits
Signal-to-Noise Plus Distortion
Ratio
1.7
10
GHz
-18
Error/Sample
± 0.5
dBFS
fIN = 50 MHz, VIN = FSR − 0.5 dB
7.5
Bits
fIN = 100 MHz, VIN = FSR − 0.5 dB
7.5
7.1
Bits (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
7.5
7.1
Bits (min)
fIN = 50 MHz, VIN = FSR − 0.5 dB
47
fIN = 100 MHz, VIN = FSR − 0.5 dB
47
44.5
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
47
44.5
dB (min)
d.c. to 500 MHz
7
dB
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ADC08D500
Absolute Maximum Ratings
ADC08D500
Converter Electrical Characteristics
(Continued)
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
NORMAL MODE (non DES) DYNAMIC CONVERTER CHARACTERISTICS
SNR
THD
2nd Harm
3rd Harm
SFDR
IMD
Signal-to-Noise Ratio
Total Harmonic Distortion
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free dynamic Range
Intermodulation Distortion
Out of Range Output Code
(In addition to OR Output high)
fIN = 50 MHz, VIN = FSR − 0.5 dB
48
fIN = 100 MHz, VIN = FSR − 0.5 dB
48
45.3
dB (min)
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
47.5
45.3
dB (min)
fIN = 50 MHz, VIN = FSR − 0.5 dB
-55
fIN = 100 MHz, VIN = FSR − 0.5 dB
-55
−47.5
dB (max)
fIN = 248 MHz, VIN = FSR − 0.5 dB
-55
−47.5
dB (max)
fIN = 50 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 100 MHz, VIN = FSR − 0.5 dB
−60
dB
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 50 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 100 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 50 MHz, VIN = FSR − 0.5 dB
55
fIN = 100 MHz, VIN = FSR − 0.5 dB
55
47.5
dB (min)
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
55
47.5
dB (min)
fIN1 = 121 MHz, VIN = FSR − 7 dB
fIN2 = 126 MHz, VIN = FSR − 7 dB
-50
dB
(VIN+) − (VIN−) > + Full Scale
255
(VIN+) − (VIN−) < − Full Scale
0
INTERLEAVE MODE (DES Pin 127=Float) - DYNAMIC CONVERTER CHARACTERISTICS
FPBW
(DES)
Full Power Bandwidth
ENOB
Effective Number of Bits
SINAD
Signal to Noise Plus Distortion
Ratio
SNR
Signal to Noise Ratio
THD
Total Harmonic Distortion
2nd Harm
Second Harmonic Distortion
3rd Harm
Third Harmonic Distortion
SFDR
Spurious Free Dynamic Range
Dual Edge Sampling Mode
900
MHz
fIN = 100 MHz, VIN = FSR − 0.5 dB
7.4
7.0
Bits (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
7.4
7.0
Bits (min)
fIN = 100 MHz, VIN = FSR − 0.5 dB
46.3
43.9
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
46.3
43.9
dB (min)
fIN = 100 MHz, VIN = FSR − 0.5 dB
46.7
44.1
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
46.7
44.1
dB (min)
fIN = 100 MHz, VIN = FSR − 0.5 dB
-58
-49
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
-58
-49
dB (min)
fIN = 100 MHz, VIN = FSR − 0.5 dB
-60
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
-60
dB
fIN = 100 MHz, VIN = FSR − 0.5 dB
-64
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
-64
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
57
47
dB(min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
57
47
dB(min)
570
mVP-P (min)
730
mVP-P (max)
ANALOG INPUT AND REFERENCE CHARACTERISTICS
VIN
VCMI
Full Scale Analog Differential Input
Range
FSR pin 14 Low
FSR pin 14 High
Analog Input Common Mode
Voltage
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650
870
VCMO
8
790
mVP-P (min)
950
mVP-P (max)
VCMO − 50
VCMO + 50
mV (min)
mV (max)
(Continued)
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
ANALOG INPUT AND REFERENCE CHARACTERISTICS
CIN
RIN
Analog Input Capacitance, Normal
operation (Notes 10, 11)
Differential
0.02
pF
Each input pin to ground
1.6
pF
Analog Input Capacitance, DES
Mode (Notes 10, 11)
Differential
0.08
pF
Each input pin to ground
2.2
pF
Differential Input Resistance
100
94
Ω (min)
106
Ω (max)
0.95
1.45
V (min)
V (max)
ANALOG OUTPUT CHARACTERISTICS
VCMO
Common Mode Output Voltage
VCMO_LVL
VCMO input threshold to set DC
Coupling mode
TC VCMO
Common Mode Output Voltage
Temperature Coefficient
CLOAD
VCMO
Maximum VCMO load Capacitance
VBG
Bandgap Reference Output
Voltage
IBG = ± 100 µA
TC VBG
Bandgap Reference Voltage
Temperature Coefficient
TA = −40˚C to +85˚C, IBG = ± 100
µA
CLOAD
VBG
Maximum Bandgap Reference
Load Capacitance
1.26
VA = 1.8V
0.60
V
VA = 2.0V
0.66
V
TA = −40˚C to +85˚C
118
ppm/˚C
1.26
80
pF
1.20
1.33
V (min)
V (max)
28
ppm/˚C
80
pF
TEMPERATURE DIODE CHARACTERISTICS
∆VBE
Temperature Diode Voltage
192 µA vs. 12 µA,
TJ = 25˚C
71.23
mV
192 µA vs. 12 µA,
TJ = 85˚C
85.54
mV
CHANNEL-TO-CHANNEL CHARACTERISTICS
Offset Error Match
1
LSB
Positive Full-Scale Error Match
Zero offset selected in Control
Register
1
LSB
Negative Full-Scale Error Match
Zero offset selected in Control
Register
1
LSB
Phase Matching (I,Q)
FIN = 1.0 GHz
<1
Degree
X-TALK
Crosstalk from I (Agressor) to Q
(Victim) Channel
Aggressor = 867 MHz F.S.
Victim = 100 MHz F.S.
−71
dB
X-TALK
Crosstalk from Q (Agressor) to I
(Victim) Channel
Aggressor = 867 MHz F.S.
Victim = 100 MHz F.S.
-71
dB
Sine Wave Clock
0.6
0.4
2.0
VP-P (min)
VP-P (max)
Square Wave Clock
0.6
0.4
2.0
VP-P (min)
VP-P (max)
VIN = 0 or VIN = VA
±1
CLOCK INPUT CHARACTERISTICS
VID
Differential Clock Input Level
II
Input Current
CIN
Input Capacitance (Notes 10, 11)
µA
Differential
0.02
pF
Each input to ground
1.5
pF
9
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ADC08D500
Converter Electrical Characteristics
ADC08D500
Converter Electrical Characteristics
(Continued)
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
DIGITAL CONTROL PIN CHARACTERISTICS
VIH
Logic High Input Voltage
(Note 12)
0.85 x VA
V (min)
VIL
Logic Low Input Voltage
(Note 12)
0.15 x VA
V (max)
CIN
Input Capacitance (Notes 11, 13)
Each input to ground
1.2
Measured differentially, OutV = VA,
VBG = Floating, (Note 15)
710
pF
DIGITAL OUTPUT CHARACTERISTICS
VOD
LVDS Differential Output Voltage
Measured differentially, OutV =
GND, VBG = Floating, (Note 15)
510
400
mVP-P (min)
920
mVP-P (max)
280
mVP-P (min)
720
mVP-P (max)
∆ VO DIFF
Change in LVDS Output Swing
Between Logic Levels
VOS
Output Offset Voltage, see Figure
1
VOS
Output Offset Voltage, see Figure
1
∆ VOS
Output Offset Voltage Change
Between Logic Levels
IOS
Output Short Circuit Current
ZO
Differential Output Impedance
VOH
Cal_Run H level output
IOH = -400uA (Note 12)
1.65
1.5
V
VOL
Cal_Run L level output
IOH = 400uA (Note 12)
0.15
0.3
V
±1
mV
VBG = Floating
800
mV
VBG = VA (Note 15)
1200
mV
±1
mV
−4
mA
Output+ & Output- connected to
0.8V
100
Ohms
POWER SUPPLY CHARACTERISTICS
IA
Analog Supply Current
PD = PDQ = Low
PD = Low, PDQ = High
PD = PDQ = High
561
340
1.8
665
408
mA (max)
mA
mA
IDR
Output Driver Supply Current
PD = PDQ = Low
PD = Low, PDQ = High
PD = PDQ = High
200
112
0.012
275
157
mA (max)
mA (max)
mA
PD
Power Consumption
PD = PDQ = Low
PD = Low, PDQ = High
PD = PDQ = High
1.4
0.8
3.5
1.78
1.0
W (max)
W
mW
PSRR1
D.C. Power Supply Rejection Ratio
Change in Full Scale Error with
change in VA from 1.8V to 2.0V
30
dB
PSRR2
A.C. Power Supply Rejection Ratio
248 MHz, 50mVP-P riding on VA
51
dB
AC ELECTRICAL CHARACTERISTICS
fCLK1
Maximum Input Clock Frequency
Normal Mode (non DES) or DES
Mode
800
fCLK2
Minimum Input Clock Frequency
Normal Mode (non DES)
200
MHz
fCLK2
Minimum Input Clock Frequency
DES Mode
450
MHz
Input Clock Duty Cycle
200 MHz ≤ Input clock frequency ≤
800 MHz (Normal Mode)(Note 12)
50
20
80
% (min)
% (max)
Input Clock Duty Cycle
450 MHz ≤ Input clock frequency ≤
800 MHz (DES Mode)(Note 12)
50
20
80
% (min)
% (max)
tCL
Input Clock Low Time
(Note 12)
500
400
ps (min)
tCH
Input Clock High Time
(Note 12)
500
400
ps (min)
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10
500
MHz (min)
(Continued)
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
45
55
% (min)
% (max)
AC ELECTRICAL CHARACTERISTICS
DCLK Duty Cycle
(Note 12)
50
tRS
Reset Setup Time
(Note 12)
150
ps
tRH
Reset Hold Time
(Note 12)
250
ps
tSD
Syncronizing Edge to DCLK Output fCLKIN = 500 MHz
Delay
fCLKIN = 200 MHz
3.53
3.85
ns
tRPW
Reset Pulse Width
(Note 11)
tLHT
Differential Low to High Transition
Time
10% to 90%, CL = 2.5 pF
250
ps
tHLT
Differential High to Low Transition
Time
10% to 90%, CL = 2.5 pF
250
ps
tOSK
DCLK to Data Output Skew
50% of DCLK transition to 50% of
Data transition, SDR Mode
and DDR Mode, 0˚ DCLK (Note 12)
± 50
ps (max)
tSU
Data to DCLK Set-Up Time
DDR Mode, 90˚ DCLK (Note 12)
2
ns
tH
DCLK to Data Hold Time
DDR Mode, 90˚ DCLK (Note 12)
2
ns
tAD
Sampling (Aperture) Delay
Input CLK+ Fall to Acquisition of
Data
1.3
ns
tAJ
Aperture Jitter
0.4
ps rms
tOD
Input Clock to Data Output Delay
(in addition to Pipeline Delay)
3.1
ns
4
50% of Input Clock transition to
50% of Data transition
DI Outputs
13
DId Outputs
Pipeline Delay (Latency)
(Notes 11, 14)
14
Normal Mode
DQ Outputs
13
DES Mode
13.5
Normal Mode
DQd Outputs
Over Range Recovery Time
Clock Cycles
(min)
14
DES Mode
Differential VIN step from ± 1.2V to
0V to get accurate conversion
Clock Cycles
14.5
1
Input Clock
Cycle
500
ns
tWU
PD low to Rated Accuracy
Conversion (Wake-Up Time)
fSCLK
Serial Clock Frequency
(Note 12)
100
MHz
tSSU
Data to Serial Clock Setup Time
(Note 12)
2.5
ns (min)
tSH
Data to Serial Clock Hold Time
(Note 12)
1
ns (min)
Serial Clock Low Time
4
ns (min)
Serial Clock High Time
4
ns (min)
5
tCAL
Calibration Cycle Time
tCAL_L
CAL Pin Low Time
See Figure 9 (Note 11)
80
Clock Cycles
(min)
tCAL_H
CAL Pin High Time
See Figure 9 (Note 11)
80
Clock Cycles
(min)
tCalDly
Calibration delay determined by pin See Section 1.1.1, Figure 9, (Note
127
15)
225
Clock Cycles
(min)
1.4 x 10
11
Clock Cycles
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ADC08D500
Converter Electrical Characteristics
ADC08D500
Converter Electrical Characteristics
(Continued)
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
231
Clock Cycles
(max)
AC ELECTRICAL CHARACTERISTICS
tCalDly
Calibration delay determined by pin See Section 1.1.1, Figure 9, (Note
127
15)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no guarantee of operation at the Absolute Maximum
Ratings. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and
test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supply limits (that is, less than GND or greater than VA), the current at that pin should be limited to
25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two.
This limit is not placed upon the power, ground and digital output pins.
Note 4: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through ZERO Ohms.
Note 5: See AN-450, “Surface Mounting Methods and Their Effect on Product Reliability”.
Note 6: The analog inputs are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device.
20121404
Note 7: To guarantee accuracy, it is required that VA and VDR be well bypassed. Each supply pin must be decoupled with separate bypass capacitors. Additionally,
achieving rated performance requires that the backside exposed pad be well grounded.
Note 8: Typical figures are at TA = 25˚C, and represent most likely parametric norms. Test limits are guaranteed to National’s AOQL (Average Outgoing Quality
Level).
Note 9: Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for this device,
therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Transfer Characteristic Figure 2. For relationship between Gain Error and Full-Scale
Error, see Specification Definitions for Gain Error.
Note 10: The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF each pin to ground
are isolated from the die capacitances by lead and bond wire inductances.
Note 11: This parameter is guaranteed by design and is not tested in production.
Note 12: This parameter is guaranteed by design and/or characterization and is not tested in production.
Note 13: The digital control pin capacitances are die capacitances only. Additional package capacitance of 1.6 pF each pin to ground are isolated from the die
capacitances by lead and bond wire inductances.
Note 14: Each of the two converters of the ADC08D500 has two LVDS output buses, which each clock data out at one half the sample rate. The data at each bus
is clocked out at one half the sample rate. The second bus (D0 through D7) has a pipeline latency that is one clock cycle less than the latency of the first bus (Dd0
through Dd7)
Note 15: Tying VBG to the supply rail will increase the output offset voltage (VOS) by 400mv (typical), as shown in the VOS specification above. Tying VBG to the
supply rail will also affect the differential LVDS output voltage (VOD), causing it to increase by 40mV (typical).
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12
ADC08D500
Specification Definitions
APERTURE (SAMPLING) DELAY is that time required after
the fall of the clock input for the sampling switch to open. The
Sample/Hold circuit effectively stops capturing the input signal and goes into the “hold” mode the aperture delay time
(tAD) after the clock goes low.
APERTURE JITTER (tAJ) is the variation in aperture delay
from sample to sample. Aperture jitter shows up as input
noise.
Bit Error Rate (B.E.R.) is the probability of error and is
defined as the probable number of errors per unit of time
divided by the number of bits seen in that amount of time. A
B.E.R. of 10-18 corresponds to a statistical error in one bit
about every four (4) years.
20121446
FIGURE 1.
CLOCK DUTY CYCLE is the ratio of the time that the clock
wave form is at a logic high to the total time of one clock
period.
LVDS OUTPUT OFFSET VOLTAGE (VOS) is the midpoint
between the D+ and D- pins output voltage; ie., [(VD+) +(
VD-)]/2.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB.
Measured at 500 MSPS with a ramp input.
MISSING CODES are those output codes that are skipped
and will never appear at the ADC outputs. These codes
cannot be reached with any input value.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion Ratio, or SINAD. ENOB is defined as (SINAD −
1.76) / 6.02 and says that the converter is equivalent to a
perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH (FPBW) is a measure of the
frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale
input.
MSB (MOST SIGNIFICANT BIT) is the bit that has the
largest value or weight. Its value is one half of full scale.
NEGATIVE FULL-SCALE ERROR (NFSE) is a measure of
how far the last code transition is from the ideal 1/2 LSB
above a differential −870 mV with the FSR pin high, or 1/2
LSB above a differential −650 mV with the FSR pin low. For
the ADC08D500 the reference voltage is assumed to be
ideal, so this error is a combination of full-scale error and
reference voltage error.
OFFSET ERROR (VOFF) is a measure of how far the midscale point is from the ideal zero voltage differential input.
GAIN ERROR is the deviation from the ideal slope of the
transfer function. It can be calculated from Offset and FullScale Errors:
Positive Gain Error = Offset Error − Positive Full-Scale
Error
Offset Error = Actual Input causing average of 8k
samples to result in an average code of 127.5.
OUTPUT DELAY (tOD) is the time delay after the falling edge
of DCLK before the data update is present at the output pins.
Negative Gain Error = −(Offset Error − Negative FullScale Error)
Gain Error = Negative Full-Scale Error − Positive FullScale Error = Positive Gain Error + Negative Gain Error
INTEGRAL NON-LINEARITY (INL) is a measure of the
deviation of each individual code from a straight line through
the input to output transfer function. The deviation of any
given code from this straight line is measured from the
center of that code value. The best fit method is used.
INTERMODULATION DISTORTION (IMD) is the creation of
additional spectral components as a result of two sinusoidal
frequencies being applied to the ADC input at the same time.
It is defined as the ratio of the power in the second and third
order intermodulation products to the power in one of the
original frequencies. IMD is usually expressed in dBFS.
LSB (LEAST SIGNIFICANT BIT) is the bit that has the
smallest value or weight of all bits. This value is
VFS / 2n
where VFS is the differential full-scale amplitude of 650 mV
or 870 mV as set by the FSR input and "n" is the ADC
resolution in bits, which is 8 for the ADC08D500.
LVDS DIFFERENTIAL OUTPUT VOLTAGE (VOD) is the
absolute value of the difference between the VD+ & VDoutputs; each measured with respect to Ground.
OVER-RANGE RECOVERY TIME is the time required after
the differential input voltages goes from ± 1.2V to 0V for the
converter to recover and make a conversion with its rated
accuracy.
PIPELINE DELAY (LATENCY) is the number of clock cycles
between initiation of conversion and when that data is presented to the output driver stage. New data is available at
every clock cycle, but the data lags the conversion by the
Pipeline Delay plus the tOD.
POSITIVE FULL-SCALE ERROR (PFSE) is a measure of
how far the last code transition is from the ideal 1-1/2 LSB
below a differential +870 mV with the FSR pin high, or 1-1/2
LSB below a differential +650 mV with the FSR pin low. For
the ADC08D500 the reference voltage is assumed to be
ideal, so this error is a combination of full-scale error and
reference voltage error.
POWER SUPPLY REJECTION RATIO (PSRR) can be one
of two specifications. PSRR1 (DC PSRR) is the ratio of the
change in full-scale error that results from a power supply
voltage change from 1.8V to 2.0V. PSRR2 (AC PSRR) is a
measure of how well an a.c. signal riding upon the power
supply is rejected from the output and is measured with a
248 MHz, 50 mVP-P signal riding upon the power supply. It is
the ratio of the output amplitude of that signal at the output to
its amplitude on the power supply pin. PSRR is expressed in
dB.
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the input signal at the output to the
13
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ADC08D500
Specification Definitions
(Continued)
rms value of the sum of all other spectral components below
one-half the sampling frequency, not including harmonics or
d.c.
SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or SINAD) is the ratio, expressed in dB, of the rms value of the
input signal at the output to the rms value of all of the other
spectral components below half the clock frequency, including harmonics but excluding d.c.
where Af1 is the RMS power of the fundamental (output)
frequency and Af2 through Af10 are the RMS power of the
first 9 harmonic frequencies in the output spectrum.
– Second Harmonic Distortion (2nd Harm) is the difference, expressed in dB, between the RMS power in the input
frequency seen at the output and the power in its 2nd
harmonic level at the output.
SPURIOUS-FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input
signal at the output and the peak spurious signal, where a
spurious signal is any signal present in the output spectrum
that is not present at the input, excluding d.c.
TOTAL HARMONIC DISTORTION (THD) is the ratio expressed in dB, of the rms total of the first nine harmonic
levels at the output to the level of the fundamental at the
output. THD is calculated as
– Third Harmonic Distortion (3rd Harm) is the difference
expressed in dB between the RMS power in the input frequency seen at the output and the power in its 3rd harmonic
level at the output.
Transfer Characteristic
20121422
FIGURE 2. Input / Output Transfer Characteristic
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14
ADC08D500
Timing Diagrams
20121414
FIGURE 3. ADC08D500 Timing — SDR Clocking
20121459
FIGURE 4. ADC08D500 Timing — DDR Clocking
15
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ADC08D500
Timing Diagrams
(Continued)
20121419
FIGURE 5. Serial Interface Timing
20121420
FIGURE 6. Clock Reset Timing in DDR Mode
20121423
FIGURE 7. Clock Reset Timing in SDR Mode with OUTEDGE Low
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16
ADC08D500
Timing Diagrams
(Continued)
20121424
FIGURE 8. Clock Reset Timing in SDR Mode with OUTEDGE High
20121425
FIGURE 9. Self Calibration and On-Command Calibration Timing
17
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ADC08D500
bration can not be initiated or run while the device is in the
power-down mode. See Section 1.7 for information on the
interaction between Power Down and Calibration.
1.0 Functional Description
The ADC08D500 is a versatile A/D Converter with an innovative architecture permitting very high speed operation. The
controls available ease the application of the device to circuit
solutions. Optimum performance requires adherence to the
provisions discussed here and in the Applications Information Section.
During the calibration process, the input termination resistor
is trimmed to a value that is equal to REXT / 33. This external
resistor is located between pin 32 and ground. REXT must be
3300 Ω ± 0.1%. With this value, the input termination resistor
is trimmed to be 100 Ω. Because REXT is also used to set the
proper current for the Track and Hold amplifier, for the
preamplifiers and for the comparators, other values of REXT
should not be used. In normal operation, calibration is performed just after application of power and whenever a valid
calibration command is given, which is holding the CAL pin
low for at least 80 clock cycles, then hold it high for at least
another 80 clock cycles. The time taken by the calibration
procedure is specified in the A.C. Characteristics Table.
Holding the CAL pin high upon power up will prevent the
calibration process from running until the CAL pin experiences the above-mentioned 80 clock cycles low followed by
80 clock cycles high.
While it is generally poor practice to allow an active pin to
float, pins 4, 14 and 127 of the ADC08D500 are designed to
be left floating without jeopardy. In all discussions throughout
this data sheet, whenever a function is called by allowing a
pin to float, connecting that pin to a potential of one half the
VA supply voltage will have the same effect as allowing it to
float.
1.1 OVERVIEW
The ADC08D500 uses a calibrated folding and interpolating
architecture that achieves over 7.5 effective bits. The use of
folding amplifiers greatly reduces the number of comparators
and power consumption. Interpolation reduces the number
of front-end amplifiers required, minimizing the load on the
input signal and further reducing power requirements. In
addition to other things, on-chip calibration reduces the INL
bow often seen with folding architectures. The result is an
extremely fast, high performance, low power converter.
The analog input signal that is within the converter’s input
voltage range is digitized to eight bits at speeds of 200
MSPS to 500 MSPS, typical. Differential input voltages below negative full-scale will cause the output word to consist
of all zeroes. Differential input voltages above positive fullscale will cause the output word to consist of all ones. Either
of these conditions at either the "I" or "Q" input will cause the
OR (Out of Range) output to be activated. This single OR
output indicates when the output code from one or both of
the channels is below negative full scale or above positive
full scale.
Each of the two converters has a 1:2 demultiplexer that
feeds two LVDS output buses. The data on these buses
provide an output word rate on each bus at half the ADC
sampling rate and must be interleaved by the user to provide
output words at the full conversion rate.
The output levels may be selected to be normal or reduced.
Using reduced levels saves power but could result in erroneous data capture of some or all of the bits, especially at
higher sample rates and in marginally designed systems.
CalDly (pin 127) is used to select one of two delay times after
the application of power to the start of calibration. This
calibration delay is 225 clock cycles (about 67.2 ms at 500
MSPS) with CalDly low, or 231 clock cycles (about 4.3 seconds at 500 MSPS) with CalDly high. These delay values
allow the power supply to come up and stabilize before
calibration takes place. If the PD pin is high upon power-up,
the calibration delay counter will be disabled until the PD pin
is brought low. Therefore, holding the PD pin high during
power up will further delay the start of the power-up calibration cycle. The best setting of the CalDly pin depends upon
the power-on settling time of the power supply.
The CalRun output is high whenever the calibration procedure is running. This is true whether the calibration is done at
power-up or on-command.
1.1.2 Acquiring the Input
Data is acquired at the falling edge of CLK+ (pin 18) and the
digital equivalent of that data is available at the digital outputs 13 clock cycles later for the DI and DQ output buses
and 14 clock cycles later for the DId and DQd output buses.
There is an additional internal delay called tOD before the
data is available at the outputs. See the Timing Diagram.
The ADC08D500 will convert as long as the clock signal is
present. The fully differential comparator design and the
innovative design of the sample-and-hold amplifier, together
with self calibration, enables a very flat SINAD/ENOB response beyond 500 MHz. The ADC08D500 output data signaling is LVDS and the output format is offset binary.
1.1.1 Self-Calibration
A self-calibration is performed upon power-up and can also
be invoked by the user upon command. Calibration trims the
100Ω analog input differential termination resistor and minimizes full-scale error, offset error, DNL and INL, resulting in
maximizing SNR, THD, SINAD (SNDR) and ENOB. Internal
bias currents are also set with the calibration process. All of
this is true whether the calibration is performed upon power
up or is performed upon command. Running the self calibration is an important part of this chip’s functionality and is
required in order to obtain adequate performance. In addition to the requirement to be run at power-up, self calibration
must be re-run whenever the sense of the FSR pin is
changed. For best performance, we recommend that self
calibration be run 20 seconds or more after application of
power and whenever the operating temperature changes
significantly, according to the particular system design requirements. See Section 2.4.2.2 for more information. Cali-
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1.1.3 Control Modes
Much of the user control can be accomplished with several
control pins that are provided. Examples include initiation of
the calibration cycle, power down mode and full scale range
setting. However, the ADC08D500 also provides an Extended Control mode whereby a serial interface is used to
access register-based control of several advanced features.
The Extended Control mode is not intended to be enabled
and disabled dynamically. Rather, the user is expected to
employ either the normal control mode or the Extended
Control mode at all times. When the device is in the Extended Control mode, pin-based control of several features
is replaced with register-based control and those pin-based
controls are disabled. These pins are OutV (pin 3), OutEdge/
DDR (pin 4), FSR (pin 14) and CalDly/DES (pin 127). See
Section 1.2 for details on the Extended Control mode.
18
1.1.5.1 Dual-Edge Sampling
(Continued)
The DES mode allows one of the ADC08D500’s inputs (I or
Q Channel) to be sampled by both ADCs. One ADC samples
the input on the positive edge of the input clock and the other
ADC samples the same input on the other edge of the input
clock. A single input is thus sampled twice per clock cycle,
resulting in an overall sample rate of twice the input clock
frequency, or 1 GSPS with a 500 MHz clock.
1.1.4 The Analog Inputs
The ADC08D500 must be driven with a differential input
signal. Operation with a single-ended signal is not recommended. It is important that the inputs either be a.c. coupled
to the inputs with the VCMO pin grounded or d.c. coupled with
the VCMO pin not grounded and an input common mode
voltage equal to the VCMO output.
In this mode the outputs are interleaved such that the data is
effectively demultiplexed 1:4. Since the sample rate is
doubled, each of the 4 output buses have a 250 MSPS
output rate with a 500 MHz input clock. All data is available
in parallel. The four bytes of parallel data that is output with
each clock is in the following sampling order, from the earliest to the latest: DQd, DId, DQ, DI. Table 1 indicates what
the outputs represent for the various sampling possibilities.
Two full-scale range settings are provided with pin 14 (FSR).
A high on pin 14 causes an input full-scale range setting of
870 mVP-P, while grounding pin 14 causes an input full-scale
range setting of 650 mVP-P. The full-scale range setting
operates equally on both ADCs.
In the Extended Control mode, the full-scale input range can
be set to values between 560 mVP-P and 840 mVP-P through
a serial interface. See Section 2.2
In the non-extended mode of operation only the "I" input can
be sampled in the DES mode. In the extended mode of
operation the user can select which input is sampled.
1.1.5 Clocking
The ADC08D500 must be driven with an a.c. coupled, differential clock signal. Section 2.3 describes the use of the clock
input pins. A differential LVDS output clock is available for
use in latching the ADC output data into whatever receives
that data.
The ADC08D500 offers options for input and output clocking.
These options include a choice of Dual Edge Sampling
(DES) or interleaved mode where the ADC08D500 performs
as a single device converting at twice the input clock rate
and a choice of which DCLK edge the output data transitions
on and choice of Single Data Rate (SDR) or Double Data
Rate (DDR) outputs.
The ADC08D500 also includes an automatic clock phase
background calibration feature which can be used in DES
mode to automatically and continuously adjust the clock
phase of the I and Q channel. This feature removes the need
to adjust the clock phase setting manually and provides
optimal Dual-Edge Sampling ENOB performance.
IMPORTANT NOTE: The background calibration feature in
DES mode does not replace the requirement for OnCommand Calibration which should be run before entering
DES mode, or if a large swing in ambient temperature is
experienced by the device.
The ADC08D500 also has the option to use a duty cycle
corrected clock receiver as part of the input clock circuit. This
feature is enabled by default and provides improved ADC
clocking, especially in the Dual-Edge Sampling mode (DES).
This circuitry allows the ADC to be clocked with a signal
source having a duty cycle ratio of 80 / 20 % (worst case) for
both the normal and the Dual Edge Sampling modes.
TABLE 1. Input Channel Samples Produced at Data Outputs
Data Outputs (Always
sourced with respect to
fall of DCLK)
Dual-Edge Sampling Mode
Normal Sampling Mode
I-Channel Selected
Q-Channel Selected *
DI
"I" Input Sampled with Fall
of CLK 13 cycles earlier.
"I" Input Sampled with Fall
of CLK 13 cycles earlier.
"Q" Input Sampled with Fall
of CLK 13 cycles earlier.
DId
"I" Input Sampled with Fall
of CLK 14 cycles earlier.
"I" Input Sampled with Fall
of CLK 14 cycles earlier.
"Q" Input Sampled with Fall
of CLK 14 cycles earlier.
DQ
"Q" Input Sampled with Fall
of CLK 13 cycles earlier.
"I" Input Sampled with Rise
of CLK 13.5 cycles earlier.
"Q" Input Sampled with Rise
of CLK 13.5 cycles earlier.
DQd
"Q" Input Sampled with Fall
"I" Input Sampled with Rise
of CLK 14 cycles after being
of CLK 14.5 cycles earlier.
sampled.
"Q" Input Sampled with Rise
of CLK 14.5 cycles earlier.
* Note that, in the Dual-Edge Sampling (DES) mode, the "Q" channel input can only be selected for sampling in the
Extended Control Mode.
1.1.5.2 OutEdge Setting
To help ease data capture in the SDR mode, the output data
may be caused to transition on either the positive or the
negative edge of the output data clock (DCLK). This is
chosen with the OutEdge input (pin 4). A high on the OutEdge input causes the output data to transition on the rising
edge of DCLK, while grounding this input causes the output
to transition on the falling edge of DCLK. See Section 2.4.3.
1.1.5.3 Double Data Rate
A choice of single data rate (SDR) or double data rate (DDR)
output is offered. With single data rate the clock frequency is
the same as the data rate of the two output buses. With
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ADC08D500
1.0 Functional Description
ADC08D500
1.0 Functional Description
"I" channel active. There is no provision to power down the
"I" channel independently of the "Q" channel. Upon return to
normal operation, the pipeline will contain meaningless information.
(Continued)
double data rate the clock frequency is half the data rate and
data is sent to the outputs on both DCLK edges. DDR
clocking is enabled in non-Extended Control mode by allowing pin 4 to float.
If the PD input is brought high while a calibration is running,
the device will not go into power down until the calibration
sequence is complete. However, if power is applied and PD
is already high, the device will not begin the calibration
sequence until the PD input goes low. If a manual calibration
is requested while the device is powered down, the calibration will not begin at all. That is, the manual calibration input
is completely ignored in the power down state. Calibration
will function with the "Q" channel powered down, but that
channel will not be calibrated if PDQ is high. If the "Q"
channel is subsequently to be used, it is necessary to perform a calibration after PDQ is brought low.
1.1.6 The LVDS Outputs
The data outputs, the Out Of Range (OR) and DCLK, are
LVDS. Output current sources provide 3 mA of output current
to a differential 100 Ohm load when the OutV input (pin 14)
is high or 2.2 mA when the OutV input is low. For short LVDS
lines and low noise systems, satisfactory performance may
be realized with the OutV input low, which results in lower
power consumption. If the LVDS lines are long and/or the
system in which the ADC08D500 is used is noisy, it may be
necessary to tie the OutV pin high. The LVDS data output
have a typical common mode voltage of 800mV when the
VBG pin is unconnected and floating. This common mode
voltage can be increased to 1.2V by tying the VBG pin to VA
if a higher common mode is required.
IMPORTANT NOTE: Tying the VBG pin to VA will also increase the differential LVDS output voltage by upto 40mV.
1.2 NORMAL/EXTENDED CONTROL
The ADC08D500 may be operated in one of two modes. In
the simpler "normal" control mode, the user affects available
configuration and control of the device through several control pins. The "extended control mode" provides additional
configuration and control options through a serial interface
and a set of 8 registers. The two control modes are selected
with pin 14 (FSR/ECE: Extended Control Enable). The
choice of control modes is required to be a fixed selection
and is not intended to be switched dynamically while the
device is operational.
Table 2 shows how several of the device features are affected by the control mode chosen.
1.1.7 Power Down
The ADC08D500 is in the active state when the Power Down
pin (PD) is low. When the PD pin is high, the device is in the
power down mode, where the output pins hold the last
conversion before the PD pin went high and the device
power consumption is reduced to a minimual level. A high on
the PDQ pin will power down the "Q" channel and leave the
TABLE 2. Features and modes
Feature
Normal Control Mode
Extended Control Mode
SDR or DDR Clocking
Selected with pin 4
Selected with DE bit in the
Configuration Register
DDR Clock Phase
Not Selectable (0˚ Phase Only)
Selected with DCP bit in the
Configuration Register. See Section
1.4
SDR Data transitions with rising or
falling DCLK edge
Selected with pin 4
Selected with the OE bit in the
Configuration Register
LVDS output level
Selected with pin 3
Selected with the OV bit in the
Configuration Register
Power-On Calibration Delay
Delay Selected with pin 127
Short delay only.
Full-Scale Range
Options (650 mVP-P or 870 mVP-P)
selected with pin 14. Selected range
applies to both channels.
Up to 512 step adjustments over a
nominal range of 560 mV to 840 mV.
Separate range selected for I- and
Q-Channels. Selected using registers
3H and Bh
Input Offset Adjust
Not possible
Separate ± 45 mV adjustments in 512
steps for each channel using registers
2h and Ah
Dual Edge Sampling Selection
Enabled with pin 127
Enabled through DES Enable Register
Dual Edge Sampling Input Channel
Selection
Only I-Channel Input can be used
Either I- or Q-Channel input may be
sampled by both ADCs
The Clock Phase is adjusted
automatically
Automatic Clock Phase control can be
selected by setting bit 14 in the DES
Enable register (Dh). The clock phase
can also be adjusted manually through
the Coarse & Fine registers Eh and Fh
DES Sampling Clock Adjustment
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20
ADC08D500
1.0 Functional Description
TABLE 4. Register Addresses
(Continued)
4-Bit Address
The default state of the Extended Control Mode is set upon
power-on reset (internally performed by the device) and is
shown in Table 3.
Loading Sequence:
A3 loaded after H0, A0 loaded last
TABLE 3. Extended Control Mode Operation (Pin 14
Floating)
A3
A2
A1
A0
Hex
Register
Addressed
0
0
0
0
0h
Reserved
Extended Control Mode
Default State
0
0
0
1
1h
Configuration
0
0
1
0
2h
"I" Ch Offset
SDR or DDR Clocking
DDR Clocking
0
0
1
1
3h
DDR Clock Phase
Data changes with DCLK
edge (0˚ phase)
"I" Ch Full-Scale
Voltage Adjust
0
1
0
0
4h
Reserved
LVDS Output Amplitude
Normal amplitude
(710 mVP-P)
0
1
0
1
5h
Reserved
0
1
1
0
6h
Reserved
Calibration Delay
Short Delay
0
1
1
1
7h
Reserved
Full-Scale Range
700 mV nominal for both
channels
1
0
0
0
8h
Reserved
1
0
0
1
9h
Reserved
Input Offset Adjust
No adjustment for either
channel
1
0
1
0
Ah
"Q" Ch Offset
Dual Edge Sampling
(DES)
1
0
1
1
Bh
Not enabled
"Q" Ch Full-Scale
Voltage Adjust
1
1
0
0
Ch
Reserved
1
1
0
1
Dh
DES Enable
1
1
1
0
Eh
DES Coarse
Adjust
1
1
1
1
Fh
DES Fine Adjust
Feature
1.3 THE SERIAL INTERFACE
The 3-pin serial interface is enabled only when the device is
in the Extended Control mode. The pins of this interface are
Serial Clock (SCLK), Serial Data (SDATA) and Serial Interface Chip Select (SCS) Eight write only registers are accessible through this serial interface.
SCS: This signal should be asserted low while accessing a
register through the serial interface. Setup and hold times
with respect to the SCLK must be observed.
SCLK: Serial data input is accepted with the rising edge of
this signal.
SDATA: Each register access requires a specific 32-bit pattern at this input. This pattern consists of a header, register
address and register value. The data is shifted in MSB first.
Setup and hold times with respect to the SCLK must be
observed. See the Timing Diagram.
Each Register access consists of 32 bits, as shown in Figure
5 of the Timing Diagrams. The fixed header pattern is 0000
0000 0001 (eleven zeros followed by a 1). The loading
sequence is such that a 0b is loaded first. These 12 bits form
the header. The next 4 bits are the address of the register
that is to be written to and the last 16 bits are the data written
to the addressed register. The addresses of the various
registers are indicated in Table 4.
Refer to the Register Description (Section 1.4) for information on the data to be written to the registers.
Subsequent register accesses may be performed immediately, starting with the 33rd SCLK. This means that the SCS
input does not have to be de-asserted and asserted again
between register addresses. It is possible, although not recommended, to keep the SCS input permanently enabled (at
a logic low) when using extended control.
IMPORTANT NOTE: The Serial Interface should not be
used when calibrating the ADC. Doing so will impair the
performance of the device until it is re-calibrated correctly.
Programming the serial registers will also reduce dynamic
performance of the ADC for the duration of the register
access time.
1.4 REGISTER DESCRIPTION
Eight write-only registers provide several control and configuration options in the Extended Control Mode. These registers have no effect when the device is in the Normal
Control Mode. Each register description below also shows
the Power-On Reset (POR) state of each control bit.
Configuration Register
Addr: 1h (0001b)
21
W only (0xB2FF)
D15
D14
D13
1
0
1
D11
D10
D9
D8
DCS DCP
D12
nDE
OV
OE
D7
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
1
1
1
1
Bit 15
Must be set to 1b
Bit 14
Must be set to 0b
Bit 13
Must be set to 1b
Bit 12
DCS: Duty Cycle Stabilizer. When this bit is
set to 1b, a duty cycle stabilization circuit is
applied to the clock input. When this bit is set
to 0b the stabilization circuit is disbaled.
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ADC08D500
1.0 Functional Description
Bit 11
(Continued)
Bit 7
DCP: DDR Clock Phase. This bit only has an
effect in the DDR mode. When this bit is set
to 0b, the DCLK edges are time-aligned with
the data bus edges ("0˚ Phase"). When this
bit is set to 1b, the DCLK edges are placed in
the middle of the data bit-cells ("90˚ Phase"),
using the one-half speed DCLK shown in
Figure 4 as the phase reference.
POR State: 0b
Bit 6:0
POR State: 0b
Bit 10
nDE: DDR Enable. When this bit is set to 0b,
data bus clocking follows the DDR (Dual
Data Rate) mode whereby a data word is
output with each rising and falling edge of
DCLK. When this bit is set to a 1b, data bus
clocking follows the SDR (single data rate)
mode whereby each data word is output with
either the rising or falling edge of DCLK , as
determined by the OutEdge bit.
POR State: 0b
Bit 9
OV: Output Voltage. This bit determines the
LVDS outputs’ voltage amplitude and has the
same function as the OutV pin that is used in
the normal control mode. When this bit is set
to 1b, the standard output amplitude of 710
mVP-P is used. When this bit is set to 0b, the
reduced output amplitude of 510 mVP-P is
used.
POR State: 1b
Bit 8
OE: Output Edge. This bit selects the DCLK
edge with which the data words transition in
the SDR mode and has the same effect as
the OutEdge pin in the normal control mode.
When this bit is 1b, the data outputs change
with the rising edge of DCLK+. When this bit
is 0b, the data output change with the falling
edge of DCLK+.
POR State: 0b
Bits 7:0
Must be set to 1b.
I-Channel Offset
Addr: 2h (0010b)
D15
D14
D13
(MSB)
W only (0x007F)
D12
D11
D10
D9
Offset Value
D8
(LSB)
D7
D6
D5
D4
D3
D2
D1
D0
Sign
1
1
1
1
1
1
1
Bits 15:8
Offset Value. The input offset of the
I-Channel ADC is adjusted linearly and
monotonically by the value in this field. 00h
provides a nominal zero offset, while FFh
provides a nominal 45 mV of offset. Thus,
each code step provides 0.176 mV of offset.
POR State: 0000 0000b
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Sign bit. 0b gives positive offset, 1b gives
negative offset.
22
Must be set to 1b
(Continued)
Bits 6:0
Must be set to 1b
I-Channel Full-Scale Voltage Adjust
Addr: 3h (0011b)
D15
D14
D13
D12
(MSB)
D11
D10
D9
D8
Addr: Ah (1010b)
D15
D6
D5
D4
D3
D2
D1
D0
(LSB)
1
1
1
1
1
1
1
0000 0000 0
560mVP-P
700mVP-P
1111 1111 1
840mVP-P
D13
W only (0x007F)
D12
D11
D10
D9
Offset Value
D8
(LSB)
D7
D6
D5
D4
D3
D2
D1
D0
Sign
1
1
1
1
1
1
1
Bit 15:8
Full Scale Voltage Adjust Value. The input
full-scale voltage of the I-Channel ADC is
adjusted linearly and monotonically from the
nominal 700 mVP-P differential by the value
in this field.
1000 0000 0
D14
(MSB)
Adjust Value
D7
Bit 15:7
Q-Channel Offset
W only (0x807F)
Offset Value. The input offset of the
Q-Channel ADC is adjusted linearly and
monotonically by the value in this field. 00h
provides a nominal zero offset, while FFh
provides a nominal 45 mV of offset. Thus,
each code step provides about 0.176 mV of
offset.
POR State: 0000 0000b
Bit 7
For best performance, it is recommended
that the value in this field be limited to the
range of 0110 0000 0b to 1110 0000 0b. i.e.,
limit the amount of adjustment to ± 15%. The
remaining ± 5% headroom allows for the
ADC’s own full scale variation .A gain
adjustment
does
not
require
ADC
re-calibration.
Sign bit. 0b gives positive offset, 1b gives
negative offset.
POR State: 0b
Bit 6:0
Must be set to 1b
POR State: 1000 0000 0b (no adjustment)
23
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ADC08D500
1.0 Functional Description
ADC08D500
1.0 Functional Description
(Continued)
Bit 14
Automatic Clock Phase (ACP) Control.
Setting this bit to 1b enables the Automatic
Clock Phase Control. In this mode the DES
Coarse and Fine manual controls are
disabled. A phase detection circuit
continually adjusts the I and Q sampling
edges to be 180 degrees out of phase.
When this bit is set to 0b, the sample (input)
clock delay between the I and Q channels is
set manually using the DES Coarse and
Fine Adjust registers. (See section 2.4.5 for
important application information)Using the
ACP Control option is recommended
over the manual DES settings.
Q-Channel Full-Scale Voltage Adjust
Addr: Bh (1011b)
D15
D14
D13
W only (0x807F)
D12
(MSB)
D11
D10
D9
D8
Adjust Value
D7
D6
D5
D4
D3
D2
D1
D0
(LSB)
1
1
1
1
1
1
1
Bit 15:7
Full Scale Voltage Adjust Value. The input
full-scale voltage of the Q-Channel ADC is
adjusted linearly and monotonically from the
nominal 700 mVP-P differential by the value
in this field.
0000 0000 0
560mVP-P
1000 0000 0
700mVP-P
1111 1111 1
840mVP-P
POR State: 0b
Bits 13:0
DES Coarse Adjust
For best performance, it is recommended
that the value in this field be limited to the
range of 0110 0000 0b to 1110 0000 0b.
i.e., limit the amount of adjustment to ± 15%.
The remaining ± 5% headroom allows for
the ADC’s own full scale variation .A gain
adjustment does not require ADC
re-calibration.
Addr: Eh (1110b)
D14
IS
ADS
D7
D6
D5
D4
1
1
1
1
Bit 15
Must be set to 1b
DES Enable
Addr: Dh (1101b)
D15
D14
DEN ACP
D12
D13
D12
D11
D10
D9
D8
1
1
1
1
1
1
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
1
1
1
1
Bit 14
DES Enable. Setting this bit to 1b enables
the Dual Edge Sampling mode. In this mode
the ADCs in this device are used to sample
and convert the same analog input in a
time-interleaved manner, accomplishing a
sampling rate of twice the input clock rate.
When this bit is set to 0b, the device
operates in the normal dual channel mode.
D10
D9
D8
1
1
1
D3
D2
D1
D0
1
1
1
1
Input Select. When this bit is set to 0b the "I"
input is operated upon by both ADCs. When
this bit is set to 1b the "Q" input is operated
on by both ADCs.
Adjust Direction Select. When this bit is set
to 0b, the programmed delays are applied to
the "I" channel sample clock while the "Q"
channel sample clock remains fixed. When
this bit is set to 1b, the programmed delays
are applied to the "Q" channel sample clock
while the "I" channel sample clock remains
fixed.
POR State: 0b
Bits 13:11 Coarse Adjust Magnitude. Each code value
in this field delays either the "I" channel or
the "Q" channel sample clock (as
determined by the ADS bit) by
approximately 20 picoseconds. A value of
000b in this field causes zero adjustment.
POR State: 000b
POR State: 0b
Bits 10:0 Must be set to 1b
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D11
CAM
POR State: 0b
W only (0x3FFF)
D7
Bit 15
D13
W only (0x07FF)
D15
POR State: 1000 0000 0b (no adjustment)
Bits 6:0
Must be set to 1b
24
The DCLK_RST signal can be asserted asynchronous to the
input clock If DCLK_RST is asserted, the DCLK output is
held in a designated state. The state in which DCLK is held
during the reset period is determined by the mode of operation (SDR/DDR) and the setting of the Output Edge configuration pin or bit. (Refer to Figure 6, Figure 8, and Figure 8 for
the DCLK reset condictions). Therefore depending upon
when the DCLK_RST signal is asserted, there may be a
narrow pulse on the DCLK line during this reset event. When
the DCLK_RST signal is de-asserted in synchronization with
the CLK rising edge, the next CLK falling edge synchronizes
the DCLK output with those of other ADC08D500s in the
system. The DCLK output is enabled again after a constant
delay which is equal to the CLK input to DCLK output delay
(tAD). The device always exhibits this delay characteristic in
normal operation.
(Continued)
DES Fine Adjust
Addr: Fh (1111b)
D15
D14
D13
W only (0x007F)
D12
D11
(MSB)
D10
D9
D8
FAM
D7
D6
D5
D4
D3
D2
D1
D0
(LSB)
1
1
1
1
1
1
1
Bits 15:7
Fine Adjust Magnitude. Each code value in
this field delays either the "I" channel or the
"Q" channel sample clock (as determined by
the ADS bit of the DES Coarse Adjust
Register) by approximately 0.1 ps. A value of
0000 0000 0b in this field causes zero
adjustment. Note that the amount of
adjustment achieved with each code will vary
with the device conditions as well as with the
Coarse Adjustment value chosen.
The DCLK-RST pin should NOT be brought high while the
calibration process is running (while CalRun is high). Doing
so could cause a digital glitch in the digital circuitry, resulting
in corruption and invalidation of the calibration.
2.0 Applications Information
POR State: 0000 0000 0b
Bit 6:0
2.1 THE REFERENCE VOLTAGE
The voltage reference for the ADC08D500 is derived from a
1.254V bandgap reference which is made available at pin
31, VBG for user convenience and has an output current
capability of ± 100 µA and should be buffered if more current
than this is required.
Must be set to 1b
1.4.1 Note Regarding Extended Mode Offset Correction
When using the I or Q channel Offset Adjust registers, the
following information should be noted.
The internal bandgap-derived reference voltage has a nominal value of 650 mV or 870 mV, as determined by the FSR
pin and described in Section 1.1.4.
There is no provision for the use of an external reference
voltage, but the full-scale input voltage can be adjusted
through a Configuration Register in the Extended Control
mode, as explained in Section 1.2.
Differential input signals up to the chosen full-scale level will
be digitized to 8 bits. Signal excursions beyond the full-scale
range will be clipped at the output. These large signal excursions will also activate the OR output for the time that the
signal is out of range. See Section 2.2.2.
One extra feature of the VBG pin is that it can be used to
raise the common mode voltage level of the LVDS outputs.
The output offset voltage (VOS) is typically 800mV when the
VBG pin is used as an output or left unconnected. To raise
the LVDS offset voltage to a typical value of 1200mV the VBG
pin can be connected directly to the supply rails.
For offset values of +0000 0000 and -0000 0000, the actual
offset is not the same. By changing only the sign bit in this
case, an offset step in the digital output code of about 1/10th
of an LSB is experienced. This is shown more clearly in the
Figure below.
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2.2 THE ANALOG INPUT
The analog input is a differential one to which the signal
source may be a.c. coupled or d.c. coupled. The full-scale
input range is selected with the FSR pin to be 650 mVP-P or
870 mVP-P, or can be adjusted to values between 560 mVP-P
and 840 mVP-P in the Extended Control mode through the
Serial Interface. For best performance, it is recommended
that the full-scale range be kept between 595 mVP-P and 805
mVP-P in the Extended Control mode.
Table 5 gives the input to output relationship with the FSR
pin high and the normal (non-extended) mode is used. With
the FSR pin grounded, the millivolt values in Table 5 are
reduced to 75% of the values indicated. In the Enhanced
Control Mode, these values will be determined by the full
scale range and offset settings in the Control Registers.
FIGURE 10. Extended Mode Offset Behavior
1.5 MULTIPLE ADC SYNCHRONIZATION
The ADC08D500 has the capability to precisely reset its
sampling clock input to DCLK output relationship as determined by the user-supplied DCLK_RST pulse. This allows
multiple ADCs in a system to have their DCLK (and data)
outputs transition at the same time with respect to the shared
CLK input that they all use for sampling.
The DCLK_RST signal must observe some timing requirements that are shown in Figure 6, Figure 7, and Figure 8 of
the Timing Diagrams. The DCLK_RST pulse must be of a
minimum width and its deassertion edge must observe setup
and hold times with respect to the CLK input rising edge.
These times are specified in the AC Electrical Characteristics Table.
25
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ADC08D500
1.0 Functional Description
ADC08D500
2.0 Applications Information
Performance is as good in the d.c. coupled mode as it is
in the a.c. coupled mode, provided the input common
mode voltage at both analog inputs remain within 50 mV
of VCMO.
(Continued)
TABLE 5. DIFFERENTIAL INPUT TO OUTPUT
RELATIONSHIP (Non-Extended Control Mode, FSR
High)
VIN+
VIN−
VCM − 217.5mV
VCM + 217.5mV
0000 0000
VCM − 109mV
VCM + 109mV
0100 0000
VCM
VCM
0111 1111 /
1000 0000
VCM + 109 mV
VCM − 109mV
1100 0000
VCM + 217.5mV
VCM − 217.5mV
1111 1111
If d.c. coupling is used, it is best to servo the input common
mode voltage, using the VCMO pin, to maintain optimum
performance. An example of this type of circuit is shown in
Figure 12.
Output Code
The buffered analog inputs simplify the task of driving these
inputs and the RC pole that is generally used at sampling
ADC inputs is not required. If it is desired to use an amplifier
circuit before the ADC, use care in choosing an amplifier with
adequate noise and distortion performance and adequate
gain at the frequencies used for the application.
Note that a precise d.c. common mode voltage must be
present at the ADC inputs. This common mode voltage,
VCMO, is provided on-chip when a.c. input coupling is used
and the input signal is a.c. coupled to the ADC.
When the inputs are a.c. coupled, the VCMO output must be
grounded, as shown in Figure 11. This causes the on-chip
VCMO voltage to be connected to the inputs through on-chip
50k-Ohm resistors.
20121455
FIGURE 12. Example of Servoing the Analog Input with
VCMO
One such circuit should be used in front of the VIN+ input and
another in front of the VIN− input. In that figure, RD1, RD2 and
RD3 are used to divide the VCMO potential so that, after being
gained up by the amplifier, the input common mode voltage
is equal to VCMO from the ADC. RD1 and RD2 are split to
allow the bypass capacitor to isolate the input signal from
VCMO. RIN, RD2 and RD3 will divide the input signal, if necessary. Capacitor "C" in Figure 12 should be chosen to keep
any component of the input signal from affecting VCMO.
Be sure that the current drawn from the VCMO output does
not exceed 100 µA.
The Input impedance in the d.c. coupled mode (VCMO pin not
grounded) consists of a precision 100Ω resistor between
VIN+ and VIN− and a capacitance from each of these inputs
to ground. In the a.c. coupled mode the input appears the
same except there is also a resistor of 50K between each
analog input pin and the VCMO potential.
Driving the inputs beyond full scale will result in a saturation
or clipping of the reconstructed output.
IMPORTANT NOTE: An Analog input channel that is not
used (e.g. in DES Mode) should be left floating when the
inputs are a.c. coupled. Do not connect an unused analog
input to ground.
2.2.1 Handling Single-Ended Input Signals
There is no provision for the ADC08D500 to adequately
process single-ended input signals. The best way to handle
single-ended signals is to convert them to differential signals
before presenting them to the ADC. The easiest way to
accomplish single-ended to differential signal conversion is
with an appropriate balun-connected transformer, as shown
in Figure 13.
20121444
FIGURE 11. Differential Input Drive
When the d.c. coupled mode is used, a common mode
voltage must be provided at the differential inputs. This
common mode voltage should track the VCMO output pin.
Note that the VCMO output potential will change with temperature. The common mode output of the driving device
should track this change.
IMPORTANT NOTE: An analog input channel that is not
used (e.g. in DES Mode) should be tied to the VCMO voltage
when the inputs are d.c coupled. Do not connect unused
analog inputs to ground.
Full-scale distortion performance falls off rapidly as the
input common mode voltage deviates from VCMO. This is
a direct result of using a very low supply voltage to
minimize power. Keep the input common voltage within
50 mV of VCMO.
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20121443
FIGURE 13. Single-Ended to Differential signal
conversion with a balun-connected transformer
26
ADC08D500
2.0 Applications Information
(Continued)
The 100 Ohm external resistor placed accross the output
terminals of the balun in parallel with the ADC08D1000’s
on-chip 100 Ohm resistor makes a 50 Ohms differential
impedance at the balun output. Or, 25 Ohms to virtual
ground at each of the balun output terminals.
Looking into the balun, the source sees the impedance of the
first coil in series with the impedance at the output of that
coil. Since the transformer has a 1:1 turns ratio, the impedance across the first coil is exactly the same as that at the
output of the second coil, namely 25 Ohms to virtual ground.
So, the 25 Ohms across the first coil in series with the 25
Ohms at its output gives 50 Ohms total impedance to match
the source.
20121447
FIGURE 14. Differential (LVDS) Clock Connection
The differential Clock line pair should have a characteristic
impedance of 100Ω and be terminated at the clock source in
that (100Ω) characteristic impedance. The clock line should
be as short and as direct as possible. The ADC08D500 clock
input is internally terminated with an untrimmed 100Ω resistor.
2.2.2 Out Of Range (OR) Indication
When the conversion result is clipped the Out of Range
output is activated such that OR+ goes high and OR- goes
low. This output is active as long as accurate data on either
or both of the buses would be outside the range of 00h to
FFh.
Insufficient clock levels will result in poor dynamic performance. Excessively high clock levels could cause a change
in the analog input offset voltage. To avoid these problems,
keep the clock level within the range specified in the Electrical Characteristics Table.
The low and high times of the input clock signal can affect
the performance of any A/D Converter. The ADC08D1000
features a duty cycle clock correction circuit which can maintain performance over temperature even in DES mode. The
ADC will meet its performance specification if the input clock
high and low times are maintained within the range (20/80%
ratio) as specified in the Electrical Characteristics Table.
High speed, high performance ADCs such as the
ADC08D500 require a very stable clock signal with minimum
phase noise or jitter. ADC jitter requirements are defined by
the ADC resolution (number of bits), maximum ADC input
frequency and the input signal amplitude relative to the ADC
input full scale range. The maximum jitter (the sum of the
jitter from all sources) allowed to prevent a jitter-induced
reduction in SNR is found to be
tJ(MAX) = (VIN(P-P)/VINFSR) x (1/(2(N+1) x π x fIN))
where tJ(MAX) is the rms total of all jitter sources in seconds,
VIN(P-P) is the peak-to-peak analog input signal, VINFSR is the
full-scale range of the ADC, "N" is the ADC resolution in bits
and fIN is the maximum input frequency, in Hertz, to the ADC
analog input.
Note that the maximum jitter described above is the arithmetic sum of the jitter from all sources, including that in the
ADC clock, that added by the system to the ADC clock and
input signals and that added by the ADC itself. Since the
effective jitter added by the ADC is beyond user control, the
best the user can do is to keep the sum of the externally
added clock jitter and the jitter added by the analog circuitry
to the analog signal to a minimum.
Clock amplitudes above those specified in the Electrical
Characteristics Table may result in increased input offset
voltage. This would cause the converter to produce an output code other than the expected 127/128 when both input
pins are at the same potential.
2.2.3 Full-Scale Input Range
As with all A/D Converters, the input range is determined by
the value of the ADC’s reference voltage. The reference
voltage of the ADC08D500 is derived from an internal bandgap reference. The FSR pin controls the effective reference
voltage of the ADC08D500 such that the differential full-scale
input range at the analog inputs is 870 mVP-P with the FSR
pin high, or is 650 mVP-P with FSR pin low. Best SNR is
obtained with FSR high, but better distortion and SFDR are
obtained with the FSR pin low.
2.3 THE CLOCK INPUTS
The ADC08D500 has differential LVDS clock inputs, CLK+
and CLK-, which must be driven with an a.c. coupled, differential clock signal. Although the ADC08D500 is tested and
its performance is guaranteed with a differential 500 MHz
clock, it typically will function well with clock frequencies
indicated in the Electrical Characteristics Table. The clock
inputs are internally terminated and biased. The clock signal
must be capacitively coupled to the clock pins as indicated in
Figure 14.
Operation up to the sample rates indicated in the Electrical
Characteristics Table is typically possible if the maximum
ambient temperatures indicated are not exceeded. Operating at higher sample rates than indicated for the given ambient temperature may result in reduced device reliability
and product lifetime. This is because of the higher power
consumption and die temperatures at high sample rates.
Important also for reliability is proper thermal management .
See Section 2.6.2.
2.4 CONTROL PINS
Six control pins (without the use of the serial interface)
provide a wide range of possibilities in the operation of the
ADC08D500 and facilitate its use. These control pins provide
27
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ADC08D500
2.0 Applications Information
begin when it is not desired. As mentioned in section 1.1.1
for best performance, a self calibration should be performed
20 seconds or more after power up and repeated when the
operating temperature changes significantly according to the
particular system performance requirements. ENOB drops
slightly as junction temperature increases and executing a
new self calibration cycle will essentially eliminate the
change.
(Continued)
Full-Scale Input Range setting, Self Calibration, Calibration
Delay, Output Edge Synchronization choice, LVDS Output
Level choice and a Power Down feature.
2.4.1 Full-Scale Input Range Setting
The input full-scale range can be selected to be either 650
mVP-P or 870 mVP-P, as selected with the FSR control input
(pin 14) in the Normal Mode of operation. In the Extended
Control Mode, the input full-scale range may be set to be
anywhere from 560 mVP-P to 840 mVP-P. See Section 2.2 for
more information.
2.4.2.3 Calibration Delay
The CalDly input (pin 127) is used to select one of two delay
times after the application of power to the start of calibration,
as described in Section 1.1.1. The calibration delay values
allow the power supply to come up and stabilize before
calibration takes place. With no delay or insufficient delay,
calibration would begin before the power supply is stabilized
at its operating value and result in non-optimal calibration
coefficients. If the PD pin is high upon power-up, the calibration delay counter will be disabled until the PD pin is brought
low. Therefore, holding the PD pin high during power up will
further delay the start of the power-up calibration cycle. The
best setting of the CalDly pin depends upon the power-on
settling time of the power supply.
Note that the calibration delay selection is not possible in the
Extended Control mode and the short delay time is used.
2.4.2 Self Calibration
The ADC08D500 self-calibration must be run to achieve
specified performance. The calibration procedure is run
upon power-up and can be run any time on command. The
calibration procedure is exactly the same whether there is a
clock present upon power up or if the clock begins some time
after application of power. The CalRun output indicator is
high while a calibration is in progress.
2.4.2.1 Power-On Calibration
Power-on calibration begins after a time delay following the
application of power. This time delay is determined by the
setting of CalDly, as described in the Calibration Delay Section, below.
The calibration process will be not be performed if the CAL
pin is high at power up. In this case, the calibration cycle will
not begin until the on-command calibration conditions are
met. The ADC08D500 will function with the CAL pin held
high at power up, but no calibration will be done and performance will be impaired. A manual calibration, however, may
be performed after powering up with the CAL pin high. See
On-Command Calibration Section 2.4.2.2.
The internal power-on calibration circuitry comes up in an
unknown logic state. If the clock is not running at power up
and the power on calibration circuitry is active, it will hold the
analog circuitry in power down and the power consumption
will typically be less than 200 mW. The power consumption
will be normal after the clock starts.
2.4.3 Output Edge Synchronization
DCLK signals are available to help latch the converter output
data into external circuitry. The output data can be synchronized with either edge of these clock signals. That is, the
output data transition can be set to occur with either the
rising edge or the falling edge of the DCLK signal, so that
either edge of that clock signal can be used to latch the
output data into the receiving circuit.
When OutEdge (pin 4) is high, the output data is synchronized with (changes with) the rising edge of the DCLK+ (pin
82). When OutEdge is low, the output data is synchronized
with the falling edge of DCLK+.
At the very high speeds of which the ADC08D500 is capable,
slight differences in the lengths of the clock and data lines
can mean the difference between successful and erroneous
data capture. The OutEdge pin is used to capture data on
the DCLK edge that best suits the application circuit and
layout.
2.4.2.2 On-Command Calibration
An on-command calibration may be run at any time in NORMAL (non-DES) mode only. Do not run a calibration while
operating the ADC in Auto DES Mode.
If the ADC is operating in Auto DES mode and a calibration
cycle is required then the controlling application should bring
the ADC into normal (non DES) mode before an On Command calibration is initiated. Once calibration has completed,
the ADC can be put back into Auto DES mode.
To initiate an on-command calibration, bring the CAL pin high
for a minimum of 80 input clock cycles after it has been low
for a minimum of 80 input clock cycles. Holding the CAL pin
high upon power up will prevent execution of power-on
calibration until the CAL pin is low for a minimum of 80 input
clock cycles, then brought high for a minimum of another 80
input clock cycles. The calibration cycle will begin 80 input
clock cycles after the CAL pin is thus brought high. The
CalRun signal should be monitored to determine when the
calibration cycle has completed.
The minimum 80 input clock cycle sequences are required to
ensure that random noise does not cause a calibration to
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2.4.4 LVDS Output Level Control
The output level can be set to one of two levels with OutV
(pin3). The strength of the output drivers is greater with OutV
high. With OutV low there is less power consumption in the
output drivers, but the lower output level means decreased
noise immunity.
For short LVDS lines and low noise systems, satisfactory
performance may be realized with the FSR input low. If the
LVDS lines are long and/or the system in which the
ADC08D500 is used is noisy, it may be necessary to tie the
FSR pin high.
2.4.5 Dual Edge Sampling
The Dual Edge Sampling (DES) feature causes one of the
two input pairs to be routed to both ADCs. The other input
pair is deactivated. One of the ADCs samples the input
signal on one clock edge, the other samples the input signal
on the other clock edge. The result is a 1:4 demultiplexed
output with a sample rate that is twice the input clock frequency.
28
results available on just one of the the two LVDS buses and
a 200 MHz input clock, decimating the 200 MSPS data by
two.
There is one LVDS output clock pair (DCLK+/-) available for
use to latch the LVDS outputs on all buses. Whether the data
is sent at the rising or falling edge of DCLK is determined by
the sense of the OutEdge pin, as described in Section 2.4.3.
DDR (Double Data Rate) clocking can also be used. In this
mode a word of data is presented with each edge of DCLK,
reducing the DCLK frequency to 1/4 the input clock frequency. See the Timing Diagram section for details.
The OutV pin is used to set the LVDS differential output
levels. See Section 2.4.4.
(Continued)
To use this feature in the non-enhanced control mode, allow
pin 127 to float and the signal at the "I" channel input will be
sampled by both converters. The Calibration Delay will then
only be a short delay.
In the enhanced control mode, either input may be used for
dual edge sampling. See Section 1.1.5.1.
IMPORTANT NOTES:
1) For the Extended Control Mode - When using the Automatic Clock Phase Control feature in dual edge sampling
mode, it is important that the automatic phase control is
disabled (set bit 14 of DES Enable register Dh to 0) before
the ADC is powered up. Not doing so may cause the device
not to wakeup from the powerdown state.
2) For the Non-Extended Control Mode - When the
ADC08D1000 is powered up and DES mode is required,
ensure that pin 127 (CalDly/DES/SCS) is initially pulled low
during or after the power up sequence. The pin can then be
allowed to float or be tied to VA / 2 to enter the DES mode.
This will ensure that the part enters the DES mode correctly.
The output format is Offset Binary. Accordingly, a full-scale
input level with VIN+ positive with respect to VIN− will produce an output code of all ones, a full-scale input level with
VIN− positive with respect to VIN+ will produce an output
code of all zeros and when VIN+ and VIN− are equal, the
output code will vary between codes 127 and 128.
2.6 POWER CONSIDERATIONS
A/D converters draw sufficient transient current to corrupt
their own power supplies if not adequately bypassed. A 33
µF capacitor should be placed within an inch (2.5 cm) of the
A/D converter power pins. A 0.1 µF capacitor should be
placed as close as possible to each VA pin, preferably within
one-half centimeter. Leadless chip capacitors are preferred
because they have low lead inductance.
The VA and VDR supply pins should be isolated from each
other to prevent any digital noise from being coupled into the
analog portions of the ADC. A ferrite choke, such as the JW
Miller FB20009-3B, is recommended between these supply
lines when a common source is used for them.
As is the case with all high speed converters, the
ADC08D500 should be assumed to have little power supply
noise rejection. Any power supply used for digital circuitry in
a syatem where a lot of digital power is being consumed
should not be used to supply power to the ADC08D500. The
ADC supplies should be the same supply used for other
analog circuitry, if not a dedicated supply.
3) The automatic phase control should also be disabled if the
input clock is interrupted or stopped for any reason.This is
also the case if a large abrupt change in the clock frequency
occurs.
4) If a calibration of the ADC is required in Auto DES mode,
the device must be returned to the Normal Mode of operation
before performing a calibration cycle. Once the Calibration
has been completed, the device can be returned to the Auto
DES mode and operation can resume.
2.4.6 Power Down Feature
The Power Down pins (PD and PDQ) allow the ADC08D500
to be entirely powered down (PD) or the "Q" channel to be
powered down and the "I" channel to remain active. See
Section 1.1.7 for details on the power down feature.
The digital data (+/-) output pins are put into a high impedance state when the PD pin for the respective channel is
high. Upon return to normal operation, the pipeline will contain meaningless information and must be flushed.
2.6.1 Supply Voltage
If the PD input is brought high while a calibration is running,
the device will not go into power down until the calibration
sequence is complete. However, if power is applied and PD
is already high, the device will not begin the calibration
sequence until the PD input goes low. If a manual calibration
is requested while the device is powered down, the calibration will not begin at all. That is, the manual calibration input
is completely ignored in the power down state.
The ADC08D500 is specified to operate with a supply voltage of 1.9V ± 0.1V. It is very important to note that, while this
device will function with slightly higher supply voltages,
these higher supply voltages may reduce product lifetime.
No pin should ever have a voltage on it that is in excess of
the supply voltage or below ground by more than 150 mV,
not even on a transient basis. This can be a problem upon
application of power and power shut-down. Be sure that the
supplies to circuits driving any of the input pins, analog or
digital, do not come up any faster than does the voltage at
the ADC08D500 power pins.
The Absolute Maximum Ratings should be strictly observed,
even during power up and power down. A power supply that
produces a voltage spike at turn-on and/or turn-off of power
can destroy the ADC08D500. The circuit of Figure 15 will
provide supply overshoot protection.
Many linear regulators will produce output spiking at
power-on unless there is a minimum load provided. Active
devices draw very little current until their supply voltages
reach a few hundred millivolts. The result can be a turn-on
spike that can destroy the ADC08D500, unless a minimum
2.5 THE DIGITAL OUTPUTS
The ADC08D1000 demultiplexes the output data of each of
the two ADCs on the die onto two LVDS output buses (total
of four buses, two for each ADC). For each of the two
converters, the results of successive conversions started on
the odd falling edges of the CLK+ pin are available on one of
the two LVDS buses, while the results of conversions started
on the even falling edges of the CLK+ pin are available on
the other LVDS bus. This means that, the word rate at each
LVDS bus is 1/2 the ADC08D1000 input clock rate and the
two buses must be multiplexed to obtain the entire 1 GSPS
conversion result.
Since the minimum recommended input clock rate for this
device is 200 MSPS (normal non DES mode), the effective
rate can be reduced to as low as 100 MSPS by using the
29
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ADC08D500
2.0 Applications Information
ADC08D500
2.0 Applications Information
the exposed pad of the package and be located such that the
exposed pad of the device is entirely over that thermal land
pattern. This thermal land pattern should be electrically connected to ground. A clearance of at least 0.5 mm should
separate this land pattern from the mounting pads for the
package pins.
(Continued)
load is provided for the supply. The 100Ω resistor at the
regulator output provides a minimum output current during
power-up to ensure there is no turn-on spiking.
In the circuit of Figure 15, an LM317 linear regulator is
satisfactory if its input supply voltage is 4V to 5V . If a 3.3V
supply is used, an LM1086 linear regulator is recommended.
20121454
FIGURE 15. Non-Spiking Power Supply
20121421
The output drivers should have a supply voltage, VDR, that is
within the range specified in the Operating Ratings table.
This voltage should not exceed the VA supply voltage.
If the power is applied to the device without a clock signal
present, the current drawn by the device might be below 200
mA. This is because the ADC08D500 gets reset through
clocked logic and its initial state is random. If the reset logic
comes up in the "on" state, it will cause most of the analog
circuitry to be powered down, resulting in less than 100 mA
of current draw. This current is greater than the power down
current because not all of the ADC is powered down. The
device current will be normal after the clock is established.
FIGURE 16. Recommended Package Land Pattern
Since a large aperture opening may result in poor release,
the aperture opening should be subdivided into an array of
smaller openings, similar to the land pattern of Figure 16.
To minimize junction temperature, it is recommended that a
simple heat sink be built into the PCB. This is done by
including a copper area of about 2 square inches (6.5 square
cm) on the opposite side of the PCB. This copper area may
be plated or solder coated to prevent corrosion, but should
not have a conformal coating, which could provide some
thermal insulation. Thermal vias should be used to connect
these top and bottom copper areas. These thermal vias act
as "heat pipes" to carry the thermal energy from the device
side of the board to the opposite side of the board where it
can be more effectively dissipated. The use of 9 to 16
thermal vias is recommended.
The thermal vias should be placed on a 1.2 mm grid spacing
and have a diameter of 0.30 to 0.33 mm. These vias should
be barrel plated to avoid solder wicking into the vias during
the soldering process as this wicking could cause voids in
the solder between the package exposed pad and the thermal land on the PCB. Such voids could increase the thermal
resistance between the device and the thermal land on the
board, which would cause the device to run hotter.
If it is desired to monitor die temperature, a temperature
sensor may be mounted on the heat sink area of the board
near the thermal vias. .Allow for a thermal gradient between
the temperature sensor and the ADC08D500 die of θJ-PAD
times typical power consumption = 2.8 x 1.6 = 4.5˚C. Allowing for a 5.5˚C (including an extra 1˚C) temperature drop
from the die to the temperature sensor, then, would mean
that maintaining a maximum pad temperature reading of
124.5˚C will ensure that the die temperature does not exceed 130˚C, assuming that the exposed pad of the
ADC08D500 is properly soldered down and the thermal vias
are adequate. (The inaccuracy of the temperature sensor is
addtional to the above calculation).
2.6.2 Thermal Management
The ADC08D500 is capable of impressive speeds and performance at very low power levels for its speed. However,
the power consumption is still high enough to require attention to thermal management. For reliability reasons, the die
temperature should be kept to a maximum of 130˚C. That is,
TA (ambient temperature) plus ADC power consumption
times θJA (junction to ambient thermal resistance) should not
exceed 130˚C. This is not a problem if the ambient temperature is kept to a maximum of +85˚C as specified in the
Operating Ratings section.
Please note that the following are general recommendations
for mounting exposed pad devices onto a PCB. This should
be considered the starting point in PCB and assembly process development. It is recommended that the process be
developed based upon past experience in package mounting.
The package of the ADC08D500 has an exposed pad on its
back that provides the primary heat removal path as well as
excellent electrical grounding to the printed circuit board.
The land pattern design for lead attachment to the PCB
should be the same as for a conventional LQFP, but the
exposed pad must be attached to the board to remove the
maximum amount of heat from the package, as well as to
ensure best product parametric performance.
To maximize the removal of heat from the package, a thermal land pattern must be incorporated on the PC board
within the footprint of the package. The exposed pad of the
device must be soldered down to ensure adequate heat
conduction out of the package. The land pattern for this
exposed pad should be at least as large as the 5 x 5 mm of
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30
2.9.1 Non-Extended Control Mode Operation
Non-extended control mode operation means that the Serial
Interface is not active and all controllable functions are controlled with various pin settings. That is, the full-scale range,
single-ended or differential input and input coupling (a.c. or
d.c.) are all controlled with pin settings. The non-extended
control mode is used by setting pin 14 high or low, as
opposed to letting it float. Table 6 indicates the pin functions
of the ADC08D500 in the non-extended control mode.
(Continued)
2.7 LAYOUT AND GROUNDING
Proper grounding and routing of all signals are essential to
ensure accurate conversion. A single ground plane should
be used instead of splitting the ground plane into analog and
digital areas.
Since digital switching transients are composed largely of
high frequency components, the skin effect tells us that total
ground plane copper weight will have little effect upon the
logic-generated noise. Total surface area is more important
than is total ground plane volume. Coupling between the
typically noisy digital circuitry and the sensitive analog circuitry can lead to poor performance that may seem impossible to isolate and remedy. The solution is to keep the
analog circuitry well separated from the digital circuitry.
High power digital components should not be located on or
near any linear component or power supply trace or plane
that services analog or mixed signal components as the
resulting common return current path could cause fluctuation
in the analog input “ground” return of the ADC, causing
excessive noise in the conversion result.
Generally, we assume that analog and digital lines should
cross each other at 90˚ to avoid getting digital noise into the
analog path. In high frequency systems, however, avoid
crossing analog and digital lines altogether. Clock lines
should be isolated from ALL other lines, analog AND digital.
The generally accepted 90˚ crossing should be avoided as
even a little coupling can cause problems at high frequencies. Best performance at high frequencies is obtained with a
straight signal path.
TABLE 6. Non-Extended Control Mode Operation (Pin
14 High or Low)
Pin
Low
High
Floating
3
0.51 VP-P
Output
0.71 VP-P
Output
n/a
4
OutEdge =
Neg
OutEdge =
Pos
DDR
127
CalDly Low
CalDly High
DES
870 mVP-P
input range
Extended
Control
Mode
14
650 mVP-P
input range
Pin 3 can be either high or low in the non-extended control
mode. Pin 14 must not be left floating to select this mode.
See Section 1.2 for more information.
Pin 4 can be high or low or can be left floating in the
non-extended control mode. In the non-extended control
mode, pin 4 high or low defines the edge at which the output
data transitions. See Section 2.4.3 for more information. If
this pin is floating, the output clock (DCLK) is a DDR (Double
Data Rate) clock (see Section 1.1.5.3) and the output edge
synchronization is irrelevant since data is clocked out on
both DCLK edges.
The analog input should be isolated from noisy signal traces
to avoid coupling of spurious signals into the input. This is
especially important with the low level drive required of the
ADC08D500. Any external component (e.g., a filter capacitor) connected between the converter’s input and ground
should be connected to a very clean point in the analog
ground plane. All analog circuitry (input amplifiers, filters,
etc.) should be separated from any digital components.
Pin 127, if it is high or low in the non-extended control mode,
sets the calibration delay. If pin 127 is floating, the calibration
delay is the same as it would be with this pin low and the
converter performs dual edge sampling (DES).
TABLE 7. Extended Control Mode Operation (Pin 14
Floating)
2.8 DYNAMIC PERFORMANCE
The ADC08D500 is a.c. tested and its dynamic performance
is guaranteed. To meet the published specifications and
avoid jitter-induced noise, the clock source driving the CLK
input must exhibit low rms jitter. The allowable jitter is a
function of the input frequency and the input signal level, as
described in Section 2.3.
It is good practice to keep the ADC clock line as short as
possible, to keep it well away from any other signals and to
treat it as a transmission line. Other signals can introduce
jitter into the clock signal. The clock signal can also introduce
noise into the analog path if not isolated from that path.
Best dynamic performance is obtained when the exposed
pad at the back of the package has a good connection to
ground. This is because this path from the die to ground is a
lower impedance than offered by the package pins.
Pin
Function
3
SCLK (Serial Clock)
4
SDATA (Serial Data)
127
SCS (Serial Interface Chip Select)
2.10 COMMON APPLICATION PITFALLS
Driving the inputs (analog or digital) beyond the power
supply rails. For device reliability, no input should not go
more than 150 mV below the ground pins or 150 mV above
the supply pins. Exceeding these limits on even a transient
basis may not only cause faulty or erratic operation, but may
impair device reliability. It is not uncommon for high speed
digital circuits to exhibit undershoot that goes more than a
volt below ground. Controlling the impedance of high speed
lines and terminating these lines in their characteristic impedance should control overshoot.
Care should be taken not to overdrive the inputs of the
ADC08D500. Such practice may lead to conversion inaccuracies and even to device damage.
Incorrect analog input common mode voltage in the d.c.
coupled mode. As discussed in section 1.1.4 and 2.2, the
2.9 USING THE SERIAL INTERFACE
The ADC08D500 may be operated in the non-extended
control (non-Serial Interface) mode or in the extended control mode. Table 6 and Table 7 describe the functions of pins
3, 4, 14 and 127 in the non-extended control mode and the
extended control mode, respectively.
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ADC08D500
2.0 Applications Information
ADC08D500
2.0 Applications Information
Driving the clock input with an excessively high level
signal. The ADC clock level should not exceed the level
described in the Operating Ratings Table or the input offset
could change.
(Continued)
Input common mode voltage must remain within 50 mV of
the VCMO output , which has a variability with temperature
that must also be tracked. Distortion performance will be
degraded if the input common mode voltage is more than 50
mV from VCMO .
Inadequate clock levels. As described in Section 2.3, insufficient clock levels can result in poor performance. Excessive
clock levels could result in the introduction of an input offset.
Using a clock source with excessive jitter, using an
excessively long clock signal trace, or having other
signals coupled to the clock signal trace. This will cause
the sampling interval to vary, causing excessive output noise
and a reduction in SNR performance.
Using an inadequate amplifier to drive the analog input.
Use care when choosing a high frequency amplifier to drive
the ADC08D500 as many high speed amplifiers will have
higher distortion than will the ADC08D500, resulting in overall system performance degradation.
Driving the VBG pin to change the reference voltage. As
mentioned in Section 2.1, the reference voltage is intended
to be fixed to provide one of two different full-scale values
(650 mVP-P and 870 mVP-P). Over driving this pin will not
change the full scale value, but can otherwise upset operation.
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Failure to provide adequate heat removal. As described in
Section 2.6.2, it is important to provide adequate heat removal to ensure device reliability. This can either be done
with adequate air flow or the use of a simple heat sink built
into the board. The backside pad should be grounded for
best performance.
32
inches (millimeters) unless otherwise noted
NOTES: UNLESS OTHERWISE SPECIFIED
REFERENCE JEDEC REGISTRATION MS-026, VARIATION BFB.
128-Lead Exposed Pad LQFP
Order Number ADC08D500CIYB
NS Package Number VNX128A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
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High Performance, Low Power, Dual 8-Bit, 500 MSPS A/D Converter
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