INFINEON PEB20324

ICs for Communications
Multichannel Network Interface Controller for HDLC + Extensions
MUNICH128X
PEB 20324 Version 2.2
Hardware Reference Manual 04.99
DS 1
•
PEB 20324, PEF 20324
Revision History:
Current Version: 04.99
Previous Version:
Product Overview 12/97 DS3
Page
Page
(in previous (in current
Version)
Version)
Subjects (major changes since last revision)
Chapter 6
Updated.
Chapter 5
Tables 1...8 Tables 2-1
...2-8
Pin Description Tables updated.
For questions on technology, delivery and prices please contact the Infineon Technologies Offices
in Germany or the Infineon Technologies Companies and Representatives worldwide:
see our webpage at http://www.infineon.com
•
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Edition 04.99
Published by Infineon Technologies AG i. Gr.,
SC,
Balanstraße 73,
81541 München
© Infineon Technologies AG i.Gr. 1999.
All Rights Reserved.
Attention please!
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applications, processes and circuits implemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics.
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question please contact your nearest Infineon Technologies Office.
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Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems2 with
the express written approval of the Infineon Technologies AG.
1 A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that
device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
PEB 20324
PEF 20324
Preface
The MUNICH128X is a 128-channel WAN Protocol Controller which provides four
independent 24/32-channel HDLC controllers, each with a dedicated 64-channel DMA
Controller and a Serial PCM Interface Controller. The device is offered in a 160pin MQFP package, making it ideal for high-port-density applications.
Organization of this Document
This Hardware Reference Manual is divided into 7 chapters. It is organized as follows:
• Chapter 1, Introduction
Gives a general description of the product and its family, lists the key features, and
presents some typical applications.
• Chapter 2, Pin Description
Lists pin locations with associated signals, categorizes signals according to function,
and describes signals.
• Chapter 3, Functional IC Description
Gives a general functional overview of the MUNICH128X.
• Chapter 4, Electrical Characteristics
Gives a detailed description of all electrical DC and AC characteristics and provides
timing diagrams and values for all interfaces.
• Chapter 5, Test Modes
Gives a detailed description of the JTAG boundary scan interface.
• Chapter 6, Package Outline
Related Documentation
MUNICH128X Version 2.2
Prpgrammer’s Reference Manual 03.99 DS1
Hardware Reference Manual
3
04.99
PEB 20324
PEF 20324
Table of Contents
Page
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1
1.1
1.2
1.3
1.4
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Differences to the MUNICH32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
2
2.1
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Pin Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
3
3.1
3.2
3.3
3.4
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
System Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
4
4.1
Operational Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Operational Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
5
5.1
5.2
5.3
5.4
5.5
5.6
5.6.1
5.6.1.1
5.6.1.2
5.6.1.3
5.6.2
5.6.3
5.6.4
5.6.5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Important Electrical Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Thermal Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Capacitances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
PCI Bus Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
PCI Read Transaction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
PCI Write Transaction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
PCI Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
De-multiplexed Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
PCM Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
System Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
JTAG-Boundary Scan Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
6
6.1
Test Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Boundary Scan Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
7
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
Hardware Reference Manual
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PEB 20324
PEF 20324
List of Figures
Figure 1-1
Figure 1-2
Figure 1-3
Figure 1-4
Figure 2-1
Figure 3-1
Figure 3-1
Figure 3-2
Figure 5-1
Figure 5-2
Figure 5-1
Figure 5-2
Figure 5-3
Figure 5-4
Figure 5-5
Figure 5-6
Figure 5-7
Figure 5-8
Figure 5-9
Figure 5-10
Figure 5-11
Figure 6-1
Page
Simplified Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
System Integration of the MUNICH128X in PCI-Based System . . . . . .12
System Integration of the MUNICH128X in De-multiplexed System . . .13
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
System Integration of the MUNICH128X in PCI-Based System . . . . . .34
System Integration of the MUNICH128X in De-multiplexed System . . .35
Power-up and Power-down scenarios . . . . . . . . . . . . . . . . . . . . . . . . . .37
Power-Failure scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Input/Output Waveform for AC Tests. . . . . . . . . . . . . . . . . . . . . . . . . . .43
PCI Output Timing Measurement Waveforms . . . . . . . . . . . . . . . . . . . .44
PCI Input Timing Measurement Waveforms . . . . . . . . . . . . . . . . . . . . .44
PCI Read Transaction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
PCI Write Transaction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
PCI Clock Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Master Single READ Transaction followed by a Master Single
WRITE Transaction in De-multiplexed Bus Configuration . . . . . . . . . . .51
Master Burst WRITE/READ Access in De-multiplexed Bus
Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
PCM Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
System Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
JTAG-Boundary Scan Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
Block Diagram of Test Access Port and Boundary Scan . . . . . . . . . . . .57
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PEB 20324
PEF 20324
List of Tables
Table 2-1
Table 2-2
Table 2-3
Table 2-4
Table 2-5
Table 2-6
Table 2-7
Table 2-8
Table 5-1
Table 5-2
Table 5-3
Table 5-4
Table 5-5
Table 5-6
Table 5-7
Table 5-8
Table 5-9
Table 5-10
Table 5-11
Table 5-12
Table 5-13
Table 6-1
Table 6-2
Page
Pin Descriptions by Functional Block: Port 0 Serial Interface . . . . . . .
Pin Descriptions by Functional Block: Port 1 Serial Interface . . . . . . .
Pin Descriptions by Functional Block: Port 2 Serial Interface . . . . . . .
Pin Descriptions by Functional Block: Port 3 Serial Interface . . . . . . .
Pin Descriptions by Functional Block: PCI Interface . . . . . . . . . . . . . .
Pin Descriptions by Functional Block:
DEMUX Interface (additional signals to PCI Interface) . . . . . . . . . . . .
Pin Descriptions by Functional Block: Power Supply. . . . . . . . . . . . . .
Pin Descriptions by Functional Block: Test Interface . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Non-PCI Interface Pins
TA = 0 to + 70×C; VDD5 = 5 V ± 5%, VDD3 = 3.3 V ± 0.3 V,
VSS = 0 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Non-PCI Interface Pins
TA = 25×C; VDD5 = 5 V ± 5%, VDD3 = 3.3 V ± 0.3 V, VSS = 0 V . . .
PCI Input and Output Measurement Conditions . . . . . . . . . . . . . . . . .
Number of Wait States Inserted by the MUNICH128X as Initiator. . . .
Number of Wait States Inserted by the MUNICH128X as Slave . . . . .
PCI Clock Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCI Interface Signal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Additional De-multiplexed Interface Signal Characteristics . . . . . . . . .
PCM Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JTAG-Boundary Scan Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Boundary Scan Sequence in MUNICH128X . . . . . . . . . . . . . . . . . . . .
Boundary Scan Test Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hardware Reference Manual
6
17
18
19
20
21
25
26
27
39
39
41
42
44
48
48
49
50
52
54
55
56
58
62
04.99
PEB 20324
PEF 20324
Introduction
1
Introduction
The MUNICH128X is a 128-channel WAN Protocol Controller which provides four
independent 24/32-channel HDLC controllers, each with a dedicated 64-channel DMA
Controller and a Serial PCM Interface Controller. The device is offered in a 160pin MQFP package, making it ideal for high-port-density applications.
The MUNICH128X provides capability for up to 128 full duplex serial PCM channels. The
chip performs layer 2 HDLC formatting/deformatting or V.110 or X.30 protocols up to
a data rate of 38.4 kbit/s (V.110) or 64 kbit/s (HDLC). The MUNICH128X also performs
transparent transmission for DMI modes 0, 1, and 2. Processed data is transferred to
host memory via the PCI interface or de-multiplexed bus interface.
The MUNICH128X is compatible with the LAPD ISDN (Integrated Services Digital
Network) protocol specified by CCITT, as well as with HDLC, SDLC, LAPB and DMI
protocols. It provides rate adaptation for time slot transmission from 64 kbit/s down to
8 kbit/s and the concatenation of time slots, supporting the ISDN H0, H11, H12
superchannels.
PCM
PCM
PCM
PCM
Serial
Interface
Serial
Interface
Serial
Interface
Serial
Interface
Protocol
Controller
Protocol
Controller
Protocol
Controller
Protocol
Controller
DMA
Controller
DMA
Controller
DMA
Controller
DMA
Controller
PCI Interface/DEMUX BUS
Address/Data
Figure 1-1
Control
ITB10007
Simplified Block Diagram
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Multichannel Network Interface Controller for HDLC +
Extensions
MUNICH128X
PEB 20324
Version 2.2
1.1
CMOS
Features
Four independent 24/32-channel HDLC
Controllers with common PCI interface.
PCM
Each of them provides:
• Dedicated 1024 byte Tx Buffer
• Dedicated 1024 byte Rx Buffer
• Dedicated Serial PCM Interface Controller
– T1 rates: 1.536, 1.544, 3.088, 6.176 Mbit/s
– E1 rates: 2.048, 4.096, 8.192 Mbit/s
P-MQFP-160-1
• Dedicated 64-channel DMA Controller
– Supports linked-list buffer processing
– 16-DWord Tx DMA FIFO
– 16-DWord Rx DMA FIFO
– 4-DWord burst of Rx descriptors
– 3-DWord burst of Tx descriptors
– n-DWord burst of configuration blocks
(n is unlimited according the MUNICH128X, but internal port arbitration may lead to
a lower typical burst size of 4 or 8 DWords)
• Dynamic Programmable Channel Allocation
– Compatible with T1/DS1 24-channel and CEPT 32-channel PCM byte format
– Concatenation of any, not necessarily consecutive, time slots to superchannels
independently for receive and transmit direction
– Support of H0, H11, H12 ISDN-channels
– Subchanneling on each time slot possible
Type
Package
PEB 20324
P-MQFP-160-1
PEF 20324
P-MQFP-160-1
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PEB 20324
PEF 20324
Introduction
• Bit Processor Functions (adjustable for each channel)
– HDLC Protocol
– Automatic flag detection
– Shared opening and closing flag
– Detection of interframe-time-fill change, generation of
interframe-time-fill ‘1’s or flags
– Zero bit insertion
– Flag stuffing and flag adjustment for rate adaption
– CRC generation and checking (16 or 32 bits)
– Transparent CRC option per channel and/or per message
– Error detection (abort, long frame, CRC error, 2 categories
of short frames, non-octet frame content)
– ABORT/IDLE flag generation
– V.110/X.30 Protocol
– Automatic synchronization in receive direction, automatic generation of
the synchronization pattern in transmit direction
– E/S/X bits freely programmable in transmit direction, may be changed
during transmission; changes monitored and reported in receive direction
– Generation/detection of loss of synchronism
– Bit framing with network data rates from 600 bit/s up to 38.4 Kbit/s
– Transparent Mode A
– Slot synchronous transparent transmission/reception without frame structure
– Flag generation, flag stuffing, flag extraction, flag generation
in the abort case with programmable flag
– Synchronized data transfer for fractional T1/PRI channels
– Transparent Mode B
– Transparent transmission/reception in frames delimited by 00H flags
– Shared opening and closing flag
– Flag stuffing, flag detection, flag generation in the abort case
– Error detection (non octet frame content, short frame, long frame)
– Transparent Mode R
– Transparent transmission/reception with GSM 08.60 frame structure
– Automatic 0000H flag generation/detection
– Support of 40, 391/2, 401/2 octet frames
– Error detection (non octet frame contents, short frame, long frame)
– Protocol Independent
– Channel inversion (data, flags, IDLE code)
– Format conventions as in CCITT Q.921 § 2.8
– Data over- and underflow detected
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Introduction
•
•
•
•
•
32 Bit / 33 MHz PCI 2.1 Interface
32 Bit / 33 MHz De-multiplexed Bus Interface Option
0.5 µm, 3.3 V-Optimized Technology
3.3 V I/O Capability with 5.0 V Input Tolerance
160-pin MQFP Package
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PEF 20324
Introduction
1.2
Logic Symbol
•
TCK
TMS
TDI
TDO
TRST
TEST
VSS
VDD3
VDD5
JTAG Test
Interface
AD(31:0)
TxD0
RxD0
TSP0
RSP0
TXDEN0
TxCLK0
RxCLK0
C/BE(3:0)
PCI
BUS
PAR
FRAME
IRDY
TRDY
STOP
IDSEL
DEVSEL
PERR
SERR
REQ
GNT
MUNICH128X
PEB 20324
PEF 20324
Serial
Channel 0
(PCM0)
Serial
Channel 1
(PCM1)
CLK
RST
INTA
Serial
Channel 2
(PCM2)
Serial
Channel 3
(PCM3)
A(27:2)
DPCI(1:0) W/R
(de-multiplexed address bus)
Control and Address Bus Extension
for De-multiplexed Bus Interface
Figure 1-2
Logic Symbol
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PEB 20324
PEF 20324
Introduction
1.3
Typical Applications
The MUNICH128X provides protocol processing and host memory buffer management
for four independent T1/E1 PRI ports. As such, the MUNICH128X fits into a system
between the framer or LIU/framer devices (e.g., the Siemens FALC®54/FALC®54-LH
transceiver) and the host bus (e.g. PCI Bus), as illustrated in Figure 1-3.
The MUNICH128X provides four independent Serial PCM ports which connect directly
into the framer devices. In PCI based systems a dedicated microcontroller or PCI bridge
chip is necessary to configure the framer or LIU/framer devices.
Additionally, the MUNICH128X provides a PCI 2.1 interface which connects directly to
the system PCI bus. Optionally, this bus can be configured in De-multiplexed Mode.
T1/E1/PRI
R
FALC 54 /
R
FALC -LH
Transceiver
Dedicated
CPU
T1/E1/PRI
T1/E1/PRI
R
R
FALC 54 /
R
FALC -LH
Transceiver
FALC 54 /
R
FALC -LH
Transceiver
T1/E1/PRI
R
FALC 54 /
R
FALC -LH
Transceiver
MUNICH128X
PCI BUS
PCI Bridge
Chip
Host
Memory
Processor
ITS10009
Figure 1-3
System Integration of the MUNICH128X in PCI-Based System
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Introduction
T1/E1/PRI
R
FALC 54 /
R
FALC -LH
Transceiver
T1/E1/PRI
T1/E1/PRI
R
R
FALC 54 /
R
FALC -LH
Transceiver
FALC 54 /
R
FALC -LH
Transceiver
T1/E1/PRI
R
FALC 54 /
R
FALC -LH
Transceiver
MUNICH128X
Glue Logic
De-multiplexed BUS
Processor
Host
Memory
ITS10010
Figure 1-4
System Integration of the MUNICH128X in De-multiplexed System
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PEF 20324
Introduction
1.4
Differences to the MUNICH32
• 128-channel capability
• Symmetrical Rx and Tx Buffer Descriptor formats for faster switching
• Improved Tx idle channel polling process for significantly reducing bus occupancy of
idle Tx channels
• Dedicated 1024 byte Tx Buffer
• Dedicated 1024 byte Rx Buffer
• Burst capability also on transmit and receive data sections (8 DWORDs)
• Additional PCM modes supported: 3.088 MBit/s, 6.176 MBit/s, 8.192 MBit/s
• 32 Bit / 33 MHz PCI 2.1 master/slave interface;
this interface can be configured in De-mux mode
• Separate Rx and Tx Status Queues in host memory
(the MUNICH128X provides one set for each of the four HDLC Controllers)
• Slave access to on-chip registers
• Time Slot-shift capability:
– Programmable from -4 clock edges to +3 clock edges
relative to the synchronization pulse
– Programmable to sample Tx and/or Rx data at either falling or rising edge of clock
• Software initiated action request (via the Command Register)
• Tx End-of-Packet transmitted-on-wire interrupt capability for each channel
• Tx packet size increased to 64 Kbytes (HDLC mode)
• Rx packet size 8 Kbyte limit interrupt disable
• Tx data TRISTATETM control line
• Synchronized data transfer in TMA mode
for complete transparency when using fractional T1/PRI
• Little/Big Endian data formats
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Pin Descriptions
2
Pin Descriptions
2.1
Pin Diagram
(top view)
•
TDO
TRST
VSS
VDD3
TMS
TCK
RxCLK0
RSP0
RxD0
TxDEN0
TxD0
TSP0
TxCLK0
RxCLK1
RSP1
RxD1
VSS
VDD3
VDD3
VSS
TxDEN1
TxD1
TSP1
TxCLK1
RxCLK2
RSP2
RxD2
TxDEN2
TxD2
TSP2
TxCLK2
RxCLK3
VSS
VDD3
RSP3
RxD3
TxDEN3
TxD3
TSP3
TxCLK3
P-MQFP-160-1
120
121
117
114
111
108
105
102
99
96
93
90
87
84
81
80
124
77
127
74
130
71
133
68
136
65
62
139
MUNICH128X
142
59
145
56
148
53
151
50
154
47
157
44
160
1
4
7
10
13
16
19
22
25
28
31
34
37
41
40
IDSEL
AD23
VDD3
VSS
AD22
AD21
AD20
AD19
VDD3
VSS
AD18
AD17
AD16
C/BE2
VDD5
VDD5
VDD3
VSS
FRAME
IRDY
TRDY
DEVSEL
STOP
VDD3
VSS
PERR
SERR
PAR
C/BE1
AD15
VDD3
VSS
AD14
AD13
AD12
AD11
VDD3
VSS
AD10
AD9
TDI
DPCI0
DPCI1
A27
A26
A25
VDD3
VSS
A24
A23
A22
A21
A20
VDD3
VSS
VDD3
VSS
A19
A18
A17
A16
RST
VDD3
VSS
CLK
GNT
REQ
AD31
AD30
VDD3
VSS
AD29
AD28
AD27
AD26
AD25
VDD3
VSS
AD24
C/BE3
Figure 2-1
W/R
A2
VSS
VDD3
A3
A4
A5
A6
VSS
VDD3
A7
A8
A9
A10
A11
VSS
VDD3
VSS
VDD3
A12
A13
A14
A15
INTA
VSS
VDD3
AD0
AD1
AD2
AD3
VSS
VDD3
AD4
AD5
AD6
AD7
VSS
VDD3
C/BE0
AD8
ITP10331
Pin Configuration
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Pin Descriptions
Pin descriptions in Tables 2-1 to 2-8 are grouped by functional block, as shown by the
heading for that group. Pin types are indicated by abbreviations:
Signal Type Definitions:
The following signal type definitions are partly taken from the PCI Specification
Revision 2.1:
I
O
t/s, I/O
s/t/s
Input is a standard input-only signal.
Totem Pole Output is a standard active driver.
Tri-State or I/O is a bi-directional, tri-state input/output pin.
Sustained Tri-State is an active low tri-state signal owned and driven
by one and only one agent at a time. (For further information refer to
the PCI Specification Revision 2.1)
o/d
Open Drain allows multiple devices to share as a wire-OR. A pull-up
is required to sustain the inactive state until another agent drives it,
and must be provided by the central resource.
Signal Name Conventions:
NC
Not Connected Pin
Such pins are not bonded with the silicon. Although any potential at
these pins will not impact the device it is recommended to leave them
unconnected. NC pins might be used for additional functionality in later
versions of the device. Leaving them unconnected will guarentee
hardware compatibility to later device versions.
Reserved
Reserved pins are for vendor specific use only and should be connected
as recommended to guarantee normal operation.
Note: The signal type definition specifies the functional usage of a pin. This does not
reflect necessarily the implementation of a pin, e.g. a pin defined of signal type
‘Input’ may be implemented with a bidirectional pad.
Note: All unused input or I/O pins without internal Pull-Up/Down resistor must be
connected to a defined level either connected to VDD3 /VSS or to a Pull-Up/Down
resistor (<= 10k).
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Pin Descriptions
Table 2-1
Pin Descriptions by Functional Block: Port 0 Serial Interface
Pin No.
Symbol
Type Description
114
RxCLK0
I
Receive Clock 0
The clock input pin used for sampling the data on
RxD0. The MUNICH128X supports the following PCM
clock rates; programmed via the MODE1 register:
T1: 1.536 MHz, 1.544 MHz, 3.088 MHz, 6.176 MHz;
E1: 2.048 MHz, 4.096 MHz, 8.192 MHz.
112
RxD0
I
Receive Data 0
The data input pin which is sampled using RxCLK0.
113
RSP0
I
Receive Synchronization Pulse 0
The input pin used for Rx PCM frame synchronization;
the synchronization pulse marks the first bit in the
PCM frame.
108
TxCLK0
I
Transmit Clock 0
The clock input used for clocking out the data on
TxD0. In most applications, the signal that drives this
pin is externally connected to RxCLK0.
110
TxD0
O
Transmit Data 0
Provides the data which is clocked out of the
MUNICH128X by TxCLK0; data is push-pull for active
bits in the PCM frame and TRISTATE for inactive
bits.
109
TSP0
I
Transmit Synchronization Pulse 0
The input pin used for Tx PCM frame synchronization;
the synchronization pulse marks the last bit in the
PCM frame.
111
TxDEN0
O
Transmit Data Enable 0
An active low output signal which specifies data on the
TxD0 output pin is valid.
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Pin Descriptions
Table 2-2
Pin Descriptions by Functional Block: Port 1 Serial Interface
Pin No.
Symbol
Type Description
107
RxCLK1
I
Receive Clock 1
The clock input pin used for sampling the data on
RxD1 The MUNICH128X supports the following PCM
clock rates, programmed via the MODE1 register:
T1: 1.536 MHz, 1.544 MHz, 3.088 MHz, 6.176 MHz;
E1: 2.048 MHz, 4.096 MHz, 8.192 MHz.
105
RxD1
I
Receive Data 1
The data input pin which is sampled using RxCLK1.
106
RSP1
I
Receive Synchronization Pulse 1
The input pin used for Rx PCM frame synchronization;
the synchronization pulse marks the first bit in the
PCM frame.
97
TxCLK1
I
Transmit Clock 1
The clock input used for clocking out the data on
TxD1. In most applications, the signal that drives this
pin is externally connected to RxCLK1.
99
TxD1
O
Transmit Data 1
Provides the data which is clocked out of the
MUNICH128X by TxCLK1; data is push-pull for active
bits in the PCM frame and TRISTATE for inactive
bits.
98
TSP1
I
Transmit Synchronization Pulse 1
The input pin used for Tx PCM frame synchronization;
the synchronization pulse marks the last bit in the
PCM frame.
100
TxDEN1
O
Transmit Data Enable 1
An active low output signal which specifies data on the
TxD1 output pin is valid.
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Pin Descriptions
Table 2-3
Pin Descriptions by Functional Block: Port 2 Serial Interface
Pin No.
Symbol
Type Description
96
RxCLK2
I
Receive Clock 2
The clock input pin used for sampling the data on
RxD2. The MUNICH128X supports the following PCM
clock rates, programmed via the MODE1 register:
T1: 1.536 MHz, 1.544 MHz, 3.088 MHz, 6.176 MHz;
E1: 2.048 MHz, 4.096 MHz, 8.192 MHz.
94
RxD2
I
Receive Data 2
The data input pin which is sampled using RxCLK2.
95
RSP2
I
Receive Synchronization Pulse 2
The input pin used for Rx PCM frame synchronization;
the synchronization pulse marks the first bit in the
PCM frame.
90
TxCLK2
I
Transmit Clock 2
The clock input used for clocking out the data on
TxD2. In most applications, the signal that drives this
pin is externally connected to RxCLK2.
92
TxD2
O
Transmit Data 2
Provides the data which is clocked out of the
MUNICH128X by TxCLK2; data is push-pull for active
bits in the PCM frame and TRISTATE for inactive
bits.
91
TSP2
I
Transmit Synchronization Pulse 2
The input pin used for Tx PCM frame synchronization;
the synchronization pulse marks the last bit in the
PCM frame.
93
TxDEN2
O
Transmit Data Enable 2
An active low output signal which specifies data on the
TxD2 output pin is valid.
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Pin Descriptions
Table 2-4
Pin Descriptions by Functional Block: Port 3 Serial Interface
Pin No.
Symbol
Type Description
89
RxCLK3
I
Receive Clock 3
The clock input pin used for sampling the data on
RxD3. The MUNICH128X supports the following PCM
clock rates, programmed via the MODE1 register:
T1: 1.536 MHz, 1.544 MHz, 3.088 MHz, 6.176 MHz;
E1: 2.048 MHz, 4.096 MHz, 8.192 MHz.
85
RxD3
I
Receive Data 3
The data input pin which is sampled using RxCLK3.
86
RSP3
I
Receive Synchronization Pulse 3
The input pin used for Rx PCM frame synchronization;
the synchronization pulse marks the first bit in the
PCM frame.
81
TxCLK3
I
Transmit Clock 3
The clock input used for clocking out the data on
TxD3. In most applications, the signal that drives this
pin is externally connected to RxCLK3.
83
TxD3
O
Transmit Data 3
Provides the data which is clocked out of the
MUNICH128X by TxCLK3; data is push-pull for active
bits in the PCM frame and TRISTATE for inactive
bits.
82
TSP3
I
Transmit Synchronization Pulse 3
The input pin used for Tx PCM frame synchronization;
the synch. pulse marks the last bit in the PCM frame.
84
TxDEN3
O
Transmit Data Enable 3
An active low output signal which specifies data on the
TxD3 output pin is valid.
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Pin Descriptions
Table 2-5
Pin No.
Pin Descriptions by Functional Block: PCI Interface
Symbol
2, 5…8,
AD(31:0)
11…13, 30,
33…36,
39…41,
45…48,
51…54,
148, 149,
152…156,
159
Type Description
t/s
Address/Data Bus
A bus transaction consists of an address phase
followed by one or more data phases.
When MUNICH128X is Master, AD(31:0) are outputs
in the address phase of a transaction. During the data
phases, AD(31:0) remain outputs for write
transactions, and become inputs for read
transactions.
When MUNICH128X is Slave, AD(31:0) are inputs in
the address phase of a transaction. During the data
phases, AD(31:0) remain inputs for write transactions,
and become outputs for read transactions.
AD(31:0) is sampled on the rising edge of CLK.
14, 29, 42,
160
C/BE(3:0) t/s
Command/Byte Enable
During the address phase of a transaction, C/BE(3:0)
define the bus command. During the data phase, C/
BE(3:0) are used as Byte Enables. The Byte Enables
are valid for the entire data phase and determine
which byte lanes carry meaningful data. C/BE0
applies to byte 0 (lsb) and C/BE3 applies to byte 3
(msb).
When MUNICH128X is Master, C/BE(3:0) are
outputs.
When MUNICH128X is Slave, C/BE(3:0) are inputs.
C/BE(3:0) is sampled on the rising edge of CLK.
28
PAR
Parity
PAR is even parity across AD(31:0) and C/BE(3:0).
PAR is stable and valid one clock after the address
phase. PAR has the same timing as AD(31:0) but
delayed by one clock.
When MUNICH128X is Master, PAR is output during
address phase and write data phases.
When MUNICH128X is Slave, PAR is output during
read data phases. Parity errors detected by the
MUNICH128X are indicated on PERR output. PAR is
sampled on the rising edge of CLK.
t/s
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Pin Descriptions
Table 2-5
Pin Descriptions by Functional Block: PCI Interface (cont’d)
Pin No.
Symbol
Type Description
19
FRAME
s/t/s
Frame
FRAME indicates the beginning and end of an access.
FRAME is asserted to indicate a bus transaction is
beginning. While FRAME is asserted, data transfers
continue. When FRAME is deasserted, the
transaction is in the final phase.
When MUNICH128X is Master, FRAME is an output.
When MUNICH128X is Slave, FRAME is an input.
FRAME is sampled on the rising edge of CLK.
20
IRDY
s/t/s
Initiator Ready
IRDY indicates the bus master’s ability to complete the
current data phase of the transaction. It is used in
conjunction with TRDY. A data phase is completed on
any clock where both IRDY and TRDY are sampled
asserted. During a write, IRDY indicates that valid
data is present on AD(31:0). During a read, it indicates
the master is prepared to accept data. Wait cycles are
inserted until both IRDY and TRDY are asserted
together.
When MUNICH128X is Master, IRDY is an output.
When MUNICH128X is Slave, IRDY is an input.
IRDY is sampled on the rising edge of CLK.
21
TRDY
s/t/s
Target Ready
TRDY indicates a slave’s ability to complete the
current data phase of the transaction. During a read,
TRDY indicates that valid data is present on AD(31:0).
During a write, it indicates the target is prepared to
accept data.
When MUNICH128X is Master, TRDY is an input.
When MUNICH128X is Slave, TRDY is an output.
TRDY is sampled on the rising edge of CLK.
23
STOP
s/t/s
STOP
STOP is used by a slave to request the current master
to stop the current bus transaction.
When MUNICH128X is Master, STOP is an input.
When MUNICH128X is Slave, STOP is an output.
STOP is sampled on the rising edge of CLK.
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Pin Descriptions
Table 2-5
Pin Descriptions by Functional Block: PCI Interface (cont’d)
Pin No.
Symbol
Type Description
1
IDSEL
I
Initialization Device Select
When MUNICH128X is slave in a transaction, if IDSEL
is active in the address phase and C/BE(3:0) indicates
a Config read or write, the MUNICH128X assumes a
read or write to a configuration register. In response,
the MUNICH128X asserts DEVSEL during the
subsequent CLK cycle.
IDSEL is sampled on the rising edge of CLK.
22
DEVSEL
s/t/s
Device Select
When activated by a slave, it indicates to the current
bus master that the slave has decoded its address as
the target of the current transaction. If no bus slave
activates DEVSEL within six bus CLK cycles, the
master should abort the transaction.
When MUNICH128X is Master, DEVSEL is input. If
DEVSEL is not activated within six clock cycles after
an address is output on AD(31:0), the MUNICH128X
aborts the transaction and generates an INTA.
When MUNICH128X is Slave, DEVSEL is output.
26
PERR
s/t/s
Parity Error
When activated, indicates a parity error over the
AD(31:0) and C/BE(3:0) signals (compared to the
PAR input). It has a delay of one CLK cycle with
respect to AD and C/BE(3:0) (i.e., it is valid for the
cycle immediately following the corresponding PAR
cycle).
PERR is asserted relative to the rising edge of CLK.
27
SERR
o/d
System Error
The MUNICH128X asserts this signal to indicate a
fatal system error.
SERR is sampled on the rising edge of CLK.
147
REQ
t/s
Request
Used by the MUNICH128X to request control of the
PCI.
REQ is sampled on the rising edge of CLK.
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Pin Descriptions
Table 2-5
Pin Descriptions by Functional Block: PCI Interface (cont’d)
Pin No.
Symbol
Type Description
146
GNT
t/s
Grant
This signal is asserted by the arbiter to grant control of
the PCI to the MUNICH128X in response to a bus
request via REQ. After GNT is asserted, the
MUNICH128X will begin a bus transaction only after
the current bus Master has deasserted the FRAME
signal.
GNT is sampled on the rising edge of CLK.
145
CLK
I
Clock
Provides timing for all PCI transactions. Most PCI
signals are sampled or output relative to the rising
edge of CLK. The maximum CLK frequency is
33 MHz.
142
RST
I
Reset
An active RST signal brings all PCI registers,
sequencers and signals into a consistent state. All PCI
output signals are driven to their initial state.
57
INTA
O (o/ Interrupt Request
d)
When an interrupt status is active and unmasked, the
MUNICH128X activates this open-drain output.
Examples of interrupt sources are transmission/
reception error, completion of transmit or receive
packets etc. The MUNICH128X deactivates INTA
when the global interrupt status register STAT is read.
INTA is activated/deactivated asynchronous to the
CLK.
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Pin Descriptions
Table 2-6
Pin Descriptions by Functional Block:
DEMUX Interface (additional signals to PCI Interface)
Pin No.
Symbol
122, 123
DPCI(1:0) I
Type Description
58…61,
A(27:2)
66…70,
73…76, 79,
124…126,
129…133,
138…141
I/O
80
I/O
W/R
Hardware Reference Manual
PCI/De-multiplexed Mode select
DPCI(1:0) = 002 : PCI Mode
DPCI(1:0) = 012 : reserved
DPCI(1:0) = 102 : PCI/De-multiplexed Mode
DPCI(1:0) = 112 : reserved
Pins DPCI(1:0) should be connected to VDD3/VSS to
achieve the appropriate mode selection.
DEMUX Address Bus
These pins provide the address bus for the Demultiplexed Interface, when DPCI(1:0) = 102.
Note:
Pin 124 ’A27’ provides a buffered PCI clock output
signal if configured in PCI operation mode
(DPCI(1:0) = ’00’).
Write/Read
This signal distinguishes write and read operations in
the De-multiplexed mode. It is tristate when the
MUNICH128X is in PCI mode.
A Pull-Up resistor to VDD3 is recommended if Demultiplexed mode is not used.
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Pin Descriptions
Table 2-7
Pin Descriptions by Functional Block: Power Supply
Pin No.
Symbol
Type Description
VSS
4, 10, 18,
25, 32, 38,
44, 50, 56,
63, 65, 72,
78, 88, 101,
104, 118,
128, 135,
137, 144,
151, 158
-
Ground (0 V)
All pins must have the same reference level.
3, 9, 17, 24, VDD3
31, 37, 43,
49, 55, 62,
64, 71, 77,
87, 102,
103, 117,
127, 134,
136, 143,
150, 157
-
Supply Voltage (3.3 V ± 0.3 V)
All pins must have the same reference level.
VDD5
-
Supply Voltage
These pins MUST be connected to 5 V supply.
The MUNICH128X uses 3.3 V I/O pads that always
require additional 5 V supply.
The 5 V power supply allows the MUNICH128X I/O
pads to provide 5 V input tolerance.
15, 16
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Pin Descriptions
Table 2-8
Pin Descriptions by Functional Block: Test Interface
Pin No.
Symbol
Type Description
115
TCK
I
JTAG Test Clock
A Pull-Up resistor to VDD3 is recommended if
boundary scan unit is not used.
116
TMS
I
JTAG Test Mode Select
A Pull-Up resistor to VDD3 is recommended if
boundary scan unit is not used.
121
TDI
I
JTAG Test Data Input
A Pull-Up resistor to VDD3 is recommended if
boundary scan unit is not used.
120
TDO
O
JTAG Test Data Output
119
TRST
I
JTAG Reset
TRST should be connected to VSS if boundary
scan unit is not used.
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Functional Description
3
Functional Description
3.1
Functional Overview
The MUNICH128X provides four independent “cores” as well as global functional blocks
(see Figure 3-1).
3.2
Block Diagram
•
PCM - BUS
PCM - BUS
CORE
CORE
24/32
Channel
24/32
Channel
64 Channel
Arbiter
64 Channel
Register Set
Serial
PCM/IF
Register Set
Serial
PCM/IF
I-BUS
Internal
PCI/DEMUX Interface
Address/Data
Figure 3-1
Control
ITB10008
Block Diagram
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Functional Description
3.3
Functional Blocks
Each core consists of dedicated circuitry: Serial PCM Interface Controller, Configuration
and State RAM (CSR), 24/32-channel HDLC Controller with internal Transmit and
Receive Buffers, 64-Channel DMA Controller, and Register Set.
3.3.1
Serial PCM Interface Controller
This block controls both Parallel–to-Serial (Tx) and Serial-to-Parallel (Rx) conversion
and PCM timing. Additionally, this block controls the multiplexing of channels through the
HDLC controller, as well as switching for the test loops.
3.3.2
Configuration and State RAM (CSR)
This block contains internal RAM which maintains the state of each channel. The
Multiplex Control Block of the Serial PCM Interface Controller handles the switching of
the CSR information into and out of the 24/32-channel HDLC Controller.
3.3.3
24/32-channel HDLC Controller
The HDLC Controller performs protocol processing for each channel independently,
based on the CSR information for each channel.
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Functional Description
3.3.3.1
Tx Block
Transmit Buffer (TB)
The Tx Block of the HDLC Controller contains a 1024 byte buffer (TB) which may be
allocated to all 32 channels of one cove equally (i.e., 2-DWords per channel) or may be
allocated based on superchannel considerations (e.g., 8–DWords per channel for
8 channels).
HDLC Protocol
Bit stuffing, flag generation, flag stuffing and adjustment, and CRC generation (either 16bit or 32-bit) are performed.
V.110 and V.30 Protocol
Bit framing from 600 bit/s to 38.4 Kbit/s, automatic generation of the synchronization
pattern, generation of loss of synchronization, programmable E/SX bits (including during
run-time) are performed.
Transparent Mode A
This mode supports slot synchronous, transparent transmission without frame structure.
It provides flag generation, flag stuffing, flag generation in the abort case with
programmable flag, and synchronized data transfer for fractional T1/E1 PRI applications.
Transparent Mode B
This mode supports transparent transmission in frames delimited by 00H flags, shared
closing and opening flag, flag stuffing and flag generation in the abort case.
Transparent Mode R
This mode supports transparent transmission with GSM 08.60 frame structure with
automatic 0000H flag generation and support of 40, 39.5, and 40.5 octet frames.
Protocol Independence
Channel inversion (data, flags, idle code) follows the format conventions as in CCITT
Q.921.
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Functional Description
3.3.3.2
Rx Block
Receive Buffer (RB)
The Rx Block of the HDLC Controller contains a 1024 byte buffer (RB) which is allocated
to channels via requests from the protocol controller, as determined by the received data
for each channel.
HDLC Protocol
Flag detection (supports multiple flags between packets or a single flag shared as a
closing flag and an opening flag between packets), abort character detection, idle code
detection, zero-bit detection and deletion, packet length count, and CRC checking (either
16-bit or 32-bit) are performed.
V.110 and V.30 Protocol
Bit framing from 600 bit/s to 38.4 Kbit/s, automatic synchronization of the
synchronization pattern, detection of loss of synchronization, programmable E/SX bits
(including during run–time) are performed.
Transparent Mode A
Mode A supports slot synchronous transparent reception without frame structure. It
provides flag detection, flag extraction and synchronized data transfer for fractional T1/
E1 PRI applications.
Transparent Mode B
This mode supports transparent reception in frames delimited by 00H flags. Sharing
closing flag and opening flag, and flag detection.
Transparent Mode R
This mode supports transparent reception with GSM 08.60 frame structure with
automatic 0000H flag detection. Support of 40, 39.5, and 40.5 octet frames, and error
detection (non–octet frame contents, short frame, long frame).
Protocol Independence
Channel inversion (data, flags, idle code) follows the format conventions as in CCITT
Q.921, data overflow and underflow detection.
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Functional Description
3.3.3.3
64-channel DMA Controller Block
This block controls memory address calculation, buffer management (including linkedlists) and interrupt processing. The 24/32-channel HDLC Controller has a dedicated
DMA channel for each channel and direction. During run-time, the DMA Controller
performs operations with host memory primarily as a bus master. This block provides
32 input and 32 output channels.
3.3.3.4
Register Set
This block provides configuration and control of the Serial PCM Interface Controller, the
HDLC Controller and the DMA Controller. Also, a shared status register STAT provides
status and interrupt information associated with each of the four cores.
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Functional Description
3.4
Global Functional Blocks
The MUNICH128X provides global functional blocks for the Internal Bus, Arbiter, and
32 Bit / 33 MHz PCI 2.1 Interface as well as De-multiplexed Bus Interface Controller.
3.4.1
Internal Bus
This block of the MUNICH128X interfaces the Bus Interface Controller to the four DMA
Controllers. This is a 33 MHz, 32 Bit demultiplexed bus that operates in a synchronous,
non–burst manner for data transfers and operates in a synchronous burst manner for
descriptor transfers.
3.4.2
Arbiter
The Arbiter provides access control of the Internal Bus. A “round-robin” Arbiter is used
which provides “fairness” for the four master DMA controllers.
3.4.3
32 Bit / 33 MHz Bus Interface Controller
The MUNICH128X may be configured either for 32 Bit / 33 MHz PCI bus operation or for
a 32 Bit / 33 MHz De-multiplexed bus interface. The MUNICH128X input pins DPCI(1:0)
are used to select the desired configuration.
The De-multiplexed bus interface is a synchronous interface very similar to the PCI
interface with the following exceptions:
1. The W/R input/output signal replaces the function of the PCI command nibble of the
C/BE(3:0) bit field.
2. Note, that in DEMUX mode as in PCI mode the MUNICH128X provides only the first
address of a Master burst read or write transaction. If burst transactions are not
supported by the local bus environment, burst capability can be disabled by bit DBE
in the global configuration register (CONF).
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Functional Description
3.5
System Integration
The MUNICH128X provides protocol processing and host memory buffer management
for four independent T1/E1 PRI ports. As such, the MUNICH128X fits into a system
between the framer or LIU/framer devices (e.g., the Siemens FALC®54/FALC®54-LH
transceiver) and the host bus (e.g. PCI Bus), as illustrated in Figure 3-1.
The MUNICH128X provides four independent Serial PCM ports which connect directly
into the framer devices. In PCI based systems a dedicated microcontroller or PCI bridge
chip is necessary to configure the framer or LIU/framer devices.
Additionally, the MUNICH128X provides a PCI 2.1 interface which connects directly to
the system PCI bus. Optionally, this bus can be configured in De-multiplexed Mode.
T1/E1/PRI
R
FALC 54 /
R
FALC -LH
Transceiver
Dedicated
CPU
T1/E1/PRI
T1/E1/PRI
R
R
FALC 54 /
R
FALC -LH
Transceiver
FALC 54 /
R
FALC -LH
Transceiver
T1/E1/PRI
R
FALC 54 /
R
FALC -LH
Transceiver
MUNICH128X
PCI BUS
PCI Bridge
Chip
Host
Memory
Processor
ITS10009
Figure 3-1
System Integration of the MUNICH128X in PCI-Based System
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Functional Description
T1/E1/PRI
R
FALC 54 /
R
FALC -LH
Transceiver
T1/E1/PRI
T1/E1/PRI
R
R
FALC 54 /
R
FALC -LH
Transceiver
FALC 54 /
R
FALC -LH
Transceiver
T1/E1/PRI
R
FALC 54 /
R
FALC -LH
Transceiver
MUNICH128X
Glue Logic
De-multiplexed BUS
Processor
Host
Memory
ITS10010
Figure 3-2
System Integration of the MUNICH128X in De-multiplexed System
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Operational Description
4
Operational Description
4.1
Operational Overview
The MUNICH128X is a “channelized” WAN protocol controller that performs protocol
processing on up to 128 full duplex serial PCM channels. It performs HDLC-based layer
2 protocol formatting and deformatting, as well as rate adaptation, for each of the
128 channels independently.
The MUNICH128X provides dedicated registers for each of the four HDLC controllers,
with each set similar to the “core” registers of the MUNICH32X. Software developed for
the “core” of the MUNICH32X requires minimal modification to run optimally on the
MUNICH128X. The architecture of the register sets allows any number of HDLC
controllers within an MUNICH128X device to operate with host software images that
differ only in their offset from the PCI base address and their pointers into host memory.
Host software sets the operating mode, rate adaptation method and time slot assignment
of each channel by configuring “blocks” (CCBs) within host memory.
During “run-time” the MUNICH128X performs all data and descriptor transfers as a bus
master. Additionally, host software may access any register of a particular HDLC
Controller within the MUNICH128X, with the device acting as a bus slave.
The MUNICH128X provides a single Status Register, which maintains information of all
interrupt events for the controller.
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5
Electrical Characteristics
5.1
Important Electrical Requirements
VDD3 = 3.3 V ± 0.3 V
VDD3 max = 3.6 V
VDD5 = 5.0 V ± 0.25 V
VDD5 max = 5.25 V
During all MUNICH128X power-up and power-down situations the difference
|VDD5 – VDD3| may not exceed 3.6V. The absolute maximums of VDD5 and VDD3 should
never be exceeded.
Figure 5-1 shows that both VDD3 and VDD5 can take on any time sequence not exceeding
a voltage difference of 3.6V, for up to 50 milliseconds at power-up and powerdown.Within 50 milliseconds of power-up the voltages must be within their respective
absolute voltage limits. At power-down, within 50 milliseconds of either voltage going
outside its operational range, the voltage difference should not exceed 3.6V and both
voltages must be returned below 0.1V:
power up
power down
U/V
5V
+/- 0.25V
3.3V
+/- 0.3V
VDD5 limit
VDD5 limit
VDD3 limit
VDD3 limit
0.1V
0
50
N
N+50 t/ms
Within the grey boxes any shape of VDD3 and VDD5 signal is allowed with the requirements that the absolute
limits of each signal are not exceeded, the slew rate recommendation for VDD3 is met to guarantee proper
boundary scan reset and the voltage difference does not exceed 3.6V.
Outside the grey boxes the voltages provided to VDD3 and VDD5 should be inside the normal operation range.
In this power-up example VDD5 is enabled after VDD3 reached its minimum operation value which is a typical
implementation.
For power-down VDD5 is switched off before VDD3.
Figure 5-1
Power-up and Power-down scenarios
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Similar criteria also apply to power down in case of power failure situations:
power failure:
VDD5 break down
U/V
VDD5 limit
5V
+/- 0.25V
power failure:
VDD3 break down
U/V
VDD5 limit
5V
+/- 0.25V
VDD3 limit
3.3V
+/- 0.3V
VDD3 limit
3.3V
+/- 0.3V
0.1V
0.1V
0
N
50
t/ms
0
N
N+15
t/ms
Within the grey boxes any shape of VDD3 and VDD5 signal is allowed with the requirements that the absolute
limits of each signal are not exceeded and the specified voltage differences are not exceeded.
a. In case of VDD5 break-down the 3.6V difference is not exceeded anyway. The voltages must return below
0.1V within 50 milliseconds.
b. In case of VDD3 break-down the maximum voltage difference must not exceed 4.5 V for a maximum of 15
milliseconds.The voltages must return below 0.1V within 50 milliseconds.
This scenario is allowed for 2000 power failure cycles.
Figure 5-2
Power-Failure scenarios
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5.2
Absolute Maximum Ratings
Table 5-1
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
min.
Ambient temperature under bias
PEB
PEF
TA
Junction temperature under bias
TJ
Tstg
VS
Storage temperature
Voltage at any pin with respect to ground
ESD robustness1)
HBM: 1.5 kΩ, 100 pF
1)
Unit
max.
°C
0
-40
70
85
125
°C
– 65
125
°C
– 0.4
VDD5 + 0.4
V
1000
V
VESD,HBM
According to MIL-Std 883D, method 3015.7 and ESD Ass. Standard EOS/ESD-5.1-1993.
The RF Pins 20, 21, 26, 29, 32, 33, 34 and 35 are not protected against voltage stress > 300 V (versus VS or
GND). The high frequency performance prohibits the use of adequate protective structures.
Note: Stresses above those listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
5.3
Table 5-2
Thermal Package Characteristics
Thermal Package Characteristics
Parameter
Symbol
Value
Unit
Thermal Package Resistance Junction to Ambient
Airflow:
Ambient Temperature:
without airflow
TA=+25°C
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θJA(0,25)
39
29
°C/W
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5.4
Operating Range
Parameter
Symbol
Limit Values
min.
Ambient temperature
PEB
PEF
TA
Supply voltage VDD3
VDD3
VDD5
VSS
Supply voltage VDD5
Ground
Unit Test Condition
max.
°C
0
-40
70
85
3.0
3.6
V
4.75
5.25
V
0
0
V
Note: In the operating range, the functions given in the circuit description are fulfilled.
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5.5
DC Characteristics
a) Non-PCI Interface Pins
Table 5-3
Non-PCI Interface Pins
TA = 0 to + 70°C; VDD5 = 5 V ± 5%, VDD3 = 3.3 V ± 0.3 V, VSS = 0 V
Parameter
Symbo
Limit Values
l
min. max.
Unit Test Condition
L-input voltage
VIL
VIH
VQL
V
H-input voltage
L-output voltage
– 0.4
0.8
2.0
VDD5 + 0.4 V
0.45
V
IQL = 7 mA
(pin TXD)
IQL = 2 mA
(all others / non-PCI)
VQH
operational ICC3
power down ICC3
H-output voltage
Power
supply
current
2.4
V
< 300
mA
<5
mA
VDD5 = 5.0 V,
inputs at 0 V/VDD3,
no output loads
<1
mA
VDD3 = 3.3 V,
<1
mA
VDD5 = 5.0 V,
inputs at 0 V/VDD3,
no output loads
< 700
mA
VDD3 = 3.3 V,
(no clocks)
ICC5
power down ICC5
operational
(no clocks)
ICC3Peak
Peak Power supply
current during
ICC5Peak
RAM initialization process
Input leakage current
Output leakage current
ILI
ILQ
IQH = – 400 µA
VDD3 = 3.3 V,
< 10
mA
10
µA
VDD5 = 5.0 V,
inputs at 0 V/VDD3,
no output loads,
300 PCI clocks after
power-up
0 V < VIN < VDD to 0 V
0 V < VOUT < VDD to 0 V
Note: The listed characteristics are ensured over the operating range of the integrated
circuit. Typical characteristics specify mean values expected over the production
spread. If not otherwise specified, typical characteristics apply at TA = 25 °C and
the given supply voltage.
Note: The electrical characteristics described in section 5.2 also apply here!
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b) PCI Pins
According to the PCI specification V2.1 from June 1, 1995
(Chapter 4: Electrical Specification for 5 V signalling)
Note: According the electrical characteristics all DEMUX Interface pins (DPCI(1:0),
A(27:2), W/R) are treated as PCI Interface pins.
5.6
Capacitances
a) Non-PCI Interface Pins
Table 5-4
Non-PCI Interface Pins
TA = 25°C; VDD5 = 5 V ± 5%, VDD3 = 3.3 V ± 0.3 V, VSS = 0 V
Parameter
Input capacitance
Output capacitance
I/O-capacitance
Symbol
CIN
COUT
CIO
Limit Values
Unit
min.
max.
1
5
pF
5
10
pF
6
15
pF
Test Condition
b) PCI Pins
According to the PCI specification V2.1 from June 1, 1995
(Chapter 4: Electrical Specification for 5 V signalling)
Note: According the electrical characteristics all DEMUX Interface pins DPCI(1:0),
A(27:2), W/R) are treated as PCI Interface pins.
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5.7
AC Characteristics
a) Non-PCI Interface Pins
TA = 0 to + 70°C; VDD5 = 5 V ± 5%; VDD3 = 3.3 V ± 0.3 V
Inputs are driven to 2.4 V for a logical “1” and to 0.4 V for a logical “0”. Timing
measurements are made at 2.0 V for a logical “1” and at 0.8 V for a logical “0”.
The AC testing input/output waveforms are shown below.
2.4
2.0
2.0
Device
Under
Test
Test Points
0.8
0.8
C Load = 50 pF
0.45
ITS09800
Figure 5-1
Input/Output Waveform for AC Tests
b) PCI Pins
According to the PCI specification V2.1 from June 1, 1995
(Chapter 4: Electrical Specification for 5 V signalling)
Note: According the electrical characteristics all DEMUX Interface pins DPCI(1:0),
A(27:2), W/R) are treated as PCI Interface pins.
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5.7.1
PCI Bus Interface Timing
The AC testing input/output waveforms are shown in figures 5-2 and 5-3 below.
Vth
Clock
Vtl
Vtest
t val
Device
Under
Test
Vtest
Output Delay
t off
C Load = 50 pF
t on
TRI-STATE
Output
Vtest
Vtest
ITS09801
Figure 5-2
PCI Output Timing Measurement Waveforms
Figure 5-3
PCI Input Timing Measurement Waveforms
Table 5-5
PCI Input and Output Measurement Conditions
Symbol
Value
Unit
Vth
Vtl
Vtest
Vmax
2.4
V
0.4
V
1.5
V
2.0
V
The timings below show the basic read and write transaction between an initiator
(Master) and a target (Slave) device. The MUNICH128X is able to work both as master
and slave.
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As a master the MUNICH128X reads/writes data from/to host memory using DMA and
burst. The slave mode is used by an CPU to access the MUNICH128X PCI Configuration
Space and the on-chip registers.
5.7.1.1
PCI Read Transaction
The transaction starts with an address phase which occurs during the first cycle when
FRAME is activated (clock 2 in figure 5-4). During this phase the bus master (initiator)
outputs a valid address on AD(31:0) and a valid bus command on C/BE(3:0). The first
clock of the first data phase is clock 3. During the data phase C/BE indicate which byte
lanes on AD(31:0) are involved in the current data phase.
The first data phase on a read transaction requires a turn-around cycle. In figure 5-4 the
address is valid on clock 2 and then the master stops driving AD. The target drives the
AD lines following the turnaround when DEVSEL is asserted. (TRDY cannot be driven
until DEVSEL is asserted.) The earliest the target can provide valid data is clock 4. Once
enabled, the AD output buffers of the target stay enabled through the end of the
transaction.
A data phase may consist of a data transfer and wait cycles. A data phase completes
when data is transferred, which occurs when both IRDY and TRDY are asserted. When
either is deasserted a wait cycle is inserted. In the example below, data is successfully
transferred on clocks 4, 6 and 8, and wait cycles are inserted on clocks 3, 5 and 7. The
first data phase completes in the minimum time for a read transaction. The second data
phase is extended on clock 5 because TRDY is deasserted. The last data phase is
extended because IRDY is deasserted on clock 7.
The Master knows at clock 7 that the next data phase is the last. However, the master is
not ready to complete the last transfer, so IRDY is deasserted on clock 7, and FRAME
stays asserted. Only when IRDY is asserted can FRAME be deasserted, which occurs
on clock 8.
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CLK
1
2
3
4
5
6
7
8
9
FRAME
Data 3
BE’s
Wait
Data Transfer
IRDY
TRDY
Data Transfer
Bus CMD
Data 2
Wait
C/BE
Data 1
Data Transfer
Address
Wait
AD
DEVSEL
Address
Phase
Data
Phase
Data
Phase
Bus Transaction
Data
Phase
ITD07575
Figure 5-4
PCI Read Transaction
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5.7.1.2
PCI Write Transaction
The transaction starts when FRAME is activated (clock 2 in figure 5-5). A write
transaction is similar to a read transaction except no turnaround cycle is required
following the address phase. In the example, the first and second data phases complete
with zero wait cycles. The third data phase has three wait cycles inserted by the target.
Both initiator and target insert a wait cycle on clock 5. In the case where the initiator
inserts a wait cycle (clock 5), the data is held on the bus, but the byte enables are
withdrawn. The last data phase is characterized by IRDY being asserted while the
FRAME signal is deasserted. This data phase is completed when TRDY goes active
(clock 8).
CLK
1
2
3
4
5
6
7
8
9
FRAME
C/BE
Bus CMD
BE’s-1
BE’s-2
TRDY
BE’s-3
Wait
Data Transfer
IRDY
Data 3
Data Transfer
Data 2
Wait
Data 1
Wait
Address
Data Transfer
AD
DEVSEL
Address
Phase
Data
Phase
Data
Phase
Data
Phase
Bus Transaction
ITD07576
Figure 5-5
PCI Write Transaction
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5.7.1.3
PCI Timing Characteristics
When the MUNICH128X operates as a PCI Master (initiator) and it either reads or writes
a burst – as controlled by the on-chip DMA controller – it does not deactivate IRDY
between consecutive data. In other words, no wait states are inserted by the
MUNICH128X as a transaction initiator. The numbers of wait states, inserted by the
MUNICH128X as initiator are listed in table 5-6.
Table 5-6
Number of Wait States Inserted by the MUNICH128X as Initiator
Transaction
Number of Wait States
1st Data Cycle
2nd and Subsequent Data Cycles
Memory read burst
0
0
Memory write burst
0
0
Fast Back-to-back burst;
1st transaction
0
0
Fast Back-to-back burst;
2nd and subsequent
transactions
1
0
When the MUNICH128X operates as a PCI Slave (target), it inserts wait cycles by
deactivating TRDY. The numbers of wait states, typically inserted by the MUNICH128X
are listed in table 5-6:
Table 5-7
Number of Wait States Inserted by the MUNICH128X as Slave
Transaction
Number of Wait States
Configuration read
2
Configuration write
0
Register read
3
Register write
0
LBI read
3
LBI write
0
The number of wait states inserted by the MUNICH128X as target is not critical because
accesses to the MUNICH128X are usually kept to a minimum in a system.
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tH
tL
2.4 V
2.0 V
1.5 V
Voltage (V)
2 Vpp min
0.8 V
0.4 V
T
Figure 5-6
PCI Clock Specification
Table 5-8
PCI Clock Characteristics
Parameter
ITD07577
Symbol
Limit Values
min.
typ.
Unit
max.
CLK cycle time
T
30
ns
CLK high time
tH
11
ns
CLK low time
tL
11
ns
CLK slew rate (see note)
1
4
V/ns
Note: Rise and fall times are specified in terms of the edge rate measured in V/ns. This
slew rate must be met across the minimum peak-to-peak portion of the clock
waveform as shown in figure 5-6.
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Table 5-9
PCI Interface Signal Characteristics
Parameter
Limit Values
min.
typ.
Unit
Remarks
max.
CLK to signal valid delay
bussed signals
(2)
11
ns
Notes 1, 2
CLK to signal valid delay
point-to-point
(2)
12
ns
Notes 1, 2
Float to active delay
2
(3)
ns
20
ns
Active to float delay
Input setup time to CLK
bussed signals
7
ns
Note 2
Input setup time to CLK
point-to-point
10
ns
Note 2
Input hold time from CLK
0
ns
Note 1Minimum times are measured with 0 pF equivalent load; maximum times are
measured with 50 pF equivalent load.
Note 2REQ and GNT are point-to-point signals. All other signals are bussed
GNT setup (min) time: 10ns
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5.7.2
De-multiplexed Bus Interface
CLK
FRAME
D (31 : 0)
Address
Data
Address
A (31 : 2)
Data
don´t care
don´t care
Address
Address
BE (3 : 0)
BE (3 : 0)
W/R
BE (3 : 0)
READ Access
WRITE Access
TRDY
ITT10451
Figure 5-7
Master Single READ Transaction followed by a Master Single WRITE
Transaction in De-multiplexed Bus Configuration
CLK
FRAME
D (31 : 0)
Address
Data 2
Data 1
Data 3
Data 4
BE (3 : 0)
BE (3 : 0)
don´t care
A (31 : 2)
BE (3 : 0)
W/R
Address
BE (3 : 0)
BE (3 : 0)
WRITE/READ Access
TRDY
ITT10452
Figure 5-8
Master Burst WRITE/READ Access in De-multiplexed Bus
Configuration
The timing provided in Table 5-7 and Table 5-8 can also be applied to the de-multiplexed
bus interface.
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Table 5-10
Additional De-multiplexed Interface Signal Characteristics
Parameter
Limit Values
min.
typ.
Unit
max.
CLK to address bus signal
valid delay
12
ns
CLK to W/R signal valid
delay
12
ns
Address bus Input setup
time to CLK
8
ns
Address bus Input hold time 0
to CLK
ns
W/R signal Input setup time 8
to CLK
ns
W/R signal Input hold time
to CLK
ns
0
Remarks
Note: The PCI parity signal PAR is not generated in de-multiplexed mode. It is driven
active low by the MUNICH128X.
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5.7.3
PCM Serial Interface Timing
37
39
RSP
43
42
RxCLK
38
40
41
RxD
46
44
TSP
50
49
TxCLK
45
47
48
TxD
51
TDTRI
ITT10012
Figure 5-9
PCM Serial Interface Timing
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Table 5-11
No.
PCM Serial Interface Timing
Parameter
Limit Values
min.
Unit
max.
37
Receive strobe guard time
10
ns
38
Receive strobe setup
5
ns
39
Receive strobe hold
5
ns
40
Receive data setup
5
ns
41
Receive data hold
5
ns
42
Receive clock high width
30
ns
43
Receive clock low width
30
ns
44
Transmit strobe guard time
20
ns
45
Transmit strobe setup
5
ns
46
Transmit strobe hold
5
ns
47
Transmit data delay
25
ns
48
Transmit clock to high impedance
25
ns
49
Transmit clock high width
30
ns
50
Transmit clock low width
30
ns
51
Transmit tristate delay
25
ns
Note: The frequency on the serial line must be smaller or equal to
1 th
/8 of the frequency on the µP bus for 1.536 MHz, 1.544 MHz, 2.048 MHz
1 th
/4 of the frequency on the µP bus for 4.096 MHz.
Note: For complete internal or complete external loop t42 and t49 must be greater or
equal to 3 times T.
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5.7.4
System Interface Timing
RES
57
ITD10332
Figure 5-10 System Interface Timing
Table 5-12
No.
System Interface Timing
Parameter
Limit Values
min.
57
RESET pulse width
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4 CLK cycles
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5.7.5
JTAG-Boundary Scan Timing
58
59
60
TCK
61
62
TMS
63
64
TDI
65
TDO
ITD09802
Figure 5-11 JTAG-Boundary Scan Timing
Table 5-13
JTAG-Boundary Scan Timing
No. Parameter
Limit Values
min.
max.
∞
Unit
58
TCK period
166
59
TCK high time
80
ns
60
TCK low time
80
ns
61
TMS setup time
30
ns
62
TMS hold time
10
ns
63
TDI setup time
30
ns
64
TDI hold time
30
ns
65
TDO valid delay
60
ns
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6
Test Modes
6.1
Boundary Scan Unit
In the MUNICH128X a Test Access Port (TAP) controller is implemented. The essential
part of the TAP is a finite state machine (16 states) controlling the different operational
modes of the boundary scan. Both, TAP controller and boundary scan, meet the
requirements given by the JTAG standard: IEEE 1149.1. Figure 6-1 gives an overview.
Test Access Port
TCK
Pins
Reset
TAP Controller
TMS
Control
Bus
Test
Control
TDI
Data in
- Finite State Machine
- Instruction Register (3 bit)
- Test Signal Generator
TDO Enable
ID Data out
SS Data
out
Data out
Figure 6-1
6
Boundary Scan (n bit)
CLOCK
TRST
1
2
Identification Scan (32 bit)
Clock Generation
BS Data IN
CLOCK
.
.
.
.
.
.
n
Block Diagram of Test Access Port and Boundary Scan
If no boundary scan operation is planned TRST has to be connected with VSS. TMS and
TDI do not need to be connected since pull-up transistors ensure high input levels in this
case. Nevertheless it would be a good practice to put the unused inputs to defined levels.
In this case, if the JTAG is not used:
TMS = TCK = ’1’ is recommended.
Test handling (boundary scan operation) is performed via the pins TCK (Test Clock),
TMS (Test Mode Select), TDI (Test Data Input) and TDO (Test Data Output) when the
TAP controller is not in its reset state, i.e. TRST is connected to VDD or it remains
unconnected due to its internal pull-up. Test data at TDI are loaded with a 4-MHz clock
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signal connected to TCK. ‘1’ or ‘0’ on TMS causes a transition from one controller state
to another; constant ’1’ on TMS leads to normal operation of the chip.
Table 6-1
Boundary Scan Sequence in MUNICH128X
TDI ->
Seq.
No.
Pin
I/O
1
DPCI0
I
1
0
2
DPCI1
I
1
0
3
A27
I/O
3
011
4
A26
I/O
3
000
5
A25
I/O
3
000
6
A24
I/O
3
100
7
A23
I/O
3
000
8
A22
I/O
3
001
9
A21
I/O
3
000
10
A20
I/O
3
010
11
A19
I/O
3
000
12
A18
I/O
3
110
13
A17
I/O
3
000
14
A16
I/O
3
000
15
RST
I/O
3
000
16
CLK
I
1
0
17
GNT
I/O
3
000
18
REQ
I/O
3
000
19
AD31
I/O
3
000
20
AD30
I/O
3
000
21
AD29
I/O
3
000
22
AD28
I/O
3
000
23
AD27
I/O
3
000
24
AD26
I/O
3
000
25
AD25
I/O
3
000
Hardware Reference Manual
Number of
Boundary Scan Cells
58
Constant Value
In, Out, Enable
04.99
PEB 20324
PEF 20324
Test Modes
Seq.
No.
Pin
I/O
26
AD24
I/O
3
000
27
C/BE3
I/O
3
000
28
IDSEL
I/O
3
000
29
AD23
I/O
3
000
30
AD22
I/O
3
000
31
AD21
I/O
3
000
32
AD20
I/O
3
000
33
AD19
I/O
3
000
34
AD18
I/O
3
000
35
AD17
I/O
3
000
36
AD16
I/O
3
000
37
C/BE2
I/O
3
000
38
FRAME
I/O
3
000
39
IRDY
I/O
3
000
40
TRDY
I/O
3
000
41
DEVSEL
I/O
3
000
42
STOP
I/O
3
000
43
PERR
I/O
3
000
44
SERR
I/O
3
000
45
PAR
I/O
3
000
46
C/BE1
I/O
3
000
47
AD15
I/O
3
000
48
AD14
I/O
3
000
49
AD13
I/O
3
000
50
AD12
I/O
3
000
51
AD11
I/O
3
000
52
AD10
I/O
3
000
53
AD9
I/O
3
000
54
AD8
I/O
3
000
55
C/BE0
I/O
3
000
Hardware Reference Manual
Number of
Boundary Scan Cells
59
Constant Value
In, Out, Enable
04.99
PEB 20324
PEF 20324
Test Modes
Seq.
No.
Pin
I/O
56
AD7
I/O
3
000
57
AD6
I/O
3
000
58
AD5
I/O
3
000
59
AD4
I/O
3
000
60
AD3
I/O
3
000
61
AD2
I/O
3
000
62
AD1
I/O
3
000
63
AD0
I/O
3
000
64
INTA
I/O
3
000
65
A15
I/O
3
000
66
A14
I/O
3
000
67
A13
I/O
3
000
68
A12
I/O
3
000
69
A11
I/O
3
000
70
A10
I/O
3
000
71
A9
I/O
3
000
72
A8
I/O
3
000
73
A7
I/O
3
000
74
A6
I/O
3
000
75
A5
I/O
3
000
76
A4
I/O
3
000
77
A3
I/O
3
000
78
A2
I/O
3
000
79
WR
I/O
3
000
80
TCLK3
I
1
0
81
TSP3
I
1
0
82
TD3
I/O
3
000
83
TDEN3
I/O
3
000
84
RD3
I
1
0
85
RSP3
I
1
0
Hardware Reference Manual
Number of
Boundary Scan Cells
60
Constant Value
In, Out, Enable
04.99
PEB 20324
PEF 20324
Test Modes
Seq.
No.
Pin
I/O
Number of
Boundary Scan Cells
Constant Value
In, Out, Enable
86
RCLK3
I
1
0
87
TCLK2
I
1
0
88
TSP2
I
1
0
89
TD2
I/O
3
000
90
TDEN2
I/O
3
000
91
RD2
I
1
0
92
RSP2
I
1
0
93
RCLK2
I
1
0
94
TCLK1
I
1
0
95
TSP1
I
1
0
96
TD1
I/O
3
000
97
TDEN1
I/O
3
000
98
RD1
I
1
0
99
RSP1
I
1
0
100
RCLK1
I
1
0
101
TCLK0
I
1
0
102
TSP0
I
1
0
103
TD0
I/O
3
000
104
TDEN0
I/O
3
000
105
RD0
I
1
0
106
RSP0
I
1
0
107
RCLK0
I
1
0
-> TDO
An input pin (I) uses one boundary scan cell (data in), an output pin (O) uses two cells
(data out, enable) and an I/O-pin (I/O) uses three cells (data in, data out, enable). Note
that some output and input pins of the MUNICH128X are tested as I/O pins in boundary
scan, hence using three cells. The boundary scan unit of the MUNICH128X contains a
total of n = 275 scan cells.
The right column of Table 6-1 gives the initialization values of the cells.
Hardware Reference Manual
61
04.99
PEB 20324
PEF 20324
Test Modes
The desired test mode is selected by serially loading a 3-bit instruction code into the
instruction register via TDI (LSB first); see Table 6-2.
Table 6-2
Boundary Scan Test Modes
Instruction (Bit 2 … 0)
Test Mode
000
001
010
011
111
others
EXTEST (external testing)
INTEST (internal testing)
SAMPLE/PRELOAD (snap-shot testing)
IDCODE (reading ID code)
BYPASS (bypass operation)
handled like BYPASS
EXTEST is used to examine the interconnection of the devices on the board. In this test
mode at first all input pins capture the current level on the corresponding external
interconnection line, whereas all output pins are held at constant values (‘0’ or ‘1’,
according to Table 6-1). Then the contents of the boundary scan is shifted to TDO. At
the same time the next scan vector is loaded from TDI. Subsequently all output pins are
updated according to the new boundary scan contents and all input pins again capture
the current external level afterwards, and so on.
INTEST supports internal testing of the chip, i.e. the output pins capture the current level
on the corresponding internal line whereas all input pins are held on constant values (‘0’
or ‘1’, according to Table 6-1). The resulting boundary scan vector is shifted to TDO.
The next test vector is serially loaded via TDI. Then all input pins are updated for the
following test cycle.
Note: In capture IR-state the code ‘001’ is automatically loaded into the instruction
register, i.e. if INTEST is wanted the shift IR-state does not need to be passed.
SAMPLE/PRELOAD is a test mode which provides a snap-shot of pin levels during
normal operation.
IDCODE: A 32-bit identification register is serially read out via TDO. It contains the
version number (4 bits), the device code (16 bits) and the manufacturer code (11 bits).
The LSB is fixed to ‘1’.
TDI ->
0011
0000 0000 0100 0100
0000 1000 001
1
-> TDO
Note: Since in test logic reset state the code ‘011’ is automatically loaded into the
instruction register, the ID code can easily be read out in shift DR state which is
reached by TMS = 0, 1, 0, 0.
BYPASS: A bit entering TDI is shifted to TDO after one TCK clock cycle.
Hardware Reference Manual
62
04.99
PEB 20324
PEF 20324
Package Outlines
7
Package Outlines
•
GPM05247
P-MQFP-160-1
(Plastic Metric Quad Flat Package)
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
SMD = Surface Mounted Device
Hardware Reference Manual
63
Dimensions in mm
04.99