AGILENT MGA

2 – 6 GHz Cascadable GaAs
MMIC␣ Amplifier
Technical Data
MGA-64135
Features
• Cascadable 50 Ω Gain Block
• Broadband Performance:
2–6␣ GHz
12.0 dB Typical Gain
± 0.8 dB Gain Flatness
12.0 dBm P1 dB
• Single Supply Bias
• Cost Effective Ceramic
Microstrip Package
Description
The MGA-64135 is a high performance gallium arsenide Monolithic
Microwave Integrated Circuit
(MMIC) housed in a cost effective,
microstrip package. This device is
designed for use as a general
purpose 50 ohm gain block in the 2
to 6␣ GHz frequency range. Typical
applications include narrow and
broadband IF and RF amplifiers
for commercial, industrial, and
military requirements.
This MMIC is a cascade of two
stages, each utilizing shunt
feedback to establish a broadband
impedance match. The source of
each stage is AC grounded to
allow biasing from a single
positive power supply. The
interstage blocking capacitor as
well as a resistive “self-bias”
network are included on chip.
The die is fabricated using HP’s
nominal .5 micron recessed
Schottky-barrier-gate, gold
metallization and silicon nitride
passivation to achieve excellent
performance, uniformity, and
reliability.
Typical Biasing Configuration
Vd
RFC
4
C block
3
IN
1
MGA
OUT
2
5965-9005E
6-192
35 Micro-X Package
MGA-64135 Absolute Maximum Ratings
Symbol
Vd
Pdiss
Pin
Tch
TSTG
Parameter
Device Voltage
Total Power Dissipation[2]
CW RF Input Power
Channel Temperature
Storage Temperature[3]
Thermal Resistance:
Liquid Crystal Measurement:
Units
V
mW
dBm
°C
°C
Absolute
Maximum[1]
12
650
+13
175
-65 to 175
θjc = 150°C/W [4]; TCH = 150°C
1 µm Spot Size [5]
Notes:
1. Operation of this device above any one of these parameters may cause
permanent damage.
2. Derate linearly at 8.3 mW/°C for
TCASE > 103°C.
3. Storage above +150°C may tarnish the leads of this package making it
difficult to solder into a circuit. After a device has been soldered into a
circuit, it may be safely stored up to 175°C.
4. The thermal resistance value is based on measurements taken with the
device soldered to a 25 mil Teflon PCB.
5. The small spot size of this technique results in a higher, though more
accurate determination of θjc than do alternate methods. See MEASUREMENTS section for more information.
MGA-64135 Electrical Specifications, TA = 25°C
Symbol
Parameters and Test Conditions: Vd = 10 V, ZO = 50 Ω
Units
Min.
f = 2 to 6 GHz
dB
10.0
f = 2 to 6 GHz
dB
± 1.20
dB
± 0.5
GP
Power Gain (|S21| 2)
∆GP
Gain Flatness
—
Gain Variation vs. Temperature
TCASE = –25°C to +85°C
f = 2 to 6 GHz
Input VSWR
f = 2 to 6 GHz
VSWR
Typ.
12.0
1.5:1
2.0:1
1.4:1
2.0:1
Output VSWR
f = 2 to 6 GHz
P1 dB
Output Power at 1 dB Gain Compression
f = 2 to 6 GHz
dBm
NF
50 Ω Noise Figure
f = 2 to 6 GHz
dB
7.5
—
Reverse Isolation (|S21| 2)
f = 2 to 6 GHz
dB
35
Id
Device Current
mA
6-193
10.0
35
Max.
12.0
50
65
MGA-64135 Typical Performance, TA = 25°C
P1 dB (dBm)
GP (dB)
14
12
10
15
9.0
14
8.5
NOISE FIGURE (dB)
16
13
12
8.0
7.5
8
6
11
0
2.0
4.0
6.0
8.0
10.0
0
2.0
FREQUENCY (GHz)
4.0
6.0
7.0
2.0
8.0
4.0
FREQUENCY (GHz)
Figure 1. Power Gain vs. Frequency,
Vd = 10 V.
6.0
8.0
FREQUENCY (GHz)
Figure 2. Output Power @ 1 dB Gain
Compression vs. Frequency, Vd = 10 V.
Figure 3. Noise Figure vs. Frequency,
Vd = 10 V.
2.0:1
VSWR
1.8:1
1.6:1
INPUT
1.4:1
OUTPUT
1.2:1
1.0:1
0
2.0
4.0
6.0
8.0
10.0
FREQUENCY (GHz)
Figure 4. VSWR vs. Frequency, Vd = 10 V.
MGA-64135 Typical Scattering Parameters (ZO = 50 Ω, TA = 25°C, Vd = 10 V)
S11
Freq.
GHz
Mag
0.5
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
.27
.18
.14
.17
.20
.18
.07
.15
.23
.32
.43
S21
S12
S22
Ang
dB
Mag
Ang
dB
Mag
Ang
Mag
Ang
–38
–44
–67
–91
–105
–114
–162
96
76
63
52
10.6
12.9
14.3
14.5
14.2
13.6
12.8
11.8
10.8
9.5
8.6
3.38
4.42
5.21
5.33
5.11
4.79
4.35
3.89
3.46
2.98
2.68
174
–9
–54
–93
–131
–167
157
123
92
63
38
–31.0
–33.1
–34.9
–37.1
–37.8
–37.3
–38.5
–36.0
–34.3
–29.3
–27.6
.028
.022
.018
.014
.013
.014
.012
.016
.019
.034
.041
–13
–20
–19
–21
–15
–10
–1
3
4
12
–11
.38
.26
.16
.11
.11
.14
.17
.16
.10
.04
.09
–41
–48
–59
–75
–71
–57
–41
–42
–54
159
116
6-194
35 Micro-X Package Dimensions
.085
2.15
4
GROUND
.083 DIA.
2.11
RF OUTPUT
641
RF INPUT
1
3
.020
.508
2
.057 ± .010
1.45 ± .25
.022
.56
GROUND
.100
2.54
Notes:
(unless otherwise specified)
1. Dimensions are in
mm
2. Tolerances
in .xxx = ± 0.005
mm .xx = ± 0.13
.455 ± .030
11.54 ± .75
.006 ± .002
.15 ± .05
6-195