UMS CHR2391-9900

CHR2391
RoHS COMPLIANT
12-16GHz Integrated Down Converter
GaAs Monolithic Microwave IC
Description
The CHR2391 is a multifunction chip which
integrates a LO time two multiplier, a balanced
cold FET mixer, and a RF LNA. It is designed for
a wide range of applications, typically commercial
communication systems. The backside of the
chip is both RF and DC grounds. This helps to
simplify the assembly process.
The circuit is manufactured with a pHEMT
process, 0.25µm gate length, via holes through
the substrate and air bridges.
It is available in chip form.
Main Features
Broadband performances: 12.0-16.0GHz
15 dB conversion gain
2dB noise figure, for IF>0.1GHz
10dBm LO input power
-10dBm RF input power (1dB gain comp.)
Low DC power consumption, [email protected]
Chip size: 2.49 X 2.13 X 0.10mm
dB







Typical on wafer measurement:
Conversion Gain & Image suppression
@ IF=0.9 & 1.5GHz
22
20
18
16
14
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
-16
2 LO frequency
10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 16.5 17.0 17.5
RF Frequency GHz
Main Characteristics
Tamb. = 25°C
Symbol
Parameter
Min
Typ
Max
Unit
FRF
RF frequency range
12
16
GHz
FLO
LO frequency range
5.25
7.25
GHz
FIF
IF frequency range
DC
1.5
GHz
Gc
Conversion gain
13
+15
dB
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
Ref. : DSCHR23911192 - 11 Jul 11
1/6
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
12 -16GHz Integrated Down Converter
CHR2391
Electrical Characteristics for Broadband Operation
Tamb = +25°C, Vd = 3.5V ,Idl=50mA, Idm=50mA
Symbol
Parameter
Min
Typ
Max
Unit
FRF
RF frequency range
12
16
GHz
FLO
LO frequency range
5.25
7.25
GHz
FIF
IF frequency range
DC
1.5
GHz
Gc
Conversion gain (1)
+13
NF
Noise Figure, for IF>0.1GHz (1)
PLO
+15
dB
2
2.5
dB
LO Input power
+10
+13
dBm
Image Suppression
15
dBc
Input power at 1dB gain compression
-10
dBm
Input IP3
2.5
dBm
LO VSWR Input LO VSWR (1)
2.0:1
RF VSWR Input RF VSWR (1)
2.0:1
Img Sup
P1dB
IP3
Id
Bias current (2)
100
130
mA
(1) On Wafer measurements
(2) Current source biasing network is recommended.
Optimum performances are obtained for Idm=50mA (Id consumption of the X2+buffer; vgb-0.4V)
and Idl=50mA(Id consumption for the lna; Vga-0.4V)
Absolute Maximum Ratings
Tamb. = 25°C (1)
Symbol
Parameter
Values
Unit
Vd
Maximum drain bias voltage
4.0
V
Id
Maximum drain bias current
180
mA
Vg
Gate bias voltage
-2.0 to +0.4
V
Vdg
Maximum drain to gate voltage ( Vd – Vg)
+5
V
Pin
Maximum RF peak input power overdrive (2)
-5
dBm
Tch
Maximum channel temperature
175
°C
Ta
Operating temperature range
-40 to +85
°C
Storage temperature range
-55 to +125
°C
Tstg
(1) Operation of this device above anyone of these parameters may cause permanent damage.
(2) Duration < 1s.
Ref. : : DSCHR23911192 - 11 Jul 11
2/6
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Specifications subject to change without notice
12 -16GHz Integrated Down Converter
CHR2391
Typical On-wafer Measurements
Bias Conditions:
Vdm= Vdl= 3.5 V, Idl= Idm= 50mA( Vga=vgb-0.4V), Vgm= -0.7V, Vgx= -0.6V
Conversion gain & Image suppression with a 90° IQ combiner
dB
22
IF= 0,9GHz
20
18
16
14
12
10
8
6
4
2
0
-2
-4
-6
-8
Infradyne Gain I
Image Rejection I
-10
-12
Image Rejection Q
Infradyne Gain Q
-14
-16
10,0 10,5 11,0 11,5 12,0 12,5 13,0 13,5 14,0 14,5 15,0 15,5 16,0 16,5 17,0
dB
RF Frequency GHz
22
IF= 1,5GHz
20
18
16
14
12
10
8
6
4
2
0
-2
-4
-6
-8
Infradyne Gain I
Image Rejection I
-10
-12
Image Rejection Q
Infradyne Gain Q
-14
-16
10,0 10,5 11,0 11,5 12,0 12,5 13,0 13,5 14,0 14,5 15,0 15,5 16,0 16,5 17,0 17,5
RF Frequency GHz
Ref. : : DSCHR23911192 - 11 Jul 11
3/6
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Specifications subject to change without notice
12 -16GHz Integrated Down Converter
CHR2391
Gain compression versus RF input power
20
IF=0.9GHz
18
16
14
12
10
8
6
Conversion Gain dB
4
IF Output power dBm
2
0
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
RF Input power dBm
20
IF=1.5GHz
18
16
14
12
10
Conversion Gain dB
8
IF Output power dBm
6
4
2
0
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
RF Input power dBm
Ref. : : DSCHR23911192 - 11 Jul 11
4/6
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Specifications subject to change without notice
12 -16GHz Integrated Down Converter
CHR2391
Chip Assembly and Mechanical Data
To Vg (lna) DC Gate
supply
To Vg (mixer) DC Gate
supply
To
VdL (lna)
+VdM
(x +buffer)
DC Gate supply
To Vg (Buffer) DC Gate
supply
To Vg (multiplier) DC Gate
supply
Note: Supply feed should be capacitively bypassed. 25µm diameter gold wire is
recommended
Bonding pad positions
Chip thickness: 100µm
Unit: µm
Tol : + / - 35µm
Ref. : : DSCHR23911192 - 11 Jul 11
5/6
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Specifications subject to change without notice
12 -16GHz Integrated Down Converter
CHR2391
Ordering Information
Chip form
:
CHR2391-99F/00
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use
as critical components in life support devices or systems without express written approval from United
Monolithic Semiconductors S.A.S.
Ref. : DSCHR23911192 - 11 Jul 11
6/6
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Specifications subject to change without notice