CSD17551Q5A www.ti.com SLPS375 – MAY 2012 30V, N-Channel NexFET™ Power MOSFETs Check for Samples: CSD17551Q5A FEATURES 1 • • • • • • • PRODUCT SUMMARY Ultra Low Qg and Qgd Low Thermal Resistance Avalanche Rated Pb Free Terminal Plating RoHS Compliant Halogen Free SON 5-mm × 6-mm Plastic Package VDS Drain to Source Voltage 30 V Qg Gate Charge Total (4.5V) 6.0 nC Qgd Gate Charge Gate to Drain RDS(on) Drain to Source On Resistance VGS(th) Threshold Voltage • nC 9 mΩ VGS = 10V 7 mΩ 1.7 V ORDERING INFORMATION Device Package Media CSD17551Q5A SON 5-mm × 6-mm Plastic Package 13-Inch Reel APPLICATIONS • 1.4 VGS = 4.5V Point of load Synchronous Buck in Networking, Telecom and Computing Systems Optimized for Control FET Applications Qty Ship 2500 Tape and Reel ABSOLUTE MAXIMUM RATINGS TA = 25°C unless otherwise stated VALUE UNIT DESCRIPTION VDS Drain to Source Voltage 30 V The NexFET power MOSFET has been designed to minimize losses in power conversion applications. VGS Gate to Source Voltage ±20 V Continuous Drain Current, TC = 25°C 48 A 13.5 A Figure 1. Top View S 8 1 D S 2 7 D S 3 6 D G 4 Continuous Drain Current, TA = 25°C(1) IDM Pulsed Drain Current, TA = 25°C(2) 85 A PD Power Dissipation(1) 3 W TJ, TSTG Operating Junction and Storage Temperature Range –55 to 150 °C EAS Avalanche Energy, single pulse ID = 25A, L = 0.1mH, RG = 25Ω 31.3 mJ (1) Typical RθJA = 41.9°C/W on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4 PCB. (2) Pulse duration ≤300μs, duty cycle ≤2% D 5 ID D P0093-01 RDS(on) vs VGS GATE CHARGE 10 TC = 25°C Id = 11A TC = 125ºC Id = 11A VGS - Gate-to-Source Voltage (V) RDS(on) - On-State Resistance - mΩ 25 20 15 10 5 0 0 2 4 6 8 10 12 14 16 VGS - Gate-to- Source Voltage - V 18 20 G001 ID = 11A VDS = 15V 8 6 4 2 0 0 3 6 9 Qg - Gate Charge - nC (nC) 12 15 G001 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated CSD17551Q5A SLPS375 – MAY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Static Characteristics BVDSS Drain to Source Voltage VGS = 0V, ID = 250μA IDSS Drain to Source Leakage Current VGS = 0V, VDS = 24V IGSS Gate to Source Leakage Current VDS = 0V, VGS = 20V VGS(th) Gate to Source Threshold Voltage VDS = VGS, ID = 250μA RDS(on) Drain to Source On Resistance gfs Transconductance 30 1.2 V 1 μA 100 nA 1.7 2.2 V 9 11 mΩ VGS = 10V, ID = 11A 7 8.8 mΩ VDS = 15V, ID = 11A 107 VGS = 4.5V, ID = 11A S Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance RG Series Gate Resistance Qg Gate Charge Total (4.5V) Qgd Gate Charge Gate to Drain Qgs Gate Charge Gate to Source Qg(th) Gate Charge at Vth Qoss Output Charge td(on) Turn On Delay Time tr Rise Time td(off) Turn Off Delay Time tf Fall Time VGS = 0V, VDS = 15V, f = 1MHz VDS = 15V, ID = 11A VDS = 13V, VGS = 0V VDS = 15V, VGS = 4.5V, IDS = 11A, RG = 2Ω 1060 1272 pF 247 296 pF 19 24 pF 1.4 1.9 Ω 6 7.2 nC 1.4 nC 2.8 nC 1.6 nC 7.2 nC 9.1 ns 15.5 ns 11.9 ns 4.3 ns Diode Characteristics VSD Diode Forward Voltage ISD = 11A, VGS = 0V 0.8 Qrr Reverse Recovery Charge 8.7 nC trr Reverse Recovery Time VDS= 13.5V, IF = 11A, di/dt = 300A/μs 1 V 13.5 ns THERMAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER RθJC Thermal Resistance Junction to Case (1) RθJA Thermal Resistance Junction to Ambient (1) (2) (1) (2) 2 MIN TYP MAX UNIT 4.2 °C/W 52.3 °C/W RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design. Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu. Copyright © 2012, Texas Instruments Incorporated CSD17551Q5A www.ti.com GATE SLPS375 – MAY 2012 GATE Source N-Chan 5x6 QFN TTA MIN Rev3 N-Chan 5x6 QFN TTA MAX Rev3 Max RθJA = 52.3°C/W when mounted on 1 inch2 (6.45 cm2) of 2oz. (0.071-mm thick) Cu. Source Max RθJA = 133°C/W when mounted on a minimum pad area of 2-oz. (0.071-mm thick) Cu. DRAIN DRAIN M0137-02 M0137-01 TYPICAL MOSFET CHARACTERISTICS (TA = 25°C unless otherwise stated) Figure 2. Transient Thermal Impedance Copyright © 2012, Texas Instruments Incorporated 3 CSD17551Q5A SLPS375 – MAY 2012 www.ti.com TYPICAL MOSFET CHARACTERISTICS (continued) (TA = 25°C unless otherwise stated) TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING 100 100 IDS - Drain-to-Source Current - A IDS - Drain-to-Source Current - A VDS = 5V 80 60 40 VGS =10V VGS =6.5V VGS =3.5V 20 0 0 1 2 3 4 VDS - Drain-to-Source Voltage - V 80 60 40 0 5 TC = 125°C TC = 25°C TC = −55°C 20 0 1 G001 Figure 3. Saturation Characteristics TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING 8 C − Capacitance − nF VGS - Gate-to-Source Voltage (V) Ciss = Cgd + Cgs Coss = Cds + Cgd Crss = Cgd 6 4 2 1.2 0.9 0.6 0.3 0 3 6 9 Qg - Gate Charge - nC (nC) 12 0 15 0 5 10 15 20 25 VDS - Drain-to-Source Voltage - V G001 Figure 5. Gate Charge 30 G001 Figure 6. Capacitance TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING 25 2.5 RDS(on) - On-State Resistance - mΩ ID = 250uA VGS(th) - Threshold Voltage - V G001 1.5 ID = 11A VDS = 15V 0 5 Figure 4. Transfer Characteristics 10 2 1.5 1 0.5 −75 −25 25 75 125 TC - Case Temperature - ºC Figure 7. Threshold Voltage vs. Temperature 4 2 3 4 VGS - Gate-to-Source Voltage - V 175 G001 TC = 25°C Id = 11A TC = 125ºC Id = 11A 20 15 10 5 0 0 2 4 6 8 10 12 14 16 VGS - Gate-to- Source Voltage - V 18 20 G001 Figure 8. On-State Resistance vs. Gate-to-Source Voltage Copyright © 2012, Texas Instruments Incorporated CSD17551Q5A www.ti.com SLPS375 – MAY 2012 TYPICAL MOSFET CHARACTERISTICS (continued) (TA = 25°C unless otherwise stated) TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING 1.8 1.6 100 VGS = 4.5V VGS = 6V VGS = 10V ID =11A ISD − Source-to-Drain Current - A Normalized On-State Resistance 2 1.4 1.2 1 0.8 0.6 0.4 −75 −25 25 75 125 TC - Case Temperature - ºC 175 TC = 25°C TC = 125°C 10 1 0.1 0.01 0.001 0.0001 0 0.2 0.4 0.6 0.8 VSD − Source-to-Drain Voltage - V G001 Figure 9. Normalized On-State Resistance vs. Temperature 1 G001 Figure 10. Typical Diode Forward Voltage TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING − IAV - Peak Avalanche Current- A 200 TC = 25ºC TC = 125ºC 100 10 1 0.001 Figure 11. Maximum Safe Operating Area 0.01 0.1 TAV - Time in Avalanche - mS 1 G001 Figure 12. Single Pulse Unclamped Inductive Switching TEXT ADDED FOR SPACING − IDS - Drain- to- Source Current - A 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 −50 −25 0 25 50 75 100 125 TC - Case Temperature - ºC 150 175 G001 Figure 13. Maximum Drain Current vs. Temperature Copyright © 2012, Texas Instruments Incorporated 5 CSD17551Q5A SLPS375 – MAY 2012 www.ti.com MECHANICAL DATA Q5A Package Dimensions L E2 H K 7 D2 3 4 b 4 5 5 6 3 6 e D1 7 2 2 8 8 1 1 q L1 Top View Bottom View Side View c A q E1 E Front View M0135-01 DIM 6 MILLIMETERS MIN NOM MAX A 0.90 1.00 1.10 b 0.33 0.41 0.51 c 0.20 0.25 0.34 D1 4.80 4.90 5.00 D2 3.61 3.81 4.02 E 5.90 6.00 6.10 E1 5.70 5.75 5.80 E2 3.38 3.58 3.78 e 1.17 1.27 1.37 H 0.41 0.56 0.71 K 1.10 L 0.51 0.61 0.71 L1 0.06 0.13 0.20 θ 0° 12° Copyright © 2012, Texas Instruments Incorporated CSD17551Q5A www.ti.com SLPS375 – MAY 2012 Figure 14. Recommended PCB Pattern DIM F1 F7 F3 8 1 F2 F11 F5 F9 5 4 F6 MILLIMETERS INCHES MIN MAX MIN MAX F1 6.205 6.305 0.244 0.248 F2 4.46 4.56 0.176 0.18 F3 4.46 4.56 0.176 0.18 F4 0.65 0.7 0.026 0.028 F5 0.62 0.67 0.024 0.026 F6 0.63 0.68 0.025 0.027 F7 0.7 0.8 0.028 0.031 F8 0.65 0.7 0.026 0.028 F9 0.62 0.67 0.024 0.026 F10 4.9 5 0.193 0.197 F11 4.46 4.56 0.176 0.18 F8 F4 F10 M0139-01 For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques. K0 4.00 ±0.10 (See Note 1) 0.30 ±0.05 2.00 ±0.05 +0.10 –0.00 12.00 ±0.30 Ø 1.50 1.75 ±0.10 Q5A Tape and Reel Information 5.50 ±0.05 B0 R 0.30 MAX A0 8.00 ±0.10 Ø 1.50 MIN A0 = 6.50 ±0.10 B0 = 5.30 ±0.10 K0 = 1.40 ±0.10 R 0.30 TYP M0138-01 Notes: 1. 10-sprocket hole-pitch cumulative tolerance ±0.2 2. Camber not to exceed 1mm in 100mm, noncumulative over 250mm 3. Material: black static-dissipative polystyrene 4. All dimensions are in mm (unless otherwise specified) 5. A0 and B0 measured on a plane 0.3mm above the bottom of the pocket Copyright © 2012, Texas Instruments Incorporated 7 PACKAGE OPTION ADDENDUM www.ti.com 10-Jul-2012 PACKAGING INFORMATION Orderable Device CSD17551Q5A Status (1) ACTIVE Package Type Package Drawing SON DQJ Pins Package Qty 8 2500 Eco Plan (2) Pb-Free (RoHS Exempt) Lead/ Ball Finish CU SN MSL Peak Temp (3) Samples (Requires Login) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CSD17551Q5A Package Package Pins Type Drawing SON DQJ 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.3 B0 (mm) K0 (mm) P1 (mm) 5.3 1.2 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CSD17551Q5A SON DQJ 8 2500 340.0 340.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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