CY54FCT244T, CY74FCT244T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS071 – OCTOBER 2001 D D D D D D D D OEA DA0 OB0 DA1 OB1 DA2 OB2 DA3 OB3 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OEB OA0 DB0 OA1 DB1 OA2 DB2 OA3 DB3 CY54FCT244T . . . L PACKAGE (TOP VIEW) OB0 DA0 OEA VCC OEB D CY54FCT244T . . . D PACKAGE CY74FCT244T . . . P, Q, OR SO PACKAGE (TOP VIEW) Function, Pinout, and Drive Compatible With FCT and F Logic Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels CY54FCT244T – 48-mA Output Sink Current 12-mA Output Source Current CY74FCT244T – 64-mA Output Sink Current 32-mA Output Source Current 3-State Outputs DA1 OB1 DA2 OB2 DA3 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 OA0 DB0 OA1 DB1 OA2 OB 3 GND DB 3 OA 3 DB 2 D description The ’FCT244T devices are octal buffers and line drivers designed to be employed as memory address drivers, clock drivers, and bus-oriented transmitters/receivers. These devices provide speed and drive capabilities equivalent to their fastest bipolar logic counterparts, while reducing power consumption. The input and output voltage levels allow direct interface with TTL, NMOS, and CMOS devices without external components. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CY54FCT244T, CY74FCT244T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS071 – OCTOBER 2001 ORDERING INFORMATION QSOP – Q 0°C to 70°C TOP-SIDE MARKING 3.6 CY74FCT244DTQCT Tube 3.6 CY74FCT244DTSOC Tape and reel 3.6 CY74FCT244DTSOCT Tube 4.1 CY74FCT244CTSOC Tape and reel 4.1 CY74FCT244CTSOCT QSOP – Q Tape and reel 4.1 CY74FCT244CTQCT FCT244C DIP – P Tube 4.6 CY74FCT244ATPC CY74FCT244ATPC Tube 4.6 CY74FCT244ATSOC Tape and reel 4.6 CY74FCT244ATSOCT Tape and reel 4.6 CY74FCT244ATQCT Tube 6.5 CY74FCT244TSOC Tape and reel 6.5 CY74FCT244TSOCT QSOP – Q Tape and reel 6.5 CY74FCT244TQCT CDIP – D Tube 4.6 CY54FCT244CTDMB LCC – L Tube 4.6 CY54FCT244CTLMB CDIP – D Tube 5.1 CY54FCT244ATDMB LCC – L Tube 5.1 CY54FCT244ATLMB CDIP – D Tube 7 CY54FCT244TDMB SOIC – SO SOIC – SO QSOP – Q SOIC – SO –55°C 55°C to 125°C ORDERABLE PART NUMBER Tape and reel SOIC – SO 40°C to 85°C –40°C SPEED (ns) PACKAGE† TA FCT244D FCT244D FCT244C FCT244A FCT244A FCT244 FCT244 LCC – L Tube 7 CY54FCT244TLMB † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS OEA OEB D OUTPUT O L L L L L L H H H H X Z H = High logic level, L = Low logic level, X = Don’t care, Z = High-impedance state 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY54FCT244T, CY74FCT244T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS071 – OCTOBER 2001 logic diagram (positive logic) OEA 1 2 18 DA1 4 16 DA2 6 14 8 12 DA0 DA3 OEB DB0 DB1 DB2 DB3 OA0 OA1 OA2 OA3 19 17 3 15 5 13 7 11 9 OB0 OB1 OB2 OB3 absolute maximum rating over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, θJA (see Note 1): P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CY54FCT244T, CY74FCT244T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS071 – OCTOBER 2001 recommended operating conditions (see Note 2) CY54FCT244T CY74FCT244DT CY74FCT244T MIN NOM MAX MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.75 5 5.25 4.75 5 5.25 VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 0.8 0.8 V High-level output current –12 –32 –32 mA IOL TA Low-level output current 48 64 64 mA 85 °C High-level input voltage Operating free-air temperature 2 –55 2 125 0 2 70 NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. 4 UNIT POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 –40 V V CY54FCT244T, CY74FCT244T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS071 – OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH CY54FCT244T TYP† MAX TEST CONDITIONS VCC = 4.5 V, VCC = 4.75 V, IIN = –18 mA IIN = –18 mA VCC = 4.5 V, IOH = –12 mA IOH = –32 mA VCC = 4 4.75 75 V MIN –0.7 –1.2 –0.7 2.4 2.4 Vhys All inputs II VCC = 5.5 V, VCC = 5.25 V, VIN = VCC VIN = VCC 5 IIH VCC = 5.5 V, VCC = 5.25 V, VIN = 2.7 V VIN = 2.7 V ±1 IIL VCC = 5.5 V, VCC = 5.25 V, VIN = 0.5 V VIN = 0.5 V ±1 IOZH VCC = 5.5 V, VCC = 5.25 V, VOUT = 2.7 V VOUT = 2.7 V 10 IOZL VCC = 5.5 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0.5 V –10 IOS‡ VCC = 5.5 V, VCC = 5.25 V, VOUT = 0 V VOUT = 0 V VCC = 0 V, VCC = 5.5 V, VOUT = 4.5 V VIN ≤ 0.2 V, ∆ICC 0.3 3.3 0.55 IOL = 64 mA 0.3 0.2 0.55 0.2 ±1 ±1 10 –10 –120 –225 –60 –120 ±1 VIN ≥ VCC – 0.2 V VIN ≥ VCC – 0.2 V VCC = 5.25 V, VIN ≤ 0.2 V, VCC = 5.5 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open 0.1 0.5 VCC = 5.5 V, One input switching at 50% duty cycle, Outputs open, OEA = OEB = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.06 V V 5 –60 V V 2 IOH = –15 mA IOL = 48 mA VCC = 4.5 V, VCC = 4.75 V, ICC –1.2 UNIT 3.3 VOL Ioff CY74FCT244T TYP† MAX MIN –225 ±1 0.2 0.1 0.2 0.5 2 2 µA µA µA µA µA mA µA mA mA 0.12 mA/ MHz VCC = 5.25 V, One input switching at 50% duty cycle, Outputs open, OEA = OEB = GND, 0.06 0.12 VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND ¶ This parameter is derived for use in total power-supply calculations. ICCD¶ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CY54FCT244T, CY74FCT244T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS071 – OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (continued) PARAMETER CY54FCT244T TYP† MAX TEST CONDITIONS MIN One bit switching VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V at f1 = 10 MHz at 50% duty cycle V = 3.4 V or GND IN IC# VCC = 5.5 V, Outputs open, Eight bits VIN = 0.2 V or OEA = OEB = GND switching VIN ≥ VCC – 0.2 V at f1 = 2.5 2 5 MHz at 50% duty cycle VIN = 3.4 V or GND 0.7 1.4 1 2.4 1.3 2.6|| 3.3 10.6|| UNIT mA One bit switching VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V at f1 = 10 MHz at 50% duty cycle V = 3.4 V or GND IN VCC = 5.25 V, Outputs open, Eight bits VIN = 0.2 V or OEA = OEB = GND switching VIN ≥ VCC – 0.2 V at f1 = 2.5 2 5 MHz at 50% duty cycle VIN = 3.4 V or GND 0.7 1.4 1 2.4 1.3 2.6|| 3.3 10.6|| Ci 5 10 5 10 pF Co 9 12 9 12 pF † Typical values are at VCC = 5 V, TA = 25°C. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: = Total supply current IC ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. 6 CY74FCT244T TYP† MAX MIN POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY54FCT244T, CY74FCT244T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS071 – OCTOBER 2001 switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D O tPZH tPZL OE O tPHZ tPLZ OE O CY54FCT244T CY54FCT244AT CY54FCT244CT MIN MAX MIN MAX MIN MAX 1.5 7 1.5 5.1 1.5 4.6 1.5 7 1.5 5.1 1.5 4.6 1.5 8.5 1.5 6.5 1.5 6.5 1.5 8.5 1.5 6.5 1.5 6.5 1.5 7.5 1.5 5.9 1.5 5.7 1.5 7.5 1.5 5.9 1.5 5.7 UNIT ns ns ns switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D O tPZH tPZL OE O tPHZ tPLZ OE O CY74FCT244T CY74FCT244AT CY74FCT244CT CY74FCT244DT MIN MAX MIN MAX MIN MAX MIN MAX 1.5 6.5 1.5 4.6 1.5 4.1 1.5 3.6 1.5 6.5 1.5 4.6 1.5 4.1 1.5 3.6 1.5 8 1.5 6.2 1.5 5.8 1.5 4.8 1.5 8 1.5 6.2 1.5 5.8 1.5 4.8 1.5 7 1.5 5.6 1.5 5.2 1.5 4 1.5 7 1.5 5.6 1.5 5.2 1.5 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT ns ns ns 7 CY54FCT244T, CY74FCT244T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS071 – OCTOBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 500 Ω S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9220301M2A ACTIVE LCCC FK 20 1 TBD 5962-9220301MRA ACTIVE CDIP J 20 1 TBD 5962-9220301MSA ACTIVE CFP W 20 1 TBD 5962-9220302M2A ACTIVE LCCC FK 20 1 TBD 5962-9220302MRA ACTIVE CDIP J 20 1 TBD 5962-9220302MSA ACTIVE CFP W 20 1 TBD 5962-9220303M2A ACTIVE LCCC FK 20 1 TBD 5962-9220303MRA ACTIVE CDIP J 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type Call TI N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type Call TI N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type 5962-9220303MSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type CY54FCT244ATDMB ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CY54FCT244ATLMB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type CY54FCT244ATW ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type CY54FCT244CTDMB ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CY54FCT244CTW ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type CY54FCT244TDMB ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CY54FCT244TLMB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type CY54FCT244TW ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type CY74FCT244ATPC ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CY74FCT244ATPCE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CY74FCT244ATQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244ATQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244ATQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244ATSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244CTQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244CTQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244CTQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244CTSOC ACTIVE SOIC DW 20 CU NIPDAU Level-1-260C-UNLIM 25 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT244CTSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244CTSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244CTSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244CTSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244DTQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244DTQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244DTSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244TQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244TSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2008 http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CY74FCT244ATQCT Package Package Pins Type Drawing SSOP/ QSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT244ATSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CY74FCT244CTQCT SSOP/ QSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT244CTSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CY74FCT244DTQCT SSOP/ QSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT244DTSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CY74FCT244TQCT SSOP/ QSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT244TSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT244ATQCT SSOP/QSOP DBQ 20 2500 346.0 346.0 33.0 CY74FCT244ATSOCT SOIC DW 20 2000 346.0 346.0 41.0 CY74FCT244CTQCT SSOP/QSOP DBQ 20 2500 346.0 346.0 33.0 CY74FCT244CTSOCT SOIC DW 20 2000 346.0 346.0 41.0 CY74FCT244DTQCT SSOP/QSOP DBQ 20 2500 346.0 346.0 33.0 CY74FCT244DTSOCT SOIC DW 20 2000 346.0 346.0 41.0 CY74FCT244TQCT SSOP/QSOP DBQ 20 2500 346.0 346.0 33.0 CY74FCT244TSOCT SOIC DW 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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