ECG014 The Communications Edge TM 0.2 Watt, High Linearity InGaP HBT Amplifier Product Description Product Features • 50 – 2000 MHz Functional Diagram The ECG014 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve performance over a broad range with +39 dBm OIP3 and +23 dBm of compressed 1-dB power and is housed in an industry standard SOT-89 SMT package. All devices are 100% RF and DC tested. • +23 dBm P1dB • +39 dBm Output IP3 • 20.5 dB Gain @ 900 MHz • 17.6 dB Gain @ 1900 MHz • Single Positive Supply (+8V) GND 4 The product is targeted for use as a gain block/driver amplifier for various current and next generation wireless technologies such as GPRS, GSM and CDMA, where high linearity and medium power is required. In addition, the ECG014 will work for numerous other applications within the 50 to 2000 MHz frequency range. • SOT-89 SMT Package Applications • Mobile Infrastructure • Defense/Homeland Security Specifications (1) Parameters Product Information 1 2 3 RF IN GND RF OUT ECG014B Typical Performance (5) Units Min MHz MHz dB dBm dBm MHz dB dB dB dBm dBm 50 Operational Bandwidth Test Frequency Gain Output P1dB Output OIP3 (2) Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) IS-95A Channel Power @ -45 dBc ACPR, 1900 MHz Noise Figure Operating Current Range (3) Device Voltage (4) 18.5 +22 +38 17 +36.5 dBm dB mA V Typ Max Parameters 2000 Frequency S21 – Gain S11 – Input R.L. S22 – Output R.L. Output P1dB Output IP3 (2) IS-95A Channel Power 900 20.5 +23 +39 1900 17.6 17 7.4 +23 +38 Units @ -45 dBc ACPR, 1900 MHz Noise Figure Supply Bias Typical MHz dB dB dB dBm dBm 900 20.5 -20 -9.5 +22.8 +39 1900 17.6 -17 -7.4 +23 +38 dBm +17 +16 dB 5 5.2 +8 V @ 100 mA 5. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +8 V, Icc = 100 mA, +25° C, Rbias = 30 Ω. +16 85 5.2 100 5 135 1. Test conditions unless otherwise noted: 25 °C, Vsupply = +8V, in tuned application circuit with Rbias = 30 Ω. 2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. The tuned application circuit is tuned for optimum ACPR performance. An improvement in OIP3 of 2 to 3 dB can be achieved for tuning for optimum OIP3 (with slightly degraded ACPR performance). 3. This corresponds to the quiescent current or operating current under small-signal conditions. 4. This device requires a minimum 7 V power supply through a dropping resistor. 8 V and 30 ohms are recommended for proper operation. Operation of the device directly to a 5 V supply could lead to thermal damage to the device. Absolute Maximum Rating Parameters Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Device Power Junction Temperature Rating -40 to +85 °C -65 to +150 °C +12 dBm +6 V 150 mA 1.5 W +250 °C Ordering Information Part No. Description ECG014B ECG014B-PCB900 ECG014B-PCB1900 0.2 Watt, High Linearity InGaP HBT Amplifier 900 MHz Evaluation Board 1900 MHz Evaluation Board Operation of this device above any of these parameters may cause permanent damage. . Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECG014 The Communications Edge TM 0.2 Watt, High Linearity InGaP HBT Amplifier Product Information Typical Device Data S-parameters (Vdevice = +5V, Icc = 100 mA, 25° C, unmatched 50 ohm system) S11 0. 4 2. 0 0 3. 0 4. 0 4. 5.0 5.0 0.2 0.2 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 10.0 0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.2 20 0.4 10.0 0 Gain (dB) 0.8 0 3. 25 Swp Max 2.01283GHz 6 0. 2. 0 DB(GMax) 1.0 1.0 0.8 6 0. DB(|S[2,1]|) S22 Swp Max 2.01283GHz 0. 4 Gain / Maximum Stable Gain 30 -10.0 -3 .0 Swp Min 0.01483GHz .0 -2 -1.0 -0 .6 .0 -2 2 -1.0 1.5 -0.8 1 Frequency (GHz) -0 .6 0.5 .4 -0 -0.8 -4 .0 -5. 0 0 2 -3 .0 .4 -0 10 -0. -4 .0 -5. 0 2 -0. -10.0 15 Swp Min 0.01483GHz Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in blue color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 50 – 2500 MHz, with markers placed at 0.25 – 2 GHz in 0.25 GHz increments. S-Parameters (Vdevice = +5 V, Icc = 100 mA, T = 25° C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) 50 100 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2500 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -5.21 -4.92 -4.72 -4.31 -4.10 -4.19 -4.63 -5.64 -7.84 -13.52 -19.89 -6.99 -2.84 -1.18 -0.78 -158.20 -170.08 -177.73 173.22 163.26 152.57 140.41 126.43 109.08 83.27 -85.25 -131.98 -160.75 177.40 167.87 27.34 25.32 24.15 22.43 20.91 19.68 18.82 18.35 18.13 18.12 17.78 16.44 14.09 10.90 9.28 141.96 144.95 138.50 118.30 100.56 85.04 69.98 54.85 38.12 17.54 -7.75 -37.07 -64.48 -86.11 -96.04 -32.11 -31.61 -31.37 -30.63 -30.32 -29.78 -29.74 -29.31 -29.86 -31.16 -34.99 -34.48 -29.33 -26.64 -25.96 16.29 9.45 6.88 7.98 5.52 2.65 -2.18 -11.26 -26.72 -52.52 -105.12 161.53 106.22 75.52 66.16 -6.58 -7.49 -7.96 -8.46 -8.81 -9.07 -9.12 -8.95 -8.04 -6.16 -3.43 -1.36 -0.69 -0.93 -1.28 -132.30 -157.02 -171.72 178.73 174.06 171.40 169.67 170.98 175.14 179.09 176.43 164.56 149.67 136.25 130.16 Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout C12 C7 C9 C8 Circuit Board Material: .014” Getek, 4 - layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning shunt capacitors. The markers and vias are spaced in .050” increments. C7/C8 are for 900 MHz matching circuits and C9/C12 are for 1900 MHz matching circuits. . Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECG014 The Communications Edge TM 0.2 Watt, High Linearity InGaP HBT Amplifier Product Information 900 MHz Application Circuit (ECG014B-PCB900) Typical RF Performance at 25°C Frequency S21 – Gain S11 – Input Return Loss S22 – Output Return Loss Output P1dB Output IP3∗ 8v C = .1uF 900 MHz 20.5 dB -20 dB -9.5 dB +22.8 dBm RES ID=R3 R=220 Ohm Channel Power PORT P=1 Z=50 Ohm +17 dBm (@-45 dBc ACPR, IS-95 9 channels fwd) Noise Figure Device Voltage Quiescent Current CAP ID=C6 C=56 pF IND ID=L1 L=33 nH SUBCKT ECG014 900 MHz CAP ID=C7 C=5.6 pF 5 dB +5 V 100 mA S22 vs. Frequency 0 -5 -5 20 -15 -20 -25 +25°C +85°C -30 +85°C -40°C -35 -40°C +25°C 900 920 940 -40 840 860 Frequency (MHz) Noise Figure vs. Frequency -15 880 900 920 940 860 880 +85°C 900 920 940 -40 -45 +25°C 22 +85°C -40°C -50 -55 +25°C -60 +85°C -65 -40°C -70 860 Frequency (MHz) 880 900 920 940 12 13 Frequency (MHz) OIP3 vs. Frequency +25°C, +9 dBm / tone 42 940 ACPR vs. Channel Power 23 20 840 920 IS-95, 9 Ch. Fw d, ±885 KHz offset, 30 KHz Meas. BW, 900 MHz 21 -40°C 900 Frequency (MHz) A C P R (d B c ) P 1 d B (d B m ) +25°C 880 -40°C P1 dB vs. Frequency 4 860 +85°C -25 840 24 2 +25°C -20 25 6 N F (d B ) -10 Frequency (MHz) 8 42 S 2 2 (d B ) S 1 1 (d B ) S 2 1 (d B ) 22 0 840 RES ID=R5 R=50 Ohm S11 vs. Frequency -10 880 CAP ID=C5 C=56 pF PORT P=2 Z=50 Ohm CAP ID=C8 C=0.8 pF 0 24 860 CAP ID=C1 C=56 pF C7 is placed at silkscreen marker ‘C’ or center of component placed at 5.6 deg. @ 900 MHz away from pin 1. C8 is placed at 22 deg. @ 900 MHz away from pin 3. S21 vs. Frequency 16 840 CAP ID=C3 CAP ID=C2 C=1000 pF CAP ID=C4 C=56 pF RES ID=R4 R=22 Ohm ∗ Please see note 2 on page 1. 18 RES ID=R1 R=30 Ohm 8.2v zener IND ID=L2 L=33 nH +39 dBm (+9 dBm / tone, 1 MHz spacing) RES ID=R2 R=390 Ohm 14 15 16 17 18 Output Channel Power (dBm) OIP3 vs. Temperature Fre. = 900, 901 MHz, +9 dBm / tone OIP3 vs. Output Power Freq. = 900, 901 MHz, +25°C 42 40 38 36 34 32 30 840 40 O IP 3 (d B m ) O IP 3 (d B m ) OIP 3 (dB m ) 40 38 36 34 860 880 900 Frequency (MHz) 920 940 32 -40 38 36 34 32 -15 10 35 Temperature (°C) 60 85 6 7 8 9 10 11 12 Output Power (dBm) 13 14 . Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECG014 The Communications Edge TM 0.2 Watt, High Linearity InGaP HBT Amplifier Product Information 1900 MHz Application Circuit (ECG014B-PCB1900) Frequency S21 – Gain S11 – Input Return Loss S22 – Output Return Loss Output P1dB Output IP3∗ (+9 dBm / tone, 1 MHz spacing) Channel Power (@-45 dBc ACPR, IS-95 9 channels fwd) Noise Figure Device Voltage Quiescent Current 1900 MHz 17.6 dB -17 dB -7.4 dB +23 dBm +38 dBm PORT P=1 Z=50 Ohm +16 dBm CAP ID=C6 C=56 pF CAP ID=C4 C=56 pF RES ID=R4 R=22 Ohm 5.2 dB +5 V 100 mA IND ID=L1 L=15 nH IND ID=L3 L=1 nH SUBCKT ECG014 1.9GHz CAP ID=C10 C=0.7 pF C9 placed at silkscreen marker ‘8” or center of component placed at 39 deg. @ 1900 MHz away from pin 1. C12 is placed at silkscreen marker ‘I” or center of component placed at 43 deg. @ 1.9 GHz away from pin 1. S11 vs. Frequency S22 vs. Frequency -2 -10 -4 +85°C -6 -40°C 0 +25°C -15 +85°C -20 -40°C 0 1850 1870 1890 1910 1930 1950 1970 1990 S 2 2 (d B ) S 1 1 (d B ) -5 +25°C +85°C -8 -40°C -10 -25 1850 1870 1890 1910 1930 1950 1970 1990 Frequency (MHz) -12 1850 1870 1890 1910 1930 1950 1970 1990 Frequency (MHz) ACPR vs. Channel Power P1 dB vs. Frequency 7 IS-95, 9 Ch. Fwd. ±885 KHz offset, 30 KHz Meas. BW, 1900 MHz -35 25 6 -40 +25°C 2 +85°C 1 -40°C A C P R (d B c ) 3 P 1 d B (d B m ) 23 4 21 19 +25°C +85°C 17 0 1850 1870 1890 1910 1930 1950 1970 1990 -40°C 15 1850 1870 1890 1910 1930 1950 1970 1990 Frequency (MHz) Frequency (MHz) 42 O IP 3 (d B m ) 36 34 Frequency (MHz) -60 10 11 12 13 14 15 16 17 18 Output Power (dBm) OIP3 vs. Output Power Freq. = 1900, 1901 MHz, 25°C 42 40 38 36 38 36 34 34 32 1850 1870 1890 1910 1930 1950 1970 1990 -55 -70 40 38 -50 OIP3 vs. Temperature freq. = 1900, 1901 MHz, +9 dBm / tone OIP3 vs. Frequency +25°C, +9 dBm / tone 40 -45 -65 O IP 3 (d B m ) 42 +25°C Frequency (MHz) Noise Figure vs. Frequency 5 CAP ID=C5 C=56 pF PORT P=2 Z=50 Ohm 20 10 CAP ID=C1 C=56 pF CAP ID=C7 C=1.5 pF 0 15 CAP ID=C3 CAP ID=C2 C=1000 pF 25 5 N F (d B ) RES ID=R1 R=30 Ohm 8.2v zener IND ID=L2 L=15 nH S21 vs. Frequency S 2 1 (d B ) RES ID=R2 R=390 Ohm RES ID=R3 R=220 Ohm ∗ Please see note 2 on page 1. OIP3 (dBm) C = .1uF 8v Typical RF Performance at 25°C 32 32 -40 -15 10 35 60 6 85 Temperature (°C) 7 8 9 10 11 12 13 14 Output Power (dBm) . Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECG014 The Communications Edge TM 0.2 Watt, High Linearity InGaP HBT Amplifier Product Information Outline Drawing Product Marking The component will be marked with an “E014” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85° C 128° C / W 149° C Notes: 1. The thermal resistance is referenced from the junction-to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 100000 10000 1000 100 60 70 80 90 100 110 120 Tab Temperature (°C) . Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004