STMICROELECTRONICS ETL9445

ETL9444/ETL9445
ETL9344/ETL9345
4-BIT NMOS MICROCONTROLLERS
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LOW COST
POWERFUL INSTRUCTION SET
2k x 8 ROM, 128 x 4 RAM
23 I/O LINES (ETL9444)
TRUE VECTORED INTERRUPT, PLUS RESTART
THREE-LEVEL SUBROUTINE STACK
16µs INSTRUCTION TIME
SINGLE SUPPLY OPERATION (4.5-6.3V)
LOW CURRENT DRAIN (13mA max.)
INTERNAL TIME-BASE COUNTER FOR REALTIME PROCESSING
INTERNAL BINARY COUNTER REGISTER
WITH MICROWIRE SERIAL I/O CAPABILITY
GENERAL PURPOSE AND TRI-STATE OUTPUTS
LSTTL/CMOS COMPATIBLE IN AND OUT
DIRECT DRIVE OF LED DIGIT AND SEGMENT
LINES
SOFTWARE/HARDWARE
COMPATIBLE
WITH OTHER MEMBERS OF ET9400 FAMILY
EXTENDED TEMPERATURE RANGE DEVICES
ETL9344/L9345 (– 40°C to + 85°C)
WIDER SUPPLY RANGE (4.5 – 9.5V)
OPTIONALLY AVAILABLE
SOIC 24/28 AND PLCC 28 PACKAGES AVAILABLE
ETL9444/ETL9344
N
(Plastic Package)
ETL9345/ETL9345
N
(Plastic Package)
PIN CONNECTION
DESCRIPTION
The ETL9444/L9445 and ETL9344/L9345 SingleChip N-Channel Microcontrollers are fully compatible with the COPS family, fabricated using
N-channel, silicon gate XMOS technology. They are
complete microcomputers containing all system timing, internal logic, ROM, RAM and I/O necessary
to implement dedicated control functions in a variety
of applications. Features include single supply operation, a variety of output configuration options, with
an instruction set, internal architecture and I/O
scheme designed to facilitate keyboard input, display output and BCD data manipulation. The
ETL9445 is identical to the ETL9444, except with 19
I/O lines instead of 23 : They are an appropriate
choice for use in numerous human interface control
environments. Standard test procedures and reliable high-density fabrication techniques provide the
medium to large volume customers with a customiMay 1989
1/27
ETL9444/9445–ETL9344/9345
zed controller oriented processor at a low end-product cost.
Figure 1 : Block Diagram (28-pin version).
2/27
The ETL9344/L9345 are exact functional equivalents, but extended temperature range versions of
the ETL9444/L9445 respectively.
ETL9444/9445–ETL9344/9345
ETL9444/L9445
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Voltage at any Pin Relative to GND
– 0.5 to + 10
V
0 to + 70
°C
– 65 to + 150
°C
300
°C
Ambient Operating Temperature
Ambient Storage Temperature
Lead Temperature (soldering, 10 seconds)
Power Dissipation
Unit
0.75W at 25°C
0.4W at 70°C
Total Source Current
120
mA
Total Sink Current
120
mA
Absolute maximum ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications are not ensured when operating the device at absolute maximum ratings.
DC ELECTRICAL CHARACTERISTICS 0°C ≤ T A ≤ + 70°C, 4.5V ≤ V C C ≤ 9.5V
(unless otherwise specified)
Parameter
Standard Operating Voltage (V CC )
Optional Operating Voltage (V CC )
Power Supply Ripple
Operating Supply Current
Input Voltage Levels
CKI Input Levels
Crystal Input (÷ 32, ÷ 16, ÷ 8)
Logic High (V IH)
Logic Low (V IL )
Schmitt Trigger Input (÷ 4)
Logic High (V IH)
Logic Low (V IL )
RESET Input Levels
Logic High
Logic Low
SO Input Level (test mode)
All Other Inputs
Logic High
Logic High
Logic Low
Logic High
Logic Low
Input Capacitance
Hi-Z Input Leakage
Test Conditions
Min.
Max.
Unit
4.5
4.5
6.3
9.5
0.5
13
V
V
V
mA
2.0
– 0.3
0.4
V
V
0.7 V CC
– 0.3
0.6
V
V
0.7 V CC
– 0.3
2.0
0.6
2.5
V
V
V
Note 1
Peak to Peak
All Inputs and Outputs Open
Schmitt Trigger Input
V CC = Max.
With TTL trip level options
selected, V CC = 5V ± 5%.
With high trip level options
selected.
3.0
2.0
– 0.3
3.6
– 0.3
–1
Output Voltage Levels
LSTTL Operation
Logic High (V OH )
Logic Low (V OL )
V CC = 5V ± 5%
I OH = – 25µA
I OL = 0.36mA
CMOS Operation
Logic High
Logic Low
I OH = – 10µA
I OL = + 10µA
1.2
7
+1
V
V
V
V
V
pF
µA
0.4
V
V
0.2
V
V
0.8
2.7
V CC – 1
Note : 1. VCC voltage change must be less than 0.5V in a 1ms period to maintain proper operation.
3/27
ETL9444/9445–ETL9344/9345
ETL9444/L9445
DC ELECTRICAL CHARACTERISTICS (continued)
Parameter
Output Current Levels
Output Sink Current
SO and SK Outputs (I OL )
L 0 -L 7 Outputs and Standard
G 0 -G 3 , D 0 -D 3 Outputs (I OL )
G 0 -G 3 and D 0 -D 3 Outputs with
High Current Options (I OL )
G 0 -G 3 and D 0 -D 3 Outputs with
Very High Current Options (I OL )
CKI (single-pin RC oscillator)
CKO
Output Source Current
Standard Configuration,
All Outputs (I OH )
Push-pull Configuration
SO and SK Outputs (I OH )
LED Configuration, L 0 -L 7
Outputs, Low Current
Driver Option (I OH )
LED Configuration, L 0 -L 7
Outputs, High Current
Driver Option (I OH )
TRI-STATE Configuration,
L 0 -L 7 Outputs, Low
Current Driver Option (I OH )
TRI-STATE Configuration,
L 0 -L 7 Outputs, High
Current Driver Option (I OH )
Input Load Source Current
CKO Output
RAM Power Supply Option
Power Requirement
TRI-STATE Output Leakage
Current
Total Sink Current Allowed
All Outputs Combined
D, G Ports
L 7 -L 4
L 3 -L 0
All Other Pins
Total Source Current Allowed
All I/O Combined
L 7 -L 4
L 3 -L 0
Each L Pin
All Other Pins
4/27
Test Conditions
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
= 9.5V, V OL = 0.4V
= 6.3V, V OL = 0.4V
= 4.5V, V OL = 0.4V
= 9.5V, V OL = 0.4V
= 6.3V, V OL = 0.4V
= 4.5V, V OL = 0.4V
= 9.5V, V OL = 1.0V
= 6.3V, V OL = 1.0V
= 4.5V, V OL = 1.0V
= 9.5V, V OL = 1.0V
= 6.3V, V OL = 1.0V
= 4.5V, V OL = 1.0V
= 4.5V, V IH = 3.5V
= 4.5V, V OL = 0.4V
V CC
V CC
V CC
V CC
V CC
V CC
= 9.5V, V OH
= 6.3V, V OH
= 4.5V, V OH
= 9.5V, V OH
= 6.3V, V OH
= 4.5V, V OH
Min.
Max.
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
1.8
1.2
0.9
0.8
0.5
0.4
15
11
7.5
30
22
15
2
0.2
– 140
– 75
– 30
– 1.4
– 1.4
– 1.2
– 800
– 480
– 250
µA
µA
µA
mA
mA
mA
V CC = 9.5V, V OH = 2.0V
V CC = 6.0V, V OH = 2.0V
– 1.5
– 1.5
– 18
– 13
mA
mA
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
– 3.0
– 3.0
– 0.75
– 0.8
– 0.9
– 1.5
– 1.6
– 1.8
– 10
– 35
– 25
mA
mA
mA
mA
mA
mA
mA
mA
µA
= 2.0V
= 2.0V
= 2.0V
= 4.75V
= 2.4V
= 1.0V
= 9.5V, V OH = 2.0V
= 6.0V, V OH = 2.0V
= 9.5V, V OH = 5.5V
= 6.3V, V OH = 3.2V
= 4.5V, V OH = 1.5V
= 9.5V, V OH = 5.5V
= 6.3V, V OH = 3.2V
= 4.5V, V OH = 1.5V
= 5.0V, V IL = 0V
– 140
mA
V R = 3.3V
6.0
µA
– 2.5
+ 2.5
120
120
4
4
1.5
mA
mA
mA
mA
mA
120
60
60
30
1.5
mA
mA
mA
mA
mA
ETL9444/9445–ETL9344/9345
ETL9344/L9345
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
– 0.5 to + 10
V
Ambient Operating Temperature
– 40 to + 85
°C
Ambient Storage Temperature
– 65 to + 150
°C
300
°C
Voltage at any Pin Relative to GND
Lead Temperature (soldering, 10 seconds)
Power Dissipation
0.75W at 25°C
0.25W at 85°C
Total Source Current
120
mA
Total Sink Current
120
mA
Absolute maximum ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications are not ensured when operating the device at absolute maximum ratings.
DC ELECTRICAL CHARACTERISTICS – 40°C ≤ T A ≤ + 85°C, 4.5V ≤ V C C ≤ 7.5V
(unless otherwise specified)
Parameter
Standard Operating Voltage (V CC )
Optional Operating Voltage (V CC )
Power Supply Ripple
Operating Supply Current
Input Voltage Levels
CKI Input Levels
Crystal Input
Logic High (V IH)
Logic Low (V IL )
Schmitt Trigger Input
Logic High (V IH)
Logic Low (V IL )
RESET Input Levels
Logic High
Logic Low
SO Input Level (test mode)
All Other Inputs
Logic High
Logic High
Logic Low
Logic High
Logic Low
Input Capacitance
Hi-Z Input Leakage
Test Conditions
Min.
Max.
Unit
4.5
4.5
5.5
7.5
0.5
15
V
V
V
mA
2.2
– 0.3
0.3
V
V
0.7 V CC
– 0.3
0.4
V
V
0.7 V CC
– 0.3
2.2
0.4
2.5
V
V
V
Note 1
Peak to Peak
All Inputs and Outputs Open
Schmitt Trigger Input
V CC = Max.
With TTL trip level options
selected, V CC = 5V ± 5%
With high trip level options
selected
3.0
2.2
– 0.3
3.6
– 0.3
–2
Output Voltage Levels
LSTTL Operation
Logic High (V OH )
Logic Low (V OL )
V CC = 5V ± 5%
I OH = – 20µA
I OL = 0.36mA
CMOS Operation
Logic High
Logic Low
I OH = – 10µA
I OL = + 10µA
1.2
7
+2
V
V
V
V
V
pF
µA
0.4
V
V
0.2
V
V
0.6
2.7
V CC – 1
Note : 1. VCC voltage change must be less than 0.5V in a 1ms period to maintain proper operation.
5/27
ETL9444/9445–ETL9344/9345
ETL9344/L9345
DC ELECTRICAL CHARACTERISTICS (continued)
Parameter
Output Current Levels
Output Sink Current
SO and SK Outputs (I OL )
L 0 -L 7 Outputs and Standard
G 0 -G 3 , D 0 -D 3 Outputs (I OL )
G 0 -G 3 and D 0 -D 3 Outputs with
High Current Options (I OL )
G 0 -G 3 and D 0 -D 3 Outputs with
Very High Current Options (I OL )
CKI (single-pin RC oscillator)
CKO
Output Source Current
Standard Configuration,
All Outputs (I OH )
Push-pull Configuration
SO and SK Outputs (I OH )
LED Configuration, L 0 -L 7
Outputs, Low Current
Driver Option (I OH )
LED Configuration, L 0 -L 7
Outputs, High Current
Driver Option (I OH )
TRI-STATE Configuration,
L 0 -L 7 Outputs, Low
Current Driver Option (I OH )
TRI-STATE Configuration,
L 0 -L 7 Outputs, High
Current Driver Option (I OH )
Input Load Source Current
CKO Output
RAM Power Supply Option
Power Requirement
TRI-STATE Output Leakage
Current
Total Sink Current Allowed
All Outputs Combined
D. G Ports
L 7 -L 4
L 3 -L 0
All Other Pins
Total Source Current Allowed
All I/O Combined
L 7 -L 4
L 3 -L 0
Each L Pin
All Other Pins
6/27
Test Conditions
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
= 7.5V, V OL = 0.4V
= 5.5V, V OL = 0.4V
= 4.5V, V OL = 0.4V
= 7.5V, V OL = 0.4V
= 5.5V, V OL = 0.4V
= 4.5V, V OL = 0.4V
= 7.5V, V OL = 1.0V
= 5.5V, V OL = 1.0V
= 4.5V, V OL = 1.0V
= 7.5V, V OL = 1.0V
= 5.5V, V OL = 1.0V
= 4.5V, V OL = 1.0V
= 4.5V, V IH = 3.5V
= 4.5V, V OL = 0.4V
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
V CC
= 7.5V, V OH = 2.0V
= 5.5V, V OH = 2.0V
= 4.5V, V OH = 2.0V
= 7.5V, V OH = 3.75V
= 5.5V, V OH = 2.0V
= 4.5V, V OH = 1.0V
= 7.5V, V OH = 2.0V
= 6.0V, V OH = 2.0V
= 5.5V, V OH = 2.0V
= 7.5V, V OH = 2.0V
= 6.0V, V OH = 2.0V
= 5.5V, V OH = 2.0V
= 7.5V, V OH = 4.0V
= 5.5V, V OH = 2.7V
= 4.5V, V OH = 1.5V
= 7.5V, V OH = 4.0V
= 5.5V, V OH = 2.7V
= 4.5V, V OH = 1.5V
= 5.0V, V IL = 0V
Min.
Max.
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
1.4
1.0
0.8
0.6
0.5
0.4
12
9
7
24
18
14
2
0.2
– 100
– 55
– 28
– 0.85
– 1.1
– 1.2
– 1.4
– 1.4
– 0.7
– 2.7
– 2.7
– 1.4
– 0.7
– 0.6
– 0.9
– 1.4
– 1.2
– 1.8
– 10
Unit
– 900
– 600
– 350
–
–
–
–
–
–
27
17
15
54
34
30
– 200
µA
µA
µA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
µA
mA
V R = 3.3V
8.0
µA
–5
+5
120
120
4
4
1.5
mA
mA
mA
mA
mA
120
60
60
30
1.5
mA
mA
mA
mA
mA
ETL9444/9445–ETL9344/9345
AC ELECTRICAL CHARACTERISTICS
ETL9444/L9445 : 0°C ≤ T A ≤ + 70°C, 4.5V ≤ V C C ≤ 9.5V (unless otherwise specified)
ETL9344/L9345 : – 40°C ≤ T A ≤ + 85°C, 4.5V ≤ V C C ≤ 7.5V (unless otherwise specified)
Parameter
Instruction Cycle Time – t c
CKI
Input Frequency – f I
Duty Cycle
Rise Time
Fall Time
CKI Using RC (÷ 4)
Test Conditions
÷
÷
÷
÷
32 Mode
16 Mode
8 Mode
4 Mode
Unit
16
40
µs
0.8
0.4
0.2
0.1
30
2.0
1.0
0.5
0.25
60
120
80
MHz
MHz
MHz
MHz
%
ns
ns
16
28
µs
R = 56kΩ ± 5%
C = 100pF ± 10%
ns
400
INPUTS :
IN 3 -IN 0 , G 3 -G 0 , L 7 -L 0
t SET UP
t HOL D
SI
t SET UP
t HOL D
SO, SK Outputs
tpd1, tpd 0
All Other Outputs
tpd1, tpd 0
Max.
f I = 2MHz
Instruction Cycle Time
CKO as SYNC Input
t SYNC
OUTPUT PROPAGATION DELAY
Min.
8.0
1.3
µs
µs
2.0
1.0
µs
µs
4.0
µs
5.6
µs
Test Condition :
C L = 50pF, R L = 20kΩ, V O UT = 1.5V
7/27
ETL9444/9445–ETL9344/9345
Figure 2 : Connection Diagrams.
Pin
Description
L 7 -L 0
8 Bidirectional I/O Ports with TRI-STATE
G 3 -G 0
4 Bidirectional I/O Ports
D 3 -D 0
4 General Purpose Outputs
IN 3 -IN 0
4 General Purpose Inputs (COP444L only)
SI
Serial Input (or counter input)
SO
Serial Output (or general purpose output)
SK
Logic-controlled Clock (or general purpose output)
CKI
System Oscillator Input
CKO
System Oscillator Output (or general purpose input, RAM power supply, or SYNC input)
RESET
System Reset Input
V CC
Power Supply
GND
Ground
Figure 3 : Input/output Timing Diagrams (crystal divide-by-16 mode).
8/27
ETL9444/9445–ETL9344/9345
Figure 3a : Synchronization Timing.
FUNCTIONAL DESCRIPTION
A block diagram of the ETL9444 is given in figure 1.
Data paths are illustrated in simplified form to depict
how the various logic elements communicate with
each other in implementing the instruction set of the
device. Positive logic is used. When a bit is set, it is
a logic ”1” (greater than 2 volts). When a bit is reset,
it is a logic ”0” (less than 0.8 volts).
All functional references to the ETL9444/L9445 also
apply to the ETL9344/L9345.
PROGRAM MEMORY
Program Memory consists of a 2048 byte ROM. As
can be seen by an examination of the
ETL9444/L9445 instruction set, these words may be
program instructions, program data or ROM addressing data. Because of the special characteristics associated with the JP, JSRP, JID, and LQID
instructions, ROM must often be thought of as being
organized into 32 pages of 64 words each.
ROM addressing is accomplished by a 11-bit PC register. Its binary value selects one of the 2048 8-bit
words contained in ROM. A new address is loaded
into the PC register during each instruction cycle.
Unless the instruction is a transfer of control instruction, the PC register is loaded with the next sequential 11-bit binary count value. Three levels of
subroutine nesting are implemented by the 11-bit
subroutine save registers, SA, SB, and SC ; providing a last-in, first-out (LIFO) hardware subroutine
stack.
ROM instruction words are fetched, decoded and
executed by the Instruction Decode, Control and
Skip Logic circuitry.
DATA MEMORY
Data memory consists of a 512-bit RAM, organized
as 8 data registers of 16 4-bit digits. RAM addressing is implemented by a 7-bit B register whose upper 3 bits (Br) select 1 of 8 data registers and lower
4 bits (Bd) select 1 of 16 4-bit digits in the selected
data register. While the 4-bit contents of the selected
RAM digit (M) is usually loaded into or from, or exchanged with, the A register (accumulator), it may
also be loaded into or from the Q latches or loaded
from the L ports. RAM addressing may also be performed directly by the LDD and XAD instructions based upon the 7-bit contents of the operand field of
these instructions. The Bd register also serves as a
source register for 4-bit data sent directly to the D
outputs.
INTERNAL LOGIC
The 4-bit A register (accumulator) is the source and
destination register for most I/O, arithmetic, logic
and data memory access operations. It can also be
used to load the Br and Bd portions of the B register,
to load and input 4 bits of the 8-bit Q latch data, to
input 4 bits of the 8-bit L I/O port data and to perform
data exchanges with the SIO register.
A 4-bit adder performs the arithmetic and logic functions, storing its results in A. It also outputs a carry
bit to the 1-bit C register, most often employed to indicate arithmetic overflow. The C register, in
conjunction with the XAS instruction and the EN register, also serves to control the SK output. C can
be outputted directly to SK or can enable SK to be
a sync clock each instruction cycle time. (See XAS
instruction and EN register description, below).
Four general-purpose inputs, IN3-IN0, are provided.
The D register provides 4 general-purpose outputs
and is used as the destination register for the 4-bit
contents of Bd. The D outputs can be directly
connected to the digits of a multiplexed LED display.
The G register contents are outputs to 4 generalpurpose bidirectional I/O ports. G I/O ports can be
directly connected to the digits of a multiplexed LED
display.
The Q register is an internal, latched, 8-bit register,
used to hold data loaded to or from M and A, as well
as 8-bit data from ROM. Its contents are output to
the L I/O ports when the L drivers are enabled under
program control (See LEI instruction).
9/27
ETL9444/9445–ETL9344/9345
pulse (”1” to ”0”) ocurring on the SI input. Each
pulse must be at least two instruction cycles
wide. SK outputs the value of SKL. The SO output is equal to the value of EN3. With EN 0 reset,
SIO is a serial shift register shifting left each instruction cycle time. The data present at SI goes
into the least significant bit of SIO. SO can be enabled to output the most significant bit of SIO
each cycle time. (See 4 below). The SK output
becomes a logic-controlled clock.
The 8 L drivers, when enabled, output the contents
of latched Q data to the L I/O ports. Also, the
contents of L may be read directly into A and M. L
I/O ports can be directly connected to the segments
of a multiplexed LED display (using the LED Direct
Drive output configuration option) with Q data being
outputted to the Sa - Sg and decimal point segments
of the display.
The SIO register functions as a 4-bit serial-in/serialout shift register or as a binary counter depending
on the contents of the EN register. (See EN register
description, below). Its contents can be exchanged
with A, allowing it to input or output a continuous serial data stream, SIO may also be used to provide
additional parallel I/O by connecting SO to external
serial-in/parallel-out shift registers.
The XAS instruction copies C into the SKL latch. In
the counter mode, SK is the output of SKL ; in the
shift register mode, SK outputs SKL ANDed with the
clock.
The EN register is an internal 4-bit register loaded
under program control by the LEI instruction. The
state of each bit of this register selects or deselects
the particular feature associated with each bit of the
EN register (EN3-EN0).
1. The least significant bit of the enable register,
EN0, selects the SIO register as either a4-bit shift
register or a 4-bit binary counter. With EN0 set,
SIO is an asynchronous binary counter, decrementing its value by one upon each low-going
2. With EN1 set the IN1 input is enabled as an interrupt input. Immediately following an interrupt,
EN1 is reset to disable further interrupts.
3. With EN2 set, the L drivers are enabled to output
the data in Q to the L I/O ports. Resetting EN2 disables the L drivers, placing the L I/O ports in a
high-impedance input state.
4. EN3, in conjunction with EN0, affects the SO output. With EN0 set (binary counter option selected) SO will output the value loaded into EN 3.
With EN0 reset (serial shift register option selected), setting EN3 enables SO as the output of the
SIO shift register, outputting serial shifted data
each instruction time. Resetting EN3 with the serial shift register option selected disables SO as
the shift register output ; data continues to be
shifted through SIO and can be exchanged with
A via an XAS instruction but SO remains reset to
”0”. The table below provides a summary of the
modes associated with EN 3 and EN0.
Enable Register Modes - Bits EN 3 and EN 0
EN 3
EN0
0
0
Shift Register
SI O
Input to Shift Register
SI
0
1
0
Shift Register
Input to Shift Register
Serial Out
0
1
Binary Counter
Input to Binary Counter
0
1
1
Binary Counter
Input to Binary Counter
1
INTERRUPT
The following features are associated with the IN1
interrupt procedure and protocol and must be considered by the programmer when utilizing interrupts.
a. The interrupt, once acknowledged as explained
below, pushes the next sequential program
counter address (PC + 1) onto the stack, pushing
in turn the contents of the other subroutine-save
registers to the next lower level
(PC + 1 → SA → SB → SC). Any previous
contents of SC are lost. The program counter is
10/27
SO
SK
If
If
If
If
If
If
If
If
SKL
SKL
SKL
SKL
SKL
SKL
SKL
SKL
= 1,
= 0,
= 1,
= 0,
= 1,
= 0,
= 1,
= 0,
SK =
SK =
SK =
SK =
SK =
SK =
SK =
SK =
Clock
0
Clock
0
1
0
1
0
set to hex address 0FF (the last word of page 3)
and EN1 is reset.
b. An interrupt will be acknowledged only after the
following conditions are met :
1. EN1 has been set.
2. A low-going pulse (”1” to ”0”) at least two instruction cycles wide occurs on the IN1 input.
3. A currently executing instruction has been
completed.
ETL9444/9445–ETL9344/9345
4. All successive transfer of control instructions
and successive LBIs have been completed
(e.g., if the main program is executing a JP instruction which transfers program control to
another JP instruction, the interrupt will not be
acknowledged until the second JP instruction
has been executed.
c. Upon acknowledgement of an interrupt, the skip
logic status is saved and later restored upon popping of the stack. For example, if an interrupt occurs during the execution of ASC (Add with
Carry, Skip on Carry) instruction which results in
carry, the skip logic status is saved and program
control is transferred to the interrupt servicing
routine at hex address 0FF. At the end of the interrupt routine, a RET instruction is executed to
”pop” the stack and return program control to the
instruction following the original ASC. At this
time, the skip logic is enabled and skips this instruction because of the previous ASC carry.
Subroutines and LQIDinstructions should not be
nested within the interrupt service routine, since
their popping the stack will enable any previously
saved main program skips, interfering with the
orderly execution of the interrupt routine.
d. The first instruction of the interrupt routine at hex
address 0FF must be a NOP.
e. A LEI instruction can be put immediately before
the RET to re-enable interrupts.
INITIALIZATION
The Reset Logic will initialize (clear) the device upon
power-up if the power supply rise time is less than
1ms and greater than 1µs. If the power supply rise
time is greater than 1ms, the user use provide an external RC network and diode to the RESET pin as
shown below. If the RC network is not used, the RESET pin must be pulled up to VCC either by the internal load or by an external resistor (≥40kΩ) to VCC.
The RESET pin is configured as a Schmitt trigger input. Initialization will occur whenever a logic ”0” is
applied to the RESET input, provided it stays low for
at least three instruction cycle times.
Power-up Clear Circuit.
Upon initialization, the PC register is cleared to 0
(ROM address 0) and the A, B, C, D, EN, and G registers are cleared. The SK output is enabled as a
SYNC output, providing a pulse each instruction cycle time. Data Memory (RAM) is not cleared upon initialization. The first instruction at address 0 must
be a CLRA.
OSCILLATOR
There are three basic clock oscillator configurations
available as shown by figure 4.
a. Crystal Controlled Oscillator. CKI and CKO
are connected to an external crystal. The instruction cycle time equals the crystal frequency divided by 32 (optional by 16 or 8).
b. External Oscillator. CKI is an external clock input signal. The external frequency is divided by
32 (optional by 16 or 8) to give the instruction cycle time. CKO is now available to be used as the
RAM power supply (VR), as a general purpose
input, or as a SYNC input.
c. RC Controlled Oscillator. CKI is configured as
a single pin RC controlled Schmitt trigger oscillator. The instruction cycle equals the oscillation
frequency divided by 4. CKO is available as the
RAM power supply (VR) or as a general purpose
input.
11/27
ETL9444/9445–ETL9344/9345
Figure 4 : ETL9444/L9445 Oscillator.
CRYSTAL OSCILLATOR
Crystal
RC CONTROLLED OSCILLATOR
Component Values
Valu e
R 1 (Ω)
R 2 (Ω)
C 1 (pF)
C 2 (pF)
455kHz
2.097MHz
4.7k
1k
1M
1M
220
30
220
6-36
R (kΩ)
C (pF)
Instruction Cycle
Time (µ s)
51
82
100
56
19 ± 15%
19 ± 13%
Note : 200kΩ ≥ R ≥ 25kΩ
360pF ≥ C ≥ 50pF
CKO PIN OPTIONS
In a crystal controlled oscillator system, CKO is used
as an output to the crystal network. As an option
CKO can be a SYNC input as described above. As
another option CKO can be a general purpose input,
read into bit 2 of A (accumulator) upon execution of
an INIL instruction. As another option, CKO can be
a RAM power supply pin (VR), allowing its connection to a standby/backup power supply to maintain
the integrity of RAM data with minimum power drain
when the main supply is inoperative or shut down to
conserve power. Using either option is appropriate
in applications where the ETL9444/L9445 system timing configuration does not require use of the CKO
pin.
b. Open-Drain - an enhancement-mode device to
ground only, allowing external pull-up as required by the user’s application. Available on SO,
SK, and all D and G outputs.
I/O OPTIONS
f. LED Direct Drive - an enhancement-mode device to ground and to VCC, meeting the typical
current sourcing requirements of the segments
of an LED display. The sourcing device is clamped to limit current flow. These devices may be
turned off under program control (See Functional
Description, EN Register), placing the outputs in
a high-impedance state to provide required LED
ETL9444/L9445 outputs have the following optional
configurations, illustrated in figure 5.
a. Standard - an enhancement mode device to
ground in con junction with a depletion-mode device to VCC, compatible with LSTTL and CMOS
input requirements. Available on SO, SK, and all
D and G outputs.
12/27
c. Push-Pull - An enhancement-mode device to
ground in conjunction with a depletion-mode device paralleled by an enhancement-mode device
to VCC. This configuration has been provided to
allow for fast rise and fall times when driving capacitive loads. Available on SO and SK outputs
only.
d. Standard L - same as a., but may be disabled.
Available on L outputs only.
e. Open Drain L - same as b., but may be disabled.
Available on L outputs only.
ETL9444/9445–ETL9344/9345
segment blanking for a multiplexed display. Available on L outputs only.
g. TRI-STATE Push-Pull - an enhancementmode device to ground and VCC. These outputs
are TRI-STATE outputs, allowing for connection
of these outputs to a data bus shared by other
bus drivers. Available on L outputs only.
ETL9444, L9445 inputs have the following optional configurations :
h. An on-chip depletion load device to VCC.
i. A Hi-Z input which must be driven to a ”1” or ”0”
by external components.
The above input and output configurations share
common enhancement-mode and depletion-mode
devices. Specifically, all configurations use one or
more of six devices (numbered 1-6, respectively).
Minimum and maximum current (IOUT and VOUT
curves are given in figure 6 for each of these devices
to allow the designer to effectively use these I/O
configurations in designing a system.
The SO, SK outputs can be configured as shown in
a., b., or c. The D and G outputs can be configured
as shown in a. or b. Note that when inputting data
to the G ports, the G outputs should be set to ”1”.
The L outputs can be configured as in d., e., f. or g.
An important point to remember if using configuration d. or f. with the L drivers is that even when the
L drivers are disabled, the depletion load device will
source a small amount of current (see figure 6, device 2) ; however, when the L-lines are used as inputs, the disabled depletion device can not be relied
on to source sufficient current to pull an input to logic
”1”.
RAM KEEP-ALIVE OPTION
Selecting CKO as the RAM power supply (VR) allows the user to shut off the chip power supply (VCC)
and maintain data in the RAM.
To insure that RAM data integrity is maintained, the
following conditions must be met :
1. RESET must go low before VCC goes low during
power off ; VCC must go high before RESET goes
high on power-up.
2. VR must be within the operating range of the
chip, and equal to VCC ± 1V during normal operation.
3. VR must be ≥ 3.3V with VCC off.
ETL9445
If the ETL9444 ls bonded as a 24-pin device, it becomes the ETL9445, illustrated in figure 2, ETL9444
Connection Diagrams. Note that the ETL9445 does
not contain the four general purpose IN inputs (IN3IN0). Use of this option precludes, of course, use of
the IN options and the interrupt feature, which uses
IN1. All other options are available for the ETL9445.
13/27
ETL9444/9445–ETL9344/9345
Figure 5 : Output Configurations.
14/27
ETL9444/9445–ETL9344/9345
Figure 6 : ETL9444/L9445 Input/output Characteristics.
15/27
ETL9444/9445–ETL9344/9345
Figure 6a : ETL9444/L9445 Input/output Characteristics.
16/27
ETL9444/9445–ETL9344/9345
Figure 6b : ETL9344/L9345 Input/output Characteristics.
17/27
ETL9444/9445–ETL9344/9345
ETL9444/L9445, ETL9344/L9345 INSTRUCTION SET
Table 1 is a symbol table providing internal architecture, instruction operand and operational symbols used in the instruction set table.
Table 2 provides the mnemonic, operand, machine
code, data flow, skip conditions, and description associated
with each
instruction
in
the
ETL9444/L9445 instruction set.
Table 1 : ETL9444/9445 ETL9344/9345 Instruction Set Table Symbols.
INTERNAL ARCHITECTURE SYMBOLS
INSTRUCTION OPERAND SYMBOLS
Symbol
Definition
Symbol
Definition
A
B
Br
Bd
C
D
EN
G
IL
4-bit Accumulator
7-bit RAM Address Register
Upper 3 Bits of B (register address)
Lower 4 Bits of B (digit address)
1-bit Carry Register
4-bit Data Output Port
4-bit Enable Register
4-bit Register to Latch Data for G I/O Port
Two 1-bit latches associated with the IN 3
or IN 0 inputs.
4-bit Input Port
8-bit TRI-STATE I/O Port
4-bit contents of RAM memory pointed to
by B register.
11-bit ROM Address Register (program
counter)
8-bit Register to Latch Data for L I/O Port
11-bit Subroutine Save Register A
11-bit Subroutine Save Register B
11-bit Subroutine Save Register C
4-bit Shift Register and Counter
Logic-controlled Clock Output
d
4-bit Operand Field, 0-15 Binary (RAM
digit select)
3-bit Operand Field, 0-7 Binary (RAM
register select)
11-bit Operand Field, 0-2047 Binary
(ROM address)
4-bit Operand Field, 0-15 Binary
(immediate data)
Contents of RAM location addressed by s.
Contents of ROM location addressed by t.
IN
L
M
PC
Q
SA
SB
SC
SIO
SK
18/27
r
a
y
RAM(s)
ROM(t)
OPERATIONAL SYMBOLS
Symbol
+
➞
↔
=
A
⊕
:
Definition
Plus
Minus
Replaces
Is exchanged with.
Is equal to.
The one’s complement of A.
Exclusive-OR
Range of Values
ETL9444/9445–ETL9344/9345
Table 2 : ETL9444/L9445 Instruction Set.
ARITHMETIC INSTRUCTIONS
Mnem Operand
Hex
Code
Machine
Language
Code
(binary)
Data Flow
Skip
Conditions
Description
ASC
30
|_______________
0 0 1 1 | 0 0 0 0 | A + C + RAM(B) → A
Carry → C
Carry
Add with Carry Skip on
Carry
ADD
31
|_______________
0 0 1 1 | 0 0 0 1 | A + RAM(B) → A
None
Add RAM to A
ADT
4A
|_______________
0 1 0 0 | 1 0 1 0 | A + 10 1 0 → A
None
Add Ten to A
5-
|_______________
0101|
y | A+y→A
Carry
Add Immediate Skip on
Carry (y ≠ 0)
CASC
10
|_______________
0 0 0 1 | 0 0 0 0 | A + RAM(B) + C → A
Carry → C
Carry
Complement and Add with
Carry, Skip on Carry
CLRA
00
|_______________
0000|0000| 0→A
None
Clear A
COMP
40
|_______________
0100|0000| A→A
None
Ones Complement of A to A
AISC
y
NOP
44
|_______________
0 1 0 0 | 0 1 0 0 | None
None
No Operation
RC
32
|_______________
0 0 1 1 | 0 0 1 0 | ”0” → C
None
Reset C
SC
22
|_______________
0 0 1 0 | 0 0 1 0 | ”1” → C
None
Set C
XOR
02
|_______________
0 0 0 0 | 0 0 1 0 | A ⊕ RAM(B) → A
None
Exclusive-OR Ram with A
TRANSFER OF CONTROL INSTRUCTIONS
Hex
Mnem Operand
Code
JID
Machine
Language
Code
(binary)
Data Flow
Skip
Conditions
Description
FF
|_________________
1 1 1 1 | 1 1 1 1 | ROM (PC 1 0 : 8 A, M)
→ PC 7 : 0
None
Jump Indirect (note 3)
6–
| 0 1 1 0 | 0 | a 1 0 : 8 | A → PC
_________________
|
a7:0
|
_________________
None
Jump
JMP
a
JP
a
|1|
a6 :0
| A → PC 6 : 0
_________________
(pages 2, 3 only)
or
|11 |
a5 :0
| A → PC 5 : 0
_________________
(all other pages)
None
Jump within Page (note 4)
JSRP
a
|10|
a5 :0
| PC + 1 → SA → SB → SC
_________________
00010 → PC 1 0 :6
a → PC 5 :0
None
Jump to Subroutine Page
(note 5)
JSR
a
6–
| 0 1 1 0 | 1 | a 1 0 : 8 | PC + 1 → SA → SB → SC
_________________
|
a7:0
| a → PC
_________________
None
Jump to Subroutine
RET
48
| 0 1 0 0 | 1 0 0 0 | SC → SB → SA → PC
_________________
None
Return from Subroutine
RETSK
49
| 0 1 0 0 | 1 0 0 1 | SC → SB → SA → PC
_________________
Always
Skip on
Return
Return from Subroutine
then Skip
19/27
ETL9444/9445–ETL9344/9345
MEMORY REFERENCE INSTRUCTIONS
Hex
Mnem Operand
Code
Machine
Language
Code
(binary)
Data Flow
Skip
Conditions
Description
CAMQ
33
3C
|_______________
0 0 1 1 | 0 0 1 1 | A → Q7 :4
|_______________
0 0 1 1 | 1 1 0 0 | RAM (B) → Q 3 : 0
None
Copy A, RAM to Q
CQMA
33
2C
|_______________
0 0 1 1 | 0 0 1 1 | Q 7 : 4 → RAM(B)
|_______________
0 0 1 0 | 1 1 0 0 | Q3 :0 → A
None
Copy Q to RAM A
None
Load RAM into A,
Exclusive-OR Br with r
None
Load A with RAM pointed
to directly by r.d.
RAM(B) → A
Br ⊕ r → Br
LD
r
–5
|_______________
0 0|r|0101|
(r = 0:3)
LDD
r.d
23
|_______________
0 0 1 0 | 0 0 1 1 | RAM(r.d) → A
|0 | r |
d |
_______________
BF
|_______________
1 0 1 1 | 1 1 1 1 | ROM (PC 1 0 : 8A.M) → Q None
SB → SC
LQID
Load Q Indirect (note 3)
RMB
0
1
2
3
4C
45
42
43
|_______________
0100|1100|
|_______________
0100|0101|
|_______________
0100|0010|
|_______________
0100|0011|
0
0
0
0
→
→
→
→
RAM
RAM
RAM
RAM
(B) 0
(B) 1
(B) 2
(B) 3
None
Reset RAM Bit
SMB
0
1
2
3
4D
47
46
4B
|_______________
0100|1101|
|_______________
0100|1101|
|_______________
0100|0110|
|_______________
0100|1011|
1
1
1
1
→
→
→
→
RAM
RAM
RAM
RAM
(B) 0
(B) 1
(B) 2
(B) 3
None
Set RAM Bit
STII
y
7–
|_______________
0111| y
| y → RAM (B)
Bd + 1 → Bd
None
Store Memory Immediate
and Increment Bd
X
r
–6
|_______________
0 0 | r | 0 1 1 0 | RAM (B) ↔ A
Br ⊕ r → Br
(r = 0:3)
None
Exchange RAM with A,
Exclusive-OR Br with r
XAD
r.d
23
|_______________
0 0 1 0 | 0 0 1 1 | RAM (r.d) ↔ A
|_______________
1| r
| d |
None
Exchange A with RAM
pointed to directly by r.d.
XDS
r
–7
|_______________
0 0 | r | 0 1 1 1 | RAM (B) ↔ A
Bd – 1 → Bd
(r = 0:3)
Br ⊕ r → Br
Bd
Exchange RAM with A and
Decrements Decrement Bd,
Past 0
Exclusive-OR Br with r
XIS
r
–4
|_______________
0 0 | r | 0 1 0 0 | RAM (B) ↔ A
Bd + 1 → Bd
(r = 0:3)
Br ⊕ r → Br
Bd
Increments
Past 15
20/27
Exchange RAM with A and
Increment Bd,
Exclusive-OR Br with r
ETL9444/9445–ETL9344/9345
REGISTER REFERENCE INSTRUCTIONS
Hex
Mnem Operand
Code
Machine
Language
Code
(binary)
Data Flow
Skip
Conditions
Description
CAB
50
|_______________
0 1 0 1 | 0 0 0 0 | A → Bd
None
Copy A to Bd
CBA
4E
|_______________
0 1 0 0 | 1 1 1 0 | Bd → A
None
Copy Bd to A
|_______________
0 0 | r | (d-1) | r.d → B
(r = 0:3)
(d = 0.9:15)
or
|_______________
0011|0011|
|_______________
1 | r | d |
(any r, any d)
Skip until
not a LBI
33
6–
|_______________
0 0 1 1 | 0 0 0 1 | y → EN
|_______________
0110|
y |
None
Load EN Immediate
(note 7)
12
|_______________
0 0 0 1 | 0 0 1 0 | A → Br (0 → A 3 )
None
Exchange A with Br
LBI
r.d
33
LEI
y
XABR
Load B Immediate with r.d
(note 6)
TEST INSTRUCTIONS
Hex
Mnem Operand
Code
Machine
Language
Code
(binary)
Data Flow
Skip
Conditions
Description
SKC
20
|_______________
0010|0000|
C = ”1”
SKE
21
|_______________
0010|0001|
A = RAM(B) Skip if A Equals RAM
SKGZ
33
21
|_______________
0011|0011|
|_______________
0010|0001|
G 3:0 = 0
0
1
2
3
33
01
11
03
13
|_______________
0011|0011|
|_______________
0000|0001|
|_______________
0001|0001|
|_______________
0000|0011|
|_______________
0001|0011|
0
1
2
3
01
11
03
13
|_______________
0000|0001|
|_______________
0001|0001|
|_______________
0000|0011|
|_______________
0001|0011|
RAM(B) 0 = 0
RAM(B) 1 = 0
RAM(B) 2 = 0
RAM(B) 3 = 0
Skip if RAM bit is zero.
41
|_______________
0100|0001|
A
time-base
counter
carry has
occured
since last
test.
Skip on Timer (note 3)
SKGBZ
SKMBZ
SKT
1st Byte
2nd Byte
Skip if C is true.
Skip if G is zero (all 4 bits).
Skip if G Bit is zero.
G0
G1
G2
G3
=
=
=
=
0
0
0
0
21/27
ETL9444/9445–ETL9344/9345
INPUT/OUTPUT INSTRUCTIONS
Hex
Mnem Operand
Code
Machine
Language
Code
(binary)
Data Flow
Skip
Conditions
Description
ING
33
2A
|_______________
0011|0011| G→A
|_______________
0010|1010|
None
Input G Ports to A
ININ
33
28
|_______________
0 0 1 1 | 0 0 1 1 | IN → A
|_______________
0010|1000|
None
Input IN Inputs to A
(note 2)
INIL
33
29
|_______________
0 0 1 1 | 0 0 1 1 | IL 3 , CKO, ”0”, IL 0 → A
|_______________
0010|1001|
None
Input IL Latches to A
(note 3)
INL
33
2E
|_______________
0 0 1 1 | 0 0 1 1 | L 7 : 4 → RAM(B)
|_______________
0 0 1 0 | 1 1 1 0 | L3: 0 → A
None
Input L Ports to RAM, A
OBD
33
3E
|_______________
0 0 1 1 | 0 0 1 1 | Bd → D
|_______________
0011|1110|
None
Output Bd to D Outputs
33
5–
|_______________
0011|0011| y→G
|_______________
0101|
y
|
None
Output to G Ports
Immediate
OMG
33
3A
|_______________
0 0 1 1 | 0 0 1 1 | RAM(B) → G
|_______________
0011|1010|
None
Output RAM to G Ports
XAS
4F
|_______________
0 1 0 0 | 1 1 1 1 | A ↔ SIO, C → SKL
None
Exchange A with SIO
(note 3)
OGI
y
Notes : 1.All subscripts for alphabetical symbols indicate bit numbers unless explicitly defined (e.g., Br and Bd are explicitly defined). Bits are
numbered 0 to N where 0 signifies the least significant bit (low-order, right-most bit). For example, A 3 indicates the most significant
(left-most) bit of the 4-bit A register.
2.The ININ instruction is not available on the 24-pin ETL9445 or ETL9345 since these devices do not contain the IN inputs.
3.For additional information on the operation of the XAS, JID, LQUID, INIL and SKT instructions, see below.
4.The JP instruction allows a jump, while in subroutine pages 2 or 3, to any ROM location within the two-page boundary of pages 2 or
3. The JP instruction, otherwise, permits a jump to a ROM location within the current 64-word page. JP may not jump to the last word
of a page.
5.A JSRP transfers program control to subroutine page 2 (0010 is loaded into the upper 4 bits of P). A JSRP may not be used when in
pages 2 or 3, JSRP may not jump to the last word in page 2.
6.LBI is a single-byte instruction if d = 0, 9, 10, 11, 12, 13, 14 or 15. The machine code for the lower 4 bits equals the binary value of
the ”d” data minus 1, e.g., to load the lower four bits of B (Bd) with the value 9 (1001 2), the lower 4 bits of the LBI instruction equal 8
(10002). To load 0, the lower 4 bits of the LBI instruction should equal 15 (1111 2).
7.Machine code for operand field y for LEI instruction should equal the binary value to be latched into EN, where a ”1” or ”0” in each bit
of EN corresponds with the selection or deselection of a particular function associated with each bit. (See Functional Description, EN
Register).
The following information is provided to assist the user in understanding the operation of several unique
instructions and to provide notes useful to programmers in writing ETL9444/L9445 programs.
XAS INSTRUCTION
XAS (Exchange A with SIO) exchanges the 4-bit
contents of the accumulator with the 4-bit contents
of the SIO register. The contents of SIO will contain
serial-in/serial-out shift register or binary counter data, depending on the value of the EN register. An
XAS instruction will also affect the SK output. (See
Functional Description, EN Register, above). If SIO
is selected as a shift register, an XAS instruction
must be performed once every 4 instruction cycles
to effect a continuous data stream.
22/27
JID INSTRUCTION
JID (Jump Indirect) is an indirect addressing instruction, transferring program control to a new ROM location pointed to indirectly by A and M. It loads the
lower 8 bits of the ROM address register PC with the
contents of ROM addressed by the 11-bit word,
PC10:8 A, M. PC10, PC9 and PC8 are not affected by
this instruction.
Note that JID requires 2 instruction cycles to execute.
INIL INSTRUCTION
INIL (Input IL Latches to A) inputs 2 latches, IL3 and
IL0 (see figure 7) and CKO into A. The IL 3 and IL0
latches are set if a low-going pulse (”1” to ”0”) has
ETL9444/9445–ETL9344/9345
occurred on the IN3 and IN0 inputs since the last INIL
instruction, provided the input pulse stays low for at
least two instruction times. Execution of an INIL inputs IL3 and IL0 into A3 and A0 respectively, and resets these latches to allow them to respond to
subsequent low-going pulses on the IN3 and IN0
lines. If CKO is mask programmed as a general purpose input, an INIL will input the state of CKO into
A2. If CKO has not been so programmed, a ”1” will
be placed in A2. A ”0” is always placed in A1 upon
the execution of an INIL. The general purpose inputs
IN3-IN0 are input to A upon execution of an ININ instruction. (see table 2, ININ instruction). INIL is useful in recognizing pulses of short duration or pulses
which occur too often to be read conveniently by an
ININ instruction.
Note : IL latches are not cleared on reset : IL3 and
IL0 not input on ETL9444/L9445.
LQID INSTRUCTION
LQID (Load Q Indirect) loads the 8-bit Q register with
the contents of ROM pointed to by the 11-bit word
PC10, PC9, PC8, A, M. LQID can be used for table
lookup or code conversion such as BCD to sevensegment. The LQID instruction ”pushes” the stack
(PC + 1 → SA → SB → SC) and replaces the least
significant 8 bits of PC as follows : A – PC7:4, RAM
(B) → PC3:0, leaving PC10, PC9 and PC8 unchanged. The ROM data pointed to by the new address
is fetched and loaded into the Q latches. Next, the
stack is ”popped” (SC → SB → SA → PC), restoring
the saved value of PC to continue sequential program execution. Since LQID pushes SB → SC, the
previous contents of SC are lost. Also, when LQID
pops the stack, the previously pushed contents of
SB are left in SC. The net result is that the contents
of SB are placed in SC (SB → SC). Note that LQID
takes two instruction cycle times to execute.
Figure 7 : INIL Hardware Implementation.
SKT INSTRUCTION
The SKT (Skip On Timer) instruction tests the state
of an internal 10-bit time-base counter. This counter
divides the instruction cycle clock, frequency by
1024 and provides a latched indication of counter overflow. The SKT instruction tests this latch, executing the next program instruction if the latch is not
set. If the latch has been set since the previous test,
the next program instruction is skipped and the latch
is reset. The features associated with this instruction, therefore, allow the ETL9344/L9345 to generate its own time-base for real-time processing
rather than relying on an external input signal.
For example, using a 2.097MHz crystal as the timebase to the clock generator, the instruction cycle
clock frequency will be 65kHz (crystal frequency ÷
32) and the binary counter output pulse frequency
willbe 64Hz. For time-of-day or similar real-time processing, the SKT instruction can call a routine which
increments a ”seconds” counter every 64 ticks.
INSTRUCTION SET NOTES
a. The first word of a ETL9444/L9445 program
(ROM address 0) must be a CLRA (Clear A) instruction.
b. Although skipped instructions are not executed,
one instruction cycle time is devoted to skipping
each byte of the skipped instruction. Thus all program paths except JID and LQID take the same
number of cycle times whether instructions are
skipped or executed. JID and LQID instructions
take 2 cycles if executed and 1 cycle if skipped.
c. The ROM is organized into 32 pages of 64 words
each. The Program Counter is an 11-bit binary
counter, and will count through page boundaries.
If a JP, JSRP, JID or LQID instruction is located
in the last word of a page, the instruction operates as if it were in the next page. For example
: a JP located in the last work of a page will jump
to a location in the next page. Also, a LQID or JID
located in the last word of page 3, 7, 11, 15, 19,
23 or 27 will access data in the next group of four
pages.
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ETL9444/9445–ETL9344/9345
OPTION LIST
The ETL9444/L9445 mask programmable options
are assigned numbers which correspond with the
ETL9444 pins.
The following is a list of ETL9444 options. When
specifying ETL9445 chip, Options 9, 10, 19, and 20
must all be set to zero. The options are programmed
at the same time as the ROM pattern to provide the
user with the hardware flexibility to interface to various I/O components using little or no external circuitry.
Option 1 = 0 : Ground Pin - no options available
Option 2 : CKO Output
= 0 : clock generator output to crystal/resonator
(0 not allowable value if option 3 = 3)
= 1 : pin is RAM power supply (VR) input
= 2 : general purpose input. load device to VCC
= 3 : general purpose input, Hi-Z
Option 3 : CKI Input
= 0 : oscillator input divided by 32 (2MHz max.)
= 1 : oscillator input divided by 16 (1MHz max.)
= 2 : oscillator input divided by 8 (500kHz max.)
= 3 : single-pin RC controlled oscillator divided
by 4
= 4 : oscillator input divided by 4 (Schmitt)
Option 4 : RESET Input
= 0 : load device to VCC
= 1 : Hi-Z input
Driver
Option 5 : L7
= 0 : Standard output
= 1 : Open-drain output
= 2 : High current LED direct segment drive
output
= 3 : High current TRI-STATE push-pull
output
= 4 : Low-current LED direct segment drive
output
= 5 : Low-current TRI-STATE push-pull
output
Option 6 : L6 Driver
same as Option 5
Option 7 : L5 Driver
same as Option 5
Option 8 : L4 Driver
same as Option 5
Option 9 : IN1 Input
= 0 : load device to VCC
= 1 : Hi-Z input
Option 10 : IN2 Input
same as Option 9
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Option 11 : VCC pin
= 0 : 4.5V to 6.3V operation
= 1 : 4.5V to 9.5V operation
Option 12 : L3 Driver
same as Option 5
Option 14 : L2 Driver
same as Option 5
Option 14 : L1 Driver
same as Option 5
Option 15 : L0 Driver
same as Option 5
Option 16 : SI Input
same as Option 9
Option 17 : SO Driver
= 0 : standard output
= 1 : open-drain output
= 2 : push-pull output
Option 18 : SK Driver
same as Option 17
Option 19 : IN0 Input
same as Option 9
Option 20 : IN3 Input
same as Option 9
Option 21 : G0 I/O Port
= 0 : very-high current standard output
= 1 : very-high current open-drain output
= 2 : high current standard output
= 3 : high current open-drain output
= 4 : standard LSTTL output (fanout = 1)
= 5 : open-drain LSTTL output (fanout = 1)
Option 22 : G1 I/O Port
same as Option 21
Option 23 : G2 I/O Port
same as Option 21
Option 24 : G3 I/O Port
same as Option 21
Option 25 : D3 Output
same as Option 21
Option 26 : D2 Output
same as Option 21
Option 27 : D1 Output
same as Option 21
Option 28 : D0 Output
same as Option 21
Option 29 : L Input Levels
= 0 : standard TTL input levels
(”0” = 0.8V, ”1” = 2.0V)
ETL9444/9445–ETL9344/9345
= 1 : higher voltage input levels
(”0” = 1.2V, ”1” = 3.6V)
Option 30 : IN Input Levels
same as Option 29
Option 31 : G Input Levels
same as Option 29
Option 32 : SI Input Levels
same as Option 29
Option 33 : RESET Input
= 0 : Schmitt trigger input
TEST MODE (Non-Standard Operation)
The SO output has been configured to provide for
standard test procedures for the custom-programmed ETL9444. With SO forced to logic ”1”, two test
modes are provided, depending upon the value of
SI :
a. RAM and Internal Logic Test Mode (SI = 1)
b. ROM Test Mode (SI = 0)
These special test modes should not be employed
by the user ; they are intended for manufacturing
test only.
APPLICATION EXAMPLE :
ETL9444 General Controller
Figure 8 shows and interconnect diagram for a
ETL9444 used as a general controller. Operation of
the system is as follows :
1. The L7-L0 outputs are configured as LED Direct
Drive outputs, allowing direct connection to the
segments of the display.
= 1 : standard TTL input levels
= 2 : higher voltage input levels
Option 34 : CKO Input Levels (CKO = input Option
2 = 2.3)
same as Option 29
Option 35 COP Bonding
= 0 : ETL9444 (28-pin device)
= 1 : ETL9445 (24-pin device)
= 2 : both 28 and 24 pin versions
2. The D 3-D0 outputs drive the digits of the multiplexed display directly and scan the columns of
the 4 x 4 keyboard matrix.
3. The IN3-IN0 inputs are used to input the 4 rows
of the keyboard matrix. Reading the IN lines in
conjunction with the current value of the D outputs allows detection, debouncing, and decoding of any one of the 16 keyswitches.
4. CKI is configured as a single-pin oscillator input
allowing system timing to be controlled by a single-pin RC network. CKO is therefore available
for use as a general-purpose input.
5. SI is selected as the input to a binary counter input. With SIO used as a binary counter, SO and
SK can be used as general purpose outputs.
6. The 4 bidirectional G I/O ports (G 3-G-0) are available for use as required by the user’s application.
7. Normal reset operation is selected.
Figure 8 : ETL9444 Keyboard/display Interface.
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ETL9444/9445–ETL9344/9345
PHYSICAL DIMENSIONS
28–PINS – PLASTIC PACKAGE
24–PINS – PLASTIC PACKAGE
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ETL9444/9445–ETL9344/9345
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no
responsability for the consequences of use of such information nor for any infringement of patents or other rights of
third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent
rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without
notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or
systems without the express written approval of SGS-THOMSON Microelectronics.
 1994 SGS-THOMSON Microelectronics - All rights reserved.
2
Purchase of I C Components by SGS-THOMSON Microelectronics conveys a license under the Philips I 2C Patent. Rights to use these
components in an I2C system is granted provided that the system conforms to the I 2C Standard Specification as defined by Philips.
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