Application Note USAGE OF PPC1663, DC to VHF WIDEBAND DIFFERENTIAL INPUT AND OUTPUT AMPLIFIER IC Document No. G12290EJ2V0AN00 (2nd edition) Date Published October 1997 N © 1997 Printed in Japan [MEMO] 2 The information in this document will be updated without notice. This document outlines a typical application of this product, that is, provides an example for designing concept of an external circuit directly required for this product. NEC only assures the quality and characteristics of this product specified in the Data Sheet, and is not responsible for any user’s product designs or application sets. The peripheral circuit shown in this document is just an example prepared for evaluating the operations of this product, and does not imply that the circuit configurations or constants are recommended values or regulations. In addition, these circuits are not intended for any mass-produced application sets. This is because the analog characteristics vary depending on the external parts used, mounting patterns, and other conditions. For this reason, customers are responsible for designing external circuits according to user-designed system requirements by referring this document, and should also confirm the characteristics of their application circuit before use. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5 3 [MEMO] 4 CONTENTS 1. GENERAL........................................................................................................................................................ 7 2. BASIC OPERATIONS..................................................................................................................................... 7 2.1 Outline of Operations........................................................................................................................... 7 2.2 Determination of Gain.......................................................................................................................... 8 2.3 Gain Adjustments ................................................................................................................................ 8 ELECTRICAL CHARACTERISTICS............................................................................................................... 9 3. 4. 5. 6. 7. 3.1 Differential Voltage Gain (AVD) ............................................................................................................ 11 3.2 Bandwidth (BW).................................................................................................................................... 11 3.3 Rise Time (tr) and Propagation Delay Time (tpd) ................................................................................ 11 3.4 Input Resistance (Rin) .......................................................................................................................... 11 3.5 Input Capacitance (Cin) ........................................................................................................................ 11 3.6 Input Offset Current (IIO) ...................................................................................................................... 11 3.7 Input Bias Current (IB).......................................................................................................................... 12 3.8 Input Noise Voltage (Vn) ...................................................................................................................... 12 3.9 Input Voltage Range (VI) ...................................................................................................................... 12 3.10 Common Mode Rejection Ratio (CMR)............................................................................................... 12 3.11 Supply Voltage Rejection Ratio (SVR) ............................................................................................... 12 3.12 Output Offset Voltage (VO(off)).............................................................................................................. 13 3.13 Output Common Mode Voltage (VO(CM)).............................................................................................. 13 3.14 Output Voltage Swing (VOp-p)............................................................................................................... 13 3.15 Output Sink Current ............................................................................................................................. 13 3.16 Power Supply Current.......................................................................................................................... 13 PRECAUTIONS FOR DESIGN IN................................................................................................................. 14 4.1 Cautions on Layout and Wiring .......................................................................................................... 14 4.2 Cautions on External Circuit ............................................................................................................... 14 4.3 Other Caution Points ........................................................................................................................... 14 APPLICATION CIRCUIT EXAMPLES ........................................................................................................... 16 5.1 Video Line Driver Circuit Example...................................................................................................... 16 5.2 Optical Signal Detection Circuit Example.......................................................................................... 17 EXAMPLE OF MOUNTING MEASURING CIRCUIT ON PRINTED BOARD ........................................... 18 6.1 Example of Mounting PPC1663G on Printed Board .......................................................................... 18 6.2 Example of Mounting PPC1663GV on Printed Board........................................................................ 19 CONCLUSION ................................................................................................................................................. 20 5 [MEMO] 6 1. GENERAL The PPC1663 is a differential input, differential output wideband amplifier IC that uses a high-frequency (fT = 6 GHz) silicon bipolar process (called NESAT™ 1). This process improves bandwidth, phase characteristics, input noise voltage characteristics, and low power consumption compared to conventional HF-band differential amplifier ICs. These features make this device suitable as a wideband amplifier in high-definition TVs, high-resolution monitors, broadcasting satellite receivers, and video cameras, as a sense amplifier in high-density CCD and optical pick-up products, or as a pulse amplifier for optical data links. Note, however, that this device's wide frequency range means that extra caution is required with regard to factors such as oscillation. This application note describes how to use the PPC1663 and its application circuits. 2. BASIC OPERATIONS 2.1 Outline of Operations Figure 1. Internal Equivalent Circuit + VCC R10 R1 R2 R11 R8 Q5 Q6 Q3 IN1 G1A Q1 Q4 IN2 Q2 R14 OUT1 G1B R3 R4 (G2A)Note R5 R16 R12 R6 Q8 R7 OUT2 R15 (G2B) R9 Q9 R13 R18 Q10 R17 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 2.4 kΩ 2.4 kΩ 50 Ω 50 Ω 590 Ω 590 Ω 600 Ω 10 kΩ 1.4 kΩ 1.1 kΩ R11 R12 R13 R14 R15 R16 R17 R18 R19 1.1 kΩ 750 Ω 300 Ω 7 kΩ 7 kΩ 1.2 kΩ 400 Ω 1.2 kΩ 400 Ω Q11 R19 Note: The µ PC1664, which included G2A and G2B pins, has been discontinued. – VCC Figure 1 shows an internal equivalent circuit diagram of the PPC1663. It is a DC direct-coupled amplifier in which two emitter-followers for transistors Q5 and Q6 are added to the two-stage differential configuration and in which feedback is propagated from the output via R14 and R15. Since OUT1 and OUT2 are differential outputs, the output voltage changes to the reverse direction at precisely double the gain (single-end) of differential voltage 'VDIF added between the differential inputs IN1 and IN2. OUT1 operates in phase with IN1 and OUT2 operates in phase with IN2, so that, for example: When IN1 > IN2, OUT1 changes to positive and OUT2 changes to negative When IN1 < IN2, OUT1 changes to negative and OUT2 changes to positive Accordingly, as is shown in Figure 2, if a sine wave is input to IN1 when IN2 is used as a ground, a sine wave having the same phase as the IN1 input is output via OUT1 and a sine wave having a 180q inverted phase is output via OUT2. 7 Figure 2. Response to Sine Wave Input + VCC Remark OUT1 IN1 For purposes of simplification, the bypass capacitor and gain select IN2 OUT2 pin have been omitted in some figures, such as – VCC Figure 2. 2.2 Determination of Gain Given re1 and re2 as the resistance values corresponding to the input differential transistors Q1 and Q2, the gain can be approximated via the following equations. Gain AVD1 for IN1 and OUT1 . AVD1 =. R14 ........................... (1) re1 + R3 + R5 Gain AVD2 for IN2 and OUT2 . AVD2 =. R15 re2 + R4 + R6 ........................... (2) Consequently, assuming that 'VDIF = VIN1 ð VIN2 as the differential voltage between IN1 and IN2, the output voltage can be calculated as follows. |'OUT1| = |'OUT2| = |'VDIF| 2 |'VDIF| 2 x AVD1 ........................ (3) x AVD2 ........................ (4) Since AVD1 = AVD2, we can add equations (3) and (4) to obtain the following. AVD1 = |'OUT1| + |'OUT2| |'VDIF| ................... (5) In equations (3), (4), and (5), A VD1 (AVD2) represents the differential output gain corresponding to the differential input voltage. Therefore, the differential voltage gain and AVD1/2 (AVD2/2) are defined as single-end voltage gain since it represents only one-sided output corresponding to the differential input voltage. 2.3 Gain Adjustments The gain values shown in equations (1) and (2) in section 2.2 above are determined according to the resistance applied to the emitter side of input differential transistors Q1 and Q2. Accordingly, in the equivalent circuit shown in Figure 1, a short between gain select pins G1A and G1B or insertion of an adjusting resistor can be used to adjust the gain in steps. Setting a short between G1A and G1B sets maximum gain, with a typical value of 320 times the differential gain. Setting an open connection between G1A and G1B sets minimum gain, with a typical value of 10 times the differential gain. The electrical characteristics for the two gain select pin conditions, when Gain 1 is the maximum gain and Gain 2 is the minimum gain, are shown in Table 3. If a gain adjusting resistor is inserted between G1A and G1B (as shown in Figure 4), any desired gain level can be obtained. Depending on the application circuit, if the Rs value is changed, the input voltage amplitude appears like it fluctuates due to changes in the interstage impedance, but the gain of the IC itself does not vary. 8 Figure 3. Pin Configuration of PPC1663 (Top View) µ PC1663 IN2 1 8 IN1 G1A 2 7 G1B VCC− 3 + 6 VCC OUT2 4 5 OUT1 Figure 4. Differential Voltage Gain vs. Gain Adjustment Resistance Characteristics Avd − RADJ characteristic Differential gain Avd 1000 100 10 10 100 1k 10 k Gain adustment resistance RADJ (Ω) between G1A and G1B 3. ELECTRICAL CHARACTERISTICS The absolute maximum ratings are listed in Table 1, recommended operating conditions in Table 2, and electrical characteristics in Table 3. Due to limitations that depend on the package, the supply voltage and temperature range differ slightly. The electrical characteristics are identical, however, because the same chip is employed. Table 1. Absolute Maximum Ratings Symbol Condition PPC1663C PPC1663G PPC1663GV Unit VCCr TA = +25qC r8 r7 r7 V Total dissipation PD Note 500 (TA = +85°C) 280 (TA = +75°C) 280 (TA = +75°C) mW Differential input voltage VID TA = +25qC r5 r5 r5 V Common mode input voltage VICM TA = +25qC, – + within VCC to VCC range r6 r6 r6 V Output current IO TA = +25qC 35 35 35 mA Operating ambient temperature TA ð45 to +85 ð45 to +75 –45 to +75 qC Storage temperature Tstg ð55 to +150 ð55 to +150 –55 to +150 qC Parameter Power supply voltage Note When mounted on a double sided copper clad 50 u 50 u 1.6 mm epoxy glass PWB 9 Table 2. Recommended Operating Conditions Parameter Symbol MIN. TYP. MAX. Unit Power supply voltage VCC (PPC1663C) r2 r6 r7 V Power supply voltage VCCr (PPC1663G, PPC1663GV) r2 r6 r6.5 V Output source current IO source 20 mA IO sink 2.5 mA 200 MHz r Output sink current Operating frequency range fopt DC Table 3. Electrical Characteristics (TA = +25qqC, VCCr = r6 V) Parameter Differential voltage gain Symbol Gain 1 Avd Gain 1 BW Gain 2 Rise time Gain 1 MIN. TYP. MAX. 200 320 500 8 10 12 RS = 50 : — 120 — (3 dB down point) — 700 — RS = 50 :, Vout = 1 VP-P — 2.9 — — 2.7 — — 2 — — 1.2 — — 4.0 — 50 180 — f = 10 MHz (Note 1) f = 10 MHz Gain 2 Bandwidth Condition tr (Note 2) Gain 2 Propagation delay Gain 1 tpd RS = 50 :, Vout = 1 VP-P Gain 2 Input resistance Gain 1 Rin Gain 2 Unit MHz ns ns k: Input capacitance Cin — 2 — pF Input offset current IIO — 0.4 5.0 PA Input bias current IR — 20 40 PA Input noise voltage Vn — 3 — PVr.m.s Input voltage range VI r1.0 — — V RS = 50 :, 10 k to 10 MHz CMR Vcm = r1 V, f d 100 kHz 53 94 — dB Supply voltage rejection ratio SVR 'V = r0.5 V 50 70 — dB Output offset voltage VO(off) VO(off) = |OUT1 ð OUT2| — 0.3 1.5 V — 0.1 1.0 2.4 2.9 3.4 V 3.0 4.0 — VP-P Common mode rejection ratio Gain 2 Gain 1 Gain 2 Output common mode voltage VO(CM) Output voltage swing VOp-p Single end Output sink current Isink 2.5 3.6 — mA Power supply current ICC — 13 20 mÁ Notes 1. Gain 1 is when gain select pins G 1A and G1B are connected 2. Gain 2 is when none of the gain select pins are connected Remark 10 The detailed specifications and package drawings should be referred to the data sheet (G11024E). The electrical characteristics are defined as follows. 3.1 Differential Voltage Gain (AVD) As was described in section 2.2, this indicates the ratio between the differential input and differential output voltage. AVD = |'OUT1| + |'OUT2| or |'VDIF| '|OUT1 ð 'OUT2| |'VDIF| The single-end gain (AVS) for single-side output is expressed as one half of A VD shown below. AVS= |'OUT1| |'VDIF| or |'OUT2| |'VDIF| 3.2 Bandwidth (BW) This is defined as the bandwidth when there is a 3-dB down gain (1 / — 2) in relation to the DC gain. 3.3 Rise Time (tr) and Propagation Delay Time (tpd) These are defined as shown below for this IC. Figure 5. Measurement Conditions for tpd and tr 50 % tpd 90 % 50 % 10 % tr 3.4 Input Resistance (Rin) This indicates the ratio of the change in the input bias voltage ('IB) to the change in the input voltage ('VIN). RIN = 'VIN/'IB The input resistance is defined as the product of the input transistor's current gain E and the emitter resistance. Therefore, this value is reduced in relation to higher gain values. 3.5 Input Capacitance (Cin) This indicates the capacitance between the input and the GND. 3.6 Input Offset Current (IIO) This is the offset current of the dual input bias current. IIO = |IB1 ð IB2| 11 3.7 Input Bias Current (IB) This indicates the base current at input transistors Q1 and Q2. 3.8 Input Noise Voltage (Vn) In Figure 6, the value measured by an RF AC voltmeter is divided by the single-end gain value. Figure 6. Input Noise Voltage Measurement Circuit 10 kHz to 10 MHz (passive filter) VCC+ 6 50 Ω 50 Ω 5 RF AC voltmeter 8 1 kΩ 3 4 1 V 1 kΩ – CC 3.9 Input Voltage Range (VI) This indicates the input voltage range for normal operation, during which input signals must be within this range. With the intermediate potential between VCC and VCCð as the center, the input voltage range is guaranteed within r1 + V (when VCC ð + VCCð = 12 V). 3.10 Common Mode Rejection Ratio (CMR) Figure 7. Common Mode Rejection Ratio Measurement Circuit + VCC 6 5 8 ∆ VIN 50 Ω 1 Differential probe ∆ VO = ∆ OUT1 + ∆ OUT2 3 4 – VCC This indicates the rate of variation in the input conversion offset relative to the common mode input signal. This can be expressed as follows, based on the circuit shown in Figure 7. CMR = 20 log 'VIN 'VO 12 x AVD 3.11 Supply Voltage Rejection Ratio (SVR) This indicates the rate of variation in the input conversion offset relative to the supply voltage. This can be expressed as follows, based on the circuit shown in Figure 8. SVR = 20 log 'V+ 'VO x AVD + Figure 8. Supply Voltage Rejection Ratio Measurement Circuit (V side) + VCC+ ± ∆ V 6 5 8 50 Ω ∆ VO = ∆ OUT1 + ∆ OUT2 1 50 Ω 3 4 – VCC 3.12 Output Offset Voltage (VO(off)) This indicates the DC voltage difference between both outputs when both of the differential inputs voltage is not applied. VO(off) = |OUT1 – OUT2| 3.13 Output Common Mode Voltage (VO(CM)) This indicates the average value from both output’s DC voltages when both of the differential inputs voltage is not applied. VO(CM) = OUT1 + OUT2 2 3.14 Output Voltage Swing (VOp-p) This indicates the maximum amplitude (swing) that occurs without distortion, mainly in the output common mode voltage. 3.15 Output Sink Current This indicates the sink current capacity of transistors Q10 and Q11. If a current that exceeds this value is accepted, the output voltage swing is greatly reduced. 3.16 Power Supply Current This indicates the circuit current and does not include the output load current. 13 4. PRECAUTIONS FOR DESIGN IN 4.1 Cautions on Layout and Wiring In high-frequency circuits, the PCB design can considerably influence circuit performance. When using this device with an especially high gain, you must note that oscillation might occur even when there is only a slight amount of external feedback. The following cautions concern the device mounting layout. x Form as wide an area as possible for the ground pattern so as to prevent feedback due to conductor inductance (a double sided copper clad epoxy glass PWB is recommended). x Make the leads from external components and the link wiring between front and rear components as short as possible. x Use a single ground as the ground for input/output circuit and the power supply. x Form the ground pattern to shield the input and output wiring so as to prevent feedback due to stray capacitance. x Lay out the output signal current path at a distance from the input wiring. x The power supply is bypassed very near to the IC's power supply pin by a small-inductance, high-frequency capacitor. If the power supply wiring is long, insert a small resistance (up to 10 :) in series. x The ground for the bypass capacitor should be laid out in order to form a loop only with the power supply line so as to prevent the high-frequency current that runs throughout the PCB from entering the input. 4.2 Cautions on External Circuit This IC features greatly improved phase characteristics, such that the characteristics inherent to this IC make it one of the more stable wideband amplifier ICs. However, the following cautions should be noted when this IC is used in application circuits. x Whenever possible, the signal source resistance values should be the same for the two inputs. Signal source resistance values should be minimized, with 1 k: maximum (If the signal source impedance is too large, the input amplitude becomes large and the output will become saturated). x Whenever possible, the load resistance values should be the same for the two outputs. * For this IC, it is essential that a balance be maintained between the two lines (IN1 to OUT1 and IN2 to OUT2) in the application circuit. 4.3 Other Caution Points x Use of single (power) supply This IC can be used with a single supply if the input voltage is biased at the intermediate between VCC and VCCð, + as is shown in the application circuit example in the data sheet. More detailed circuit examples and their characteristics are shown in Figure 9 and Tables 4 and 5. Note, however, that in this case the load current along RL is more than twice as great as when the load is VO(CM) connected with r power supply to a ground (recommended: max. 20 mA, IO = ). RL 14 Figure 9. Example Using Single Power Supply Supply Voltage (See Table 4) Input +5 V 5 8 50 Ω RS 0.01 µF 2.2 µ F 3 kΩ 2.2 µF 6 0.01 µF RS 50 Ω 3 kΩ 2.2 µF Output 1 RL µ PC1663 1 0.01 µF 0.01 µF 50 Ω Output 2 4 3 RL 50 Ω 0.01 µF Table 4. Reference Usage Range Parameter + – VCC – VCC Supply voltage Condition PPC1663C PPC1663G PPC1663GV Unit Single power supply –0.3 to +16 –0.3 to +14 –0.3 to +14 V Symbol Table 5. +5 V Single Power Supply Operation Performance (Based on Figure 9) Parameter Gain Condition Gain 1 Characteristics Unit 35 dB 15 MHz Gain 2 Bandwidth Gain 1 11 3 dB down point Gain 2 106 MHz 115 Rise time Gain 1 RS = 50 :, VOUT = 80 mVP-P 2.2 ns Propagation delay Gain 1 RS = 50 :, VOUT = 80 mVP-P 2.8 ns time Gain 2 RS = 50 :, VOUT = 60 mVP-P 1.8 Phase Gain 1 100 MHz Gain 2 Output, Max. –123 degree –93 RL = 240 : RL = 50 : RL = 910 : 15 MHz RL = 80 : 5.0 dBm 0 –11.5 x Driving a low-impedance line As was described in section 3.15 above, the sink current of the IC itself is only 3.6 mA (TYP.), which is inadequate for driving a low-impedance line such as a video line. As is shown in Figure 10, it is possible to drive a low-impedance line if a bypass resistor rated between 150 and 600 : is connected and a capacitor coupling is used to link the increased drive capacity of the output-level emitter-follower. In this case, the output current (IO = (VO(CM) / RL) generated based on the R L value should not be more than 20 mA. 15 Figure 10. Driving a Low Impedance Line +6 V 6 C 5 RL 150 to 600 Ω 3 4 RL −6 V 5. APPLICATION CIRCUIT EXAMPLES 5.1 Video Line Driver Circuit Example Figure 11. Video Line Driver Circuit Example +6 V <b> <a> 0.1 µ F 6 5 75 Ω COAXIAL Vout 8 eIN µ PC1663 75 Ω 1 75 Ω 3 4 200 Ω 75 Ω 200 Ω −6 V Maximum output voltage Vout (VP-P) Figure 12. Vout vs. f Characteristics (Video Line, Single End) Remark 2.0 the values of point <a> in Figure 11 of the application circuit. The values for the PPC1663 are those of point <b>, therefore when converted, they are equivalent to 1.0 approximately twice the value of Vout at point <a>. Because the measured values at point <a> are single-end, in the case of 0 100 k differential I/O, the values of points <a> 1M 10 M Frequency f (Hz) 16 The measurement results in Figure 12 are 100 M 1G and <b> are twice the value of the singleend values. Phase characteristics (degree) Figure 13. Phase Characteristics vs. Frequency Characteristics 0 −45 −90 Gain 2 −135 −180 Gain 1 100 k 1M 10 M Frequency f (Hz) 100 M 5.2 Optical Signal Detection Circuit Example Figure 14. Optical Signal Detection Circuit Example VC VCC+ = +5 V VC R2 75 Ω R5 1 kΩ R4 50 Ω 8 Pin photodiode 6 5 Q1 µ PC1663 2SK238 4 2 7 1 3 NDL2102 NDL2104 NDL2208 NDL5200 50 Ω R1 R3 50 Ω R6 1 kΩ 1 000 pF C1 1 000 pF C2 VCC– = –5 V Since a high gain value may lower the IC's input impedance, stable operation can be ensured by including an FET buffer (source follower), as is shown in Figure 14. This FET buffer also shifts the level of the input voltage from the diode. For detail on the FET and PIN photodiode, see the data sheet for each product. 17 6. EXAMPLE OF MOUNTING MEASURING CIRCUIT ON PRINTED BOARD 6.1 Example of Mounting PPC1663G on Printed Board Figure 15 shows an example of mounting of 8-pin SOP 225-mil type product on a PCB for use in the test circuit described in the PPC1663 data sheet. The evaluation board in Figure 15 is designed for single-end test circuit of IN2 input and OUT2 output. Figure 15. Example of assembled test Circuit on Evaluation Board 1 µ PC1663G IN2 C4 R2 R1 C1 C5 VCC– C3 VCC+ R3 C2 R4 OUT2 Parts Table No. Notes on Printed Board Value C1 to 3 0.1 PF C4 to 5 1000 pF R1 to 2 50 : R3 1 k: R4 950 :* (*1) 35-Pm copper patterning on both sides of 50 u 50 u 0.4-mm polyimide board (*2) Rear side ground pattern (*3) Solder plating of patterning side (*4) { is through-hole. (*5) To mount C2, pattern should be cut. * R4 is the value obtained by subtracting the impedance of the measuring instrument from R3. 18 6.2 Example of Mounting PPC1663GV on Printed Board Figure 16 shows an example of mounting of 8-pin SSOP 175-mil type product on a PCB for use in the test circuit described in the PPC1663 data sheet. This evaluation board can be used either for a single-end or differential amplifier. The assembled example in Figure 16 is for a single-end amplifier and provides one IN1 and one OUT1 pins. Figure 16. Example of assembled test Circuit on Evaluation Board VCC– VCC + µ PC1663GV 1 C 1 IN1 R1 2 C4 C5 R C 3 C 2 R 3 4 R OUT1 Parts Table No. C1 to 3 Notes on Printed Board Value (*1) 35-Pm copper patterning on both sides of 50 u 50 u 0.4-mm polyimide board 0.1 PF C4 to 5 1000 pF R1 to 2 50 : R3 1 k: R4 950 :* (*2) Rear side ground pattern (*3) Solder plating of patterning side (*4) { is through-hole. (*5) To mount R4, pattern should be cut. * R4 is the value obtained by subtracting the impedance of the measuring instrument from R3. 19 7. CONCLUSION The usage of the PPC1663 DC to VHF wideband differential input and output amplifier IC has been described above. Another product that uses a high-frequency process, the PPC2726T, is also offered as an L-band differential input and differential output wideband amplifier IC that operates up to 1.6 GHz. Reference Materials PPC1663 Data Sheet (Document No. G11024E) PPC2726T Data Sheet (Document No. P10873E) 20 [MEMO] 21 [MEMO] 22 Facsimile Message From: Name Company Tel. Although NEC has taken all possible steps to ensure that the documentation supplied to our customers is complete, bug free and up-to-date, we readily accept that errors may occur. Despite all the care and precautions we©ve taken, you may encounter problems in the documentation. Please complete this form whenever you©d like to report errors or suggest improvements to us. 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