DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC1694GR GENERAL PURPOSE HIGH FREQUENCY WIDEBAND IC FOR FREQUENCY DOWN-CONVERTER DESCRIPTION The µPC1694GR is Silicon monolithic IC for down-converter that is capable of operating up to 1 GHz. This IC consists of double balanced mixer (DBM), local oscillator and IF amplifier. Furthermore, combination with the µPC1663G (high-speed video amp) enables it to be applied to a FM demodulation circuit such as DBS tuner. The package is 14-pin SOP suitable for surface mounting. FEATURES • Satisfactory 1% cross-modulation distortion characteristics: CM = 103 dBµ @ fdes = 200 MHz • Wide band operation: f ≤ 1 GHz • Easy to connect with varactor diode due to balanced amplifier oscillator • Single-end push-pull IF amplifier suppresses fluctuation in output impedance • Supply voltage: 5 V • Packaged in 14-pin SOP suitable for smaller mounting area APPLICATIONS • Tuners for TV and VCR ORDERING INFORMATION Part Number µPC1694GR-E1 Package Supplying Form 14-pin plastic SOP (225 mil) Embossed tape 16 mm wide. Pin 1 indicates pull-out direction of tape. Remark To order evaluation samples, please contact your local NEC office. (Part number for sample order: µPC1694GR) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P12965EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1997, 1999 µPC1694GR INTERNAL BLOCK DIAGRAM OSC Collector OSC Base (Coupling) (Bypass) OSC Base NC (Feed Back) VCC 7 MIX. Out1 NC 1 NC 14 OSC Buff. OSC IF Pre Amp. MIX. IF Main Amp. 8 GND NC IF Out (75 Ω Const.) RF In2 (Bypass) RF In1 MIX. Out2 PIN CONFIGURATION (Top View) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 1. 2. 3. 4. 5. MIX output 1 GND (Non Connection) OSC base (bypass) OSC base (feedback) OSC collector (coupling) (MIX/IF Amp. switch) 6. GND (Non Connection) 7. VCC 8. IF output (75 Ω) 9. GND 10. RF input 2 (bypass) 11. GND (Non Connection) 12. RF input 1 13. GND (Non Connection) 14. MIX output 2 ABSOLUTE MAXIMUM RATINGS (TA = +25°C) Parameter Symbol Conditions Rating Unit 6.0 V 325 mW Supply Voltage VCC Power Dissipation PD Operating Ambient Temperature TA –40 to +85 °C Storage Temperature Tstg –65 to +150 °C TA = +85°C Note Note Mounted on 50 × 50 × 1.6-mm epoxy glass PWB, with copper patterning on both sides. 2 Data Sheet P12965EJ3V0DS00 µPC1694GR RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA –40 +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5 V) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current 1 ICC1 No input signal Note 1 32 40 48 mA Mixer Output Voltage VMIX 1-14 pin voltage, No input signal Note 1 –30 0 +30 mV Conversion Gain 1 CG1 fRF = 55 to 470 MHz, fIF = 50 MHz PRF = –40 dBm RF Input Terminal: Non Tuned 14 18 21 dB 14 18 21 dB — 12.5 15.0 dB — 13.5 16.0 dB Conversion Gain 2 Noise Figure 1 Noise Figure 2 CG2 NF1 NF2 Note 2 fRF = 470 to 890 MHz, fIF = 50 MHz PRF = –40 dBm RF Input Terminal: Non Tuned Note 3 fRF = 55 to 470 MHz, fIF = 50 MHz RF Input Terminal: Non Tuned Note 2 fRF = 470 to 890 MHz, fIF = 50 MHz RF Input Terminal: Non Tuned Note 3 Output Power 1 PO(sat)1 fRF = 470 MHz, fIF = 50 MHz, PRF = 0 dBm Note 2 +8 +10 — dBm Output Power 2 PO(sat)2 fRF = 890 MHz, fIF = 50 MHz, PRF = 0 dBm Note 3 +8 +10 — dBm Circuit Current 2 (U/IF) ICC2 No input signal Note 1 32 40 48 mA Power Gain (U/IF) GP fin = 50 MHz, Pin = –40 dBm Note 2 17 21 24 dB fin = 50 MHz Note 2 — 12.0 15.0 dB Noise Figure 3 (U/IF) NF3 Notes 1. By test circuit 1 2. By test circuit 2 3. By test circuit 3 Data Sheet P12965EJ3V0DS00 3 µPC1694GR STANDARD CHARACTERISTICS (FOR REFERENCE) (TA = +25°C, VCC = 5 V) Reference Value Unit fRF = 55 MHz, fIF = 50 MHz, PRF = –40 dBm RF Input Terminal: Tuned Note 1 24.5 dB CG4 fRF = 200 MHz, fIF = 50 MHz, PRF = –40 dBm RF Input Terminal: Tuned Note 1 24.5 dB Conversion Gain 5 CG5 fRF = 470 MHz, fIF = 50 MHz, PRF = –40 dBm RF Input Terminal: Tuned Note 1 23.0 dB Conversion Gain 6 CG6 fRF = 890 MHz, fIF = 50 MHz, PRF = –40 dBm RF Input Terminal: Tuned Note 2 20.0 dB 1% Cross-modulation Distortion 1 CM1 fRF = 55 to 470 MHz, fIF = 50 MHz Note 1, 3 103 dBµ 1% Cross-modulation Distortion 2 CM2 fRF = 470 to 890 MHz, fIF = 50 MHz Note 2, 3 100 dBµ 1% Cross-modulation Distortion 3 (U/IF) CM3 fRF = 50 MHz Note 1, 4 103 dBµ Oscillation Frequency Stability 1 fstb1 VCC ± 10%, fOSC = 100 to 520 MHz Note 1 ±100 kHz Oscillation Frequency Stability 2 fstb2 VCC ± 10%, fOSC = 520 to 940 MHz Note 2 ±200 Oscillation Stop (Start) Voltage 1 VOSC1 fOSC = 100 to 520 MHz Note 1 2.5 Oscillation Stop (Start) Voltage 2 VOSC2 fOSC = 520 to 940 MHz Note 2 3.0 Parameter Symbol Test Conditions Conversion Gain 3 CG3 Conversion Gain 4 V Notes 1. By test circuit 2 2. By test circuit 3 3. fundes = fRF ± 12 MHz, PRF = –31 dBm, fIF = 50 MHz, AM: 100 kHz, 30%Mod., S/I Ratio = 46 dBc, Output 75 Ω Open 4. fin = 50 MHz, fundes = 62 MHz, Pin = –31 dBm, AM: 100 kHz, 30% Mod., S/I Ratio = 46 dBc, Output 75 Ω Open 4 Data Sheet P12965EJ3V0DS00 µPC1694GR TYPICAL CHARACTERISTICS (TA = +25°C) CIRCUIT CURRNT vs. SUPPLY VOLTAGE 60 No Input Signal Circuit Current Icc (mA) 50 40 30 20 10 0 1 2 3 4 5 6 Supply Voltage VCC (V) NOISE FIGURE AND CONVERSION GAIN vs. INPUT FREQUENCY 30 18 16 14 12 10 25 Conversion Gain CG (dB) Noise Figure NF (dB) 20 VCC = 5 V fIF = 50 MHz RF Input Terminal: No Tuned Test Circuit 2, 3 PRF = –40 dBm 20 15 10 5 0 500 1000 1200 Input Frequency fRF (MHz) Data Sheet P12965EJ3V0DS00 5 µPC1694GR CONVERSION GAIN vs. INPUT FREQUENCY VCC = 5 V fIF = 50 MHz RF Input Terminal: Tuned PRF = –40 dBm Conversion Gain CG (dB) 30 25 20 15 10 5 0 55 200 500 900 Input Frequency fRF (MHz) 1% Cross-modulation Distortion CM (dBµ) 1% CROSS-MODULATION DISTORTION vs. INPUT FREQUENCY 110 100 90 VCC = 5 V fundes = fRF ± 12 MHz PRF = –31 dBm fIF = 50 MHz AM: 100 kHz, 30 % Mod. S/I Ratio = 46 dBc Output 75 Ω Open 80 70 60 0 500 Input Frequency fRF (MHz) 6 Data Sheet P12965EJ3V0DS00 1 000 1 200 µPC1694GR OUTPUT POWER vs. INPUT POWER +30 Output Power Pout (dBm) VCC = 5 V fRF = 470 MHz fIF = 50 MHz 0 –40 0 –20 +20 Input Power Pin (dBm) OSC-FREQUENCY STABILITY vs. OSCILLATION FREQUENCY +300 Oscillation Frequency Stability Fstb (kHz) VCC ± 10 % VCC – 10 % 0 –300 VCC + 10 % 0 500 1000 1200 Oscillation Frequency fOSC (MHz) Data Sheet P12965EJ3V0DS00 7 µPC1694GR TEST CIRCUIT 1 1 000 pF V 14 8 1 7 470 pF 1 000 pF A V VCC = 5 V When measuring circuit current with U/IF Amp, leave pin 5 open. 8 Data Sheet P12965EJ3V0DS00 µPC1694GR TEST CIRCUIT 2 RF Input Terminal: Tuned Input Frequency Symbol VRF/UIF Input 1 000 pF fRF = 55 MHz fRF = 200 MHz fRF = 470 MHz 8 pF 4 pF 2 pF C1 L2 20 pF Wire diameter : φ 0.3 mm Wire diameter : φ 0.4 mm Wire diameter : φ 0.4 mm : φ 3.5 mm Bore : φ 3.2 mm Bore : φ 3.5 mm Number of turns: 23 T Number of turns: 3 T Number of turns: 2 T L1 Bore C1 L1 Wire diameter : φ 0.3 mm Wire diameter : φ 0.3 mm Wire diameter : φ 0.5 mm : φ 3.5 mm Bore : φ 4.0 mm Bore : φ 3.5 mm Number of turns: 32 T Number of turns: 7 T Number of turns: 2 T L2 Bore VRF/UIF Input IF Output 1 000 pF 1 000 pF 0.47 µ H 20 pF 1 000 pF 1 10 pF 1.5 pF 1 000 pF 4 700 pF 1 000 pF 1 kΩ 1 000 pF 47 pF 47 kΩ 1 000 pF HVU306A L5 L4 3.3 kΩ FTC VCC5 VCC4 (BLOW) (BHIGH) Symbol Oscillation Frequency FTC VCC3 (BHYP) L3 L3 fOSC = 300 to 520 MHz Bore L4 fOSC = 150 to 300 MHz Bore L5 fOSC = 100 to 150 MHz Bore 47 kΩ 1 000 pF 47 kΩ FTC FTC VCC2 VTu = 1 to 29 V (BM2) Coil used Wire diameter : φ 0.5 mm : φ 3.0 mm Number of turns: 2 T 1 kΩ 1 kΩ FTC 1 µH 56 pF 47 to 330 Ω Wire diameter : φ 0.4 mm : φ 2.5 mm Number of turns: 3 T Wire diameter : φ 0.4 mm : φ 3.0 mm Number of turns: 9 T FTC VCC1 (BM1) VLOW VCC1 (BM1) 5V VCC2 (BM2) 5V VCC3 (BHYP) OPEN VCC4 (BHIGH) OPEN VCC5 (BLOW) 5V VHIGH 5V 5V OPEN 5V OPEN VHYPER 5V 5V 5V OPEN OPEN U/IF 5V OPEN OPEN OPEN OPEN Data Sheet P12965EJ3V0DS00 9 µPC1694GR TEST CIRCUIT 3 ,, ,, UHF/RF Input RF Input Terminal: (fRF = 890 MHz) = 25 mm UHF/RF Input L1: Wire diameter: φ 0.4 mm, Bore: φ 3.0 mm, Number of turns: 1 T L1 ZO = 200 Ω 1 000 pF 1 000 pF 20 pF to 30 pF IF Output 1 000 pF 330//4 pF 1 ,, ,, 330 pF 5 pF 47 kΩ 0.5 pF FTC 150 nH 4 pF 8 pF 47 Ω 1 000 pF FTC HVU202 5 pF VCC2 =5V Vtu = 1 to 29 V 10 FTC 5 pF Data Sheet P12965EJ3V0DS00 VCC1 =5V µPC1694GR APPLICATION CIRCUIT EXAMPLE 1 For FM demodulator (Example using µPC1694GR and µPC1663G) 330 pF VCC1 = 5 V µ PC1694GR 47 Ω IF INPUT 1 000 pF 7 8 1 000 pF Balun 10 pF L1 L2 5 pF HVU306A 47 Ω 6 pF 1 000 pF 10 pF HVU306A 14 1 180 Ω Lag Lead L.P.F. 47 Ω 47 Ω 100 pF 47 Ω 47 Ω 100 pF Trap 2 pF µPC1663G 1 L3 8 2 200 pF VIDEO OUTPUT 4 1 kΩ VCC2 = 10 V 5 1 kΩ L1: Wire diameter: φ 0.3 mm, Bore: φ 1.5 mm, Number of turns: 13 T L2: Wire diameter: φ 0.4 mm, Bore: φ 3.5 mm, Number of turns: 2 T L3: Wire diameter: φ 0.3 mm, Bore: φ 1.8 mm, Number of turns: 7 T Balun: TDK WBT5,5P5-C10129E Data Sheet P12965EJ3V0DS00 11 µPC1694GR APPLICATION CIRCUIT EXAMPLE 2 For TV/VCR TUNER 330 pF VCC = 5 V µ PC1694GR IF OUTPUT fIF = 58.75 MHz 1 000 pF 47 Ω 1 000 pF 8 7 150 nH 330 pF 1st. IF INPUT fRF = 954 MHz (from 1st. IF Amp.) Dielectric resonator 1 pF 1 pF 1 000 pF 5 pF 14 Filter ATT RF Amp. 1st. MIX. VAFT 1 1st. IF Filter 1st. IF 2nd IF 2nd MIX. INPUT IF OUTPUT Buff. Buff. PLL prescaler 1st. Lo OSC 2nd. Lo OSC µ PC1694GR 12 Data Sheet P12965EJ3V0DS00 µPC1694GR A' RF2 RF1 IF VCC4 (BHIGH) VCC5 (BLOW) VCC3 (BHYP) 1 69.5 mm C1694 (Front side) 50 mm ILLUSTRATION OF THE APPLICATION CIRCUIT EXAMPLE 2 ASSEMBLED ON EVALUATION BOARD A OSC Data Sheet P12965EJ3V0DS00 13 14 VTU B (Back Side) B' ,,,, , , ,, IF OUTPUT VCC1 (BM1) VCC2 (BM2) Data Sheet P12965EJ3V0DS00 L3 L4 RF, U/IF INPUT L5 µPC1694GR ,, , Double-sided glass epoxy board through-holes Front and back sides should be matched in A-A' and B-B' : short-circuited strip. µPC1694GR A' C1694 C1663 1 µPC1694GR 69.5 mm IF IN VIDEO OUT TP2 A TP1 (Front Side) 50 mm ILLUSTRATION OF THE APPLICATION CIRCUIT EXAMPLE 1 ASSEMBLED ON EVALUATION BOARD Data Sheet P12965EJ3V0DS00 15 16 VCC2 (Back Side) B VIDEO OUTPUT B' µ PC1663G Data Sheet P12965EJ3V0DS00 IF INPUT Double-sided glass epoxy board through-holes Front and back sides should be matched in A-A' and B-B' µPC1694GR VCC1 µPC1694GR PACKAGE DIMENSION 14 PIN PLASTIC SOP (225 mil) 14 8 detail of lead end +7° 3° –3° 1 7 10.2 ± 0.26 6.55 ± 0.2 4.38 ± 0.1 1.49 1.1 ± 0.16 0.6 ± 0.2 1.42 MAX 1.27 0.40 +0.10 –0.05 +0.10 0.15 –0.05 0.10 0.10 M 0.1 ± 0.1 1.59 +0.21 –0.20 NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. Data Sheet P12965EJ3V0DS00 17 µPC1694GR NOTE ON CORRECT USE (1) Since this IC uses high frequency process, care is required against the excessive input of static electricity, etc. (2) Use the shortest possible wiring for the GND pin. (3) Use the widest possible earth pattern to avoid increase of ground impedance (because it may cause abnormal oscillation). (4) Insert a bypass capacitor for the VCC pin (example: 1 000 pF, 2 200 pF, etc.) (5) Abnormal oscillation may occur depending on the values of the choke coil and floating capacitance. Therefore, insert a resistor between the power supply and choke coil. (See the application circuit example.) RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Note Count: 3, Exposure limit: None IR35-00-3 VPS Package peak temperature: 215 °C or below Time: 40 seconds or less (at 200 °C) Note Count: 3, Exposure limit: None VP15-00-3 Wave Soldering Soldering bath temperature: 260 °C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None WS60-00-1 Partial Heating Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Note Exposure limit: None – Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 18 Data Sheet P12965EJ3V0DS00 µPC1694GR [MEMO] Data Sheet P12965EJ3V0DS00 19 µPC1694GR • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. 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To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8