HI-SINCERITY Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 1/7 MICROELECTRONICS CORP. H432 Series H432 Series Pin Assignment ADJUSTABLE SHUNT REGULATOR 3 1 Description The H432 series are three-terminal adjustable regulators with guaranteed thermal stability over applicable temperature ranges. The output voltage may be set to any value between VREF (approximately 1.24 or 1.25 volts) and 30 volts with two external resistors. These devices have a typical dynamic output impedance of 0.2Ω. Active output circuitry provides a very sharp turn-on characteristic, making these devices excellent replacement for zener diodes in many applications. 1 3-Lead Plastic SOT-23 Package Code: N Pin 1: Reference Pin 2: Cathode Pin 3: Anode 2 2 Features 1 • Programmable output voltage • Temperature coefficient is 50ppm/oC typical • Temperature compensated for operation over full temperature range • Low output noise voltage • Fast turn on response 3-Lead Plastic SOT-89 Package Code: M Pin 1: Reference Pin 2: Anode Pin 3: Cathode 3 2 12 3 3-Lead Plastic TO-92 Package Code: A Pin 1: Reference Pin 2: Anode Pin 3: Cathode 3 Ordering Information Package VREF 1.24V±2% VREF 1.24V±1% VREF 1.24V±0.5% VREF 1.25V±2% VREF 1.25V±1% VREF 1.25V±0.5% SOT-23 SOT-89 TO-92 H432AN H432AM H432AA H432BN H432BM H432BA H432CN H432CM H432CA H432DN H432DM H432DA H432EN H432EM H432EA H432FN H432FM H432FA Absolute Maximum Ratings (Operating temperature range applies unless otherwise specified) Characteristics Symbol Cathode Voltage Cathode Current Range (Continuous) Reference Input Current Range VKA IK IREF Power Dissipation PD Operating Temperature Range Junction Temperature Storage Temperature Range Topr TJ Tstg Value Unit 30 50 0.05~+10 SOT-23 280 SOT-89 770 TO-92 770 0~+70 150 -65~+150 V mA mA mW o C C o C o Operating Conditions Characteristics Cathode Voltage Cathode Current Range (Continuous) H432 Series Symbol Min. Typ. Max. Unit VKA IK VREF 1 10 30 - V mA HSMC Product Specification HI-SINCERITY Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 2/7 MICROELECTRONICS CORP. Functional Block Diagram & Symbol Functional Block Diagram Symbol Cathode Reference + Cathode - Reference VREF Anode Anode Test Circuits Fig 1. VK=VREF Fig 2. VK>VREF II Fig 3. Off-State Current II VIN VK VIN IREF VK R1 VIN VK IREF IK IOFF IK VREF R2 VREF Note: VK=VREF(1+R1/R2)+IREFxR1 Electrical Characteristics (Ta=25oC unless otherwise specified) Characteristics Reference Input Voltage (Fig1) H432AN/AM/AA H432BN/BM/BA H432CA/CM/CA H432DN/DM/DA H432EN/EM/EA H432FN/FM/FA Deviation of Reference Input Voltage OverTemperature (Fig1) Symbol VREF VREF(dev) Ratio of Change in Reference Input Voltage to ∆VREF / the Change in Cathode Voltage (Fig2) ∆VK Reference Input Current (Fig2) Deviation of Reference Input Current Over Full Temperature Range (Fig2) Minimum Cathode Current for Regulation (Fig1) Off-State Cathode Current (Fig3) H432 Series IREF IREF(dev) IK(min) IK(off) Test Conditions VK=VREF, IK=10mA VK=VREF, IK=10mA Tmin≤Ta≤Tmax IK=10mA, ∆VK=10V to VREF IK=10mA, ∆VK=30V to 10V IK=10mA, R1=10kΩ, R2=∞ IK=10mA, R1=10kΩ, R2=∞, Ta=Full Range VK=VREF VK=30V, VREF=0 Min Typ Max Unit 1.215 1.228 1.234 1.225 1.238 1.244 1.24 1.24 1.24 1.25 1.25 1.25 1.265 1.252 1.246 1.275 1.262 1.256 V - 4 17 mV - -1.4 -2.7 mV/V - -1 -2 mV/V - 1 4 uA - 0.4 1.2 uA - 0.4 0.1 1 1 mA uA HSMC Product Specification HI-SINCERITY Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 3/7 MICROELECTRONICS CORP. Characteristics Curve Change in Reference Input Voltage & Cathode Voltage Cathode Current & Cathode Voltage 20 0 Change in Reference Input Voltage (mV) 15 Cathode Current (mA) 10 5 0 -5 -10 -15 o VK=VREF, Ta=25 C Test Circuit (Fig1) -20 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 -25 -1 -0.5 0 0.5 Cathode Voltage (V) 1 0 1.5 300 1.246 200 1.244 100 1.242 1.24 1.238 30 40 0 -100 -200 o VK=VREF, IK=10mA Test Circuit (Fig1) 1.236 20 Cathode Voltage (V) Cathode Current & Cathode Voltage 1.248 Cathode Current (uA) Reference Input Voltage (V) Reference Input Voltage & Temperature 10 VK=VREF, Ta=25 C Test Circuit (Fig1) -300 1.234 -400 -20 0 20 40 60 o Temperature ( C) 80 100 120 -1 -0.5 0 0.5 Cathode Voltage (V) 1 1.5 Small Signal Voltage Amplification & Frequency 60 Voltage Amplification (dB) 50 40 30 Vout 20 6.8K Ik 180 + 10 10uF 4.3K 0 5V GND -10 100 H432 Series 1000 10000 100000 Frequency (Hz) 1000000 10000000 HSMC Product Specification HI-SINCERITY Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 4/7 MICROELECTRONICS CORP. Typical Application Fig 4. Shunt Regulator Fig 5. High Current Shunt Regulator Vcc Vout Vcc Vout R1 R1 R2 R2 Vout=(1+R1/R2)VREF Vout=(1+R1/R2)VREF Fig 6. Output Control of a Three-Terminal Fixed Fig 7. Series Pass Regulator Regulator Vcc Vcc H7805 IN Vout Vout OUT COMMON R1 R1 R2 R2 Vout=(1+R1/R2)VREF; Vout(min)=VREF+5V Vout=(1+R1/R2)VREF; Vout(min)=VREF+VBE Fig 8. Current Limiter or Current Source Fig 9. Constant Current Sink Vcc Vcc Isink Iout RCL Rs Iout=VREF/RCL H432 Series Isink=VREF/RS HSMC Product Specification HI-SINCERITY Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 5/7 MICROELECTRONICS CORP. SOT-89 Dimension C Marking: H Date Code Control Code Pb Free Mark HSMC Logo D B 1 2 Pb-Free: " . " (Note) Normal: None H 4 3 2 3 Note: Green label is used for pb-free packing E I J F Pin Style: 1.Reference 2.Anode 3.Cathode DIM A B C D E F G H I Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 G A Min. 4.40 4.05 1.50 2.40 0.36 *1.50 *3.00 1.40 0.35 Max. 4.60 4.25 1.70 2.60 0.51 1.60 0.41 *: Typical, Unit: mm 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M TO-92 Dimension α2 A Marking: Pb Free Mark Pb-Free: " . " (Note) Normal: None B 1 2 H 4 3 2 A 3 Date Code α3 Control Code Note: Green label is used for pb-free packing C D Pin Style: 1.Reference 2.Anode 3.Cathode H I G α1 Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I α1 α2 α3 Min. 4.33 4.33 12.70 0.36 3.36 0.36 - Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27 *5° *2° *2° *: Typical, Unit: mm E F H432 Series 3-Lead TO-92 Plastic Package HSMC Package Code: A HSMC Product Specification HI-SINCERITY Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 6/7 MICROELECTRONICS CORP. SOT-23 Dimension DIM A B C D G H J K L S V Marking: A L 4 3 2 3 Pb-Free: " " (Note) Normal: None B S 1 V Pb Free Mark Note: Pb-free product can distinguish by the green label or the extra description on the right side of the label. 2 G Pin Style: 1.Reference 2.Cathode 3.Anode Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 C D H K Min. 2.80 1.20 0.89 0.30 1.70 0.013 0.085 0.32 0.85 2.10 0.25 Max. 3.04 1.60 1.30 0.50 2.30 0.10 0.177 0.67 1.15 2.75 0.65 *: Typical, Unit: mm J 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 H432 Series HSMC Product Specification HI-SINCERITY Spec. No. : IC200404 Issued Date : 2004.03.01 Revised Date : 2005.03.25 Page No. : 7/7 MICROELECTRONICS CORP. Soldering Methods for HSMC’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat Ramp-down 25 t 25oC to Peak Time Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly <3 C/sec <3oC/sec - Temperature Min (Tsmin) 100oC 150oC - Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec <3oC/sec <3oC/sec 183oC 217oC 60~150 sec 60~150 sec 240oC +0/-5oC 260oC +0/-5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 245 C ±5 C 5sec ±1sec Average ramp-up rate (TL to TP) o Preheat - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices. H432 Series o o o o 260 C +0/-5 C 5sec ±1sec HSMC Product Specification