PANJIT 1SMB3EZ82

1SMB3EZ6.8~1SMB3EZ100
SILICON ZENER DIODES
VOLTAGE
6.8 to 100 Volts
POWER
3.0 Watts
SMB/DO-214AA
Unit: inch (mm)
FEATURES
• Low profile package
.155(3.94)
.130(3.30)
• Built-in strain relief
• Plastic package has Underwriters Laboratory Flammability
Classification 94V-O
.083(2.11)
• Typical ID less than 1.0µA above 11V
.075(1.91)
• Low inductance
• High temperature soldering : 260°C /10 seconds at terminals
.185(4.70)
.160(4.06)
• Pb free product are available : 99% Sn can meet RoHS environment
substance directive request
MECHANICALDATA
Case: JEDEC DO-214AA, Molded plastic over passivated junction
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Indicated by cathode band
.083(2.13)
.096(2.44)
.012(.305)
.006(.152)
.050(1.27)
.030(0.76)
Standard packing: 12mm tape (E1A-481)
.008(.203)
.002(.051)
.220(5.59)
.200(5.08)
Weight: 0.003 ounce, 0.093 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
Value
Units
Peak Pulse Power Dissipation on TA=50O C (Notes A)
Derate above 70O C
PD
3.0
24.0
W atts
mW/ O C
Peak Forward Surge Current 8.3ms single half sine-wave
superimposed on rated load (JEDEC method)
IFSM
15
Amps
TJ,TSTG
-55 to + 150
Operating Junction and Storage Temperature Range
O
C
NOTES:
A.Mounted on 5.0mm2 (.013mm thick) land areas.
B.Measured on 8.3ms, and single half sine-wave or equivalent square wave ,duty cycle=4 pulses per minute maximum
REV.0-JUN.15.2005
PAGE . 1
1SMB3EZ6.8~1SMB3EZ100
N o m i na l Ze ne r V o l t a g e
Part Number
V Z @ IZT
No m. V
Max. Reverse
Leakage Current
M a x i m u m Z e n e r Im p e d a n c e
Z ZT @ IZT
IZT
Z ZK @ IZK
IZK
IR @VR
M i n. V
M a x. V
O hm s
mA
O hm s
mA
µA
V
Marking
C ode
P a cka g e
3.0 watt Zener Diodes
1SMB3EZ6.8
6.8
6.46
7.14
2
110.0
700
1.00
5.00
4.00
3006
SMB
1SMB3EZ7.5
7.5
7.13
7.88
2
100.0
700
0.50
5.00
5.00
3007
SMB
1SMB3EZ8.2
8.2
7.79
8.61
2
91.0
700
0.50
5.00
6.00
3008
SMB
1SMB3EZ8.7
8.7
8.27
9.14
2
85.0
700
0.50
4.00
6.60
30A 8
SMB
1SMB3EZ9.1
9.1
8.65
9.56
3
82.0
700
0.50
3.00
7.00
3009
SMB
1SMB3EZ10
10
9..50
10.50
4
75.0
700
0.25
3.00
7.60
3010
SMB
1SMB3EZ11
11
10.45
11.55
4
68.0
700
0.25
1.00
8.40
3011
SMB
1SMB3EZ12
12
11.40
12.60
5
63.0
700
0.25
1.00
9.10
3012
SMB
1SMB3EZ13
13
12.35
13.65
5
58.0
700
0.25
0.50
9.90
3013
SMB
1SMB3EZ14
14
13.30
14.70
6
53.0
700
0.25
0.50
10.60
3014
SMB
1SMB3EZ15
15
14.25
15.75
7
50.0
700
0.25
0.50
11.40
3015
SMB
1SMB3EZ16
16
15.20
16.80
8
47.0
700
0.25
0.50
12.20
3016
SMB
1SMB3EZ17
17
16.15
17.85
9
44.0
750
0.25
0.50
13.00
3017
SMB
1SMB3EZ18
18
17.10
18.90
10
42.0
750
0.25
0.50
13.70
3018
SMB
1SMB3EZ19
19
18.05
19.95
11
40.0
750
0.25
0.50
14.40
3019
SMB
1SMB3EZ20
20
19.00
21.00
11
37.0
750
0.25
0.50
15.20
3020
SMB
1SMB3EZ22
22
20.90
23.10
12
34.0
750
0.25
0.50
16.70
3022
SMB
1SMB3EZ24
24
22.80
25.20
13
31.0
750
0.25
0.50
18.20
3024
SMB
1SMB3EZ25
25
23.75
26.25
14
30.0
750
0.25
0.50
19.00
3025
SMB
1SMB3EZ27
27
25.65
28.35
18
28.0
750
0.25
0.50
20.60
3027
SMB
1SMB3EZ28
28
26.60
29.40
18
27.0
750
0.25
0.50
21.30
3028
SMB
1SMB3EZ30
30
28.50
31.50
20
25.0
1000
0.25
0.50
22.50
3030
SMB
1SMB3EZ33
33
31.35
34.65
23
23.0
1000
0.25
0.50
25.10
3033
SMB
1SMB3EZ36
36
34.20
37.80
25
21.0
1000
0.25
0.50
27.40
3036
SMB
1SMB3EZ39
39
37.05
40.95
30
19.0
1000
0.25
0.50
29.70
3039
SMB
1SMB3EZ43
43
40.85
45.15
35
17.0
1500
0.25
0.50
32.70
3043
SMB
1SMB3EZ47
47
44.65
49.35
40
16.0
1500
0.25
0.50
35.70
3047
SMB
1SMB3EZ51
51
48.45
53.55
48
15.0
1500
0.25
0.50
38.80
3051
SMB
1SMB3EZ56
56
53.20
58.80
55
13.0
2000
0.25
0.50
42.60
3056
SMB
1SMB3EZ60
60
57.00
63.00
58
12.5
2000
0.25
0.50
45.60
3060
SMB
1SMB3EZ62
62
58.90
65.10
60
12.0
2000
0.25
0.50
47.10
3062
SMB
1SMB3EZ68
68
64.60
71.40
75
11.0
2000
0.25
0.50
51.70
3068
SMB
1SMB3EZ75
75
71.25
78.75
90
10.0
2000
0.25
0.50
56.00
3075
SMB
1SMB3EZ82
82
77.90
86.10
100
9.1
3000
0.25
0.50
62.20
3082
SMB
1SMB3EZ87
87
82.65
91.35
120
8.5
3000
0.25
0.50
66.10
3087
SMB
1SMB3EZ91
91
86.45
95.55
125
8.2
3000
0.25
0.50
69.20
3091
SMB
1SMB3EZ100
100
95.00
105.00
175
7.5
3000
0.25
0.50
76.00
3100
SMB
REV.0-JUN.15.2005
PAGE . 2
1SMB3EZ6.8~1SMB3EZ100
APPLICATION NOTE:
Since the actual voltage available from a given zener diode is temperature dependent, it is necessary to determinejunction
temperature under any set of operating conditions in order to calculate its value. The following procedure is recommended:
Lead Temperature, T L , should be determined from:
T L = q LA P D + T A
O
q L A is the lead-to-ambient thermal resistance ( C/W) and Pd is the power dissipation. The value for q L A will vary and depends
on the device mounting method. q L A is generally 30-40 OC/W for the various clips and tie points in common use and for printed
circuit board wiring.
The temperature of the lead can also be measured using a thermocouple placed on the lead as close as possible to the tie poin
The thermal mass connected to the tie point is normally large enough so that it will not significantly respond to heat surges
generated in the diode as a result of pulsed operation once steady-state conditions are achieved. Using the measured value of
TL, the junction temperature may be determined by:
T J = T L + D T JL
D T JL is the increase in junction temperature above the lead temperature and may be found from Figure 2 for a train of power puls
or from Figure 10 for dc power.
D T JL = q J L P D
For worst-case design, using expected limits of I Z , limits of P D and the extremes of T J ( D T J ) may be estimated. Changes in volta
V Z , can then be found from:
DV = qV Z DT J
q V Z , the zener voltage temperature coefficient, is found from Figures 5 and 6.
Under high power-pulse operation, the zener voltage will vary with time and may also be affected significantly by the zener resis
For best regulation, keep current excursions as low as possible.
Data of Figure 2 should not be used to compute surge capa-bility. Surge limitations are given in Figure 3. They are lower than w
be expected by considering only junction temperature, as current crowding effects cause temperatures to be extremely high in s
spots resulting in device degradation should the limits of Figure 3 be exceeded.
REV.0-JUN.15.2005
PAGE . 3
1SMB3EZ6.8~1SMB3EZ100
REV.0-JUN.15.2005
PAGE . 4