ETC HSMC-C220

Agilent HSMx-C220
High Performance ChipLEDs
Data Sheet
Description
The HSMx-C220 is the smallest and
the most efficient ChipLED package
available in the market. The package contains a reflector cup and
lens to maximize light extraction.
They are available in a wide range
of colors. All packages come in
8 mm tape on 7 inch reels which
make them suitable for automated
pick and place process. The parts
are also compatible with IR reflow
solder processes.
The small package size makes
these LEDs prime choices for all
backlighting applications and
front panel illumination especially
where space is a premium. The
directional viewing angle of less
than 90 degrees makes the parts
suitable for use with light guide/
pipe.
Device Selection Guide
Part Number
HSMA-C220
HSMC-C220
HSML-C220
HSMU-C220
HSMM-C220
HSMN-C220
HSMD-C220
HSMG-C220
HSMS-C220
HSMY-C220
HSMH-C220
Color
AS AlInGaP Amber
AS AlInGaP Red
AS AlInGaP Orange
TS AlInGaP Amber
InGaN Green
InGaN Blue
GaP Orange
GaP Green
GaP HER
GaP Yellow
AS AlGaAs Red
Package Description
Untinted, non-diffused
Untinted, non-diffused
Untinted, non-diffused
Untinted, non-diffused
Untinted, non-diffused
Untinted, non-diffused
Untinted, non-diffused
Untinted, non-diffused
Untinted, non-diffused
Untinted, non-diffused
Untinted, non-diffused
Features
• Small size (2 x 1.25 x 1.2 mm)
• High performance (with reflector
cup and lens)
• Directional optics
• Industry standard footprint
• Compatible with IR solder
• Operating temperature range of
–40°C to +85°C
• Available in 8 mm tape on 7 in.
(178 mm) diameter reels
Applications (Indoor)
• Keypad backlighting
• Push-button backlighting
• LCD backlighting
• Symbol backlighting
• Front panel indicator
Package Dimensions
2.00 (0.08)
1.25 (0.05)
0.63 (0.025)
POLARITY
1.20 (0.048)
0.50 (0.02)
1.25 (0.05)
GREEN CATHODE MARKING
0.45 (0.018)
1.16 (0.046)
1.25 (0.05)
SOLDERING
PAD
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
Absolute Maximum Ratings at TA = 25˚C
Parameter
AlInGaP
InGaN
AlGaAs
GaP
Units
DC Forward Current
30
25
25
20
mA
Peak Pulsing Current[1]
100
100
100
100
mA
Power Dissipation
78
105
65
52
mW
Reverse Voltage (IR = 100 µA)
5
5
5
5
V
LED Junction Temperature
95
95
95
95
˚C
Operating Temperature Range
–40 to +85
˚C
Storage Temperature Range
–40 to +100
˚C
Note:
1. Pulse condition of 1/10 duty and 0.1 ms width.
Electrical Characteristics at TA = 25˚C
Color
Forward Voltage
VF (Volts)
@ IF = 20 mA
Typ.
Max.
Reverse Breakdown
VR (Volts)
@ IR = 100 µA
Min.
Capacitance
C(pF), VR = 0,
f = 1 MHz
Typ.
Thermal
Resistance RθJ-PIN
Typ.
AS Amber
1.9
2.6
5
48
485
AS Red
1.9
2.6
5
48
485
AS Orange
1.9
2.6
5
52
485
TS Amber
2.2
2.6
5
40
485
InGaN Green
3.5
4.1
5
53
380
InGaN Blue
3.5
4.1
5
55
380
GaP Orange
2.2
2.6
5
10
450
GaP Green
2.2
2.6
5
7
450
GaP HER
2.1
2.6
5
4
450
GaP Yellow
2.1
2.6
5
3
450
AlGaAs Red
1.8
2.6
5
26
350
3
Optical Characteristics at TA = 25˚C
Color
Luminous
Intensity
IV (mcd)
@ 20 mA[1]
Min.
Typ.
Peak
Wavelength
λpeak (nm)
Typ.
Color,
Dominant
Wavelength
λd[2] (nm)
Typ.
Viewing
Angle
2 θ1/2
Degrees[3]
Typ.
Luminous
Efficacy
ηv
(lm/w)
Typ.
AS Amber
63
180
595
592
85
500
AS Red
63
180
637
626
85
155
AS Orange
63
180
609
605
85
385
TS Amber
100
300
595
592
85
490
InGaN Green
63
230
523
525
65
490
InGaN Blue
25
70
468
470
65
70
GaP Orange
6.3
25
605
604
75
350
GaP Green
10
30
570
572
75
540
GaP HER
6.3
20
630
626
75
135
GaP Yellow
6.3
20
589
586
75
480
AlGaAs Red
25
80
660
639
75
75
Notes:
1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength, λd , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4
1.0
RELATIVE INTENSITY
GREEN
AIGaAs
YELLOW
0.5
ORANGE
0
500
HER
550
600
650
700
750
WAVELENGTH - nm
Figure 1a. Relative intensity vs. wavelength for GaP and AlGaAs.
1
RELATIVE INTENSITY
ORANGE
0.8
RED
AMBER
0.6
0.4
0.2
0
500
550
600
650
700
WAVELENGTH - nm
Figure 1b. Relative intensity vs. wavelength for AlInGaP.
RELATIVE INTENSITY – %
1.0
GREEN
BLUE
0.5
0
350
400
450
500
550
WAVELENGTH – nm
Figure 1c. Relative intensity vs. wavelength for InGaN.
5
600
650
IF – FORWARD CURRENT – mA
100
AIGaAs
GREEN
10
YELLOW
1
ORANGE
HER
0.1
1.5
1.7
1.9
2.1
2.3
2.5
VF – FORWARD VOLTAGE – V
IF – FORWARD CURRENT – mA
100
TS AllnGap
10
InGaN GREEN
AS AllnGaP
1
InGaN BLUE
0.1
1.5
2.5
3.5
4.5
VF – FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
AlGaAs
1.2
0.8
0.4
GaP
0
0
10
20
30
IF – FORWARD CURRENT – mA
Figure 3a. Luminous intensity vs. forward
current – GaP and AlGaAs.
6
40
1.4
1.2
1.2
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.6
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
IF – FORWARD CURRENT – mA
Figure 3b. Luminous intensity vs. forward
current – AlInGaP.
30
0.8
0.6
0.4
0.2
0
0
5
10
15
20
IF – FORWARD CURRENT – mA
Figure 3c. Luminous intensity vs. forward
current – InGaN.
25
IF MAX. – MAXIMUM FORWARD CURRENT
IF MAX. – MAXIMUM FORWARD CURRENT
35
R0JA = 600°C/W
30
25
AS
AllnGaP
20
15
10
TS AllnGaP
5
0
0
10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE TA – DEG
30
R0JA = 600°C/W
25
AIGaAs
GaP
20
15
10
InGaN
5
0
0
10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE TA – DEG
Figure 4. Maximum forward current vs. ambient temperature.
1
RELATIVE INTENSITY
0.9
85°
0.8
0.7
75°
0.6
0.5
65°
0.4
0.3
0.2
0.1
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE – DEGREES
Figure 5. Radiation pattern.
7
TEMPERATURE
10 SEC. MAX.
230°C MAX.
4°C/SEC. MAX.
140-160°C
1.15 (0.045)
–3°C/SEC. MAX.
4°C/SEC.
MAX.
0.90
(0.035)
OVER 2 MIN.
TIME
USER FEED DIRECTION
PRINTED LABEL
CATHODE SIDE
Figure 8. Reeling orientation.
180
Ø (7.08)
21.0
(0.83)
2.0
(0.08)
60.0
Ø (2.36)
Ø 13.0
(0.51)
LABEL
13.0
(0.51)
10.0
(0.39)
Figure 9. Reel dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
8
0.90
(0.035)
Figure 7. Recommended soldering pattern.
Figure 6. Recommended reflow soldering profile.
1.5 TYP.
(0.06)
1.06
(0.042)
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
COVER TAPE
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
PART NUMBER
HSMx-C220 SERIES
2.44 (0.096)
1.68 (0.066)
Figure 10. Tape dimensions.
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCHES) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCHES) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 11. Tape leader and trailer dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
9
MINIMUM OF
230 mm
(9.05 INCHES)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
1.30 (0.051)
Intensity Bin Limits
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
HSMG-C220
Intensity Range (mcd)
Min.
Max.
0.10
0.20
0.16
0.32
0.25
0.50
0.40
0.80
0.63
1.25
1.00
2.00
1.60
3.20
2.50
5.00
4.00
8.00
6.30
12.50
10.00
20.00
16.00
32.00
25.00
50.00
40.00
80.00
63.00
125.00
100.00
200.00
160.00
320.00
250.00
500.00
400.00
800.00
630.00
1250.00
1000.00
2000.00
1600.00
3200.00
2500.00
5000.00
HSMN-C220
Bin ID
A
B
C
D
E
Dom. Wavelength (nm)
Min.
Max.
459.0
465.0
463.0
469.0
467.0
473.0
471.0
477.0
475.0
481.0
HSMM-C220
Bin ID
A
B
C
D
E
10
Dom. Wavelength (nm)
Min.
Max.
514.0
521.0
519.0
526.0
524.0
531.0
529.0
536.0
534.0
541.0
Bin ID
A
B
C
D
E
Dom. Wavelength (nm)
Min.
Max.
561.0
565.0
564.0
568.0
567.0
571.0
570.0
574.0
573.0
577.0
HSMA-C220
Bin ID
A
B
C
D
H
J
Dom. Wavelength (nm)
Min.
Max.
581.5
585.0
584.0
587.5
586.5
590.0
589.5
592.5
591.5
595.0
594.0
597.5
HSMD-C220
Bin ID
A
B
C
D
E
F
Dom. Wavelength (nm)
Min.
Max.
596.0
601.0
599.0
604.0
602.0
607.0
605.0
610.0
608.0
613.0
611.0
616.0
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicators
Components and Application
Note 1217 Pick and Place and
Soldering of the Agilent HSMXC540, HSMx-C220 Surface
Mount LEDs respectively.
Storage Condition: 5 to 30°C @
60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicators
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5°C for 20 hours.
11
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For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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(408) 654-8675
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Hong Kong: (+65) 6271 2451
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Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-6549EN
June 24, 2002
5988-7126EN