ISP1102 Advanced Universal Serial Bus transceiver Rev. 03 — 02 September 2003 Product data 1. General description The ISP1102 Universal Serial Bus (USB) transceiver is fully compliant with the Universal Serial Bus Specification Rev. 2.0. The ISP1102 can transmit and receive USB data at full-speed (12 Mbit/s). The transceiver allows USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) with power supply voltages from 1.65 to 3.6 V to interface with the physical layer of the USB. The transceiver has an integrated 5 V-to-3.3 V voltage regulator for direct powering via the USB supply line VBUS. The transceiver has an integrated voltage detector to detect the presence of the VBUS voltage (VCC(5.0)). When VCC(5.0) or Vreg(3.3) is lost, the D+ and D− pins can be shared with other serial protocols. The transceiver is a bi-directional differential interface and is available in HBCC16 and HVQFN14 packages. The transceiver is ideal for use in portable electronic devices, such as mobile phones, digital still cameras, personal digital assistants and information appliances. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Complies with Universal Serial Bus Specification Rev. 2.0 Supports data transfer at full-speed (12 Mbit/s) Integrated 5 V-to-3.3 V voltage regulator for powering via USB line VBUS VBUS voltage presence indication on pin VBUSDET VP and VM pins function in bi-directional mode allowing pin count saving for ASIC interface Used as USB device transceiver or USB host transceiver Stable RCV output during single-ended zero (SE0) condition Two single-ended receivers with hysteresis Low-power operation Supports I/O voltage range from 1.65 to 3.6 V ±12 kV ESD protection (ISP1102W) at D+, D−, VCC(5.0) and GND pins Full industrial operating temperature range from −40 to +85 C Available in HBCC16 and HVQFN14 lead-free and halogen-free packages. ISP1102 Philips Semiconductors Advanced USB transceiver 3. Applications ■ Portable electronic devices, such as: ◆ Mobile phone ◆ Digital Still Camera (DSC) ◆ Personal Digital Assistant (PDA) ◆ Information Appliance (IA). 4. Ordering information Table 1: Ordering information Type number Package Name Description Version ISP1102W HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 × 3 × 0.65 mm SOT639-2 ISP1102BS HVQFN14 plastic thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 × 2.5 × 0.85 mm SOT773-1 5. Block diagram 3.3 V V CC(I/O) VOLTAGE REGULATOR VCC(5.0) Vreg(3.3) Vpu(3.3) 1.5 kΩ D+ VBUSDET D− SOFTCON OE RCV VP/VPO 33 Ω (1%) 33 Ω (1%) LEVEL SHIFTER ISP1102 VM/VMO SUSPND GND 004aaa207 Fig 1. Block diagram. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 2 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 6. Pinning information 10 D+ 11 n.c. VBUSDET D− 4 5 6 7 8 D− VP/VPO 3 ISP1102W 1 Bottom view 16 15 14 9 D+ GND 12 n.c. 13 Vreg(3.3) OE 1 004aaa209 Fig 2. Pin configuration HBCC16. 10 n.c. (exposed diepad) 14 Bottom view VCC(5.0) OE (exposed diepad) Vpu(3.3) 2 SOFTCON RCV GND ISP1102BS RCV 2 SOFTCON 3 VP/VPO 13 12 11 Vreg(3.3) 4 9 VCC(I/O) 8 VCC(5.0) VBUSDET 7 SUSPND VCC(I/O) 6 VM/VMO n.c. 5 Vpu(3.3) VM/VMO SUSPND 6.1 Pinning 004aaa208 Fig 3. Pin configuration HVQFN14. 6.2 Pin description Table 2: Pin description Symbol[1] OE Pin HBCC16 HVQFN14 1 1 Type Description I input for output enable (CMOS level with respect to VCC(I/O), active LOW); enables the transceiver to transmit data on the USB bus input pad; push pull; CMOS RCV 2 2 O differential data receiver output (CMOS level with respect to VCC(I/O)); driven LOW when input SUSPND is HIGH; the output state of RCV is preserved and stable during an SE0 condition output pad; push pull; 4 mA output drive; CMOS VP/VPO 3 3 I/O single-ended D+ receiver output VP (CMOS level with respect to VCC(I/O)); for external detection of SE0, error conditions, speed of connected device; this pin also acts as the drive data input VPO; see Table 3 and Table 4 bidirectional pad; push-pull input; three-state output; 4 mA output drive; CMOS VM/VMO 4 4 I/O single-ended D− receiver output VM (CMOS level with respect to VCC(I/O)); for external detection of SE0, error conditions, speed of connected device; this pin also acts as the drive data input VMO; see Table 3 and Table 4 bidirectional pad; push-pull input; three-state output; 4 mA output drive; CMOS SUSPND 5 5 I suspend input (CMOS level with respect to VCC(I/O)); a HIGH level enables low-power state while the USB bus is inactive and drives output RCV to a LOW level input pad; push pull; CMOS © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 3 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver Table 2: Pin description…continued Symbol[1] Pin Type Description - - not connected 7 6 - supply voltage for digital I/O pins (1.65 to 3.6 V). When VCC(I/O) is not connected, the D+ and D− pins are in three-state. This supply pin is totally independent of VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3) voltage. VBUSDET 8 7 O VBUS indicator output (CMOS level with respect to VCC(I/O)); when VBUS > 4.1 V, then VBUSDET = HIGH and when VBUS < 3.6 V, then VBUSDET = LOW; when SUSPND = HIGH, then pin VBUSDET is pulled HIGH D− 9 8 AI/O negative USB data bus connection (analog, differential) D+ 10 9 AI/O positive USB data bus connection (analog, differential) n.c. 11 - n.c. 12 - n.c. - 10 - not connected Vreg(3.3) 13 11 - internal regulator option: regulated supply voltage output (3.0 to 3.6 V) during 5 V operation; a decoupling capacitor of at least 0.1 µF is required HBCC16 HVQFN14 n.c. 6 VCC(I/O) output pad; push pull; 4 mA output drive; CMOS not connected not connected regulator bypass option: used as a supply voltage input (3.3 V ±10%) for 3.3 V operation VCC(5.0) 14 12 - Vpu(3.3) 15 13 - internal regulator option: supply voltage input (4.0 to 5.5 V); can be connected directly to USB line VBUS regulator bypass option: connect to Vreg(3.3) pull-up supply voltage (3.3 V ±10%); connect an external 1.5 kΩ resistor on D+ (full-speed). Pin function is controlled by input SOFTCON: SOFTCON = LOW — Vpu(3.3) floating (high impedance); ensures zero pull-up current SOFTCON = HIGH — Vpu(3.3) = 3.3 V; internally connected to Vreg(3.3) SOFTCON 16 14 I software controlled USB connection input; a HIGH level applies 3.3 V to pin Vpu(3.3), which is connected to an external 1.5 kΩ pull-up resistor; this allows USB connect or disconnect signalling to be controlled by software input pad; push pull; CMOS GND [1] exposed die pad exposed die pad - ground supply; down bonded to the exposed die pad (heatsink); to be connected to the PCB ground Symbol names with an overscore (e.g. OE) indicate active LOW signals. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 4 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 7. Functional description 7.1 Function selection Table 3: Function table SUSPND OE D+, D− RCV VP/VPO L L driving/ receiving active VPO input VMO input normal driving (differential receiver active) L H receiving[1] active VP output H L driving inactive[2] H H high-Z[1] inactive[2] [1] [2] VM/VMO Function VM output receiving VPO input VMO input driving during suspend (differential receiver inactive) VP output VM output low-power state Signal levels on the D+ and D− pins are determined by other USB devices and external pull-up or pull-down resistors. In the suspend mode (SUSPND = HIGH), the differential receiver is inactive and the output RCV is always LOW. Out-of-suspend (K) signalling is detected via the single-ended receivers VP/VPO and VM/VMO. 7.2 Operating functions Table 4: Driving function using differential input data interface (pin OE = L) VM/VMO VP/VPO Data L L SE0 L H differential logic 1 H L differential logic 0 H H illegal state Table 5: Receiving function (pin OE = H) D+, D− RCV differential logic 0 L L H differential logic 1 H H L SE0 RCV*[1] L L [1] VP/VPO VM/VMO RCV* denotes the signal level on output RCV just before the SE0 state occurs. This level is stable during the SE0 period. 7.3 Power supply configurations The ISP1102 can be used with different power supply configurations, which can be changed dynamically. Table 7 provides an overview of the power supply configurations. Normal mode — VCC(I/O) is connected. VCC(5.0) is connected only, or VCC(5.0) and Vreg(3.3) are connected. For 5 V operation, VCC(5.0) is connected to a 5 V source (4.0 to 5.5 V). The internal voltage regulator then produces 3.3 V for the USB connections. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 5 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver For 3.3 V operation, both VCC(5.0) and Vreg(3.3) are connected to a 3.3 V source (3.0 to 3.6 V). VCC(I/O) is independently connected to a voltage source (1.65 to 3.6 V), depending on the supply voltage of the external circuit. Sharing mode — VCC(I/O) is connected only; VCC(5.0) and Vreg(3.3) are not connected. In this mode, the D+ and D− pins are made three-state and the ISP1102 allows external signals of up to 3.6 V to share the D+ and D− lines. The internal circuits of the ISP1102 ensure that virtually no current (maximum 10 µA) is drawn via the D+ and D− lines. The power consumption through pin VCC(I/O) drops to the low-power (suspended) state level. Pins VBUSDET and RCV are driven LOW to indicate this mode. The VBUSDET function is ignored during the suspend mode of the ISP1102. Some hysteresis is built into the detection of Vreg(3.3) lost. Table 6: Pin states in the sharing mode Pin Sharing mode VCC(5.0) not present Vreg(3.3) not present VCC(I/O) 1.65 to 3.6 V input Vpu(3.3) high impedance (off) D+, D− VP/VPO, high impedance VM/VMO[1] L RCV L VBUSDET L OE, SUSPND, SOFTCON high impedance [1] VP/VPO and VM/VMO are bidirectional pins. Table 7: Power supply configuration overview VCC(5.0) Configuration Special characteristics connected normal mode - not connected sharing mode D+, D− and Vpu(3.3) high impedance; VBUSDET driven LOW © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 6 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 7.4 Power supply input options The ISP1102 has two power supply input options. Internal regulator — pin VCC(5.0) is connected to 4.0 to 5.5 V. The internal regulator is used to supply the internal circuitry with 3.3 V (nominal). The Vreg(3.3) pin becomes a 3.3 V output reference. Regulator bypass — pins VCC(5.0) and Vreg(3.3) are connected to the same supply. The internal regulator is bypassed and the internal circuitry is supplied directly from pin Vreg(3.3). The voltage range is 3.0 to 3.6 V to comply with the USB specification. The supply voltage range for each input option is specified in Table 8. Table 8: Power supply input options Input option VCC(5.0) Vreg(3.3) Internal regulator supply input for internal regulator (4.0 to 5.5 V) voltage reference output supply input for digital (3.3 V, 300 µA) I/O pins (1.65 V to 3.6 V) Regulator bypass connected to Vreg(3.3) with maximum voltage drop of 0.3 V (2.7 to 3.6 V) supply input (3.0 V to 3.6 V) supply input for digital I/O pins (1.65 V to 3.6 V) © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data VCC(I/O) Rev. 03 — 02 September 2003 7 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 8. Electrostatic discharge (ESD) 8.1 ESD protection For HBCC package, the pins that are connected to the USB connector (D+, D−, VCC(5.0) and GND) have a minimum of ±12 kV ESD protection. The ±12 kV measurement is limited by the test equipment. Capacitors of 4.7 µF connected from Vreg(3.3) to GND and VCC(5.0) to GND are required to achieve this ±12 kV ESD protection (see Figure 4). The ISP1102W can withstand ±12 kV using the Human Body Model and ±5 kV using the Contact Discharge Method as specified in IEC 61000-4-2. R C 1 MΩ charge current limit resistor RD 1500 Ω discharge resistance DEVICE UNDER TEST VCC(5.0) A Vreg(3.3) HIGH VOLTAGE DC SOURCE CS 100 pF storage capacitor B 4.7 µF 4.7 µF GND 004aaa145 Fig 4. Human Body ESD test model. Note: For HVQFN package, the pins that are connected to the USB connector (D+, D−, VCC(5.0) and GND) have a minimum of ±7 kV ESD protection. 8.2 ESD test conditions A detailed report on test set-up and results is available on request. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 8 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 9. Limiting values Table 9: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC(5.0) Min Max Unit supply voltage −0.5 +6.0 V VCC(I/O) I/O supply voltage −0.5 +4.6 V VI DC input voltage Ilu latch-up current electrostatic discharge voltage Vesd VI = −1.8 to +5.4 V pins D+, D−, VCC(5.0) and GND; ILI < 3 µA for HBCC package [1][2] −0.5 VCC(I/O) + 0.5 V - 100 mA −12000 +12000 V pins D+, D−, VCC(5.0) and GND; ILI < 3 µA for HVQFN package [2] −7000 +7000 V all other pins; ILI < 1 µA [2] −2000 +2000 V −40 +125 °C storage temperature Tstg [1] [2] Conditions Testing equipment limits measurement to only ±12 kV. Capacitors needed on VCC(5.0) and Vreg(3.3) (see Section 8). Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model). 10. Recommended operating conditions Table 10: Recommended operating conditions Symbol Parameter VCC(5.0) VCC(I/O) Conditions Min Typ Max Unit supply voltage 4.0 5.0 5.5 V I/O supply voltage 1.65 - 3.6 V VI input voltage 0 - VCC(I/O) V VI(AI/O) input voltage on AI/O pins 0 - 3.6 V Tamb ambient temperature −40 - +85 °C pins D+ and D− 11. Static characteristics Table 11: Static characteristics: supply pins VCC(5.0) = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 8 for valid voltage level combinations; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions [1][2] Min Typ Max Unit 3.0 3.3 3.6 V Vreg(3.3) regulated supply voltage output internal regulator option; Iload ≤ 300 µA ICC operating supply current transmitting and receiving at 12 Mbit/s; CL = 50 pF on pins D+ and D− [3] - 4 8 mA ICC(I/O) operating I/O supply current transmitting and receiving at 12 Mbit/s [3] - 1 2 mA ICC(idle) supply current during full-speed idle and SE0 idle: VD+ > 2.7 V, VD− < 0.3 V; SE0: VD+ < 0.3 V, VD− < 0.3 V [4] - - 300 µA ICC(I/O)(static) static I/O supply current idle, SE0 or suspend - - 20 µA © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 9 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver Table 11: Static characteristics: supply pins…continued VCC(5.0) = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 8 for valid voltage level combinations; Tamb = −40 to +85 °C; unless otherwise specified. Symbol ICC(susp) Parameter suspend supply current Conditions [4] SUSPND = HIGH ICC(I/O)(sharing) sharing mode I/O supply current VCC(5.0) not connected IDx(sharing) sharing mode load current on pins D+ and D− VCC(5.0) not connected; SOFTCON = LOW; VDx = 3.6 V VCC(5.0)th supply voltage detection threshold 1.65 V ≤ VCC(I/O) ≤ 3.6 V VCC(5.0)hys supply voltage detection hysteresis VCC(I/O) = 1.8 V VCC(I/O)th I/O supply voltage detection threshold Vreg(3.3) = 2.7 to 3.6 V VCC(I/O)hys I/O supply voltage detection hysteresis Vreg(3.3) = 3.3 V Vreg(3.3)th regulated supply voltage detection threshold 1.65 V ≤ VCC(I/O) ≤ Vreg(3.3); 2.7 V ≤ Vreg(3.3) ≤ 3.6 V supply lost supply present supply lost supply present supply lost [5] supply present Vreg(3.3)hys [1] [2] [3] [4] [5] regulated supply voltage detection hysteresis VCC(I/O) = 1.8 V Min Typ Max Unit - - 20 µA - - 20 µA - - 10 µA - - 3.6 V 4.1 - - V - 70 - mV - - 0.5 V 1.4 - - V - 0.45 - V - - 0.8 V 2.4 - - V - 0.45 - V Iload includes the pull-up resistor current via pin Vpu(3.3). The minimum voltage is 2.7 V in the suspend mode. Maximum value characterized only, not tested in production. Excluding any load current and Vpu(3.3) or Vsw source current to the 1.5 kΩ and 15 kΩ pull-up and pull-down resistors (200 µA typ.). When VCC(I/O) < 2.7 V, the minimum value for Vreg(3.3)th = 2.0 V for supply present condition. Table 12: Static characteristics: digital pins VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC(I/O) = 1.65 to 3.6 V Input levels VIL LOW-level input voltage - - 0.3VCC(I/O) V VIH HIGH-level input voltage 0.6VCC(I/O) - - V IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOH = 100 µA VCC(I/O) − 0.15 - - V IOH = 2 mA VCC(I/O) − 0.4 - - V −1 - +1 µA Leakage current ILI input leakage current [1] © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 10 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver Table 12: Static characteristics: digital pins…continued VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit input capacitance pin to GND - - 10 pF Capacitance CIN Example 1: VCC(I/O) = 1.8 V ± 0.15 V Input levels VIL LOW-level input voltage - - 0.5 V VIH HIGH-level input voltage 1.2 - - V Output levels LOW-level output voltage VOL VOH HIGH-level output voltage IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 µA 1.5 - - V IOH = 2 mA 1.25 - - V Example 2: VCC(I/O) = 2.5 V ± 0.2 V Input levels VIL LOW-level input voltage - - 0.7 V VIH HIGH-level input voltage 1.7 - - V IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 µA 2.15 - - V IOH = 2 mA 1.9 - - V Output levels LOW-level output voltage VOL VOH HIGH-level output voltage Example 3: VCC(I/O) = 3.3 V ± 0.3 V Input levels VIL LOW-level input voltage - - 0.9 V VIH HIGH-level input voltage 2.15 - - V IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V Output levels LOW-level output voltage VOL VOH [1] HIGH-level output voltage IOH = 100 µA 2.85 - - V IOH = 2 mA 2.6 - - V If VCC(I/O) ≥ Vreg(3.3), then the leakage current will be higher than the specified value. Table 13: Static characteristics: analog I/O pins D+ and D− VCC(5.0) = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Input levels Differential receiver VDI differential input sensitivity |VI(D+) − VI(D−)| 0.2 - - V VCM differential common mode voltage includes VDI range 0.8 - 2.5 V © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 11 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver Table 13: Static characteristics: analog I/O pins D+ and D−…continued VCC(5.0) = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Single-ended receiver VIL LOW-level input voltage - - 0.8 V VIH HIGH-level input voltage 2.0 - - V Vhys hysteresis voltage 0.4 - 0.7 V - - 0.3 V 2.8 - 3.6 V −1 - +1 µA - - 20 pF 34 39 44 Ω Output levels LOW-level output voltage VOL VOH HIGH-level output voltage RL = 1.5 kΩ to 3.6 V RL = 15 kΩ to GND [1] Leakage current OFF-state leakage current ILZ Capacitance transceiver capacitance pin to GND ZDRV driver output impedance steady-state drive ZINP input impedance 10 - - MΩ RSW internal switch resistance at pin Vpu(3.3) - - 10 Ω 3.0 - 3.6 V CIN Resistance [2] Termination VTERM [1] [2] [3] [4] [3][4] termination voltage for upstream port pull-up (Rpu) VOH(min) = Vreg(3.3) − 0.2 V. Includes external resistors of 33 Ω ±1% on both pins D+ and D−. This voltage is available at pins Vreg(3.3) and Vpu(3.3). The minimum voltage is 2.7 V in the suspend mode. 12. Dynamic characteristics Table 14: Dynamic characteristics: analog I/O pins D+ and D− VCC(5.0) = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 8 for valid voltage level combinations; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver characteristics tFR rise time CL = 50 to 125 pF; 10% to 90% of |VOH − VOL|; see Figure 5 4 - 20 ns tFF fall time CL = 50 to 125 pF; 90% to 10% of |VOH − VOL|; see Figure 5 4 - 20 ns FRFM differential rise/fall time matching (tFR/tFF) excluding the first transition from Idle state 90 - 111.1 % VCRS output signal crossover voltage excluding the first transition from Idle state; see Figure 6 1.3 - 2.0 V [1] © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 12 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver Table 14: Dynamic characteristics: analog I/O pins D+ and D−…continued VCC(5.0) = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 8 for valid voltage level combinations; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tPLH(drv) driver propagation delay (VPO, VMO to D+, D−) LOW-to-HIGH; see Figure 6 and Figure 9 - - 18 ns tPHL(drv) driver propagation delay (VPO, VMO to D+, D−) HIGH-to-LOW; see Figure 6 and Figure 9 - - 18 ns tPHZ driver disable delay (OE to D+, D−) HIGH-to-OFF; see Figure 7 and Figure 10 - - 15 ns tPLZ driver disable delay (OE to D+, D−) LOW-to-OFF; see Figure 7 and Figure 10 - - 15 ns tPZH driver enable delay (OE to D+, D−) OFF-to-HIGH; see Figure 7 and Figure 10 - - 15 ns tPZL driver enable delay (OE to D+, D−) OFF-to-LOW; see Figure 7 and Figure 10 - - 15 ns Driver timing Receiver timings Differential receiver tPLH(rcv) propagation delay (D+, D− to RCV) LOW-to-HIGH; see Figure 8 and Figure 11 - - 15 ns tPHL(rcv) propagation delay (D+, D− to RCV) HIGH-to-LOW; see Figure 8 and Figure 11 - - 15 ns Single-ended receiver tPLH(se) propagation delay (D+, D− to VP/VPO, VM/VMO) LOW-to-HIGH; see Figure 8 and Figure 11 - - 18 ns tPHL(se) propagation delay (D+, D− to VP/VPO, VM/VMO) HIGH-to-LOW; see Figure 8 and Figure 11 - - 18 ns [1] Characterized only, not tested. Limits guaranteed by design. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 13 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 1.65 V logic input t FR, t LR 0.9 V 0.9 V 0V t FF, t LF t PLH(drv) VOH 90 % 90 % t PHL(drv) VOH differential data lines 10 % 10 % VOL MGS963 Fig 5. Rise and fall times. VCRS VCRS VOL MGS964 Fig 6. Timing of VPO and VMO to D+ and D−. 2.0 V 1.65 V logic input differential data lines 0.9 V 0.9 V VCRS VCRS 0.8 V 0V VOH differential data lines VOL t PLH(rcv) t PLH(se) t PHZ t PLZ t PZH t PZL VOH VOH −0.3 V logic output VCRS VOL +0.3 V Fig 7. Timing of OE to D+ and D−. MGS966 0.9 V 0.9 V VOL MGS965 Fig 8. Timing of D+ and D− to RCV, VP/VPO and VM/VMO. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data t PHL(rcv) t PHL(se) Rev. 03 — 02 September 2003 14 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 13. Test information Vpu(3.3) test point 1.5 kΩ D.U.T. D+/D− 33 Ω 004aaa037 15 kΩ CL Load capacitance CL = 50 pF (minimum or maximum timing) Fig 9. Load on pins D+ and D−. test point 33 Ω 500 Ω D.U.T. 50 pF V MBL142 V = 0 V for tPZH and tPHZ V = Vreg(3.3) for tPZL and tPLZ Fig 10. Load on pins D+ and D− for enable and disable times. test point D.U.T. 25 pF MGS968 Fig 11. Load on pins VM/VMO, VP/VPO and RCV. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 15 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 14. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b D B SOT639-2 v M C A B w M C A f terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C v M C A B w M C detail X e1 Dh C e y y1 C 5 9 e e4 Eh e2 1/2 e4 1 13 16 A1 X 1/2 e3 A2 e3 A 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b b1 b2 b3 D Dh E Eh e e1 e2 e3 e4 f v w y y1 mm 0.8 0.10 0.05 0.7 0.6 0.33 0.27 0.33 0.27 0.38 0.32 0.38 0.32 3.1 2.9 1.45 1.35 3.1 2.9 1.45 1.35 0.5 2.5 2.5 2.45 2.45 0.23 0.17 0.08 0.1 0.05 0.2 OUTLINE VERSION REFERENCES IEC SOT639-2 JEDEC JEITA MO-217 EUROPEAN PROJECTION ISSUE DATE 01-11-13 03-03-12 Fig 12. Package outline HBCC16. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 16 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver HVQFN14: plastic thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 2.5 x 0.85 mm A B D SOT773-1 terminal 1 index area A A1 c E detail X e1 v M C A B w M C b 1/2 e C y y1 C e 7 4 L 8 3 e e2 Eh 1 10 terminal 1 index area 14 11 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 2.6 2.4 1.45 1.15 2.6 2.4 1.45 1.15 0.5 1.5 1 0.35 0.25 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT773-1 --- --- --- EUROPEAN PROJECTION ISSUE DATE 02-07-05 Fig 13. Package outline HVQFN14. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 17 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 15. Packaging The ISP1102W (HBCC16 package) is delivered on a Type A carrier tape, see Figure 14. The tape dimensions are given in Table 15. The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking process. The cumulative tolerance of 10 successive sprocket holes is ±0.02 mm. The camber must not exceed 1 mm in 100 mm. 4 idth W A0 K0 B0 P1 Type A direction of feed W K0 A0 4 B0 elongated sprocket hole P1 Type B direction of feed MLC338 Fig 14. Carrier tape dimensions. Table 15: Type A carrier tape dimensions for the ISP1102W Dimension Value Unit A0 3.3 mm B0 3.3 mm K0 1.1 mm P1 8.0 mm W 12.0 ±0.3 mm 16. Soldering 16.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 18 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver There is no soldering method that is ideal for all IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. In these situations reflow soldering is recommended. 16.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 220 °C (SnPb process) or below 245 °C (Pb-free process) – for all BGA and SSOP-T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 16.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 19 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 16.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 16.5 Package related soldering information Table 16: Suitability of surface mount IC packages for wave and reflow soldering methods Package[1] Soldering method Wave Reflow[2] BGA, LBGA, LFBGA, SQFP, SSOP-T[3], TFBGA, VFBGA not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable[4] suitable PLCC[5], SO, SOJ suitable suitable not recommended[5][6] SSOP, TSSOP, VSO, VSSOP not recommended[7] PMFP[8] not suitable LQFP, QFP, TQFP [1] [2] [3] [4] suitable not suitable For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data suitable Rev. 03 — 02 September 2003 20 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Hot bar soldering or manual soldering is suitable for PMFP packages. [6] [7] [8] 17. Revision history Table 17: Revision history Rev Date 03 20030902 CPCN Description - Product data (9397 750 11228) Modifications: • • • • • • • Added HVQFN14 package information Section 2: updated Added pad details to Table 2 Section 7.3: updated the first line under Normal mode Table 6: added a table note Section 8.1: updated the first paragraph and added a note Table 9: updated info on Vesd and added a table note. 02 20030106 - Product data (9397 750 10397) 01 20000524 - Objective data © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Product data Rev. 03 — 02 September 2003 21 of 23 ISP1102 Philips Semiconductors Advanced USB transceiver 18. Data sheet status Level Data sheet status[1] Product status[2][3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19. Definitions 20. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Product data Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11228 Rev. 03 — 02 September 2003 22 of 23 Philips Semiconductors ISP1102 Advanced USB transceiver Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 8 8.1 8.2 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 16.5 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 5 Function selection. . . . . . . . . . . . . . . . . . . . . . . 5 Operating functions. . . . . . . . . . . . . . . . . . . . . . 5 Power supply configurations . . . . . . . . . . . . . . . 5 Power supply input options . . . . . . . . . . . . . . . . 7 Electrostatic discharge (ESD). . . . . . . . . . . . . . 8 ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . 8 ESD test conditions . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Recommended operating conditions. . . . . . . . 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 20 Package related soldering information . . . . . . 20 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 22 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 © Koninklijke Philips Electronics N.V. 2003. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 02 September 2003 Document order number: 9397 750 11228