IXYS IXST30N60BD1

High Speed IGBT with Diode
IXSH 30N60BD1
IXSK 30N60BD1
IXST 30N60BD1
Short Circuit SOA Capability
Test Conditions
VCES
TJ = 25°C to 150°C
600
V
VCGR
TJ = 25°C to 150°C; RGE = 1 MW
600
V
VGES
Continuous
±20
V
VGEM
Transient
±30
V
IC25
TC = 25°C
55
A
IC90
TC = 90°C
30
A
ICM
TC = 25°C, 1 ms
110
A
SSOA
(RBSOA)
VGE = 15 V, TJ = 125°C, RG = 10 W
Clamped inductive load, VCL = 0.8 VCES
ICM = 60
A
tSC
(SCSOA)
VGE = 15 V, VCE = 360 V, TJ = 125°C
RG = 33 W, non repetitive
10
ms
PC
TC = 25°C
200
W
Maximum Ratings
-55 ... +150
°C
TJM
150
°C
Tstg
-55 ... +150
°C
TJ
Mounting torque
1.13/10 Nm/lb.in.
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Weight
TO-247/TO-268
TO-264
Symbol
Test Conditions
BVCES
IC
= 750 mA, VGE = 0 V
600
VGE(th)
IC
= 2.5 mA, VCE = VGE
4
ICES
VCE = 0.8 • VCES
VGE = 0 V
IGES
VCE = 0 V, VGE = ±20 V
VCE(sat)
VGE = 15 V
300
°C
6/4
10
g
g
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
TJ = 25°C
TJ = 125°C
IC = IC90
IC = IC25
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
= 600 V
= 55 A
= 2.0 V
= 140 ns
VCE(sat)
tfi
Symbol
Md
VCES
IC25
V
7
V
200
3
mA
mA
±100
nA
2.0
2.7
V
V
TO-247AD
(IXSH)
G
C
E
TO-268 (D3)
(IXST)
C
G
E
TO-264
(IXSK)
G
G = Gate
E = Emitter
C
E
C = Collector
TAB = Collector
Features
• International standard packages:
JEDEC TO-247, TO-264& TO-268
• Short Circuit SOA capability
• Medium freqeuncy IGBT and antiparallel FRED in one package
• New generation HDMOSTM process
Applications
• AC motor speed control
• DC servo and robot drives
• DC choppers
• Uninterruptible power supplies (UPS)
• Switch-mode and resonant-mode
power supplies
Advantages
• Space savings (two devices in one
package)
• Easy to mount with 1 screw
(isolated mounting screw hole)
• Surface mountable, high power case
style
• Reduces assembly time and cost
• High power density
98517A (7/00)
1-5
IXSH 30N60BD1 IXSK 30N60BD1 IXST 30N60BD1
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
gfs
IC = IC90; VCE = 10 V,
Pulse test, t £ 300 ms, duty cycle £ 2 %
C ies
Coes
C res
VCE = 25 V, VGE = 0 V, f = 1 MHz
Qg
Qge
Qgc
IC = IC90, VGE = 15 V, VCE = 0.5 VCES
td(on)
t ri
td(off)
tfi
Eoff
td(on)
t ri
Eon
td(off)
tfi
Eoff
Inductive load, TJ = 25°C
IC = IC90; VGE = 15 V
VCE = 0.8 VCES; RG = 4.7 W
Note 1.
Inductive load, TJ = 125°C
IC = IC90; VGE = 15 V
VCE = 0.8 VCES; RG = 4.7 W
Note 1
RthJC
RthCK
RthCK
TO-247
TO-264
Reverse Diode (FRED)
S
3100
240
30
pF
pF
pF
100
30
38
nC
nC
nC
30
30
150
140
1.5
ns
ns
ns
ns
mJ
270
270
2.5
30
35
0.5
270
250
2.5
ns
ns
mJ
ns
ns
mJ
0.25
0.15
0.62 K/W
K/W
K/W
Test Conditions
VF
IF = IC90, VGE = 0 V
Note 2
IRM
IF = 50A; VGE = 0 V; TJ = 100 °C
VR = 100 V; -diF/dt = 100 A/ms
TJ = 150 °C
TJ = 25 °C
2
IF = 1 A; -di/dt = 100 A/ms; VR = 30 V TJ = 25°C
35
1.7
2.5
V
V
2.5
A
50
ns
.09 K/W
RthJC
Notes: 1. Switching times may increase for VCE (Clamp) > 0.8 • VCES, higher TJ or increased RG.
2. Pulse test, t £ 300 ms, duty cycle d £ 2 %
TO-268AA (IXST) (D3 PAK)
Dim.
A
A1
A2
b
b2
C
D
E
E1
e
H
L
L1
L2
L3
L4
© 2000 IXYS All rights reserved
Dim. Millimeter
Min. Max.
Inches
Min. Max.
A
B
19.81 20.32
20.80 21.46
0.780 0.800
0.819 0.845
C
D
15.75 16.26
3.55 3.65
0.610 0.640
0.140 0.144
E
F
4.32 5.49
5.4
6.2
0.170 0.216
0.212 0.244
G
H
1.65 2.13
4.5
0.065 0.084
0.177
J
K
1.0
1.4
10.8 11.0
0.040 0.055
0.426 0.433
L
M
4.7
0.4
5.3
0.8
0.185 0.209
0.016 0.031
N
1.5 2.49
0.087 0.102
TO-264 AA (IXSK) Outline
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Symbol
t rr
10
TO-247 AD (IXSH) Outline
Millimeter
Min. Max.
4.9
5.1
2.7
2.9
.02
.25
1.15
1.45
1.9
2.1
.4
.65
13.80 14.00
15.85 16.05
13.3
13.6
5.45 BSC
18.70 19.10
2.40
2.70
1.20
1.40
1.00
1.15
0.25 BSC
3.80
4.10
Inches
Min. Max.
.193 .201
.106 .114
.001 .010
.045 .057
.75
.83
.016 .026
.543 .551
.624 .632
.524 .535
.215 BSC
.736 .752
.094 .106
.047 .055
.039 .045
.010 BSC
.150 .161
Dim.
A
A1
A2
b
b1
b2
c
D
E
e
J
K
L
L1
P
Q
Q1
R
R1
S
T
Millimeter
Min.
Max.
4.82
2.54
2.00
1.12
2.39
2.90
0.53
25.91
19.81
5.46
0.00
0.00
20.32
2.29
3.17
6.07
8.38
3.81
1.78
6.04
1.57
5.13
2.89
2.10
1.42
2.69
3.09
0.83
26.16
19.96
BSC
0.25
0.25
20.83
2.59
3.66
6.27
8.69
4.32
2.29
6.30
1.83
Inches
Min.
Max.
.190
.202
.100
.114
.079
.083
.044
.056
.094
.106
.114
.122
.021
.033
1.020
1.030
.780
.786
.215 BSC
.000
.010
.000
.010
.800
.820
.090
.102
.125
.144
.239
.247
.330
.342
.150
.170
.070
.090
.238
.248
.062
.072
Min. Recommended Footprint
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592
4,881,106
5,017,508
5,049,961
5,187,117
5,486,715
4,850,072
4,931,844
5,034,796
5,063,307
5,237,481
5,381,025
2-5
IXSH 30N60BD1 IXSK 30N60BD1 IXST 30N60BD1
Fig.1 Saturation Characteristics
Fig.2 Output Characterstics
200
100
VGE = 15V
TJ = 25°C
TJ = 25°C VGE = 15V
13V
160
IC - Amperes
80
IC - Amperes
11V
13V
11V
60
40
9V
120
80
7V
9V
40
20
7V
5V
0
0
0
1
2
3
4
0
5
2
4
8
10
VCE - Volts
VCE - Volts
Fig.3 Collector-Emitter Voltage
vs. Gate-Emitter Voltage
Fig.4 Temperature Dependence
of Output Saturation Voltage
1.6
120
VGS=15V
TJ = 125°C
VCE (sat) - Normalized
80
11V
60
40
IC = 60A
VGE = 15V
13V
100
IC - Amperes
6
9V
20
1.4
1.2
IC = 30A
1.0
IC = 15A
0.8
7V
0.6
0
0
2
4
6
8
25
10
50
75
VCE - Volts
125
Fig.6 Temperature Dependence of
Breakdown and Threshold Voltage
10000
VCE = 10V
f = 1Mhz
Capacitance - pF
IC - Amperes
120
100
80
60
TJ = 125°C
40
150
TJ - Degrees C
Fig.5 Input Admittance
140
100
20
Ciss
1000
Coss
100
Crss
TJ = 25°C
10
0
4
6
8
10
VGE - Volts
© 2000 IXYS All rights reserved
12
14
16
0
5
10
15
20
25
30
35
40
VCE-Volts
3-5
IXSH 30N60BD1 IXSK 30N60BD1 IXST 30N60BD1
Fig.7 Turn-Off Energy per Pulse and
Fall Time on Collector Current
Fig.8 Dependence of Turn-Off Energy
Per Pulse and Fall Time on RG
1.5
7.5
2.0
8
TJ = 125°C
E(ON)
E(OFF)
0.5
2.5
E(ON) - millijoules
5.0
IC = 60A
1.5
6
E(ON)
1.0
4
E(ON)
IC = 30A
E(OFF)
0.5
2
E(ON)
E(OFF)
IC = 15A
0.0
0
20
40
0.0
0.0
80
60
0
0
10
Fig.9 Gate Charge Characteristic Curve
30
40
50
Fig.10 Turn-Off Safe Operating Area
100
IC =30A
VCE = 300V
IC - Amperes
12
VGE - Volts
20
RG - Ohms
IC - Amperes
15
E(OFF) - millijoules
1.0
E(OFF) - milliJoules
RG = 10
E(ON) - millijoules
E(OFF)
TJ = 125°C
9
6
TJ = 125°C
10
RG = 4.7
dV/dt < 5V/ns
1
3
0
0.1
0
25
50
75
100
125
0
Qg - nanocoulombs
100
200
300
400
500
600
VCE - Volts
Fig.11 Transient Thermal Resistance
1
D=0.5
ZthJC (K/W)
D=0.2
0.1 D=0.1
D=0.05
D=0.02
0.01
D=0.01
D = Duty Cycle
Single pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
Pulse Width - Seconds
© 2000 IXYS All rights reserved
4-5
IXSH 30N60BD1 IXSK 30N60BD1 IXST 30N60BD1
60
A
1000
50
IF
TVJ= 100°C
VR = 300V
A
25
800
Qr
600
IF= 60A
IF= 30A
IF= 15A
IRM
IF= 60A
IF= 30A
IF= 15A
40
TVJ=150°C
30
TVJ= 100°C
VR = 300V
nC
20
30
15
TVJ=100°C
400
20
10
TVJ=25°C
200
10
0
0
1
2
5
0
100
3 V
A/ms 1000
-diF/dt
VF
Fig. 12 Forward current IF versus VF
Fig. 13 Reverse recovery charge Qr
versus -diF/dt
2.0
200
ms 1000
600 A/
800
-diF/dt
400
Fig. 14 Peak reverse current IRM
versus -diF/dt
trr
I RM
tfr
0.75
tfr
80
IF= 60A
IF= 30A
IF= 15A
µs
V FR
VFR
15
1.0
1.00
TVJ= 100°C
V IF = 30A
TVJ= 100°C
VR = 300V
ns
Kf
0
20
90
1.5
0
10
0.50
5
0.25
70
0.5
Qr
0.0
60
0
40
80
120 °C 160
0
TVJ
200
400
800
A/
ms 1000
600
0
0
200
400
-diF/dt
Fig. 15 Dynamic parameters Qr, IRM
versus TVJ
Fig. 16 Recovery time trr versus -diF/dt
1
K/W
0.00
ms 1000
600 A/
800
diF/dt
Fig. 17 Peak forward voltage VFR and tfr
versus diF/dt
Constants for ZthJC calculation:
i
1
2
3
0.1
ZthJC
Rthi (K/W)
ti (s)
0.502
0.193
0.205
0.0052
0.0003
0.0162
0.01
0.001
0.00001
DSEP 29-06
0.0001
0.001
0.01
s
0.1
1
t
Fig. 18 Transient thermal resistance junction to case
© 2000 IXYS All rights reserved
5-5