SUBMINIATURE SOLID STATE LAMP KM2520SGD03 SUPER BRIGHT GREEN Features Description !SUBMINIATURE PACKAGE. The Super Bright Green source color devices are made !WIDE VIEWING ANGLE. with Gallium Phosphide Green Light Emitting Diode. ! GULL WING LEAD. ! LONG LIFE - SOLID STATE RELIABILITY. !LOW PACKAGE PROFILE. !PACKAGE : 1000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: DSAB4669 APPROVED : J. Lu REV NO: V.2 CHECKED : Allen Liu DATE:FEB/08/2003 DRAWN: F.Y.YUAN PAGE: 1 OF 4 Selection Guide Par t No . Dic e KM2520SGD03 Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT GREEN (GaP) GREEN DIFFUSED V i ew i n g An g l e Min. Typ. 2θ1/2 2.6 10 40° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er λpeak Peak Wavelength Super Bright Green λD Dominate Wavelength ∆λ1/2 D ev i c e Ty p . Un it s Tes t Co n d it io n s 565 nm I F =20mA Super Bright Green 568 nm I F =20mA Spectral Line Half-width Super Bright Green 30 nm I F =20mA pF VF=0V;f=1MHz 2.5 V I F =20mA 10 uA V R = 5V C Capacitance Super Bright Green 15 VF Forward Voltage Super Bright Green 2.2 IR Reverse Current Super Bright Green Max . Absolute Maximum Ratings at T)=25°°C P ar am e t e r Su p er B r ig h t Gr een Un it s Power dissipation 105 mW DC Forward Current 25 mA Peak Forward Current [1] 140 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB4669 APPROVED : J. Lu REV NO: V.2 CHECKED : Allen Liu DATE:FEB/08/2003 DRAWN: F.Y.YUAN PAGE: 2 OF 4 Super Bright Green SPEC NO: DSAB4669 APPROVED : J. Lu KM2520SGD03 REV NO: V.2 CHECKED : Allen Liu DATE:FEB/08/2003 DRAWN: F.Y.YUAN PAGE: 3 OF 4 KM2520SGD03 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB4669 APPROVED : J. Lu REV NO: V.2 CHECKED : Allen Liu DATE:FEB/08/2003 DRAWN: F.Y.YUAN PAGE: 4 OF 4