KINGBRIGHT APTC2012SGC

2.0x1.25mm SMD CHIP LED LAMP
APTC2012SGC
SUPER BRIGHT GREEN
Features
Description
!2.0mmx1.25mm SMT LED,0.75mm THICKNESS.
The Super Bright Green source color devices are made
!LOW
with Gallium Phosphide Green Light Emitting Diode.
POWER CONSUMPTION.
! WIDE
VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
! VARIOUS
COLORS AND LENS TYPES AVAILABLE.
!PACKAGE
: 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAB6365
APPROVED : J. Lu
REV NO: V.2
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN:S.J.HOU
PAGE: 1 OF 4
Selection Guide
Par t No .
Dic e
APTC2012SGC
Iv (m c d )
@ 20 m A
L en s Ty p e
SUPER BRIGHT GREEN (GaP)
WATER CLEAR
V i ew i n g
An g l e
Min .
Ty p .
2θ1/2
4
15
120°
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25°°C
Sy m b o l
Par am et er
λpeak
Peak Wavelength
Super Bright Green
λD
Dominate Wavelength
∆λ1/2
D ev i c e
Ty p .
Un it s
Tes t Co n d it io n s
565
nm
I F =20mA
Super Bright Green
568
nm
I F =20mA
Spectral Line Half-width Super Bright Green
30
nm
I F =20mA
pF
VF=0V;f=1MHz
2.5
V
I F =20mA
10
uA
V R = 5V
C
Capacitance
Super Bright Green
15
VF
Forward Voltage
Super Bright Green
2.2
IR
Reverse Current
Super Bright Green
Max .
Absolute Maximum Ratings at T)=25°°C
P ar am e t e r
Su p er B r ig h t Gr een
Un it s
Power dissipation
105
mW
DC Forward Current
25
mA
Peak Forward Current [1]
140
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAB6365
APPROVED : J. Lu
REV NO: V.2
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN:S.J.HOU
PAGE: 2 OF 4
Super Bright Green
SPEC NO: DSAB6365
APPROVED : J. Lu
APTC2012SGC
REV NO: V.2
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN:S.J.HOU
PAGE: 3 OF 4
APTC2012SGC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAB6365
APPROVED : J. Lu
REV NO: V.2
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN:S.J.HOU
PAGE: 4 OF 4