Ordering number : ENA2035
Monolithic Digital IC
LB1947VC
PWM Current Control Type
Forward/Reverse Motor Driver
Overview
The LB1947VC is a PWM current control type forward/reverse motor driver IC. The IC is optimal for use in driving
brushed DC motors for printers.
Features
• PWM current control (fixed OFF time)
• Selectable current decay pattern (FAST, SLOW, and MIX DECAY modes)
• Simultaneous ON prevention function (feed-through current prevention)
• Built-in thermal shutdown circuit
• Built-in noise canceler
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Symbol
Maximum motor supply voltage
VBB max
Output peak current
IO peak
Output continuous current
IO max
Logic supply voltage
VCC max
Logic input voltage range
VIN
Emitter output voltage
VE max
Reference voltage
VREF
Allowable power dissipation
Pd max
Operating temperature
Storage temperature
Conditions
tw ≤ 20μs
Ratings
Unit
50
V
2.25
A
2.0
A
7.0
V
-0.3 to VCC
V
1.1
V
-0.3 to VCC
V
1.3
W
Topr
-20 to +85
°C
Tstg
-55 to +150
°C
Independent IC
Caution 1) Absolute maximum ratings represent the value which cannot be exceeded for any length of time.
Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current, high
voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details.
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment. The products mentioned herein
shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life,
aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system,
safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives
in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any
guarantee thereof. If you should intend to use our products for new introduction or other application different
from current conditions on the usage of automotive device, communication device, office equipment, industrial
equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the
intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely
responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer ' s products or
equipment.
32112 SY 20120312-S00003 No.A2035-1/11
LB1947VC
Allowable Operating Ranges at Ta = 25°C
Parameter
Symbol
Conditions
Ratings
Unit
Motor supply voltage
VBB
10 to 45
V
Logic supply voltage
VCC
4.75 to 5.25
V
Reference voltage
VREF
0 to VCC-2
V
Electrical Characteristics at Ta = 25°C, VCC = 5V
Ratings
Parameter
Symbol
Conditions
Unit
min
typ
max
Output Block
Output stage supply current
IBB ON
No-load state, Forward
0.4
0.6
1.0
mA
IBB BR
No-load state, Brake
0.2
0.4
0.8
mA
IBB OFF
No-load state, Output off
0.2
0.4
0.8
mA
IBB wt
No-load state, Standby mode
0.1
mA
VOsat1
IO = +1.0A, Sink
1.2
1.5
V
VOsat2
IO = +2.0A, Sink
1.6
1.9
V
VOsat3
IO = -1.0A, Source
1.8
2.2
V
VOsat4
IO = -2.0A, Source
2.1
2.4
V
Output leak current
IO1(leak)
VO = VBB, Sink
50
μA
IO2(leak)
VO = 0V, Source
Output sustain voltage
VSUS
L = 3.9mH, IO = 2.0A, Design guarantee value*
ICC ON
IN1: High, IN2: Low, ST: High
11
16
21
mA
ICC BR
IN1: Low, IN2: High, ST: High
11
16
21
mA
ICC OFF
IN1: Low, IN2: Low, ST: High
11
16
21
mA
1.0
2
3.0
mA
Output saturation voltage
-50
μA
50
V
Logic Block
Logic supply current
ICC wt
ST: Low
Logic pin input voltage
VINH
High level voltage
(ST, IN1, IN2, VI)
VINL
Low level voltage
Logic pin input current
IINH
VIN = 5V
(ST, IN1, IN2, VI)
IINL
VIN = 0.8V
Sensing voltage
VE
Sensing voltage 25H
VEH25
2
V
60
90
6
10
0
0.8
V
120
μA
13
μA
1.1
V
V
VI = High, VREF = 2.5V
0.970
1.0
1.030
Sensing voltage 25L
VEL25
VI = Low, VREF = 2.5V
0.483
0.5
0.513
V
Sensing voltage 15H
VEH15
VI = High, VREF = 1.5V
0.385
0.4
0.410
V
Sensing voltage 15L
VEL15
VI = Low, VREF = 1.5V
0.190
0.2
0.210
V
Sensing voltage 05H
VEH05
VI = High, VREF = 0.5V
0.190
0.2
0.210
V
Sensing voltage 05L
VEL05
VI = Low, VREF = 0.5V
0.092
0.1
0.108
V
Reference current
Iref
VREF = 1.0V
+0.5
μA
CR pin current
ICR
CR = 1.0V
-1.04
mA
MD pin input voltage
VMDH
High level voltage
VMDM
Middle level voltage
-0.5
-1.56
-1.3
VCC-0.3
V
0.3VCC
VCC-1.0
.0.4
V
+1.0
μA
VMDL
Low level voltage
MD pin input current
IMDH
MD = VCC-0.5V, CR = 1.0V
-1.0
IMDL
MD = 0.4V, CR = 2.0V
-5.0
Thermal shutdown temperature
TSD
Design guarantee value*
V
μA
170
°C
* Design guarantee value, Do not measurement.
No.A2035-2/11
LB1947VC
Package Dimensions
unit : mm (typ)
3336
21.6
HEAT SPREADER
(20.0)
3.0
(11.0)
(11.0)
3.35
12.4
(9.05)
17.9
(14.55)
(8.6)
(R1.75)
1
(1.91)
0.4
15
1.27
2.54 2.54
0.7
SANYO : HZIP15
Pd max -- Ta
Allowable power dissipation, Pd max -- W
2.0
1.6
1.2
0.8
0.4
0
-20
0
20
40
60
80 85
100
Ambient temperature, Ta -- C
Pin Assignment
LB1947VC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
GND
MD
CR
VREF
NC
IN2
IN1
VCC
VBB
ST
NC
VI
OUTA
E
OUTA
Top view
No.A2035-3/11
LB1947VC
Block Diagram
OUTA
3
OUTA
1
VBB
7
MD 14
8 VCC
IN1 9
Control
logic
IN2 10
circuit
ST 6
VI 4
Thermal
shutdown circuit
UVLO
VREF 12
One-shot
multi-
Current
select
circuit
blanking
time
GND 15
13
CR
2
E
Truth Table
IN1
IN2
ST
VI
MD
OUTA
OUTA
H
L
H
H
L
H
L
Operating mode
Forward, 2/5 times, FAST
H
L
H
H
M
H
L
Forward, 2/5 times, MIX
H
L
H
H
H
H
L
Forward, 2/5 times, SLOW
H
L
H
L
L
H
L
Forward, 1/5 times, FAST
H
L
H
L
M
H
L
Forward, 1/5 times, MIX
H
L
H
L
H
H
L
Forward, 1/5 times, SLOW
H
H
H
H
L
L
H
Reverse, 2/5 times, FAST
H
H
H
H
M
L
H
Reverse, 2/5 times, MIX
H
H
H
H
H
L
H
Reverse, 2/5 times, SLOW
H
H
H
L
L
L
H
Reverse, 1/5 times, FAST
H
H
H
L
M
L
H
Reverse, 1/5 times, MIX
H
H
H
L
H
L
H
Reverse, 1/5 times, SLOW
L
H
H
H
L
L
L
Brake, 2/5 times, FAST
L
H
H
H
M
L
L
Brake, 2/5 times, MIX
L
H
H
L
L
L
L
Brake, 1/5 times, FAST
L
H
H
L
M
L
L
Brake, 1/5 times, MIX
L
H
H
X
H
L
L
Brake, no current limiting
L
L
H
X
X
OFF
OFF
Output OFF
X
X
L or OPEN
X
X
OFF
OFF
Standby mode (circuit OFF)
Except for MD pin, Low at input OPEN.
MD M: determined by external voltage.
No.A2035-4/11
LB1947VC
Pin Function
Pin No.
Pin name
Function
OUTA
OUTA
Output pin.
2
E
Sense voltage control pin.
4
VI
High: sense voltage is 2/5 of VREF
Low: sense voltage is 1/5 of VREF
6
ST
High: circuit operation ON
1
3
Equivalent circuit
VCC
100μA
Low: standby mode
9
IN1
50kΩ
High: rotation mode
Low: brake mode
10
IN2
High: reverse mode
4
VI
40kΩ
Low: forward mode
7
VBB
Motor power supply voltage.
8
VCC
Logic power supply voltage.
12
VREF
Output current setting reference pin.
VCC
Setting range: 0 to (VCC−2V)
3s
1s
12
VREF
13
CR
Oscillator with self-excitation.
14
MD
Current attenuation switching pin.
Low : FAST DECAY
High: SLOW DECAY
M : MIX DECAY
M is set by external power supply voltage.
Range : 1.1 to 4.0V
15
5, 11
GND
Ground pin
NC
No connect
No.A2035-5/11
LB1947VC
Sample Application Circuits
1. Forward/reverse motor with current limiter
24V
M
*Schottky barrier type for external diodes.
OUTA
OUTA
3
MD
IN1
IN2
ST
VI
VREF
1
VBB
7
14
8
VCC
5V
9
Control
logic
circuit
10
6
4
Thermal
shutdown circuit
UVLO
12
Current
select
circuit
One-shot
multiblanking
time
GND
15
13
CR
RE
E
I = VREF/ (5 × RE)
Limiter current setting method
IN1
2
IN2
ST
OUTA
OUTA
Mode
H
L
H
H
L
H
H
H
L
H
Reverse
L
H
H
L
L
Brake
L
L
H
OFF
OFF
Output OFF
−
−
L
OFF
OFF
Standby mode
Forward
No.A2035-6/11
LB1947VC
2. Forward/reverse motor
24V
M
*Schottky barrier type for external diodes.
OUTA
OUTA
3
MD
IN1
IN2
ST
VI
VREF
1
VBB
7
14
8
VCC
5V
9
Control
logic
circuit
10
6
4
Thermal
shutdown circuit
UVLO
12
Current
select
circuit
One-shot
multiblanking
time
GND
15
13
CR
IN1
IN2
ST
OUTA
OUTA
H
L
H
H
L
2
E
Mode
Forward
H
H
H
L
H
Reverse
L
H
H
L
L
Brake
L
L
H
OFF
OFF
Output OFF
−
−
L
OFF
OFF
Standby mode
No.A2035-7/11
LB1947VC
3. PWM current control forward/reverse motor (MIX DECAY)
24V
M
*Schottky barrier type for external diodes.
OUTA
OUTA
3
MD
IN1
IN2
ST
VI
VREF
1
VBB
7
14
8
VCC
5V
9
10
Control
logic
circuit
6
4
Thermal
shutdown circuit
UVLO
12
Current
select
circuit
One-shot
multiblanking
time
GND
RE
15
13
CR
2
E
No.A2035-8/11
LB1947VC
Notes on Usage
1. VREF pin
Because the VREF pin serves for input of the set current reference voltage, precautions against noise must be taken.
2. GND pin
The ground circuit for this IC must be designed so as to allow for high-current switching. Blocks where high current
flows must use low-impedance patterns and must be removed from small-signal lines. Especially the ground
connection for the sensing resistor RE at pin E, and the ground connection for the Schottky barrier diodes should be in
close proximity to the IC ground.
The capacitors between VCC and ground, and VBB and ground should be placed close to the VCC and VBB pins,
respectively.
3. CR pin setting (Switching off time, Noise cancel time)
The noise cancel time (Tn) and the switching off time (Toff) are set by the following expressions:
Noise cancel time: Tn ≈ C × R × ln {(1.0 − RI) / (4.0 − RI) [sec]
CR charge current: 1.3mA
Switching off time: Toff ≈ −C × R × ln (1.0 / 4.8) [sec]
Internal configuration at CR pin
VCC line
One-shot multi-blanking
time circuit
CR
C:680pF
CR constant range: R = 4.7k to 100kΩ
C = 330pF to 2200pF
No.A2035-9/11
LB1947VC
Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm, and
should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A2035-10/11
LB1947VC
SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using
products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd.
products described or contained herein.
SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all
semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or
malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise
to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt
safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not
limited to protective circuits and error prevention circuits for safe design, redundant design, and structural
design.
In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are
controlled under any of applicable local export control laws and regulations, such products may require the
export license from the authorities concerned in accordance with the above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written consent of SANYO Semiconductor Co.,Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the
SANYO Semiconductor Co.,Ltd. product that you intend to use.
Upon using the technical information or products described herein, neither warranty nor license shall be granted
with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third
party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's
intellctual property rights which has resulted from the use of the technical information and products mentioned
above.
This catalog provides information as of March, 2012. Specifications and information herein are subject
to change without notice.
PS No.A2035-11/11