LM4841 Stereo 2W Amplifiers with DC Volume Control, Transient Free Outputs, and Cap-less Headphone Drive General Description Key Specifications The LM4841 is a monolithic integrated circuit that provides DC volume control and stereo bridged audio power amplifiers capable of producing 2W into 4Ω (Note 1) or 2.2W into 3Ω (Note 2) with less than 1.0% THD. The LM4841 uses advanced, latest generation circuitry to eliminate all traces of clicks and pops when the supply voltages is first applied. The amplifier has a headphoneamplifier-select input pin that is used to switch the amplifiers from bridge to single-ended mode for driving headphones. A new circuit topology eliminates headphone output coupling capacitors (patent pending). Boomer ® audio integrated circuits are designed specifically to provide high quality audio while requiring a minimum amount of external components. The LM4841 incorporates a DC volume control, stereo bridged audio power amplifiers and a selectable gain or bass boost, making it optimally suited for multimedia monitors, portable radios, desktop, and portable computer applications. The LM4841 features an externally controlled, low-power consumption shutdown mode (Shutdown Low), and both a power amplifier and headphone mute for maximum system flexibility and performance. n PO at 1% THD+N n into 3Ω (MH and LQ) n into 4Ω ( MH and LQ) n into 8Ω (MT, MH, and LQ) n Single-ended THD+N at 85mW into 32Ω n Shutdown current Note 1: When properly mounted to the circuit board, LM4841MH and LM4841LQ will deliver 2W into 4Ω. The LM4841MT will deliver 1.1W into 8Ω. See the Application Information section for LM4841MH usage information. 2.2W (typ) 2.0W (typ) 1.1W (typ) 1.0%(typ) 0.7µA (typ) Features n Stereo headphone amplifier mode that eliminates the Output Coupling Capacitors (patent pending) n Acoustically Enhanced DC Volume Control Taper n System Beep Detect n Stereo switchable bridged/single-ended power amplifiers n Selectable internal/external gain and bass boost n Advanced “click and pop” suppression circuitry n Thermal shutdown protection circuitry Applications n Portable and Desktop Computers n Multimedia Monitors n Portable Radios, PDAs, and Portable TVs Note 2: An LM4841MH that has been properly mounted to the circuit board and forced-air cooled will deliver 2.2W into 3Ω. Connection Diagrams TSSOP Package 20028002 Top View Order Number LM4841MT or LM4841MH See NS Package Number MTC28 for TSSOP and MXA28A for Exposed-DAP TSSOP Boomer ® is a registered trademark of National Semiconductor Corporation. © 2002 National Semiconductor Corporation DS200280 www.national.com LM4841 Stereo 2W Amplifiers with DC Volume Control,Transient Free Outputs, and Cap-less Headphone Drive August 2002 LM4841 Connection Diagrams (Continued) LLP Package 20028097 Top View Order Number LM4841LQ See NS Package Number LQA028AA for Exposed-DAP LLP Block Diagram 20028001 FIGURE 1. LM4841 Block Diagram www.national.com 2 (Note 10) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage 6.0V Storage Temperature θJC (typ) — LQA028A 3˚C/W θJA (typ) — LQA028A 42˚C/W θJC (typ) — MTC28 20˚C/W θJA (typ) — MTC28 80˚C/W θJC (typ) — MXA28A -65˚C to +150˚C 2˚C/W θJA (typ) — MXA28A (exposed DAP) (Note 4) 41˚C/W Internally limited θJA (typ) — MXA28A (exposed DAP) (Note 3) 54˚C/W All pins except Pin 28 2500V 59˚C/W Pin 28 6500V θJA (typ) — MXA28A (exposed DAP) (Note 5) θJA (typ) — MXA28A (exposed DAP) (Note 6) 93˚C/W −0.3V to VDD +0.3V Input Voltage Power Dissipation (Note 11) ESD Susceptibility (Note 12) ESD Susceptibility (Note 13) 200V Junction Temperature 150˚C Soldering Information Small Outline Package Vapor Phase (60 sec.) 215˚C Infrared (15 sec.) 220˚C Operating Ratings See AN-450 “Surface Mounting and their Effects on Product Reliability” for other methods of soldering surface mount devices. Temperature Range TMIN ≤ TA ≤TMAX −40˚C ≤TA ≤ 85˚C Supply Voltage 2.7V≤ VDD ≤ 5.5V Electrical Characteristics for Entire IC (Notes 7, 10) The following specifications apply for VDD = 5V unless otherwise noted. Limits apply for TA = 25˚C. LM4841 Symbol VDD Parameter Conditions Typical (Note 14) Limit (Note 15) Supply Voltage Units (Limits) 2.7 V (min) 5.5 V (max) 30 mA (max) IDD Quiescent Power Supply Current VIN = 0V, IO = 0A 15 ISD Shutdown Current Vshutdown = GND 0.7 VIH Headphone Sense High Input Voltage 4 V (min) VIL Headphone Sense Low Input Voltage 0.8 V (max) THum Un-Mute Threshold Voltage 10 40 mVrms mVrms Gain 1st Stage = 1 Vshutdown = VDD VIN applied to A or B input 2.0 22 µA (max) Electrical Characteristics for Volume Attenuators (Notes 7, 10) The following specifications apply for VDD = 5V. Limits apply for TA = 25˚C. LM4841 Symbol CRANGE Parameter Attenuator Range Conditions Gain with VDCVol = 5V, No Load Attenuation with VDCVol = 0V (BM & SE) AM Mute Attenuation Typical (Note 14) Limit (Note 15) Units (Limits) ± 0.75 dB (max) -75 dB (min) Vmute = 5V, Bridged Mode (BM) -78 dB (min) Vmute = 5V, Single-Ended Mode (SE) -78 dB (min) 3 www.national.com LM4841 Absolute Maximum Ratings LM4841 Electrical Characteristics for Single-Ended Mode Operation (Notes 7, 10) The following specifications apply for VDD = 5V. Limits apply for TA = 25˚C. LM4841 Symbol PO Parameter Output Power Conditions Typical (Note 14) Units (Limits) Limit (Note 15) THD = 1.0%; f = 1kHz; RL = 32Ω 85 mW THD = 10%; f = 1 kHz; RL = 32Ω 95 mW 0.065 % THD+N Total Harmonic Distortion+Noise VOUT = 1VRMS, f=1kHz, RL = 10kΩ, AVD = 1 PSRR Power Supply Rejection Ratio CB = 1.0 µF, f =120 Hz, VRIPPLE = 200 mVrms 58 dB SNR Signal to Noise Ratio POUT =75 mW, R Filter 102 dB Xtalk Channel Separation f=1kHz, CB = 1.0 µF 65 dB L = 32Ω, A-Wtd Electrical Characteristics for Bridged Mode Operation (Notes 7, 10) The following specifications apply for VDD = 5V, unless otherwise noted. Limits apply for TA = 25˚C. LM4841 Symbol Parameter Conditions Typical (Note 14) Limit (Note 15) 5 ± 50 Units (Limits) VOS Output Offset Voltage VIN = 0V, No Load PO Output Power THD + N = 1.0%; f=1kHz; RL = 3Ω (Note 8) 2.2 W THD + N = 1.0%; f=1kHz; RL = 4Ω (Note 9) 2 W THD = 1% (max);f = 1 kHz; RL = 8Ω THD+N Total Harmonic Distortion+Noise 1.1 mV (max) 1.0 W (min) THD+N = 10%;f = 1 kHz; RL = 8Ω 1.5 W PO = 1W, 20 Hz < f < 20 kHz, RL = 8Ω, AVD = 2 0.3 % PO = 340 mW, RL = 32Ω 1.0 % PSRR Power Supply Rejection Ratio CB = 1.0 µF, f = 120 Hz, VRIPPLE = 200 mVrms; RL = 8Ω 74 dB SNR Signal to Noise Ratio VDD = 5V, POUT = 1.1W, RL = 8Ω, A-Wtd Filter 93 dB Xtalk Channel Separation f=1kHz, CB = 1.0 µF 70 dB Note 3: The θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 2in 2 piece of 1 ounce printed circuit board copper. Note 4: The θJA given is for an MXA28A package whose exposed-DAP is soldered to a 2in2 piece of 1 ounce printed circuit board copper on a bottom side layer through 21 8mil vias. Note 5: The θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 1in 2 piece of 1 ounce printed circuit board copper. Note 6: The θJA given is for an MXA28A package whose exposed-DAP is not soldered to any copper. Note 7: All voltages are measured with respect to the ground pins, unless otherwise specified. All specifications are tested using the typical application as shown in Figure 1. Note 8: When driving 3Ω loads from a 5V supply, LM4841MH and LM4841LQ must be mounted to the circuit board and forced-air cooled. Note 9: When driving 4Ω loads from a 5V supply, the LM4841MH and LM4841LQ must be mounted to the circuit board. Note 10: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 11: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θ JA, and the ambient temperature TA. The maximum allowable power dissipation is PDMAX = (TJMAX − TA )/θJA. For the LM4841MT and LM4841LQ, TJMAX = 150˚C. See Power Dissipation for further information. Note 12: Human body model, 100 pF discharged through a 1.5 kΩ resistor. Note 13: Machine Model, 220 pF–240 pF discharged through all pins. Note 14: Typicals are measured at 25˚C and represent the parametric norm. Note 15: Limits are guaranteed to National’s AOQL ( Average Outgoing Quality Level). Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. www.national.com 4 LM4841 Typical Application 20028003 FIGURE 2. Typical Application Circuit ( MT / MH Package Pinout ) Truth Table for Logic Inputs (Note 16) Headphone Sense Gain Select Mode Mute Output Stage Set To Volume Control X 0 0 0 Internal Gain On X 0 0 0 Internal Gain On X 1 0 0 External Gain On X 1 0 0 External Gain On On 0 1 0 Internal Gain On Off 0 1 0 External Gain On On 1 1 0 External Gain On Off 1 1 0 Internal Gain On X X X 1 X Muted Note 16: If system beep is detected on the Beep In pin (pin 11), the system beep will be passed through the bridged amplifier regardless of the logic of the Mute and HP sense pins. 5 www.national.com LM4841 Typical Performance Characteristics MH/LQ Specific Characteristics LM4841MH/LQ THD+N vs Output Power LM4841MH/LQ THD+N vs Frequency 20028071 20028070 LM4841MH/LQ THD+N vs Output Power LM4841MH/LQ THD+N vs Frequency 20028072 20028073 LM4841MH/LQ Power Dissipation vs Output Power LM4841MH/LQ (Note 17) Power Derating Curve 20028065 20028064 Note 17: These curves show the thermal dissipation ability of the LM4841MH/LQ at different ambient temperatures given these conditions: 500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias. 2in2: The part is soldered to a 2in2, 1oz. copper plane. 1in2: The part is soldered to a 1in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. www.national.com 6 LM4841 Non-MH/LQ Specific Characteristics THD+N vs Frequency THD+N vs Frequency 20028058 20028057 THD+N vs Frequency THD+N vs Frequency 20028014 20028015 THD+N vs Frequency THD+N vs Frequency 20028017 20028016 7 www.national.com LM4841 Non-MH/LQ Specific Characteristics (Continued) THD+N vs Frequency THD+N vs Frequency 20028018 20028019 THD+N vs Frequency THD+N vs Frequency 20028021 20028020 THD+N vs Frequency THD+N vs Output Power 20028024 20028022 www.national.com 8 LM4841 Non-MH/LQ Specific Characteristics (Continued) THD+N vs Output Power THD+N vs Output Power 20028025 20028026 THD+N vs Output Power THD+N vs Output Power 20028027 20028028 THD+N vs Output Power THD+N vs Output Power 20028030 20028029 9 www.national.com LM4841 Non-MH/LQ Specific Characteristics (Continued) THD+N vs Output Power THD+N vs Output Power 20028031 20028032 THD+N vs Output Power THD+N vs Output Power 20028034 20028033 THD+N vs Output Voltage Docking Station Pins THD+N vs Output Voltage Docking Station Pins 20028060 20028059 www.national.com 10 LM4841 Typical Performance Characteristics Output Power vs Load Resistance Output Power vs Load Resistance 20028062 20028006 Output Power vs Load Resistance Power Supply Rejection Ratio 20028039 20028007 Output Power vs Load Resistance Dropout Voltage 20028053 20028008 11 www.national.com LM4841 Typical Performance Characteristics (Continued) Volume Control Characteristics Power Dissipation vs Output Power 20028040 20028051 Power Dissipation vs Output Power External Gain/ Bass Boost Characteristics 20028052 20028061 Power Derating Curve Crosstalk 20028063 20028049 www.national.com 12 LM4841 Typical Performance Characteristics (Continued) Output Power vs Supply voltage Output Power vs Supply Voltage 20028054 20028056 Supply Current vs Supply Voltage 20028009 13 www.national.com LM4841 Application Information ELIMINATING OUTPUT COUPLING CAPACITORS LM4841’s one-half supply voltage on a plug’s sleeve connection. Driving a portable notebook computer or audio-visual display equipment is possible. This presents no difficulty when the external equipment uses capacitively coupled inputs. For the very small minority of equipment that is DC-coupled, the LM4841 monitors the current supplied by the amplifier that drives the headphone jack’s sleeve. If this current exceeds 500mAPK, the amplifier is shutdown, protecting the LM4841 and the external equipment. Typical single-supply audio amplifiers that can switch between driving bridge-tied-load (BTL) speakers and single-ended (SE) headphones use a coupling capacitor on each SE output. This capacitor blocks the half-supply voltage to which the output amplifiers are typically biased and couples the audio signal to the headphones. The signal return to circuit ground is through the headphone jack’s sleeve. The LM4841 eliminates these coupling capacitors. AmplifierA+ (pin 28 on MT/MH) is internally configured to apply VDD/2 to a stereo headphone jack’s sleeve. This voltage matches the quiescent voltage present on the AmpAout- and AmpBout- outputs that drive the headphones. The headphones operate in a manner very similar to a bridge-tied-load (BTL). The same DC voltage is applied to both headphone speaker terminals. This results in no net DC current flow through the speaker. AC current flows through a headphone speaker as an audio signal’s output amplitude increases on the speaker’s terminal. When operating as a headphone amplifier, the headphone jack sleeve is not connected to circuit ground. Using the headphone output jack as a line-level output will place the OUTPUT TRANSIENT (’POPS AND CLICKS’) ELIMINATED The LM4841 contains advanced circuitry that eliminates output transients (’pop and click’). This circuitry prevents all traces of transients when the supply voltage is first applied, when the part resumes operation after shutdown, or when switching between BTL speakers and SE headphones. Two circuits combine to eliminate pop and click. One circuit mutes the output when switching between speaker loads. Another circuit monitors the input signal. It maintains the muted condition until there is sufficient input signal magnitude ( > 22mVRMS, typ) to mask any remaining transient that may occur. (See Turn On Characteristics). 20028095 FIGURE 3. Differential output signal (Trace B) is devoid of transients. The SHUTDOWN pin is driven by a shutdown signal (Trace A). The inverting output (Trace C) and the non-inverting output (Trace D) are applied across an 8Ω BTL load. Figure 3 shows the LM4841’s lack of transients in the differential signal (Trace B) across a BTL 8Ω load. The LM4841’s active-high SHUTDOWN pin is driven by the logic signal shown in Trace A. Trace C is the VOUT- output signal and trace D is the VOUT+ output signal. The shutdown signal www.national.com frequency is 1Hz with a 50% duty cycle. Figure 4 is generated with the same conditions except that the output drives a 32Ω single-ended (SE) load. Again, no trace of output transients on Trace B can be observed. 14 LM4841 Application Information (Continued) 20028096 FIGURE 4. Single-ended output signal (Trace B) is devoid of transients. The SHUTDOWN pin is driven by a shutdown signal (Trace A). The inverting output (Trace C) and the VBYPASS output (Trace D) are applied across a 32Ω BTL load. EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATIONS The LM4841’s exposed-DAP (die attach paddle) packages (MH,LQ) provide a low thermal resistance between the die and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the surrounding PCB copper traces, ground plane and, finally, surrounding air. The result is a low voltage audio power amplifier that produces 2.1W at ≤ 1% THD with a 4Ω load. This high power is achieved through careful consideration of necessary thermal design. Failing to optimize thermal design may compromise the LM4841’s high power performance and activate unwanted, though necessary, thermal shutdown protection. The MH and LQ packages must have their exposed DAPs soldered to a grounded copper pad on the PCB. The DAP’s PCB copper pad is connected to a large grounded plane of continuous unbroken copper. This plane forms a thermal mass heat sink and radiation area. Place the heat sink area on either outside plane in the case of a two-sided PCB, or on an inner layer of a board with more than two layers. Connect the DAP copper pad to the inner layer or backside copper heat sink area with 32(4x8) (MH) vias or 6(3x2) LQ. The via diameter should be 0.012in–0.013in with a 1.27mm pitch. Ensure efficient thermal conductivity by plating-through and solder-filling the vias. Best thermal performance is achieved with the largest practical copper heat sink area. If the heatsink and amplifier share the same PCB layer, a nominal 2.5in2 (min) area is necessary for 5V operation with a 4Ω load. Heatsink areas not placed on the same PCB layer as the LM4841MH and LQ packages should be 5in2 (min) for the same supply voltage and load resistance. The last two area recommendations apply for 25˚C ambient temperature. Increase the area to compensate for ambient temperatures above 25˚C. The junction temperature must be held below 150˚C to prevent activating the LM4841’s thermal shutdown protection. The LM4841’s power de-rating curve in the Typical Performance Characteristics shows the maximum power dissipation versus temperature. Example PCB layouts for the exposed-DAP TSSOP and LQ packages are shown in the Demonstration Board Layout section. Further detailed and specific information concerning PCB layout and fabrication is available in National Semiconductor’s AN1187. PCB LAYOUT AND SUPPLY REGULATION CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS Power dissipated by a load is a function of the voltage swing across the load and the load’s impedance. As load impedance decreases, load dissipation becomes increasingly dependent on the interconnect (PCB trace and wire) resistance between the amplifier output pins and the load’s connections. Residual trace resistance causes a voltage drop, which results in power dissipated in the trace and not in the load as desired. For example, 0.1Ω trace resistance reduces the output power dissipated by a 4Ω load from 2.1W to 2.0W. This problem of decreased load dissipation is exacerbated as load impedance decreases. Therefore, to maintain the highest load dissipation and widest output voltage swing, PCB traces that connect the output pins to a load must be as wide as possible. Poor power supply regulation adversely affects maximum output power. A poorly regulated supply’s output voltage decreases with increasing load current. Reduced supply voltage causes decreased headroom, output signal clipping, and reduced output power. Even with tightly regulated supplies, trace resistance creates the same effects as poor supply regulation. Therefore, making the power supply traces as wide as possible helps maintain full output voltage swing. BRIDGE CONFIGURATION EXPLANATION As shown in Figure 2, the LM4841 output stage consists of two pairs of operational amplifiers, forming a two-channel (channel A and channel B) stereo amplifier. (Though the following discusses channel A, it applies equally to channel B.) Figure 2 shows that the first amplifier’s negative (-) output serves as the second amplifier’s input. This results in both amplifiers producing signals identical in magnitude, but 180˚ out of phase. Taking advantage of this phase difference, a load is placed between −OUTA and +OUTA and driven differentially (commonly referred to as “bridge mode”). This results in a differential gain of AVD = 2 * (RGFA/RGIA) 15 (1) www.national.com LM4841 Application Information mum ambient temperature that still allows maximum stereo power dissipation without violating the LM4841’s maximum junction temperature. (Continued) Bridge mode amplifiers are different from single-ended amplifiers that drive loads connected between a single amplifier’s output and ground. For a given supply voltage, bridge mode has a distinct advantage over the single-ended configuration: its differential output doubles the voltage swing across the load. This produces four times the output power when compared to a single-ended amplifier under the same conditions. This increase in attainable output power assumes that the amplifier is not current limited or that the output signal is not clipped. To ensure minimum output signal clipping when choosing an amplifier’s closed-loop gain, refer to the Audio Power Amplifier Design section. Another advantage of the differential bridge output is no net DC voltage across the load. This is accomplished by biasing channel A’s and channel B’s outputs at half-supply. This eliminates the coupling capacitor that single supply, singleended amplifiers require. Eliminating an output coupling capacitor in a single-ended configuration forces a single-supply amplifier’s half-supply bias voltage across the load. This increases internal IC power dissipation and may permanently damage loads such as speakers. TA = TJMAX – 2*PDMAX θJA For a typical application with a 5V power supply and an 4Ω load, the maximum ambient temperature that allows maximum stereo power dissipation without exceeding the maximum junction temperature is approximately 45˚C for the MH package. TJMAX = PDMAX θJA + TA PDMAX = (VDD)2/(2π2RL) designing a Equation (2) for a singlevoltage and Single-Ended (2) However, a direct consequence of the increased power delivered to the load by a bridge amplifier is higher internal power dissipation for the same conditions. The LM4841 has two operational amplifiers per channel. The maximum internal power dissipation per channel operating in the bridge mode is four times that of a single-ended amplifier. From Equation (3), assuming a 5V power supply and a 4Ω load, the maximum single channel power dissipation is 1.27W or 2.54W for stereo operation. 2 2 PDMAX = 4 * (VDD) /(2π RL) Bridge Mode POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection. Applications that employ a 5V regulator typically use a 10 µF in parallel with a 0.1 µF filter capacitor to stabilize the regulator’s output, reduce noise on the supply line, and improve the supply’s transient response. However, their presence does not eliminate the need for a local 1.0 µF tantalum bypass capacitance connected between the LM4841’s supply pins and ground. Do not substitute a ceramic capacitor for the tantalum. Doing so may cause oscillation. Keep the length of leads and traces that connect capacitors between the LM4841’s power supply pin and ground as short as possible. Connecting a 1µF capacitor, CB, between the BYPASS pin and ground improves the internal bias voltage’s stability and the amplifier’s PSRR. The PSRR improvements increase as the bypass pin capacitor value increases. Too large a capacitor, however, increases turn-on time and can compromise the amplifier’s click and pop performance. The selection of bypass capacitor values, especially CB, depends on desired PSRR requirements, click and pop performance (as explained in the following section, Selecting Proper External Components), system cost, and size constraints. (3) The LM4841’s power dissipation is twice that given by Equation (2) or Equation (3) when operating in the single-ended mode or bridge mode, respectively. Twice the maximum power dissipation point given by Equation (3) must not exceed the power dissipation given by Equation (4): PDMAX' = (TJMAX − TA)/θJA (4) The LM4841’s TJMAX = 150˚C. In the LQ package soldered to a DAP pad that expands to a copper area of 5in2 on a PCB, the LM4841’s θJA is 20˚C/W. In the MH and LQ packages soldered to a DAP pad that expands to a copper area of 2in2 on a PCB, the LM4841MH’s and LQ’s θJA is 41˚C/W. For the LM4841MT package, θJA = 80˚C/W. At any given ambient temperature TA, use Equation (4) to find the maximum internal power dissipation supported by the IC packaging. Rearranging Equation (4) and substituting PDMAX for PDMAX' results in Equation (5). This equation gives the maxi- www.national.com (6) Equation (6) gives the maximum junction temperature TJMAX. If the result violates the LM4841’s 150˚C TJMAX, reduce the maximum junction temperature by reducing the power supply voltage or increasing the load resistance. Further allowance should be made for increased ambient temperatures. The above examples assume that a device is a surface mount part operating around the maximum power dissipation point. Since internal power dissipation is a function of output power, higher ambient temperatures are allowed as output power or duty cycle decreases. If the result of Equation (2) is greater than that of Equation (3), then decrease the supply voltage, increase the load impedance, or reduce the ambient temperature. If these measures are insufficient, a heat sink can be added to reduce θJA. The heat sink can be created using additional copper area around the package, with connections to the ground pin(s), supply pin and amplifier output pins. External, solder attached SMT heatsinks such as the Thermalloy 7106D can also improve power dissipation. When adding a heat sink, the θJA is the sum of θJC, θCS, and θSA. (θJC is the junction-to-case thermal impedance, θCS is the case-to-sink thermal impedance, and θSA is the sink-to-ambient thermal impedance.) Refer to the Typical Performance Characteristics curves for power dissipation information at lower output power levels. POWER DISSIPATION Power dissipation is a major concern when successful single-ended or bridged amplifier. states the maximum power dissipation point ended amplifier operating at a given supply driving a specified output load. (5) 16 the BYPASS pin in a controlled, linear manner. Ideally, the input and outputs track the voltage applied to the BYPASS pin. The gain of the internal amplifiers remains unity until the voltage on the BYPASS pin reaches 1/2 VDD. As soon as the voltage on the BYPASS pin is stable, the LM4841 is ready to be fully turned on. To turn the device on, the input signal must exceed 22mVrms. This is accomplished through a threshold detect circuit that enables all appropriate output amplifiers after the 22mVrms limit is reached. Until this threshold is reached, some of the amplifiers remain in a tri-state mode. This insures that there is no current flowing through to the speakers or headphones during power up. Without current flow, the speakers or headphones remain silent. During headphone mode, A+, B-, and B+ are in tristate mode during power up. During speaker mode, A+ and B+ are in tri-state mode during power up. (Continued) SELECTING PROPER EXTERNAL COMPONENTS Optimizing the LM4841’s performance requires properly selecting external components. Though the LM4841 operates well when using external components with wide tolerances, best performance is achieved by optimizing component values. The LM4841 is unity-gain stable, giving a designer maximum design flexibility. The gain should be set to no more than a given application requires. This allows the amplifier to achieve minimum THD+N and maximum signal-to-noise ratio. These parameters are compromised as the closed-loop gain increases. However, low gain circuits demand input signals with greater voltage swings to achieve maximum output power. Fortunately, many signal sources such as audio CODECs have outputs of 1VRMS (2.83VP-P). Please refer to the Audio Power Amplifier Design section for more information on selecting the proper gain. Although the BYPASS pin current cannot be modified, changing the size of CBYP alters the device’s turn-on time. As the size of CBYP increases, the turn-on time increases. There is a linear relationship between the size of CBYP and the turn-on time. Here are some typical turn-on times for various values of CBYP: Input Capacitor Value Selection Amplifying the lowest audio frequencies requires a high value input coupling capacitor (0.33µF in Figure 2), but high value capacitors can be expensive and may compromise space efficiency in portable designs. In many cases, however, the speakers used in portable systems, whether internal or external, have little ability to reproduce signals below 150 Hz. Applications using speakers with this limited frequency response reap little improvement by using a large input capacitor. CBYP Besides effecting system cost and size, the input coupling capacitor has an affect on the LM4841’s click and pop performance. When the supply voltage is first applied, a transient (pop) is created as the charge on the input capacitor changes from zero to a quiescent state. The magnitude of the pop is directly proportional to the input capacitor’s size. Higher value capacitors need more time to reach a quiescent DC voltage (usually VDD/2) when charged with a fixed current. The amplifier’s output charges the input capacitor through the feedback resistor, Rf. Thus, pops can be minimized by selecting an input capacitor value that is no higher than necessary to meet the desired −6dB frequency. As shown in Figure 2, the input resistor (RIA, RIB = 20k) ( and the input capacitor (CIA, CIB = 0.33µF) produce a −6dB high pass filter cutoff frequency that is found using Equation (7). TON 0.01µF 2ms 0.1µF 20ms 0.22µF 44ms 0.47µF 94ms 1.0µF 200ms DOCKING STATION INTERFACE Applications such as notebook computers can take advantage of a docking station to connect to external devices such as monitors or audio/visual equipment that sends or receives line level signals. The LM4841 has two outputs, Dock A and Dock B, which connect to outputs of the internal input amplifiers that drive the volume control inputs. These input amplifiers can drive loads of > 1kΩ (such as powered speakers) with a rail-to-rail signal. Since the output signal present on the Dock A and Dock B pins are biased to VDD/2, coupling capacitors should be connected in series with the load when using these outputs. Typical values for the output coupling capacitors are 0.33µF to 1.0µF. If polarized coupling capacitors are used, connect their ’+’ terminals to the respective output pin. Since the Dock outputs precede the internal volume control, the signal amplitude will be equal to the input signal’s magnitude and cannot be adjusted. However, the input amplifier’s closed-loop gain can be adjusted using external resistors. These 20k resistors (RFA and RFB) are shown in Figure 2 and they set each input amplifier’s gain to -1. Use Equation 7 to determine the input and feedback resistor values for a desired gain. (7) As an example when using a speaker with a low frequency limit of 150Hz, the input coupling capacitor, using Equation (7), is 0.063µF. The 0.33µF input coupling capacitor shown in Figure 2 allows the LM4841 to drive a high efficiency, full range speaker whose response extends below 30Hz. TURN ON Characteristics The LM4841 contains advanced circuitry that minimizes turn-on and shutdown transients or “clicks and pops”. For this discussion, turn-on refers to either applying the power supply voltage or when the shutdown mode is deactivated. While the power supply is ramping to its final value, the LM4841’s internal amplifiers are configured as unity gain buffers. An internal current source changes the voltage of - Av = RF / RIN (8) Adjusting the input amplifier’s gain sets the minimum gain for that channel. Although the single ended output of the Bridge Output Amplifiers can be used to drive line level outputs, it is recommended that the A & B Dock Outputs simpler signal path be used for better performance. 17 www.national.com LM4841 Application Information LM4841 Application Information When activated, the LM4841’s micro-power shutdown feature turns off the amplifier’s bias circuitry, reducing the supply current. On the demo board, the micro-power shutdown feature is controlled by a single pole switch that connects the shutdown pin to either VDD, for normal operation, or directly to ground to enable shutdown. In a system with a microprocessor or a microcontroller, use a digital output to apply the control voltage to the SHUTDOWN pin. (Continued) BEEP DETECT FUNCTION Computers and notebooks produce a system “beep“ signal that drives a small speaker. The speaker’s auditory output signifies that the system requires user attention or input. To accommodate this system alert signal, the LM4841’s beep input pin is a mono input that accepts the beep signal. Internal level detection circuitry at this input monitors the beep signal’s magnitude. When a signal level greater than VDD/2 is detected on the BEEP IN pin, the bridge output amplifiers are enabled. The beep signal is amplified and applied to the load connected to the output amplifiers. A valid beep signal will be applied to the load even when MUTE is active. Use the input resistors connected between the BEEP IN pin and the stereo input pins to accommodate different beep signal amplitudes. These resistors are shown as 200kΩ devices in Figure 2. Use higher value resistors to reduce the gain applied to the beep signal. The resistors must be used to pass the beep signal to the stereo inputs. The BEEP IN pin is used only to detect the beep signal’s magnitude: it does not pass the signal to the output amplifiers. The LM4841’s shutdown mode must be deactivated before a system alert signal is applied to BEEP IN pin. MODE FUNCTION The LM4841’s MODE function has 2 states controlled by the voltage applied to the MODE pin. In Mode 0 (mode pin at GND), the HP Sense has no effect on the gain setting (only the Gain Select Input Controls either internal or external gain). In Mode 1 (mode pin tied high), the HP Sense and Gain Select both can toggle between Internal and External Gain. See ’Truth Table for Logic Inputs’ on page 5. MUTE FUNCTION The LM4841 mutes the amplifier and DOCK outputs when VDD is applied to the MUTE pin. Even while muted, the LM4841 will amplify a system alert (beep) signal whose magnitude satisfies the BEEP DETECT circuitry. Applying 0V to the MUTE pin returns the LM4841 to normal, unmuted operation. Prevent unanticipated mute behavior by connecting the MUTE pin to VDD or ground. Do not let the mute pin float. MICRO-POWER SHUTDOWN The voltage applied to the SHUTDOWN pin controls the LM4841’s shutdown function. Activate micro-power shutdown by applying ground (logic low) to the SHUTDOWN pin. 20028087 FIGURE 5. Headphone Sensing Circuit (MT & MH Packages) www.national.com 18 input signal from an audio signal to the VDD/2 DC voltage present on pin 28, and mutes the bridge-connected loads. Amp A -OUT and Amp B -OUT drive the headphones. (Continued) CAP-LESS HEADPHONE (SINGLE-ENDED) AMPLIFIER OPERATION Figures 2 and 6 also show suggested headphone jack electrical connections. The jack is designed to mate with a three−wire plug. The plug’s tip and ring should each carry one of the two stereo output signals, whereas the sleeve provides the return to Amp A +OUT. A headphone jack with one control pin contact is sufficient to drive the HP−IN pin when connecting headphones An internal pull−up circuit is connected to the HP Sense (Pin 21 HP-IN) headphone amplifier control pin. When this pin is left unconnected, VDD is applied to the HP−IN. This turns off Amp B +OUT (not seen in Fig 5, see Fig 2 Pin 15) and switches Amp A +OUT’s input signal from an audio signal to the VDD/2 voltage present on pin 28 (Amp A + OUT). The result is muted bridge-connected loads. Quiescent current consumption is reduced when the IC is in this single−ended mode. Figure 5 above shows the implementation of the LM4841’s headphone control function. An internal comparator with a nominal 400mV offset monitors the signal present at the −OUT B output. It compares this signal against the signal applied to the HP−IN pin (Notice in Figure 5, Pin 21 is shorted to Pin 17 without a headphone plugged in). When these signals are equal, as in the case when a BTL is connected to the amplifier, an internal comparator forces the LM4841 to maintain bridged−amplifier operation. When the HP−IN pin is externally floated, such as when headphones are connected to the jack shown in Figure 5, an internal pull−up forces VDD on the internal comparator’s HP−IN inputs. This changes the comparator’s output state and enables the headphone function: it turns off Amp B +OUT (not seen in Fig 5, see Fig 2 Pin 15), switches the Amp A +OUT A switch can replace the headphone jack contact pin. When a switch shorts the HP−IN pin to VDD (An open switch contact will accomplish this because there is an internal pull-up resistor), the bridge−connected speakers are muted and Amp A -OUT and Amp B -OUT drive the stereo headphones. When a switch shorts the HP−IN pin to GND (pulling down the internal pull-up resistor), the LM4841 operates in bridge mode. If headphone drive is not needed, short the HP−IN pin to the −OUTB pin. ESD Protection As stated in the Absolute Maximum Ratings, pin 28 on the MT/MH packages and pin 25 on the LQ package, have a maximum ESD susceptibility rating of 6500V. For higher ESD voltages, the addition of a PCDN042 dual transil (from California Micro Devices), as shown in Figure 6, will provide additional protection. 20028094 FIGURE 6. The PCDN042 provides additional ESD protection beyond the 6500V shown in the Absolute Maximum Ratings for the AMP2A output In some cases a designer may want to improve the low frequency response of the bridged amplifier or incorporate a bass boost feature. This bass boost can be useful in systems where speakers are housed in small enclosures. A resistor, RBA, and a capacitor, CBA, in parallel, can be placed in series with the feedback resistor of the bridged amplifier as seen in Figure 7. GAIN SELECT FUNCTION (Bass Boost) The LM4841 features selectable gain, using either internal or external feedback resistors. Either set of feedback resistors set the gain of the output amplifiers. The voltage applied to the GAIN SELECT pin controls which gain is selected. Applying VDD to the GAIN SELECT pin selects the external gain mode. Applying 0V to the GAIN SELECT pin selects the internally set unity gain. 19 www.national.com LM4841 Application Information LM4841 Application Information (Continued) 20028011 FIGURE 7. Low Frequency Enhancement ( MT/MH PINOUT ) The LM4841 volume control consists of 31 steps that are individually selected by a variable DC voltage level on the volume control pin. The range of the steps, controlled by the DC voltage, are from 0dB - 78dB. Each gain step corresponds to a specific input voltage range, as shown in table 2, (on the following page.) To minimize the effect of noise on the volume control pin, which can affect the selected gain level, hysteresis has been implemented. The amount of hysteresis corresponds to half of the step width, as shown in Volume Control Characterization Graph (DS200133-40). At low, frequencies CBA is a virtual open circuit and at high frequencies, its nearly zero ohm impedance shorts RBA. The result is increased bridge-amplifier gain at low frequencies. The combination of RBA and CBA form a -6dB corner frequency at fC = 1/(2πRBACBA) (9) The bridged-amplifier low frequency differential gain is: AVD = 2(RGFA + RBA) / RGIA For highest accuracy, the voltage shown in the ’recommended voltage’ column of the table is used to select a desired gain. This recommended voltage is exactly halfway between the two nearest transitions to the next highest or next lowest gain levels. The gain levels are 1dB/step from 0dB to -6dB, 2dB/step from -6dB to -36dB, 3dB/step from -36dB to -47dB, 4dB/step from -47db to -51dB, 5dB/step from -51dB to -66dB, and 12dB to the last step at -78dB. (10) Using the component values shown in Figure 2 (RGFA = 20kΩ, RBA = 20kΩ, and CBA = 0.068µF), a first-order, -6dB pole is created at 120Hz. Assuming R GIA = 20kΩ, the low frequency differential gain is 4. The input (Cin A and B) capacitor values must be selected for a low frequency response that covers the range of frequencies affected by the desired bass-boost operation. DC VOLUME CONTROL The LM4841 has an internal stereo volume control whose setting is a function of the DC voltage applied to the DC VOL CONTROL pin. www.national.com 20 LM4841 Application Information (Continued) VOLUME CONTROL TABLE ( Table 2 ) Gain (dB) Voltage Range (% of Vdd) Voltage Range (Vdd = 5) Voltage Range (Vdd = 3) Low High Recommended Low High Recommended Low High Recommended 0 77.5% 100.00% 100.000% 3.875 5.000 5.000 2.325 3.000 3.000 -1 75.0% 78.5% 76.875% 3.750 3.938 3.844 2.250 2.363 2.306 -2 72.5% 76.25% 74.375% 3.625 3.813 3.719 2.175 2.288 2.231 -3 70.0% 73.75% 71.875% 3.500 3.688 3.594 2.100 2.213 2.156 -4 67.5% 71.25% 69.375% 3.375 3.563 3.469 2.025 2.138 2.081 -5 65.0% 68.75% 66.875% 3.250 3.438 3.344 1.950 2.063 2.006 -6 62.5% 66.25% 64.375% 3.125 3.313 3.219 1.875 1.988 1.931 -8 60.0% 63.75% 61.875% 3.000 3.188 3.094 1.800 1.913 1.856 -10 57.5% 61.25% 59.375% 2.875 3.063 2.969 1.725 1.838 1.781 -12 55.0% 58.75% 56.875% 2.750 2.938 2.844 1.650 1.763 1.706 -14 52.5% 56.25% 54.375% 2.625 2.813 2.719 1.575 1.688 1.631 -16 50.0% 53.75% 51.875% 2.500 2.688 2.594 1.500 1.613 1.556 -18 47.5% 51.25% 49.375% 2.375 2.563 2.469 1.425 1.538 1.481 -20 45.0% 48.75% 46.875% 2.250 2.438 2.344 1.350 1.463 1.406 -22 42.5% 46.25% 44.375% 2.125 2.313 2.219 1.275 1.388 1.331 -24 40.0% 43.75% 41.875% 2.000 2.188 2.094 1.200 1.313 1.256 -26 37.5% 41.25% 39.375% 1.875 2.063 1.969 1.125 1.238 1.181 -28 35.0% 38.75% 36.875% 1.750 1.938 1.844 1.050 1.163 1.106 -30 32.5% 36.25% 34.375% 1.625 1.813 1.719 0.975 1.088 1.031 -32 30.0% 33.75% 31.875% 1.500 1.688 1.594 0.900 1.013 0.956 -34 27.5% 31.25% 29.375% 1.375 1.563 1.469 0.825 0.937 0.881 -36 25.0% 28.75% 26.875% 1.250 1.438 1.344 0.750 0.862 0.806 -39 22.5% 26.25% 24.375% 1.125 1.313 1.219 0.675 0.787 0.731 -42 20.0% 23.75% 21.875% 1.000 1.188 1.094 0.600 0.712 0.656 -45 17.5% 21.25% 19.375% 0.875 1.063 0.969 0.525 0.637 0.581 -47 15.0% 18.75% 16.875% 0.750 0.937 0.844 0.450 0.562 0.506 -51 12.5% 16.25% 14.375% 0.625 0.812 0.719 0.375 0.487 0.431 -56 10.0% 13.75% 11.875% 0.500 0.687 0.594 0.300 0.412 0.356 -61 7.5% 11.25% 9.375% 0.375 0.562 0.469 0.225 0.337 0.281 -66 5.0% 8.75% 6.875% 0.250 0.437 0.344 0.150 0.262 0.206 -78 0.0% 6.25% 0.000% 0.000 0.312 0.000 0.000 0.187 0.000 21 www.national.com LM4841 Application Information (Continued) The last step in this design example is setting the amplifier’s −6dB frequency bandwidth. To achieve the desired ± 0.25dB pass band magnitude variation limit, the low frequency response must extend to at least one-fifth the lower bandwidth limit and the high frequency response must extend to at least five times the upper bandwidth limit. The gain variation for both response limits is 0.17dB, well within the ± 0.25dB desired limit. The results are an AUDIO POWER AMPLIFIER DESIGN Audio Amplifier Design: Driving 1W into an 8Ω Load The following are the desired operational parameters: Power Output: 1 WRMS Load Impedance: 8Ω Input Level: 1 VRMS Input Impedance: Bandwidth: 20 kΩ 100 Hz−20 kHz ± 0.25 dB fL = 100Hz/5 = 20Hz (14) fH = 20kHz x 5 = 100kHz (15) and an The design begins by specifying the minimum supply voltage necessary to obtain the specified output power. One way to find the minimum supply voltage is to use the Output Power vs Supply Voltage curve in the Typical Performance Characteristics section. Another way, using Equation (10), is to calculate the peak output voltage necessary to achieve the desired output power for a given load impedance. To account for the amplifier’s dropout voltage, two additional voltages, based on the Dropout Voltage vs Supply Voltage in the Typical Performance Characteristics curves, must be added to the result obtained by Equation (10). The result is Equation (11). As mentioned in the Selecting Proper External Components section, Rin A and B and Cin A and B create a highpass filter that sets the amplifier’s lower bandpass frequency limit. Find the input coupling capacitor’s value using Equation (14). Cin A and B≥ 1/(2πRin A and BfL) (16) 1/(2π*20kΩ*20Hz) = 0.397µF (17) The result is (11) VDD ≥ (VOUTPEAK+ (VODTOP + VODBOT)) Use a 0.39µF capacitor, the closest standard value. (12) The product of the desired high frequency cutoff (100kHz in this example) and the differential gain AVD, determines the upper passband response limit. With AVD = 3 and fH = 100kHz, the closed-loop gain bandwidth product (GBWP) is 300kHz. This is less than the LM4841’s 3.5MHz GBWP. With this margin, the amplifier can be used in designs that require more differential gain while avoiding performance,restricting bandwidth limitations. The Output Power vs Supply Voltage graph for an 8Ω load indicates a minimum supply voltage of 4.6V. This is easily met by the commonly used 5V supply voltage. The additional voltage creates the benefit of headroom, allowing the LM4841 to produce peak output power in excess of 1W without clipping or other audible distortion. The choice of supply voltage must also not create a situation that violates of maximum power dissipation as explained above in the Power Dissipation section. After satisfying the LM4841’s power dissipation requirements, the minimum differential gain needed to achieve 1W dissipation in an 8Ω load is found using Equation (12). Recommended Printed Circuit Board Layout Figures 8 through 14 show the recommended PC board layout that is optimized for the LM4841 and associated external components. This circuit is designed for use with an external 5V supply and 8Ω speakers. This circuit board is easy to use. Apply 5V and ground to the board’s VDD and GND pads, respectively. Connect 8Ω speakers between the board’s −OUTA and +OUTA and -OUTB and +OUTB pads. (13) Thus, a minimum overall gain of 2.83 allows the LM4841’s to reach full output swing and maintain low noise and THD+N performance. www.national.com 22 LM4841 LM4841LQ Demo Board Artworks 20028098 FIGURE 8. Top Layer SilkScreen 20028099 FIGURE 9. Top Layer LQ 23 www.national.com LM4841 LM4841LQ Demo Board Artworks (Continued) 200280A0 FIGURE 10. Bottom Layer LQ www.national.com 24 LM4841 Analog Audio LM4841LQ Eval Board Assembly Part Number: 5510118313-001 Revision: A Bill of Material Item Part Number Part Description Qty Ref Designator Remark 1 551011373-001 LM4841 Eval Board PCB etch 001 1 10 482911373-001 LM4841LQ 1 20 151911368-001 Cer Cap 0.068µF 50V 10% 1206 2 25 152911368-001 Tant Cap 0.1µF 10V 10% 3 Size = A 3216 C2, C3, C4 26 152911368-002 Tant Cap 0.33µF 10V 10% Size = A 3216 3 CinA, CinB, Cinbeep 27 152911368-003 Tant Cap 1µF 16V 10% Size = A 3216 3 CBYP, CoutA, CoutB 28 152911368-004 Tant Cap 10µF 10V 10% Size = C 6032 1 C1 31 472911368-002 Res 20K Ohm 1/8W 1% 1206 10 RINAandB, RGFAandB, RBA, RBB, RGIAandB, RFAandB 33 472911368-004 Res 200K Ohm 1/16W 1% 0603 2 RBeepAandB 40 131911368-001 Stereo Headphone Jack W/ Switch 1 41 131911368-002 Slide Switch 4 mute, mode, Gain, SD Mouser # 10SP003 42 131911368-003 Potentiometer 1 Volume Control Mouser # 317-2090-100K 43 131911368-004 RCA Jack 3 InA, InB, BeepIn Mouser # 16PJ097 44 131911368-005 Banana Jack, Black 3 GND, AOUT-, BOUT- Mouser # ME164-6219 45 131911368-006 Banana Jack, Red 3 VDD, AOUT+, BOUT+ Mouser # ME164-6218 CBA, CBB Switchcraft 35RAPC4BH3 25 www.national.com LM4841 LM4841 MT & MH Demo Board Artworks 20028088 FIGURE 11. Top Layer SilkScreen 20028089 FIGURE 12. Top Layer TSSOP www.national.com 26 LM4841 LM4841 MT & MH Demo Board Artworks (Continued) 20028090 FIGURE 13. Bottom Layer TSSOP 20028091 FIGURE 14. Drill Drawing 27 www.national.com LM4841 Analog Audio LM4841 MSOP Eval Board Assembly Part Number: 980011373-100 Revision: A Bill of Material Item Part Number Part Description 1 551011373-001 LM4841 Eval Board PCB 1 etch 001 10 482911373-001 LM4841 MSOP 1 20 151911368-001 Cer Cap 0.068µF 50V 10% 1206 2 CBA, CBB 25 152911368-001 Tant Cap 0.1µF 10V 10% 3 Size = A 3216 C2, C3, C4 26 152911368-002 Tant Cap 0.33µF 10V 10% Size = A 3216 3 CinA, CinB, Cinbeep 27 152911368-003 Tant Cap 1µF 16V 10% Size = A 3216 3 CBYP, CoutA, CoutB 28 152911368-004 Tant Cap 10µF 10V 10% 1 Size = C 6032 C1 31 472911368-002 Res 20K Ohm 1/8W 1% 1206 10 RINAandB, RGFAandB, RBA, RBB, RGIAandB, RFAandB 33 472911368-004 Res 200K Ohm 1/16W 1% 0603 2 RBeepAandB 40 131911368-001 Stereo Headphone Jack 1 W/ Switch 41 131911368-002 Slide Switch 4 mute, mode, Gain, SD Mouser # 10SP003 42 131911368-003 Potentiometer 1 Volume Control Mouser # 317-2090-100K 43 131911368-004 RCA Jack 3 InA, InB, BeepIn Mouser # 16PJ097 44 131911368-005 Banana Jack, Black 3 GND, AOUT-, BOUT- Mouser # ME164-6219 45 131911368-006 Banana Jack, Red 3 VDD, AOUT+, BOUT+ Mouser # ME164-6218 www.national.com Qty Ref Designator Remark Switchcraft 35RAPC4BH3 28 LM4841 Physical Dimensions inches (millimeters) unless otherwise noted LLP Package Order Number LM4841LQ NS Package Number LQA028A for Exposed-DAP LLP 29 www.national.com LM4841 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) TSSOP Package Order Number LM4841MT NS Package Number MTC28 for TSSOP www.national.com 30 inches (millimeters) unless otherwise noted (Continued) Exposed-DAP TSSOP Package Order Number LM4841MH NS Package Number MXA28A for Exposed-DAP TSSOP LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Email: [email protected] www.national.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: [email protected] National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. LM4841 Stereo 2W Amplifiers with DC Volume Control,Transient Free Outputs, and Cap-less Headphone Drive Physical Dimensions