MBRB20100CT SWITCHMODEt Power Rectifier D2PAK Surface Mount Power Package The D2PAK Power Rectifier is a state−of−the−art device that employs the use of the Schottky Barrier principle with a platinum barrier metal. http://onsemi.com Features • • • • • • • • • SCHOTTKY BARRIER RECTIFIER 20 AMPERES 100 VOLTS Package Designed for Power Surface Mount Applications Center−Tap Configuration Guardring for Stress Protection Low Forward Voltage 175°C Operating Junction Temperature Epoxy Meets UL 94 V−0 @ 0.125 in Short Heat Sink Tab Manufactured − Not Sheared! Similar in Size to Industry Standard TO−220 Package Pb−Free Packages are Available 1 4 3 Mechanical Characteristics • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 • Weight: 1.4 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C >400 V Human Body Model, 3B >8000 V 4 1 D2PAK CASE 418B STYLE 3 3 MARKING DIAGRAM MAXIMUM RATINGS (Per Leg) Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 100 V Average Rectified Forward Current (Rated VR, TC = 110°C) Total Device IF(AV) 10 20 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 100°C) IFRM 20 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 150 A Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) IRRM 0.5 A Storage Temperature Range Tstg −65 to +175 °C Operating Junction Temperature (Note 1) TJ −65 to +175 °C Voltage Rate of Change (Rated VR) dv/dt 10,000 V/ms Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. © Semiconductor Components Industries, LLC, 2009 May, 2009 − Rev. 8 1 AY WW B20100G AKA A Y WW B20100 G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Publication Order Number: MBRB20100CT/D MBRB20100CT THERMAL CHARACTERISTICS (Per Leg) Characteristic Thermal Resistance, Junction−to−Case Junction−to−Ambient (Note 2) Symbol Value Unit RqJC RqJA 2.0 50 °C/W ELECTRICAL CHARACTERISTICS (Per Leg) Maximum Instantaneous Forward Voltage (Note 3) (iF = 10 Amp, TC = 125°C) (iF = 10 Amp, TC = 25°C) (iF = 20 Amp, TC = 125°C) (iF = 20 Amp, TC = 25°C) vF 0.75 0.85 0.85 0.95 V Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TJ = 125°C) (Rated dc Voltage, TJ = 25°C) iR 6.0 0.1 mA 2. When mounted using minimum recommended pad size on FR−4 board. 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. ORDERING INFORMATION Package Shipping† MBRB20100CT D2PAK 50 Units / Rail MBRB20100CTG D2PAK 50 Units / Rail D2PAK 800 Units / Tape & Reel D2PAK (Pb−Free) 800 Units / Tape & Reel Device (Pb−Free) MBRB20100CTT4 MBRB20100CTT4G 10 50 TJ = 150°C 125°C 20 IR , REVERSE CURRENT (mA) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 150°C 10 100°C 5 TJ = 25°C 3 1 1.0 125°C 0.1 100°C 0.01 0.001 25°C 0.5 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.0001 1 0 20 vF, INSTANTANEOUS VOLTAGE (VOLTS) 100 80 Figure 2. Typical Reverse Current Per Diode 20 20 RATED VOLTAGE APPLIED RqJC = 2°C/W 18 AVERAGE POWER (WATTS) dc 60 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Per Diode IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 40 15 SQUARE WAVE 10 5.0 IPK/IAV = 5 TJ = 125°C PI 16 IPK/IAV = 10 14 12 IPK/IAV = 20 10 SQUARE WAVE 8 6 DC 4 2 0 80 100 120 140 TC, CASE TEMPERATURE (°C) 160 0 180 0 2 4 6 8 10 12 14 AVERAGE CURRENT (AMPS) 16 18 20 Figure 4. Average Power Dissipation & Average Current Figure 3. Typical Current Derating, Case, Per Leg http://onsemi.com 2 MBRB20100CT PACKAGE DIMENSIONS D2PAK CASE 418B−04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. C E −B− V W 4 1 2 A S 3 −T− SEATING PLANE K J G D 3 PL 0.13 (0.005) W H M T B STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE M VARIABLE CONFIGURATION ZONE DIM A B C D E F G H J K L M N P R S V INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 N R P U L L M L M M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 3 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MBRB20100CT SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. 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