MC74LCX07 Low−Voltage CMOS Hex Buffer with Open Drain Outputs With 5 V−Tolerant Inputs The MC74LCX07 is a high performance hex buffer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers. These LCX devices have open drain outputs which provide the ability to set output levels, or do active−HIGH AND or active−LOW OR functions. A VI specification of 5.5 V allows MC74LCX07 inputs to be safely driven from 5.0 V devices. http://onsemi.com MARKING DIAGRAMS 14 SOIC−14 D SUFFIX CASE 751A 14 1 1 Features • • • • • • Designed for 2.3 to 3.6 V VCC Operation 5.0 V Tolerant Inputs/Outputs LVTTL Compatible 14 LVCMOS Compatible 14 24 mA Output Sink Capability 1 • TSSOP−14 DT SUFFIX CASE 948G 1 Near Zero Static Supply Current (10 A) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA • • Wired−OR, Wired−AND • Output Level Can Be Set Externally Without Affecting Speed of • LCX07G AWLYWW Device ESD Performance: 14 14 1 Human Body Model >1500 V; Machine Model >200 V Pb−Free Packages are Available* VCC A3 O3 A4 O4 A5 O5 14 13 12 11 10 9 8 LCX 07 ALYW SOEIAJ−14 M SUFFIX CASE 965 74LCX07 ALYWG 1 A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G = Pb−Free Package = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION 1 2 3 4 5 6 7 A0 O0 A1 O1 A2 O2 GND See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 1. Pinout: 14−Lead (Top View) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 May, 2005 − Rev. 10 1 Publication Order Number: MC74LCX07/D MC74LCX07 A0 A1 A2 A3 1 3 5 13 * 2 * 4 * 6 * 12 * 10 * 8 O0 PIN NAMES O1 O2 Pins Function An On Data Inputs Outputs O3 TRUTH TABLE A4 A5 11 9 O4 An On O5 L H L Z * OD Figure 2. Logic Diagram MAXIMUM RATINGS Symbol Parameter Value VCC DC Supply Voltage VI DC Input Voltage −0.5 VI +7.0 VO DC Output Voltage −0.5 VO +7.0 IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output/Sink Current ICC IGND TSTG Storage Temperature Range Condition −0.5 to +7.0 Unit V V Output in HIGH or LOW State (Note 1) V −50 VI < GND mA −50 VO < GND mA +50 VO > VCC mA +50 mA DC Supply Current Per Supply Pin 100 mA DC Ground Current Per Ground Pin 100 mA −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. ORDERING INFORMATION Package Shipping† MC74LCX07D SOIC−14 55 Units / Rail MC74LCX07DG SOIC−14 (Pb−Free) 55 Units / Rail MC74LCX07DR2 SOIC−14 2500 Tape & Reel MC74LCX07DR2G SOIC−14 (Pb−Free) 2500 Tape & Reel MC74LCX07DT TSSOP−14* 96 Units / Rail MC74LCX07DTG TSSOP−14* 96 Units / Rail MC74LCX07DTR2 TSSOP−14* 2500 Tape & Reel MC74LCX07DTR2G TSSOP−14* 2500 Tape & Reel MC74LCX07M SOEIAJ−14 50 Units / Rail MC74LCX07MG SOEIAJ−14 (Pb−Free) 50 Units / Rail MC74LCX07MEL SOEIAJ−14 2000 Tape & Reel MC74LCX07MELG SOEIAJ−14 (Pb−Free) 2000 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 2 MC74LCX07 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Operating Data Retention Only Min Typ Max Unit 2.0 1.5 2.3 to 3.3 5.5 5.5 V 0 5.5 V 0 5.5 V VCC Supply Voltage VI Input Voltage VO Output Voltage IOH HIGH Level Output Current VCC= 3.0 V−3.6 V VCC= 2.7 V−3.0 V VCC= 2.3 V−2.7 V −24 −12 −8 mA IOL LOW Level Output Current VCC= 3.0 V−3.6 V VCC= 2.7 V−3.0 V VCC= 2.3 V−2.7 V +24 +12 +8 mA TA Operating Free−Air Temperature −40 +85 °C t/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V (HIGH or LOW State) DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol VIH VIL VOL Max Unit V 2.3 V VCC 2.7 V 0.7 V 2.7 V VCC 3.6 V 0.8 2.3 V VCC 3.6 V; IOL = 100 A 0.2 VCC = 2.3 V; IOL= 8 mA 0.3 VCC = 2.7 V; IOL= 12 mA 0.4 Characteristic HIGH Level Input Voltage (Note 2) LOW Level Input Voltage (Note 2) LOW Level Output Voltage II Maximum Input Leakage Current IOFF Power−Off Leakage Current ICC Maximum Quiescent Supply Current ICC Increase in ICC per Input Condition Min 2.3 V VCC 2.7 V 1.7 2.7 V VCC 3.6 V 2.0 V VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 2.3 V VCC 3.6 V, 0 V VI 5.5 V 5 A VCC = 0V, VO or VI = 5.5V 10 A 2.3 V VCC 3.6 V, VI= VCC or GND 2.3 V VCC 3.6 V, 3.6 V VI 5.5 V 10 10 A 2.3 V VCC 3.6 V 4.5 V VCC 5.5 V 500 1.0 A mA 2. These values of VI are used to test DC electrical characteristics only. AC ELECTRICAL CHARACTERISTICS Limits TA= −40C to +85C Symbol tPLZ tPZL Parameter Propagation Delay Input to Output VCC = 3.3 V 0.3 V VCC= 2.7 V CL= 50 pF CL= 50 pF VCC = 2.5 V 0.2 V CL= 30 pF Min Max Min Max Min Max Unit 0.5 0.5 3.0 3.0 0.8 0.8 3.7 3.7 0.8 0.8 3.8 3.8 ns ns DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Unit VOLP Dynamic LOW Peak Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH =2.5 V, VIL = 0 V 0.9 0.7 V VOLV Dynamic LOW Valley Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.8 −0.6 V 3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. http://onsemi.com 3 MC74LCX07 CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Input Capacitance COUT Output Capacitance CPD Power Dissipation Capacitance Condition Typical Unit VCC = 3.3 V, VI = 0 V or VCC 7 pF VCC = 3.3 V, VI = 0 V or VCC 8 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF VCC Vmi An Vmi 0V tPLZ tPZL On Vmo VLZ VOL PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1MHz; tW = 500 ns VCC 3.3 V 0.3 V 2.7 V Vmi 1.5 V 1.5 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 VLZ VOL + 0.3 V VOL + 0.3 V VOL + 015 V Symbol 2.5 V 0.2 V Figure 3. AC Waveforms VCC 6 V or VCC 2 PULSE GENERATOR R1 DUT RT CL SWITCH TEST tPZL, tPLZ 6V Open Collector/Drain tPLH and tPHL 6V tPZH, tPHZ CL = CL = RL = RT = RL GND 50 pF at VCC = 3.3 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 or equivalent ZOUT of pulse generator (typically 50 ) Figure 4. Test Circuit http://onsemi.com 4 GND MC74LCX07 PACKAGE DIMENSIONS SOIC−14 D SUFFIX CASE 751A−03 ISSUE G −A− 14 8 −B− P 7 PL 0.25 (0.010) B M M 7 1 G F R X 45 C −T− D 14 PL 0.25 (0.010) SEATING PLANE M T B A S DIM A B C D F G J K M P R J M K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. S MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE A 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E http://onsemi.com 5 DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0 8 0 8 MC74LCX07 PACKAGE DIMENSIONS SOEIAJ−14 M SUFFIX CASE 965−01 ISSUE O 14 LE 8 Q1 E HE L 7 1 M DETAIL P Z D VIEW P A e c DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 −−− 1.42 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 −−− 0.056 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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