ETC MMSD16128808S-V-IS

MEMORY MODULE
SDRam 128Mx16-SOP
Synchronous Dynamic Ram
MODULE
MMSD16128808S-V
2Gbit SDRam organized as 128Mx16, based on 32Mx8
Pin Assignment (Top View)
SOP 58 - (Pitch : 0.80 mm)
Features
- Stack of eight 256Mbit SDRam.
- Organized as 128Mx16-bit.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
- Single +3.3V ±0.3V power supply.
- Fully synchronous ; all signals registered on positive edge of
system clock.
- Internal pipelined operation ; column adress can be changed
every clock cycle.
- Programmable burst lengths ; 1, 2, 4, 8 or full page.
- Auto Precharge, includes Concurrent Auto Precharge, and
Auto Refresh Modes.
- Self Refresh Modes.
- LVTTL-compatible inputs and outputs.
- Available Temperature Range :
VDD
DQ0
VDDQ
DQ8
DQ1
VSSQ
DQ9
DQ2
VDDQ
DQ10
DQ3
VSSQ
DQ11
VDD
#CS1
#WE
#CAS
#RAS
#CS0
BA0
21
BA1
41 CKE0
22 A10/AP 42 CLK0
23
A0
43 DQM0
A1
24
44 DQM1
25
45 VSS
A2
26
A3
46 DQ15
27 VDD 47 VDDQ
28 #CS2 48 DQ4
29 #CS3 49 DQ14
30 CLK1 50 VSSQ
31 CKE1 51 DQ5
32 VSS
52 DQ13
33
A4
53 VDDQ
A5
54 DQ6
34
35
A6
55 DQ12
A7
56 VSSQ
36
A8
37
57 DQ7
A9
38
58 VSS
A11
39
A12
40
0°C to +70°C
-40°C to +85°C
- Available with screening option for high reliability application
FUNCTIONAL BLOCK DIAGRAM
(Space, etc...).
Bank 0, #CS0
Bank 1, #CS1
Bank 2, #CS2
Bank 3, #CS3
General description
1
The MMSD16128808S-V is a high-speed highly integrated
CLK0, CKE0
3
DQM0
DQ0-DQ7
5
CLK1, CKE1
7
Synchronous Dynamic Random Access Memory containing
2,147,483,648 bits.
It is organized with four banks of 512 Mbit.
Each bank has a 16-bit interface and is selected with specific #CS
2
CLK and CKE.
It is particularly well suited for use in high reliability, high
DQM1
DQ8-DQ15
CLK0, CKE0
4
6
CLK1, CKE1
8
performance and high density system applications, such as
solid state mass recorder, server or workstation.
The MMSD16128808S-V is
packaged in a 58 pin SOP.
(All others signals are common to the eight memories)
SDRam Memory Module
ULYSSE
(3DSD2048-163)
3D PLUS S.A. reserves the right to change or cancel products or specifications without notice
3DFP-0014-REV : 4 - SEPT. 2003
MEMORY MODULE
SDRam 128Mx16-SOP
Synchronous Dynamic Ram
MODULE
MMSD16128808S-V
2Gbit SDRam organized as 128Mx16, based on 32Mx8
Mechanical Drawing
D
A
E
E1
A2
Max
A
11.55
12.15
A2
10.30
10.90
D
25.40
25.80
E
13.40
13.80
E1
10.85
b
e
b
e
Min
11.05
0.30
0.80
Dimensions (mm)
Max. weight : 6.95 gr.
Test Tools
MMSD16128808S-V
DC Operating conditions and characteristics
Parameter
Supply voltage
Input logic high voltage
Input logic low voltage
Output logic high Voltage
Output logic low voltage
Symbol
VDD
VIH
VIL
VOH
VOL
Min
3.0
2.0
-0.3
2.4
-
Typ
3.3
3.0
-
Max
3.6
VDD+0.3
0.8
0.4
Absolute maximum ratings
Unit
V
V
V
V
V
Parameter
Voltage on any pin relative to VSS
Symbol
VIN, VOUT
TSTG
PD
LOS
Storage temperature
Power dissipation
Short circuit current
Value
-1.0 ~ 4.6
-55 ~ +150
2
50
Unit
V
°C
Value
Unit
mA
mA
mA
W
mA
DC Characteristics
Parameter
Operating current (One bank active)
Precharge standby current in
power-down mode
MMSD16128808S-V
Modified by 3D PLUS
ENPLAS 64-08-04
- X X
Symbol
ICC1
ICC2P
ICC2PS
202
24
16
MODULE MARKING
3D Plus LOGO
Part Number Marking
C=
I=
Temperature Range
(0°C to + 70°C)
(-40°C to + 85°C)
Data Code (WWYY)
Part Option Marking
Serial Number Optional
Pin 1 Indicator
MMXX00000000XXX
-XX
0000
0000
Quality Level
N = Commercial Grade
B=
Industrial Grade
S=
Space Grade
MAIN SALES OFFICE
FRANCE
USA
ULYSSE
(3DSD2048-163)
3D PLUS
641, rue Hélène Boucher Z.I.
78532 BUC Cedex
3D PLUS USA, Inc
2570 Eldorado Parkway
Suite 150
Mckinney, TX 75070
Tél : 33 (0)1 30 83 26 50
Fax : 33 (0)1 39 56 25 89
Tél : (214) 733-8505
Fax : (214) 733-8506
Web : www.3d-plus.com
DISTRIBUTOR
e-mail : [email protected]
e-mail : [email protected]
3D PLUS S.A. reserves the right to change or cancel products or specifications without notice
3DFP-0014-REV : 4 - SEPT. 2003