DYNEX MP02XX175-12

MP02 XX 175 Series
MP02 XX 175 Series
Dual Diode Modules
Replaces December 1998 version, DS5101-3.0
DS5101-4.0 January 2000
FEATURES
KEY PARAMETERS
1200V
VRRM
5625A
IFSM
IF(AV)(per arm)
170A
2500V
Visol
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
CIRCUIT OPTIONS
■ International Standard Footprint
■ Alumina (non-toxic) Isolation Medium
Code
Circuit
HB
APPLICATIONS
■ Rectifier Bridges
■ DC Power Supplies
G
■ Plating Rectifiers
■ Traction Systems
GN
VOLTAGE RATINGS
Type
Number
PACKAGE OUTLINE
Conditions
Repetitive
Peak
Voltages
VRRM
MP02/175 - 12
1200
Tvj = 150oC
MP02/175 - 10
1000
IRM = 30mA
MP02/175 - 08
800
VRSM = VRRM + 100V
Lower voltage grades available. For full description of part
number see "Ordering Instructions" on page 3.
CURRENT RATINGS - PER ARM
Parameter
Symbol
IF(AV)
IF(RMS)
Module outline type code: MP02.
See Package Details for further information
Mean forward current
RMS value
Conditions
Halfwave, resistive load
Tcase = 75oC
Max.
Units
Tcase = 75oC
170
A
Tcase = 85oC
152
A
Theatsink = 75oC
149
A
Theatsink = 85oC
133
A
267
A
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MP02 XX 175 Series
SURGE RATINGS - PER ARM
Symbol
IFSM
2
It
Parameter
Surge (non-repetitive) on-state current
10ms half sine;
Tj = 150oC
10ms half sine;
Tj = 150oC
2
I t for fusing
Max.
Units
VR = 0
5625
A
VR = 50% VRRM
4500
A
VR = 0
158000
A2s
VR = 50% VRRM
100000
A2s
Conditions
THERMAL & MECHANICAL RATINGS
Parameter
Symbol
Rth(j-c)
Rth(c-hs)
Thermal resistance - junction to case
per Diode
Thermal resistance - case to heatsink
per Diode
Max.
Units
dc
0.37
o
halfwave
0.38
o
3 phase
0.39
o
C/W
Mounting torque = 6Nm
with mounting compound
0.07
o
C/W
Conditions
C/W
C/W
Tvj
Virtual junction temperature
150
o
Tsto
Storage temperature range
-40 to 150
o
Visol
Isolation voltage
Commoned terminals to base plate
AC RMS, 1min, 50Hz
C
C
2.5
kV
Max.
Units
1.30
V
30
mA
CHARACTERISTICS
Symbol
Conditions
VFM
Forward voltage
At 450A , Tcase = 25oC
IRM
Peak reverse current
At VRRM, Tj = 150oC
VTO
Threshold voltage
At Tvj = 150oC
0.81
V
On-state slope resistance
At Tvj = 150oC
0.84
mΩ
rT
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Parameter
MP02 XX 175 Series
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP02 HB 175 - 12
MP
02
HB
175
12
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at Tcase = 75oC
= VRRM/100
Examples:
MP02HB175 - 12
MP02G175 - 08
MP02GN175 - 10
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of V(TO) and rT
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should be
taken to ensure no foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.
3/9
MP02 XX 175 Series
CURVES
Instantaneous forward current IF - (A)
2000
Measured under pulse conditions
1500
Tj = 150˚C
1000
500
0
0.5
1.0
1.5
2.0
Instantaneous forward voltage VF - (V)
2.5
Fig. 1 Maximum (limit) forward characteristics (Per diode)
Thermal impedance - (˚C/W)
0.4
d.c.
0.3
0.2
0.1
0
0.001
0.01
0.1
1.0
10
Time - (s)
Fig. 2 Transient thermal impedance (DC) - (Per diode)
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100
MP02 XX 175 Series
10000
I2t = Î2 x t
2
9000
7000
6000
5000
10
4000
9
8
3000
2
It
2000
7
1000
6
0
1
10
ms
1
2 3 5
10
I2t value - A2s x 104
Peak half sine wave forward current - (A)
8000
5
20 30 50
cycles at 50Hz
Duration
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150˚C)
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MP02 XX 175 Series
On-state power loss per device - (W)
350
d.c.
300
250
180˚ Rectangular
180˚ Sine
120˚ Rectangular
60˚ Rectangular
200
150
100
50
0
0
50
100
150
200
Mean forward current - (A)
250
300
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz
140
120
100
0
0
50
100
150
200
Mean forward current - (A)
d.c.
20
180˚ Rectangular
40
180˚ Sine
60
120˚ Rectangular
80
60˚ Rectangular
Maximum permissible case temperature - (˚C)
160
250
300
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz
6/9
MP02 XX 175 Series
1200
0.04 0.02 Rth(hs-a) ˚C/W
Total power - (W)
1000
R - Load
800
0.10 0.08
600
400
0.12
0.15
0.20
200
0.30
0.40
0
0
20
L - Load
60
40
80 100 120 140
0
Maximum ambient temperature - (˚C)
400
100
200
300
D.C. output current - (A)
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
1200
1000
Total power - (W)
0.08
0.04 0.02 Rth(hs-a) ˚C/W
R & L - Load
800
600
0.10
0.12
0.15
0.20
0.30
0.40
400
200
0
0
20
60
40
80 100 120 140
0
Maximum ambient temperature - (˚C)
100
200
300
D.C. output current - (A)
400
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various
values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
7/9
MP02 XX 175 Series
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
23
23
24
34
12.8
Ø6.5
13
80
1
2
3
30
2x M6
94
Nominal weight: 350g
Recommended fixings for mounting: M6 socket head cap screws
Recommended mounting torque: 6Nm (55lb.ins)
Recommended torque for electrical connections: 5Nm (44lb.ins)
Maximum torque for electrical connections: 8Nm (70lb.ins)
Module outline type code: MP02
CIRCUIT CONFIGURATIONS
1
2
3
HB
1
2
3
2
3
G
1
GN
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MP02 XX 175 Series
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e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
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These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS5101-4 Issue No. 4.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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