MPVZ4006G Rev 2, 02/2008 Freescale Semiconductor Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPVZ4006G series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for the appliance, consumer, health care and industrial market. The analog output can be read directly into the A/D input of Freescale microcontrollers. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing. MPVZ4006G INTEGRATED PRESSURE SENSOR 0 to 6 kPa (0 to 612 mm H2O) 0.3 to 4.6 V OUTPUT SMALL OUTLINE PACKAGE SURFACE MOUNT Features • • • • 2.5% Maximum Error over +10°C to +60°C with Auto Zero 5% Maximum Error over +10°C to +60°C without Auto Zero Durable Thermoplastic (PPS) Package Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations MPVZ4006GW6U CASE 1735-01 Application Examples • Washing Machine Water Level Measurement (Reference AN1950) • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Appliance Liquid Level and Pressure Measurement • Respiratory Equipment MPVZ4006G6U/T1 CASE 482-01 SMALL OUTLINE PACKAGE THROUGH-HOLE J ORDERING INFORMATION Device Type Ported Element Options Case No. MPX Series Order No. Packing Options Marking Surface Mount 1735-01 MPVZ4006GW6U Rails MZ4006GW Through-Hole 1560-02 MPVZ4006GW7U Rails MZ4006GW Surface Mount 482-01 MPVZ4006G6U Rails MPVZ4006G Surface Mount 482-01 MPVZ4006G6T1 Tape & Reel MPVZ4006G Through-Hole 482B-03 MPVZ4006G7U Rails MPVZ4006G MPVZ4006GW7U CASE 1560-02 MPVZ4006G7U CASE 482B-03 PIN NUMBERS(1) 1 N/C 5 N/C 2 VS 6 N/C 3 Gnd 7 N/C 4 Vout 8 N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. © Freescale Semiconductor, Inc., 2006, 2008. All rights reserved. VS Gain Stage #2 and Ground Reference Shift Circuitry Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Vout Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Parametric Symbol Value Units Maximum Pressure (P1 > P2) Pmax 75 kPa Storage Temperature Tstg -30° to +100° °C Operating Temperature TA +10° to +60° °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 — 6.0 612 kPa mm H2O Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current IS — — 10 mAdc Full Scale Output (2) VFSS 4.374 4.6 4.826 V Offset(3)(5) Voff 0.152 0.265 0.378 V Sensitivity V/P — 766 7.511 — mV/kPa mV/mm H2O — — — ±2.46 — — — ±5.0 %VFSS with auto zero %VFSS without auto zero Accuracy(4)(5) (10 to 60°C) 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure, at 25°C. • Offset Stability: Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. • TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 10° to 60°C, relative to 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ4006G, external mechanical stresses and mounting position can affect the zero pressure output reading. To obtain the 2.46% FSS accuracy, the device output must be “autozeroed'' after installation. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. The specified accuracy assumes a maximum temperature change of ±5°C between autozero and measurement. MPVZ4006G 2 Sensors Freescale Semiconductor ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPVZ4006G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and Fluorosilicone Gel Die Coat qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 and Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Stainless Steel Cap Die +5 V P1 Wire Bond Thermoplastic Case OUTPUT Vout Vs IPS Lead Frame 1.0 μF 0.01 μF 470 pF GND P2 Die Bond Differential Sensing Element Figure 3. Recommended Power Supply Decoupling and Output Filtering Recommendations (For additional output filtering, please refer to Application Note AN1646.) Figure 2. Cross Sectional Diagram SOP (Not to Scale) 5.0 5.0 Transfer Function (kPa): Vout = VS*[(0.1533*P) + 0.053] ± 5.0% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C 4.5 4.0 3.5 4.0 3.5 3.0 2.5 MAX 2.0 Output (V) Output (V) 3.0 TYPICAL 1.5 2.5 TYPICAL MAX 2.0 1.5 MIN 1.0 MIN 1.0 0.5 0 Transfer Function (kPa): Vout = VS*[(0.1533*P) + 0.053] ± 2.46% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C 4.5 0.5 0 2.0 4.0 Differential Pressure (kPa) Figure 4. Output versus Pressure Differential at ±5.0% VFSS (without auto zero, note 5 in Operating Characteristics) 6.0 0 0 2.0 4.0 6.0 Differential Pressure (kPa) Figure 5. Output versus Pressure Differential at ±2.46% VFSS (with auto zero, note 5 in Operating Characteristics) MPVZ4006G Sensors Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which isolates the die from the environment. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table Part Number Case Type Pressure (P1) Side Identifier MPVZ4006GW6U 1735-01 Vertical Port Attached MPVZ4006GW7U 1560-02 Vertical Port Attached MPVZ4006G6U/T1 482-01 Stainless Steel Cap 482B-03 Stainless Steel Cap MPVZ4006G7U MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 6. SOP Footprint (Case 482) MPVZ4006G 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -ANOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 -BG 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C -T- SEATING PLANE DIM A B C D G J K M N S INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 5.59 5.33 0.220 0.210 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15˚ 0˚ 15˚ 0˚ 10.54 0.415 10.29 0.405 14.22 0.560 13.72 0.540 K M J DETAIL X CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE MPVZ4006G Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ4006G 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ4006G Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ4006G 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ4006G Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ4006G 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ4006G Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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