FREESCALE MPX4080D

Pressure
Freescale Semiconductor
+
MPX4080D
Rev 4, 1/2009
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPX4080D
Series
0 to 80 kPa (0 to 11.6 psi)
0.6 to 4.9 V Output
The MPX4080D series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
•
•
•
•
3.0% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated from -40° to 105°C
Easy-to-Use, Durable Epoxy Unibody Package
ORDERING INFORMATION
Device Name
MPX4080D
Package
Options
Case
No.
None
Tray
867
•
# of Ports
Single
Dual
Gauge
Pressure Type
Differential
•
UNIBODY PACKAGE
MPX4080D
CASE 867-08
© Freescale Semiconductor, Inc., 2005, 2008, 2009. All rights reserved.
Absolute
Device Marking
MPX4080D
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
0
—
80
kPa
VS
4.85
5.1
5.35
Vdc
Io
—
7.0
10
mAdc
Voff
0.478
0.575
0.672
Vdc
Full Scale Output(4)(0 to 85°C)
@ VS = 5.1 V
VFSO
4.772
4.900
5.020
Vdc
Full Scale Span(5)(0 to 85°C)
@ VS = 5.1 V
VFSS
—
4.325
—
Vdc
Accuracy
—
—
—
3.0
%VFSS
Sensitivity
V/P
—
54
—
mV/kPa
Pressure Range
Supply Voltage
(1)
(2)
Supply Current
Minimum Pressure Offset(3)(0 to 85°C)
@ VS = 5.1 V
1. 1 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
MPX4080D
2
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings (1)
Rating
Symbol
Value
Unit
Pmax
400
kPa
Operating Temperature
TA
-40 to +105
°C
Storage Temperature
Tstg
-40 to +125
°C
Maximum Pressure
(P1 > P2)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS 3
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout 1
Pins 4, 5, and 6 Are NO CONNECTS
GND 2
Figure 1. Fully Integrated Pressure Sensor Schematic
MPX4080D
Sensors
Freescale Semiconductor
3
Pressure
On-Chip Temperature Compensation and Calibration
Figure 2 shows the sensor output signal relative to
differential pressure input. Typical, minimum, and maximum
output curves are shown for operation over a temperature
range of 0° to 85°C using the decoupling circuit shown in
Figure 4. The output will saturate outside of the specified
pressure range.
Figure 3 illustrates the differential sensing chip in the basic
chip carrier (Case 867). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the sensor
diaphragm.
Output (V)
3.5
TYP
3
2.5
MAX
2
MIN
1.5
1
0.5
kPa
PSI
0
0
10
20
30
40
50
60
70
80
Output Range (TYP)
VS = 5.1 Vdc
TA = 25°C
MPX4080
4
Span Range (TYP)
5
4.5
The MPX4080D pressure sensor operating
characteristics, internal reliability, and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Offset
(TYP)
Pressure (kPa)
Figure 2. Output versus Pressure Differential
Fluoro Silicone
Gel Die Coat
Die
Stainless Steel
Metal Cover
Epoxy Plastic
Case
Wire Bond
Lead Frame
Differential/Gauge Element
Die
Bond
Figure 3. Cross-Sectional Diagrams (not to scale)
+5.0 V
Vout
OUTPUT
Vs
IPS
1.0 µF
0.01 µF
GND
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filter
(For additional output filtering information, refer to Application Note AN1646.)
MPX4080D
4
Sensors
Freescale Semiconductor
Pressure
Transfer Function (MPX4080D)
Nominal Transfer Value:
Vout = VS (P x 0.01059 + 0.11280)
± (Pressure Error x Temp. Mult. x 0.01059 x VS)
VS = 5.1 V ± 0.25 VDC
Temperature Error Multiplier
MPX4080D
Temp.
4.0
Multiplier
- 40
0 to 85
+105
3.0
3
1
2
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
130
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 105°C.
Pressure Error Band
Error Limits for Pressure
3.0
Error (kPa)
2.0
1.0
0.0
0
20
40
60
80
100
Pressure in kPa
120
-1.0
-2.0
-3.0
MPX4080D
Pressure
Error (max)
0 to 6 kPa
0 to 60 kPa
60 to 80 kPa
± 1.8 kPa
± 1.5 kPa
± 2.3 kPa
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side is identified by the stainless steel
cap.
MPX4080D
Sensors
Freescale Semiconductor
5
Pressure
PACKAGE DIMENSIONS
C
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
M
T A
M
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
16.00
0.595
0.630 15.11
13.56
0.514
0.534 13.06
5.59
0.200
0.220
5.08
0.84
0.027
0.033
0.68
1.63
0.048
0.064
1.22
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
18.42
0.695
0.725 17.65
30˚ NOM
30˚ NOM
12.57
0.475
0.495 12.07
11.43
0.430
0.450 10.92
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT
MPX4080D
6
Sensors
Freescale Semiconductor
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MPX4080D
Rev. 4
1/2009
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