Pressure Freescale Semiconductor MPXHZ6401A Rev 0, 05/2010 Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXHZ6401A Series 50 to 400 kPa (7.25 to 58.02 psi) 0.5 to 4.5 V Output The MPXHZ6401A series pressure sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor’s packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of onchip integration make this sensor a logical and economical choice for the system designer. The MPXHZ6401A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Features • • • • • • Resistant to High Humidity and Common Automotive Media Improved Accuracy at High Temperature 1.5% Maximum Error over 0°C to 85°C Temperature Compensated from -40°C to +125°C Durable Thermoplastic (PPS) Surface Mount Package (SSOP) with Optional Axial Port Ideally Suited for Microprocessor or Microcontroller–Based Systems ORDERING INFORMATION Device Name Device Type Options Package Options Case No. Device Marking Super Small Outline Package (MPXHZ6401A Series) MPXHZ6401A6U MPXHZ6401A6T1 Basic Element Absolute, Element Only Rail 1317 MPXHZ6401A Absolute, Element Only Tape & Reel 1317 MPXHZ6401A SUPER SMALL OUTLINE PACKAGES MPXHZ6401A6U/6T1 CASE 1317 © Freescale Semiconductor, Inc., 2010. All rights reserved. Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Characteristic Symbol Min Typ Max Unit Pressure Range POP 50 — 400 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Minimum Pressure Offset @ VS = 5.0 Volts(2) (0 to 85°C) Voff 0.437 0.5 0.563 Vdc Full Scale Output @ VS = 5.0 Volts(3) (0 to 85°C) VFSO 4.438 4.501 4.563 Vdc Full Scale Span (0 to 85°C) VFSS — 4.0 — V V/P — 11.43 — mV/kPa — -1.58 — 1.58 %VFSS Sensitivity Accuracy(4) (0 to 85°C) 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Scan (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Accuracy (error budget) is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of VFSS at 25°C due to all sources of error including the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: Offset Stability: TcSpan: TcOffset: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, -40°C to 125°C and 1.5 million pressure cycles, with minimum rated pressure applied. Output deviation over the temperature range of 0°C to 85°C, relative to 25°C. Output deviation with minimum rated pressure applied, over the temperature range of 0°C to 85°C, relative to 25°C. MPXHZ6401A 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) Pmax 1200 kPa Storage Temperature Tstg -40° to +125° °C Operating Temperature TA -40° to +125° °C Output Source Current @ Full Scale Output(2) I o+ +0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io - -0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from VOUT to Gnd or VOUT to VS in the application circuit. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND 3 Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic MPXHZ6401A Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear–stress strain gauge, temperature compensation, calibration, and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the configuration in the basic chip carrier (case 1317) prior to porting. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable thermoplastic package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as common automotive media. NOTE: The MPXHZ6401A series pressure sensor’s operating characteristics, internal reliability and qualification Fluoro Silicone Gel Die Coat +5.0 V Stainless Steel Cap Die Wire Bond tests are based on use of air as the pressure media. Media, other than air, may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0°C to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. P1 VS Pin 2 Thermoplastic Case MPXHZ6401A 100 nF Lead Frame to ADC Vout Pin 4 47 pF GND Pin 3 51 K Die Bond Absolute Element Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 3. Typical Application Circuit (Output Source Current Operation) 5.0 Vout = Vs * [(0.002286 * P) - 0.01429 ± 5.5 * 0.002286 * Vs * Tm] 4.5 VS = 5.0 ± 0.25 Vdc 4.0 Temperature = 0°C to 85°C Output (Volts) 3.5 3.0 2.5 MAX TYP 2.0 1.5 1.0 450 400 350 300 250 150 100 50 0 0 200 MIN 0.5 Pressure (kPa) Figure 4. Output vs. Absolute Pressure MPXHZ6401A 4 Sensors Freescale Semiconductor Pressure Temperature Error Band MPXHZ6401A SERIES 4.0 Break Points 3.0 Temperature Error Factor (Tm) 2.0 Temp Multiplier - 40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 80 60 100 120 140 Temperature in Cº NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC Pressure Error Band Error Limits for Pressure Pressure Error (kPa) 10 5 0 -5 -10 50 100 150 200 250 300 350 400 Pressure (in kPa) Pressure 50 to 400 (kPa) Error (Max) ±5.5 (kPa) MPXHZ6401A Sensors Freescale Semiconductor 5 Pressure MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.050 1.27 TYP solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317) MPXHZ6401A 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6401A Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6401A 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6401A Sensors Freescale Semiconductor 9 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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