MURB1620CTG, NRVUB1620CTT4G SWITCHMODE Power Rectifier D2PAK Power Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features • • • • • • • • • • Package Designed for Power Surface Mount Applications Ultrafast 35 Nanosecond Recovery Times 175°C Operating Junction Temperature Epoxy Meets UL 94 V−0 @ 0.125 in High Temperature Glass Passivated Junction Low Leakage Specified @ 150°C Case Temperature Short Heat Sink Tab Manufactured − Not Sheared! Similar in Size to Industrial Standard TO−220 Package NRVUB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* http://onsemi.com ULTRAFAST RECTIFIER 16 AMPERES, 200 VOLTS D2PAK CASE 418B STYLE 3 1 4 3 MARKING DIAGRAM AY WW U1620G AKA Mechanical Characteristics: • Case: Epoxy, Molded, Epoxy Meets UL 94, V−0 • Weight: 1.7Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8000 V) A Y WW U1620 G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION Package Shipping† D2PAK 50 Units / Rail MURB1620CTT4G D2PAK (Pb−Free) 800 / Tape & Reel NRVUB1620CTT4G D2PAK (Pb−Free) 800 / Tape & Reel Device MURB1620CTG *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 November, 2012 − Rev. 7 1 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MURB1620CT/D MURB1620CTG, NRVUB1620CTT4G MAXIMUM RATINGS (Per Leg) Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (Rated VR, TC = 150°C) Total Device IF(AV) 8.0 16 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 150°C) IFM Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction and Storage Temperature Range TJ, Tstg A 16 A 100 −65 to +175 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS (Per Leg) Characteristic Symbol Value Unit Maximum Thermal Resistance, Junction−to−Case RqJC 3 °C/W Maximum Thermal Resistance, Junction−to−Ambient RqJA 50 °C/W TL 260 °C Symbol Max Unit Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 8 A, TC = 150°C) (iF = 8 A, TC = 25°C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TC = 150°C) (Rated DC Voltage, TC = 25°C) iR Maximum Reverse Recovery Time (IF = 1 A, di/dt = 50 A/ms) (IF = 0.5 A, iR = 1 A, IREC = 0.25 A) trr V 0.895 0.975 mA 250 5 ns 35 25 100 10 K 50 1.0 K 400 I R, REVERSE CURRENT (A) μ i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0% 20 10 5.0 2.0 1.0 0.7 TJ = 175°C 100°C 25°C 0.3 0.1 0.2 100 TJ = 175°C 20 4 100°C 1 25°C 0.2 0.04 0.4 0.6 0.8 vF, INSTANTANEOUS VOLTAGE (V) 1 1.2 0.01 0 Figure 1. Typical Forward Voltage, Per Leg 20 40 60 100 120 140 80 VR, REVERSE VOLTAGE (V) 160 180 200 Figure 2. Typical Reverse Current, Per Leg* http://onsemi.com 2 10 RATED VR APPLIED RqJC = 3°C/W 9.0 8.0 DC 7.0 6.0 5.0 4.0 SQUARE WAVE 3.0 2.0 1.0 0 140 150 180 160 170 TC, CASE TEMPERATURE (°C) PF(AV), AVERAGE POWER DISSIPATION (WATTS) I F(AV), AVERAGE POWER DISSIPATION (WATTS MURB1620CTG, NRVUB1620CTT4G 10 9.0 TJ = 175°C 8.0 7.0 SQUARE WAVE 6.0 DC 5.0 4.0 3.0 2.0 1.0 0 0 1 9 10 Figure 4. Power Dissipation, Per Leg 1 D = 0.5 0.5 0.2 P(pk) 0.1 0.1 0.05 0.01 ZqJC(t) = r(t) RqJC D curves apply for power pulse train shown read time at T1 t1 0.05 t2 Duty Cycle, D = t1/t2TJ(pk) - TC = P(pk) ZqJC(t) SINGLE PULSE 0.02 0.01 0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10 20 50 t, TIME (ms) Figure 5. Thermal Response 1K 300 C, CAPACITANCE (pF) r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED Figure 3. Current Derating Case, Per Leg 2 3 4 5 6 7 8 IF(AV), AVERAGE FORWARD CURRENT (AMPS) TJ = 25°C 100 30 10 1 10 VR, REVERSE VOLTAGE (V) Figure 6. Typical Capacitance, Per Leg http://onsemi.com 3 100 100 200 500 MURB1620CTG, NRVUB1620CTT4G PACKAGE DIMENSIONS D2PAK 3 CASE 418B−04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. C E −B− V W 4 1 2 A S 3 −T− SEATING PLANE K J G D 3 PL 0.13 (0.005) VARIABLE CONFIGURATION ZONE W H M T B M N R P L L M M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE U L M DIM A B C D E F G H J K L M N P R S V MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MURB1620CTG, NRVUB1620CTT4G ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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