NJL5901R-2 COBP PHOTO REFLECTOR GENERAL DESCRIPTION The NJL5901R-2 is the compact surface mount type photo reflector, which is permitted the Lead(Pb)-free reflow soldering (260℃ , 2 Times). The NJL5901R-2 has realized the compact package compared with conventional product/NJL5901AR-1. FEATURES • Miniature, thin package : 1.0mm × 1.4mm × 0.6mm • Pb free solder re-flowing permitted : 260°C, 2times • Built-in visible light cut-off filter APPLICATIONS • Detecting the location of Lens unit for Cellular Phone’s camera module • Detecting the watch hand for radio controlled watch • Detecting the location of CD/DVD optical pickup head • Detecting the rotation of various motors • Paper edge detection and mechanism timing detection of facsimile, copy machine etc ABSOLUTE MAXIMUM RATINGS (Ta=25°C) PARAMETER Emitter Forward Current (Continuous) Reverse Voltage (Continuous) Power Dissipation SYMBOL RATINGS UNIT IF VR PD 20 6 45 mA V mW Detector Collector-Emitter Voltage Emitter-Collector Voltage Collector Current Collector Power Dissipation VCEO VECO IC PC 16 6 10 25 V V mA mW Coupled Total Power Dissipation Operating Temperature Storage Temperature Reflow Soldering Temperature Ptot Topr Tstg Tsol 60 -30 to +85 -40 to +100 260 mW °C °C °C ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C) PARAMETER Emitter Forward Voltage Reverse Current Capacitance SYMBOL TEST CONDITION MIN TYP MAX UNIT — — 1.3 10 25 — V μA pF — — 0.2 — — 412 5 20 20 — — VF IR Ct IF=4mA VR=6V VR=0V,f=1MHz 0.9 — — Detector Dark Current Collector-Emitter Voltage ICEO VCEO VCE=10V IC=100μA 16 Coupled Output Current*1 Operating Dark Current *2 Rise Time Fall Time IO ICEOD tr tf IF=4mA,VCE=2V,d=0.7mm IF=4mA,VCE=2V IO=100μA,VCE=2V,RL=1KΩ,d=0.7mm IO=100μA,VCE=2V,RL=1KΩ,d=0.7mm — 165 — — — — μA V μA μA μs μs *1 Refer to OUTPUT CURRENT TEST CONDITION *2 Iceod may increase according to the periphery situation of the surface mounted product. 28.Jan.2010 Rev.1.2 -1– NJL5901R-2 OUTLINE (typ.) Unit : mm 1.4 (0.05) E (0.05) 0.15 K C LED Center (0.34) PTx Center Ａ：Ａｎｏｄｅ 0.6 0.3 0.6 0.3 0.6 Ｋ：Ｃａｔｈｏｄｅ 0.3 (0.25) (0.05) 0.3 0.15 (0.25) (0.24) 1.0 0.3 A 0.45 (0.05) (0.6) 0.45 0.3 Ｃ：Ｃｏｌｌｅｃｔｏｒ Ｅ：Ｅｍｉｔｔｅｒ PCB Pattern OUTPUT CURRENT TEST CONDITION DARK CURRENT TEST CONDITION The infrared signal from LED is reflected at the aluminum surface ( 0.6mm) Aluminum Evaporation Surface 1.3 mm Light Sealed Dark Box IF Iceod IF Io VCE VCE 28.Jan.2010 Rev.1.2 -2– NJL5901R-2 RESPONSE TIME TEST CONDITION Al evaporation surface INPUT Vcc 50% RD INPUT OUTPUT 90% OUTPUT 10% RL td ts tr tf EDGE RESPONSE TEST CONDITION l=0mm l=0mm LED side LED side 0.7mm Aluminum Evaporation Surface Aluminum Evaporation Surface Direction-X 28.Jan.2010 Rev.1.2 0.7mm Direction-Y -3– NJL5901R-2 ■ TYPICAL CHARACTERISTCS Forward Current vs. Temperature 100 50 90 45 80 40 Forward Current IF(mA) Power Dissipation P(mW) Power Dissipation vs. Temperature 70 60 Total Power 50 Dissipation Total Power Dissipation 40 30 20 35 30 25 20 15 10 Collector Power 10 5 Dissipation 0 0 0 20 40 60 80 100 0 20 Ambient Temperature Ta(°C) 40 60 80 100 Ambient Temperature Ta(°C) Forward Voltage vs. Forward Current Forward Voltage vs. Temperature 100 1.6 Forward Voltage VF(V) Forward Current IF(mA) 1.4 10 IF=20mA 1.2 IF=4mA 1 0.8 1 0.0 1.0 -40 2.0 -20 20 40 60 80 100 Ambient Temperature Ta(°C) Forward Voltage VF(V) Dark Current vs. Temperature Operating Dark Current vs. Temperature 1000 10 Operating Dark Current Iceod(μA) 100 Dark Current Iceo(nA) 0 10 1 VCE=10V 0.1 0.01 0.001 1 IF=4mA , VCE=2V 0.1 0.01 -40 -20 0 20 40 60 Ambient Temperature Ta(°C) 28.Jan.2010 Rev.1.2 80 100 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) -4– NJL5901R-2 Output Current vs. Forward Current (Ta=25°C) Output Current vs. Temperature 1200 120 Relative Output Current Io/Io(25°C)(%) 1100 1000 Output Current Io(μA) 900 800 700 600 500 400 300 200 VCE=2V , d=0.7mm 100 80 60 40 IF=4mA , VCE=2V 20 100 0 0 0 2 4 6 8 -40 10 -20 Forward Current IF(mA) 0 20 40 60 80 100 Ambient Temperature Ta(°C) Output Characteristics (Ta=25°C) Vce Saturation (Ta=25°C) 0.500 1200 1100 IF=8mA 900 Output Current Io(μA) Collector-Emitter Voltage Vce(V) IF=10mA 1000 800 700 IF=6mA 600 500 400 IF=4mA 300 200 0.400 0.300 Io=400μA Io=300μA Io=200μA 0.200 Io=100μA 0.100 IF=2mA 100 0 0.000 0 1 2 3 4 0.1 5 1.0 Output Current vs. Distance (Ta=25°C) Output Current vs. Edge Distance (Ta=25°C) 120 Relative Output Current Io/Io(max.)(%) 120 Relative Output Current Io/Io(max.)(%) 10.0 Forward Current IF(mA) Collector-Emitter Voltage Vce(V) 100 IF=4mA , VCE=2V 80 60 40 20 0 IF=4mA , VCE=2V , d=0.7mm 100 Direction Y 80 60 Direction X 40 20 0 0 0.5 1 1.5 2 Reflector Distance d(mm) 28.Jan.2010 Rev.1.2 2.5 3 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Edge Distance l(mm) -5– NJL5901R-2 Spectral Response (Ta=25°C) Detector 120 120 100 100 IF=4mA Relative Response (%) Relative Response (%) Spectral Response (Ta=25°C) Emitter 80 60 40 VCE=2V 80 tr 60 tf 40 td 20 20 0 700 800 900 1000 0 500 1100 Wavelength λ(nm) 600 700 800 900 VCE=2V , Io=100μA 1000 Wavelength λ(nm) Switching Time vs. Load Resistance (Ta=25°C) 100 tf Switching Time t(μs) tr 10 td ts VCE=2V , Io=100μA 1 0.1 0.1 1 10 Load Resistance RL(kΩ) Attention: Please be aware that all data in the graph are just for reference and not for guarantee. 28.Jan.2010 Rev.1.2 -6– NJL5901R-2 ■ MOUNTING METHOD NOTE Mounting was evaluated with the following profiles in our company, so there was no problem. However, confirm mounting by the condition of your company beforehand. Mounting: Twice soldering is allowed. ■ INFRARED REFLOW SOLDERING METHOD Recommended reflow soldering procedure f 260°C e 230°C 220°C d 180°C 150°C a : Temperature ramping rate b : Pre-heating temperature time c : Temperature ramping rate d : 220°C or higher time e : 230°C or higher time f : Peak temperature : 1 to 4°C/s : 150 to 180°C : 60 to 120s : 1 to 4°C /s : Shorter than 60s : Shorter than 40s g : Temperature ramping rate : 1 to 6°C /s : Lower than 260°C The temperature of the surface of mold package Room Temp. a b c g (NOTE1) Using reflow furnace with short wave infrared radiation heater such as halogen lamp Regarding temperature profile, please refer to those fo reflow furnace. In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black colored mold resin. Therefore, please avoid from direct exposure to mold resin. (NOTE2) Other method Such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS) are not appropriate because the body of device will be heated rapidly. Therefore, these are not recommended to apply. (NOTE3) The resin gets softened right after soldering, so, the following care has to be taken Not to contact the lens surface to anything. Not to dip the device into water or any solvents. ■ FLOE SOLDERING METHOD Flow soldering is not possible. ■ IRON SOLDERING METHOD Iron soldering is not possible. 28.Jan.2010 Rev.1.2 -7– NJL5901R-2 ■ CLEANING Avid washing the device after soldering by reflow method. ■ IC STORAGE CONDITIONS AND ITS DURATION (1) Temperature and humidity ranges Pack Sealing Temperature: Humidity: Pack Opening Temperature: Humidity: 5 to 40 [°C] 40 to 80 [%] 5 to 40 [°C] 40 to 60 [%] After opening the bag, solder products within 48h. Avoid a dry environment below 40% because the products are is easily damageable by the electrical discharge. Store the products in the place where it does not create dew with the products due to a sudden change in temperature. (2) When baking, place the reel vertically to avoid load to the side. (3) Do not store the devices in corrosive-gas atmosphere. (4) Do not store the devices in a dusty place. (5) Do not expose the devices to direct rays of the sun. (6) Do not allow external forces or loads to be applied to IC’s. (7) BE careful because affixed label on the reel might be peeled off when baking. ■ BAKING In case of keeping expect above condition be sure to apply baking. (Heat-resistant tape) Baking method: Ta=60°C, 48 to 72h, Three times baking is allowed Ta=100°C, 2 to 6h, Three times baking is allowed ■ STORAGE DURATION Within a year after delivering this device. For the products stored longer than a year, confirm their terminals and solderability before they are used. ■ APPLICATION NOTES (1) Attention in handling Treat not to touch the lens surface. Avoid dust and any other foreign materials on the lens surface such as point, bonding material, etc. Never to apply reverse voltage (VEC) of more than 6V on the photo transistor when measuring the characteristics or adjusting the system. If applied, it causes to lower the sensitivity. When mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object. 28.Jan.2010 Rev.1.2 -8– NJL5901R-2 ■ PACKING SPECIFICATION PACKING DIMENTIONS UNIT : mm Drawing direction P2 Insert direction φ D0 P0 T SYMBOL DIMENSION REMARKS A 1.15 ±0.05 BOTTOM DIMENSION B 1.60 ±0.05 BOTTOM DIMENSION A φ D1 +0.10 0 E 0.60 ±0.05 1.75 ±0.10 F 3.50 ±0.05 F D1 P0 4.00 ±0.10 P1 4.00 ±0.10 W P1 1.50 E B (TE1) W1 D0 T1 P2 2.00 ±0.05 T0 0.20 ±0.05 T1 0.76 ±0.05 W0 8.00 ±0.10 W1 5.40 ±0.10 THICKNESS 0.1MAX * Carrier tape material : Polycarbonate(antistatic) Cover tape material : Polyester(antistatic) ■ Taping Strength Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 70g. ■ Packaging 1) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification 2-1) Start rolling : Carrier tape open space more than 20 Pieces. 2-2) End of rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 2,000 Pieces 4) Seal off after putting each reels in a damp proof bag with silica gel. SYMBOL D E A B C D C E DIMENSION φ180 ±1.0 φ60 ±1.0 φ13 ±0.2 φ21 ±0.8 2.0 ±0.5 W0 9.5 ±0.5 W1 14.5 ±0.5 [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. 28.Jan.2010 Rev.1.2 -9–