NLU3G16 Triple Non-Inverting Buffer The NLU3G16 MiniGatet is an advanced high-speed CMOS triple non-inverting buffer in ultra-small footprint. The NLU3G16 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. http://onsemi.com Features •High Speed: tPD = 3.5 ns (Typ) @ VCC = 5.0 V •Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C •Power Down Protection Provided on inputs •Balanced Propagation Delays •Overvoltage Tolerant (OVT) Input and Output Pins •Ultra-Small Packages •These are Pb-Free Devices IN A1 1 8 VCC OUT Y3 2 7 OUT Y1 IN A2 3 6 IN A3 MARKING DIAGRAMS 1 UDFN8 1.8 x 1.2 CASE 517AJ UYM G RM 1 ULLGA8 1.45 x 1.0 CASE 613AA 1 ULLGA8 1.6 x 1.0 CASE 613AB LRM G ULLGA8 1.95 x 1.0 CASE 613AC LRM G 8 1 4 GND 5 UY, R or LR = Specific Device Code M = Date Code G = Pb-Free Package OUT Y2 Figure 1. Pinout (Top View) PIN ASSIGNMENT IN A1 IN A2 IN A3 1 1 1 OUT Y2 OUT Y2 OUT Y3 Figure 2. Logic Symbol 1 IN A1 2 OUT Y3 3 IN A2 4 GND 5 OUT Y2 6 IN A3 7 OUT Y1 8 VCC FUNCTION TABLE A Y L H L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2008 March, 2008 - Rev. 2 1 Publication Order Number: NLU3G16/D NLU3G16 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V DC Output Voltage -0.5 to +7.0 V VIN < GND -20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range -65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 Latchup Performance Above VCC and Below GND at 125°C (Note 2) UL 94 V-0 @ 0.125 in ±500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN Digital Input Voltage VOUT Output Voltage TA Operating Free-Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V http://onsemi.com 2 Min Max Unit 1.65 5.5 V 0 5.5 V 0 5.5 V -55 +125 °C 0 0 100 20 ns/V NLU3G16 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL VOH VOL Parameter VCC (V) Conditions Low-Level Input Voltage Low-Level Input Voltage High-Level Output Voltage Low-Level Output Voltage TA = 25 5C Min Typ TA = +855C Max Min 1.65 0.75 x VCC 0.75 x VCC 2.3 to 5.5 0.70 x VCC 0.70 x VCC Max TA = -555C to +1255C Min Max V 1.65 0.25 x VCC 0.25 x VCC 0.25 x VCC 2.3 to 5.5 0.30 x VCC 0.30 x VCC 0.30 x VCC VIN = VIH or VIL IOH = -50 mA 2.0 3.0 4.5 1.9 2.9 4.4 VIN = VIH or VIL IOH = -4 mA IOH = -8 mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50 mA 2.0 3.0 4.5 VIN = VIH or VIL IOL = 4 mA IOL = 8 mA 2.0 3.0 4.5 Unit 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.80 2.34 3.66 V V V 0 0 0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 1.0 10 40 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol Parameter VCC (V) Test Condition tPLH, tPHL Propagation Delay, Input A to Output Y 3.0 to 3.6 4.5 to 5.5 CIN Input Capacitance CPD Power Dissipation Capacitance (Note 3) TA = 25 5C Min TA = +855C Typ Max CL = 15 pF 4.5 7.1 CL = 50 pF 6.4 CL = 15 pF CL = 50 pF 5.0 Max Unit 8.5 10 ns 10.6 12 14.5 3.5 5.5 6.5 8.0 4.5 7.5 8.5 10 4.0 10 10 10 8.0 Min Max TA = -555C to +1255C Min pF pF 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. http://onsemi.com 3 NLU3G16 SWITCHING WAVEFORMS TEST POINT VCC 50% OUTPUT A GND DEVICE UNDER TEST tPHL tPLH 50% VCC CL * Y *Includes all probe and jig capacitance Figure 3. Switching Waveforms Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† UDFN8 (Pb-Free) 3000 / Tape & Reel NLU3G16AMX1TCG ULLGA8, 1.95 x 1.0, 0.5P (Pb-Free) 3000 / Tape & Reel NLU3G16BMX1TCG ULLGA8, 1.6 x 1.0, 0.4P (Pb-Free) 3000 / Tape & Reel NLU3G16CMX1TCG ULLGA8, 1.45 x 1.0, 0.35P (Pb-Free) 3000 / Tape & Reel Device NLU3G16MUTAG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLU3G16 PACKAGE DIMENSIONS UDFN8 1.8x1.2, 0.4P CASE 517AJ-01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B D 0.10 C PIN ONE REFERENCE ÉÉÉ L1 E DETAIL A NOTE 5 0.10 C TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW A1 e/2 e (b2) C DETAIL A 8X 1 4 8 5 SEATING PLANE L MOUNTING FOOTPRINT SOLDERMASK DEFINED (L2) BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF 8X b 8X 0.10 M C A B 0.05 M C 0.66 7X 0.22 NOTE 3 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS http://onsemi.com 5 NLU3G16 PACKAGE DIMENSIONS ULLGA8 1.45x1.0, 0.35P CASE 613AA-01 ISSUE A ÉÉÉ ÉÉÉ ÉÉÉ PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW A1 C e L MOUNTING FOOTPRINT SOLDERMASK DEFINED* 7X e/2 1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 7X 0.48 NOTE 4 8X 0.22 4 L1 1.18 8 5 8X b 0.53 0.10 C A B BOTTOM VIEW 0.05 C 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NLU3G16 PACKAGE DIMENSIONS ULLGA8 1.6x1.0, 0.4P CASE 613AB-01 ISSUE A PIN ONE REFERENCE 0.10 C 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 8X 0.05 C MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 SEATING PLANE SIDE VIEW C A1 MOUNTING FOOTPRINT SOLDERMASK DEFINED* 7X e/2 0.49 e 1 7X L NOTE 4 8X 0.26 4 L1 1.24 8 5 8X b 0.53 0.10 C A B BOTTOM VIEW 0.05 C NOTE 3 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLU3G16 PACKAGE DIMENSIONS ULLGA8 1.95x1.0, 0.5P CASE 613AC-01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 7X e/2 e 7X L 0.49 NOTE 4 8X 0.30 4 1 L1 1.24 8 5 8X BOTTOM VIEW b 0.10 C A B 0.05 C 0.53 1 PKG OUTLINE NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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