NUF8000MU Low Capacitance 8 Line EMI Filter with ESD Protection in UDFN Package This device is an 8 line EMI filter array for wireless applications. Greater than -30 dB typical attenuation is obtained at frequencies from 800 MHz to 5.0 GHz. The NUF8000MU has a typical cut-off frequency of 95 MHz. This UDFN package is specifically designed to enhance EMI filtering for low-profile or slim design electronics especially where space and height is a premium. It also offers ESD protection-clamping transients from static discharges. ESD protection is provided across all capacitors. Features http://onsemi.com 16 1 Cd Cd 2 15 Cd Cd 3 •EMI Filtering and ESD Protection •Integration of 40 Discrete Components •Compliance with IEC61000-4-2 (Level 4) •UDFN Package, 1.2 x 3.5 mm, 0.4 mm Pitch •Moisture Sensitivity Level 1 •ESD Ratings: Machine Model = C 14 Cd Cd 4 13 Cd Cd Cd Cd 5 Human Body Model = 3B 12 6 11 •This is a Pb-Free Device* Cd Benefits Cd 10 7 •Reduces EMI/RFI Emissions on a Data Line •Low Profile Package; Typical Height of 0.5 mm •Design-Friendly and Easy-to-Use Pin Configurations, Cd Cd 8 9 Cd Particularly for Portable Electronics •Integrated Solution Offers Cost and Space Savings in UDFN Package •Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response •Integrated Solution Improves System Reliability Cd (Top View) MARKING DIAGRAM 16 1 Applications 800 M G UDFN16 MU SUFFIX CASE 517AF •EMI Filtering and ESD Protection for Data Lines •Keypad Interface and Protection for Portable Electronics •Bottom Connector Interface for Mobile Handsets •Notebook Computers and Digital Cameras •LCD Display Interface in Mobile Handsets •Camera Display Interface in Mobile Handsets 800 M G 1 = Specific Device Code = Date and Assembly Location = Pb-Free Package ORDERING INFORMATION *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2007 October, 2007 - Rev. 0 1 Device Package Shipping† NUF8000MUT2G UDFN16 (Pb-Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF8000MU/D NUF8000MU MAXIMUM RATINGS Parameter Symbol ESD Discharge IEC61000-4-2 Value VPP Unit kV Contact Discharge 8.0 Operating Temperature Range TOP -40 to 85 °C Storage Temperature Range TSTG -55 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Symbol Test Conditions Min Typ VRWM VBR IR = 1.0 mA Leakage Current IR VRWM = 3.3 V Resistance RA IR = 20 mA Capacitance (Notes 1 and 2) Cd Cut-Off Frequency (Note 3) f3dB Above this frequency, appreciable attenuation occurs 1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz. 2. Total Line Capacitance is 2 times the Diode Capacitance (Cd). 3. 50 source and 50 load termination. http://onsemi.com 2 Max Unit 5.0 V 8.0 V 6.0 7.0 100 nA 85 100 115 15 20 pF 95 MHz NUF8000MU TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified) 0 0 -5 -10 -10 -20 -30 S41 (dB) S21 (dB) -15 -20 -25 -30 -50 -60 -35 -70 -40 -45 1.E+06 1.E+07 1.E+08 1.E+09 -80 10.0E+6 1.E+10 1.0E+9 10.0E+9 FREQUENCY (Hz) Figure 1. Typical Insertion Loss Characteristic Figure 2. Typical Analog Crosstalk 2 1.05 1.5 1.025 1 0.5 1 2 3 4 1 0.975 0.95 -40 0 0 100.0E+6 FREQUENCY (Hz) RESISTANCE () NORMALIZED CAPACITANCE -40 5 -20 0 20 40 60 80 REVERSE VOLTAGE (V) TEMPERATURE (°C) Figure 3. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance Cd at 2.5 V) Figure 4. Typical Resistance over Temperature http://onsemi.com 3 NUF8000MU PACKAGE DIMENSIONS UDFN16, 3.5x1.2, 0.4P CASE 517AF-01 ISSUE B 0.10 C PIN ONE REFERENCE 2X ÉÉÉÉ ÉÉÉÉ 0.10 C ÉÉ ÇÇ ÉÉ A B D 2X E A1 A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DETAIL A TOP VIEW (A3) DETAIL A DIM A A1 A3 b D D2 E E2 e K L A 0.10 C 16X SEATING PLANE 0.08 C SIDE VIEW D2 16X C A1 14X SOLDERING FOOTPRINT* e L 8 1 1.35 E2 1 16X K 16 9 BOTTOM VIEW 16X MILLIMETERS MIN NOM MAX 0.45 0.50 0.55 0.00 0.03 0.05 0.127 REF 0.15 0.20 0.25 3.50 BSC 2.70 2.80 2.90 1.20 BSC 0.20 0.30 0.40 0.40 BSC 0.20 ----0.20 0.25 0.30 b 0.10 C A B 0.05 C 0.35 0.30 NOTE 3 0.10 2.85 15X 0.40 PITCH 0.20 16X 0.32 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NUF8000MU/D