DISCRETE SEMICONDUCTORS DATA SHEET OM3105P Hybrid integrated circuits for inductive proximity detectors Preliminary specification File under Discrete Semiconductors, SC17 Philips Semiconductors January 1994 Philips Semiconductors Preliminary specification Hybrid integrated circuits for inductive proximity detectors OM3105P FEATURES DESCRIPTION • Extra small dimensions (3 x 20 mm max.) The OM3105P is a hybrid integrated circuit intended for inductive proximity detectors in a tubular construction, especially the M5 hollow stud. The circuit performs a make function (version 1): when actuated, the current flows through the load, which can be for example a LED or an optocoupler. It is also possible to perform a break function when using version OM3115P. • Wide supply voltage range (6 to 35 V) • Supply current typical 1.5 mA (output stage switched off) • High output current (250 mA max.) • RC filter on the supply lines • PNP output transistor protected against transients from the inductive load Available versions: OM3105P: pnp output; make function • Circuit protected against wrong polarity connection of the supply voltage OM3115P: pnp output; break function OM3105N: npn output; make function • Electronic short-circuit protection OM3115N: npn output; break function • Detection distance adjustable by a chip resistor (Rd), type 1206 OM31.5./0: for external LED connection. • Only a simple coil in one part is required; e.g. the OM2860 requires a coil in two parts • Hysteresis adjustable by a chip resistor (Rh), type 0603, for using the OM3105P with other then M5 coils • Status of the output is shown by a yellow or red LED mounted on the substrate surface • The OM3105P is also available without a LED, but with an output pad for external LED connection • A version with a NPN output transistor is available (OM3105P). QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYP. DC supply voltage IO output current VB = 24 V; Ts = 25 °C − 250 mA fsw operating switching frequency M5 coil − 5 kHz Ts operating substrate temperature −20 +70 °C 2 35 UNIT VB January 1994 6 MAX. V Philips Semiconductors Preliminary specification Hybrid integrated circuits for inductive proximity detectors OM3105P MECHANICAL DATA 20 max 8 3 3 max 7.75 inductive load 1 7 0.3 5 2 MSA936 - 1 6 4 Dimensions in mm. Coil: Ø 0.063 mm Cu wire, 80 turns. Potcore: 3.3 x 1.3 mm. Fig.1 Outline and connections. PAD INFORMATION PAD NUMBER January 1994 DESCRIPTION 1 output 2 negative supply (−) 3 positive supply (+) 4 coil connection 5 coil connection 6 Rd resistor (type 1206) for adjusting the detection distance 7 Rt resistor (type 0603) for adjusting the stability with temperature variations 8 Rh resistor (type 0603) for adjusting the hysteresis 3 Philips Semiconductors Preliminary specification Hybrid integrated circuits for inductive proximity detectors OM3105P LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VB DC supply voltage 6 35 V IO output current; Ts = 25 °C − 250 mA Tstg storage temperature −40 +125 °C Ts operating substrate temperature −20 +70 °C CHARACTERISTICS VB = 24 V (DC); Ts = 25 °C; unless otherwise specified. SYMBOL PARAMETER IB CONDITIONS supply current TYP. MAX. UNIT output stage ON 11 − mA output stage OFF 1.5 − mA Vd voltage drop IO = 250 mA 1 1.5 V d detection distance coil M5 0.8 − mm MBD233 1.0 MBD235 1.0 d (mm) d (mm) d off d off 0.9 0.9 d on d on 0.8 0.8 20 0 20 40 80 60 Ts Fig.2 6 (o C) Fig.3 Switching distance as a function of the substrate temperature. January 1994 4 12 18 24 V (V) 30 B Switching distance as a function of the DC supply voltage. Philips Semiconductors Preliminary specification Hybrid integrated circuits for inductive proximity detectors OM3105P MBD234 400 I O max (mA) 350 300 250 200 150 20 Fig.4 0 20 40 60 80 Ts (o C) Overload protection as a function of the substrate temperature. MOUNTING RECOMMENDATIONS Potting recommendations General First cover the hybrid IC with about 0.5 mm of silicone rubber, let it harden and with the parts inserted in the tube, fill up the tube with epoxy. If a protective cap is incorporated, it should be as thin as possible, because its thickness “d” forms part of the operating distance “S”. A brass stud wall should not extend beyond the potcore. The exact value of “S” with its spread is determined by a number of variables, e.g.: d value of the adjustment resistor Rx, the oscillator coil, the metal of the actuator, the material and shape of the housing. Soldering recommendations • Use normal 60/40 solder. • Use a soldering iron with a fine point. • Soldering time should be kept to a minimum, not exceeding 2.5 s per soldering point (Tsld = 250 °C maximum). MSB318 • The substrate should preferably be pre-heated to a temperature of 100 °C with a minimum of 80 °C and a maximum of 125 °C. January 1994 Fig.5 Insertion of potcore in brass tube. 5 Philips Semiconductors Preliminary specification Hybrid integrated circuits for inductive proximity detectors OM3105P DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1994 6 Philips Semiconductors Preliminary specification Hybrid integrated circuits for inductive proximity detectors NOTES January 1994 7 OM3105P Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. 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