8 Watts General Specifications Resistive Element: Substrate: Terminals: Thick film Beryllium oxide ceramic Thick film silver Surface Mount Attenuators Model RFP-250250-4AAXX Surface Mount Attenuators Electrical Specifications Attenuation Value: Features 1, 2, 3, 4, 5, 6, 9, 10, 20 or 30 dB DC - 2.5 GHz 8 Watts Frequency Range: Power: • DC - 2.5 GHz • 8 Watts Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +150°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. • BeO Ceramic • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Outline Drawing TOP VIEW SIDE VIEW BOTTOM VIEW .250 .230 .040 RFP AA XXdB HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING Note: XX denotes attenuation value. .060 .250 .170 .115 .055 .085 .165 VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Surface Mount Attenuators Model RFP-250250-4AAXX Specifications PART NUMBER ATTENUATION (dB)TOL. (+/-dB) WIDTH LENGTH THK POWER (WATTS) VSWR FREQ.(GHz) RFP-250250-4AA1 1 0.30 0.25 0.25 0.04 8 1.20:1 2.5 RFP-250250-4AA2 2 0.40 0.25 0.25 0.04 8 1.20:1 2.5 RFP-250250-4AA3 3 0.40 0.25 0.25 0.04 8 1.20:1 2.5 RFP-250250-4AA4 4 0.40 0.25 0.25 0.04 8 1.20:1 2.5 RFP-250250-4AA5 5 0.40 0.25 0.25 0.04 8 1.25:1 2.5 RFP-250250-4AA6 6 0.40 0.25 0.25 0.04 8 1.30:1 2.5 RFP-250250-4AA9 9 0.40 0.25 0.25 0.04 8 1.30:1 2.5 RFP-250250-4AA10 10 0.40 0.25 0.25 0.04 8 1.30:1 2.5 RFP-250250-4AA20 20 0.75 0.25 0.25 0.04 8 1.25:1 2.5 RFP-250250-4AA30 30 1.50 0.25 0.25 0.04 8 1.20:1 2.0 Suggested Mounting Procedures Power Derating % OF RATED POWER SOLDER PASTE 100 SOLDER PASTE 75 PC BOARD HEATSINK 50 SCREW (2 PLS.) SOLDER FILLED VIA 25 1. Solder part in place using 60/40 type solder with controlled temperature iron (700°F). 0 25 50 75 100 125 150 P.C.B. SOLDER INTERFACE TEMPERATURE — °C 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws. Available on Tape and Reel for Pick and Place Manufacturing. 2 Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369