30 Watts, 50 Ω General Specifications Resistive Element: Substrate: Terminals: Thick film Aluminum nitride ceramic Tin/Lead, 90/10 over nickel Electrical Specifications Resistance Value: Frequency Range: Power: V.S.W.R.: Features • DC – 2.0 GHz • 30 Watts Aluminum Nitride SMD Terminations Model RFP-375375N6Z50-2 Aluminum Nitride Terminations 50 ohms, ±2% DC - 2.0 GHz 30 Watts 1.25:1 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +125°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. • Aluminum Nitride (AlN) Ceramic • Surface Mountable • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Outline Drawing BOTTOM VIEW TOP VIEW SIDE VIEW .375 .060 RFP ZN XXX .375 .040 .040 .100 .175 Note: XXX denotes value. .100 .175 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Aluminum Nitride SMD Terminations Model RFP-375375N6Z50-2 Typical Performance Suggested Mounting Procedures Power Derating SCREW (2 PLS.) % OF RATED POWER 100 SOLDER PASTE 75 50 PC BOARD HEATSINK 25 SOLDER FILLED VIA 1. Solder part in place using 60/40 type solder with controlled temperature iron (700°F). 0 25 50 75 100 125 P.C.B. SOLDER INTERFACE TEMPERATURE — °C 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws. Available on Tape and Reel for Pick and Place Manufacturing. 2 Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369