MBRD1035CTLG, MBRD1035CTLT4G, SBRD81035CTLT4G SWITCHMODE Schottky Power Rectifier DPAK Power Surface Mount Package The MBRD1035CTL employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies, free wheeling diode and polarity protection diodes. http://onsemi.com SCHOTTKY BARRIER RECTIFIER 10 AMPERES 35 VOLTS Features • Highly Stable Oxide Passivated Junction • Guardring for Stress Protection • Matched Dual Die Construction − • • • • • • DPAK CASE 369C May be Paralleled for High Current Output High dv/dt Capability Short Heat Sink Tap Manufactured − Not Sheared Very Low Forward Voltage Drop Epoxy Meets UL 94 V−0 @ 0.125 in SBRD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ESD Rating: ♦ Human Body Model = 3B (> 8 kV) ♦ Machine Model = C (> 400 V) 1 4 3 MARKING DIAGRAM YWW B10 35CLG Y WW B1035CL G = Year = Work Week = Device Code = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 November, 2012 − Rev. 9 1 Publication Order Number: MBRD1035CTL/D MBRD1035CTLG, MBRD1035CTLT4G, SBRD81035CTLT4G MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 115°C) Per Leg Per Package Symbol Value Unit VRRM VRWM VR 35 V IO A 5.0 10 Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 115°C) Per Leg IFRM Non−Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Per Package IFSM A 10 Storage / Operating Case Temperature Operating Junction Temperature (Note 1) Voltage Rate of Change (Rated VR, TJ = 25°C) A 50 Tstg, Tc −55 to +150 °C TJ −55 to +150 °C dv/dt 10,000 V/ms Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. THERMAL CHARACTERISTICS Rating Symbol Thermal Resistance, Junction−to−Case Per Leg RqJC Thermal Resistance, Junction−to−Ambient (Note 2) Per Leg RqJA Value 3.0 137 Unit °C/W °C/W 2. Rating applies when using minimum pad size, FR4 PC Board ELECTRICAL CHARACTERISTICS Rating Symbol Maximum Instantaneous Forward Voltage (Note 3) (See Figure 2) Per Leg (IF = 5 Amps, TJ = 25°C) (IF = 5 Amps, TJ = 100°C) (IF = 10 Amps, TJ = 25°C) (IF = 10 Amps, TJ = 100°C) VF Maximum Instantaneous Reverse Current (Note 3) (See Figure 4) Per Leg (VR = 35 V, TJ = 25°C) (VR = 35 V, TJ = 100°C) (VR = 17.5 V, TJ = 25°C) (VR = 17.5 V, TJ = 100°C) IR Value Unit V 0.47 0.41 0.56 0.55 mA 2.0 30 0.20 5.0 3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0% http://onsemi.com 2 MBRD1035CTLG, MBRD1035CTLT4G, SBRD81035CTLT4G ORDERING INFORMATION Package Shipping† MBRD1035CTLG DPAK (Pb−Free) 75 Units / Rail MBRD1035CTLT4G DPAK (Pb−Free) 2,500 Units / Tape & Reel SBRD81035CTLT4G DPAK (Pb−Free) 2,500 Units / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. I F, INSTANTANEOUS FORWARD CURRENT (AMPS) I F, INSTANTANEOUS FORWARD CURRENT (AMPS) TYPICAL CHARACTERISTICS 100 TJ = 125°C 10 TJ = 100°C TJ = 25°C TJ = - 40°C 1.0 0.1 0.10 0.30 0.50 0.70 0.90 1.10 100 TJ = 125°C 10 TJ = 25°C 1.0 TJ = 100°C 0.1 0.10 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Per Leg I R , MAXIMUM REVERSE CURRENT (AMPS) I R , REVERSE CURRENT (AMPS) 0.50 0.70 0.90 1.10 Figure 2. Maximum Forward Voltage Per Leg 1E+0 100E-3 1E+0 100E-3 TJ = 125°C 10E-3 1E-3 TJ = 100°C 100E-6 TJ = 25°C 0 10 20 VR, REVERSE VOLTAGE (VOLTS) TJ = 125°C 10E-3 TJ = 100°C 1E-3 100E-6 10E-6 1E-6 0.30 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 30 35 TJ = 25°C 10E-6 1E-6 0 10 20 VR, REVERSE VOLTAGE (VOLTS) 30 Figure 4. Maximum Reverse Current Per Leg Figure 3. Typical Reverse Current Per Leg http://onsemi.com 3 35 PFO , AVERAGE POWER DISSIPATION (WATTS) I O , AVERAGE FORWARD CURRENT (AMPS) MBRD1035CTLG, MBRD1035CTLT4G, SBRD81035CTLT4G 8.0 dc 7.0 SQUARE WAVE (50% DUTY CYCLE) 6.0 5.0 Ipk/Io = p 4.0 Ipk/Io = 5 3.0 Ipk/Io = 10 2.0 Ipk/Io = 20 1.0 freq = 20 kHz 0 0 20 40 60 80 120 100 4.0 SQUARE WAVE (50% DUTY CYCLE) 3.5 3.0 Ipk/Io = p 2.5 Ipk/Io = 5 2.0 Ipk/Io = 10 1.5 Ipk/Io = 20 1.0 0.5 0 0 140 1.0 1000 C, CAPACITANCE (pF) TJ = 25°C 100 10 10 15 3.0 4.0 5.0 6.0 7.0 8.0 Figure 6. Forward Power Dissipation Per Leg TJ , DERATED OPERATING TEMPERATURE ( ° C) Figure 5. Current Derating Per Leg 5 2.0 IO, AVERAGE FORWARD CURRENT (AMPS) TL, LEAD TEMPERATURE (°C) 0 dc 20 125 RqJA = 2.43°C/W 115 RqJA = 25°C/W 105 RqJA = 48°C/W 95 RqJA = 67.5°C/W 85 RqJA = 84°C/W 75 65 0 25 5 10 15 20 25 30 35 VR, DC REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 8. Typical Operating Temperature Derating Per Leg * Figure 7. Capacitance Per Leg * Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ = TJmax − r(t)(Pf + Pr) where TJ may be calculated from the equation: r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. http://onsemi.com 4 r (t) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) MBRD1035CTLG, MBRD1035CTLT4G, SBRD81035CTLT4G 1.0 50%(DUTY CYCLE) 20% 10% 0.1 5.0% 2.0% 1.0% SINGLE PULSE 0.01 0.00001 Rtjl(t) = Rtjl • r(t) 0.0001 0.001 0.01 0.1 10 1.0 100 1000 t, TIME (s) r (t) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) Figure 9. Thermal Response Junction to Case (Per Leg) 1.0E+00 50% (DUTY CYCLE) 20% 1.0E-01 1.0E-02 10% 5.0% 2.0% 1.0% 1.0E-03 SINGLE PULSE 1.0E-04 0.00001 0.0001 Rtjl(t) = Rtjl • r(t) 0.001 0.01 0.1 1.0 10 t, TIME (s) Figure 10. Thermal Response Junction to Ambient (Per Leg) http://onsemi.com 5 100 1000 10000 MBRD1035CTLG, MBRD1035CTLT4G, SBRD81035CTLT4G PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C ISSUE D A E b3 c2 B Z D 1 L4 A 4 L3 b2 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C H DETAIL A 3 c b 0.005 (0.13) M H C L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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