SEMIKRON SEMIX241DH16S

SEMiX241DH16s
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
A
Chip
Tc = 85 °C
240
Tc = 100 °C
200
A
Tj = 25 °C
2250
A
Tj = 130 °C
1900
A
Tj = 25 °C
25300
A2s
Tj = 130 °C
18000
A2s
VRSM
1700
V
VRRM
1600
V
IT(AV)
ITSM
i2t
®
SEMiX 13
sinus 180°
10 ms
10 ms
VDRM
(di/dt)cr
Tj = 130 °C
Bridge Rectifier Module
(halfcontrolled)
(dv/dt)cr
Tj = 130 °C
SEMiX241DH16s
Module
Tj
Tstg
Visol
Features
• Terminal height 17 mm
• Chips soldered directly to isolated
substrate
Typical Applications*
• Input Bridge Rectifier for AC/DC motor
control
• Power supply
AC sinus 50Hz
1600
V
100
A/µs
1000
V/µs
-40 ... 130
°C
-40 ... 125
°C
1 min
4000
V
1s
4800
V
Characteristics
Symbol
Conditions
min.
typ.
max.
Unit
Chip
VT
Tj = 25 °C, IT = 300 A
1.9
V
VT(TO)
Tj = 130 °C
0.85
V
rT
Tj = 130 °C
4
mΩ
IDD;IRD
Tj = 130 °C, VDD = VDRM; VRD = VRRM
24
mA
tgd
Tj = 25 °C, IG = 1 A, diG/dt = 1 A/µs
1
tgr
VD = 0.67 * VDRM
2
µs
tq
Tj = 130 °C
150
µs
IH
Tj = 25 °C
150
250
mA
300
600
mA
µs
IL
Tj = 25 °C, RG = 33 Ω
VGT
Tj = 25 °C, d.c.
3
V
IGT
Tj = 25 °C, d.c.
150
mA
VGD
Tj = 130 °C, d.c.
IGD
Tj = 130 °C, d.c.
0.25
6
V
mA
Rth(j-c)
per thyristor
Rth(j-c)
per thyristor
0.32
K/W
per module
0.32
K/W
K/W
per module
sin. 180°
Rth(j-c)
K/W
per thyristor
K/W
per module
K/W
Module
Rth(c-s)
per chip
K/W
per module
0.04
K/W
Ms
to heat sink (M5)
3
5
Nm
Mt
to terminals (M6)
2.5
5
Nm
5 * 9,81
m/s2
a
w
350
g
DH
© by SEMIKRON
Rev. 29 – 05.03.2010
1
SEMiX241DH16s
Fig. 4L: Power dissipation per module vs. direct current
Fig. 4R: Power dissipation per module vs. case
temperature
Fig. 5: Recovered charge vs. current decrease
Fig. 6: Transient thermal impedance vs. time
Fig. 7: On-state characteristics
Fig. 8: Surge overload current vs. time
2
Rev. 29 – 05.03.2010
© by SEMIKRON
SEMiX241DH16s
© by SEMIKRON
Rev. 29 – 05.03.2010
3
SEMiX241DH16s
Fig. 9: Gate trigger characteristics
spring configuration
SEMiX 13
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.
4
Rev. 29 – 05.03.2010
© by SEMIKRON