SEME-LAB SML50HB06

SML50HB06
Attributes:
-aerospace build standard
-high reliability
-lightweight
-metal matrix base plate
-AlN isolation
Maximum rated values/
Electrical Properties
Collector-emitter Voltage
Vce
600
V
Ic, nom
Ic
50
75
A
DC Collector Current
Tc=80C
Tc=25C
Repetitive peak Collector Current
tp=1msec,Tc=80C
Icrm
100
A
Total PowerDissipation
Tc=25C
Ptot
280
W
Vges
+/-20
V
If
50
A
Gate-emitter peak voltage
DC Forward Diode
Current
Repetitive Peak
Forward Current
tp=1msec
Ifrm
100
A
I2t value per diode
Vr=0V, tp=10msec,
Tvj=125C
I2t
450
A2sec
RMS, 50Hz, t=1min
Visol
2500
V
Isolation test voltage
Collector-emitter saturation
voltage
Ic=50A,Vge=15V, Tc=25C
Ic=50A,Vge=15V,Tc=125C
Vce(sat)
Gate Threshold voltage
Ic=50A,Vce=Vge, Tvj=25C
Vge(th)
Input capacitance
f=1MHz,Tvj=25C,Vce=25V,
Vge=0V
Cies
2.2
nF
Reverse transfer Capacitance
f=1MHz,Tvj=25C,Vce=25V,
Vge=0V
Cres
0.2
nF
Collector emitter cut off
current
Vce=600V,Vge=0V,Tvj=25C
Vce=600V,Vge=0V,Tvj=125C
Ices
1
1
Gate emitter cut off current
Vce=0V,Vge=20V,Tvj=25C
Iges
4.5
1.95
2.2
2.45
V
5.5
6.5
V
500
µA
400
µA
Turn on delay time
Ic=50A, Vcc=300V
Vge=+/15V,Rg=2.7Ω,Tvj=25C
Vge=+/-15V,Rg=2.7Ω,Tvj=125C
td,on
40
42
nsec
nsec
Ic=50A, Vcc=300V
Vge=+/-15V,Rg=2.7Ω,Tvj=25C
Vge=+/-15V,Rg=2.7Ω,Tvj=125C
tr
9
10
nsec
nsec
Ic=50A, Vcc=300V
Vge=+/-15V,Rg=2.7Ω,Tvj=25C
Vge=+/-15V,Rg=2.7Ω,Tvj=125C
td,off
120
130
nsec
nsec
Ic=50A, Vcc=300V
Vge=+/-15V,Rg=2.7Ω,Tvj=25C
Vge=+/-15V,Rg=2.7Ω,Tvj=125C
tf
12
21
nsec
nsec
Ic=50A,Vce=300V,Vge=15V
Rge=2.7Ω,Tvj=125C,L=35nH
Eon
0.5
mJ
Turn off energy loss per pulse Ic=50A,Vce=300V, Vge=15V
Rge=Ω,Tvj=125C,L=35nH
Eoff
1.0
mJ
Isc
225
A
Stray Module inductance
Lσce
40
nH
Terminal-chip resistance
Rc
1.2
mΩ
Rise time
Turn off delay time
Fall time
Turn energy loss per pulse
SC Data
tp≤10µsec, Vge≤15V
Tvj≤125C,Vcc=300V,Vce(max)Vces-Lσdi/dT
Diode characteristics
Forward voltage
Ic=50A,Vge=0V, Tc=25C
Ic=50A,Vge=0V, Tc=125C
Peak reverse recovery current If=50A, -di/dt=2900A/µsec
Vce=300V,Vge=-10V,Tvj=25C
Vce=300V,Vge=-10V,Tvj=125C
Recovered charge
Reverse recovery energy
Vf
Irm
If=50A, -di/dt=2900A/µsec
Vce=600V,Vge=-10V,Tvj=25C
Vce=600V,Vge=-10V,Tvj=125C
Qr
If=50A, -di/dt=2900A/µsec
Vce=600V,Vge=-10V,Tvj=25C
Vce=600V,Vge=-10V,Tvj=125C
Erec
1.25 1.6 V
1.2
88
92
A
3.4
5.6
µC
1.5
mJ
mJ
Thermal Properties
Thermal resistance junction to
case
Thermal resistance case to
heatsink
Min
Igbt
Diode
Typ
RθJ-C
0.67
1.1
RθC-hs
Maximum junction temperature
Tvj
Maximum operating temperature
Top
Storage Temperature
Tstg
Max
0.03
K/W
K/W
150
C
-55
125
C
-55
125
C
CIRCUIT DIAGRAM